Decoder for traffic warning (VWF)
radio transmissions
Product specification
File under Integrated Circuits, IC01
May 1992
Page 2
Philips SemiconductorsProduct specification
Decoder for traffic warning (VWF) radio
transmissions
GENERAL DESCRIPTION
The TDA1579 decoder is for radio transmissions having
57 kHz amplitude-modulated subcarriers as used in the
German 'Verkehrs Warnfunk' (VWF) traffic warning
system.
QUICK REFERENCE DATA
Measured in Fig.1 at V
‘BK-traffic area C’ signal; or with f
PARAMETERCONDITIONSSYMBOLMIN.TYP.MAX.UNIT
Supply voltageV
Supply currentI
Nominal input voltageat f = 57 kHzV
Input impedanceat f ≤ 57 kHzZ
Control level−3 dBV
Input voltagepeak-to-peak valueV
SK switch-on
threshold levelm
SK switch hysteresis∆m
SK switch-on delayt
SK switch-off delayt
DK switch-on
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
A
A
UNIT
max.
mm
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT102-1
12
min.
max.
IEC JEDEC EIAJ
b
1.40
1.14
0.055
0.044
b
1
0.53
0.38
0.021
0.015
b
2
0.32
1.40
0.23
1.14
0.013
0.055
0.009
0.044
REFERENCES
(1)(1)
cD E eM
21.8
21.4
0.86
0.84
9
6.48
6.20
0.26
0.24
E
(1)
Z
L
e
1
M
3.9
8.25
3.4
7.80
0.15
0.32
0.13
0.31
EUROPEAN
PROJECTION
E
0.37
0.33
H
9.5
8.3
w
max.
0.2542.547.62
0.854.70.513.7
0.010.100.30
0.0330.190.0200.15
ISSUE DATE
93-10-14
95-01-23
May 199210
Page 11
Philips SemiconductorsProduct specification
Decoder for traffic warning (VWF) radio
transmissions
SO20: plastic small outline package; 20 leads; body width 7.5 mm
D
c
y
Z
20
11
TDA1579
TDA1579T
SOT163-1
E
H
E
A
X
v M
A
pin 1 index
1
e
0510 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
mm
A
max.
2.65
0.10
A
1
0.30
0.10
0.012
0.004
A
2.45
2.25
0.096
0.089
A
b
0.49
0.36
p
cD
0.32
0.23
0.013
0.009
2
3
0.25
0.019
0.01
0.014
UNIT
inches
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
10
w M
b
p
scale
(1)E(1)(1)
13.0
12.6
0.51
0.49
eHELLpQ
7.6
1.27
7.4
0.30
0.050
0.29
10.65
10.00
0.42
0.39
Q
A
2
A
1
1.4
0.055
1.1
0.4
0.043
0.016
detail X
1.1
1.0
0.043
0.039
(A )
L
p
L
0.25
0.01
A
3
θ
0.250.1
0.01
ywvθ
Z
0.9
0.4
8
0.004
0.035
0.016
0
o
o
OUTLINE
VERSION
SOT163-1
IEC JEDEC EIAJ
075E04 MS-013AC
REFERENCES
May 199211
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-01-24
Page 12
Philips SemiconductorsProduct specification
Decoder for traffic warning (VWF) radio
transmissions
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
“IC Package Databook”
our
DIP
OLDERING BY DIPPING OR BY WAVE
S
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
(order code 9398 652 90011).
). If the
stg max
TDA1579
TDA1579T
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
AVE SOLDERING
W
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
EPAIRING SOLDERED JOINTS
R
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
May 199212
Page 13
Philips SemiconductorsProduct specification
Decoder for traffic warning (VWF) radio
transmissions
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
TDA1579
TDA1579T
May 199213
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