Datasheet TDA1561Q-N2, TDA1561Q-N1 Datasheet (Philips)

Page 1
DATA SH EET
Preliminary specification Supersedes data of 1997 Jun 11 File under Integrated Circuits, IC01
1997 Aug 14
INTEGRATED CIRCUITS
TDA1561Q
Page 2
1997 Aug 14 2
Philips Semiconductors Preliminary specification
2 × 23 W high efficiency car radio power amplifier
TDA1561Q
FEA TURES
Low dissipation due to switching from Single-Ended (SE) to Bridge-Tied Load (BTL) mode
High Common Mode Rejection Ratio (CMRR)
Mute/standby/operating/SE-only (mode select pin)
Zero crossing mute and standby circuit
Load dump protection circuit
Short-circuit safe to ground, to supply voltage and
across load
Loudspeaker protection circuit
Device switches to single-ended operation at excessive
junction temperatures.
GENERAL DESCRIPTION
The TDA1561Q is a monolithic power amplifier in a 13 lead single-in-line (SIL) plastic power package. It contains two identical 23 W amplifiers. The dissipation is minimized by switching from SE to BTL mode, only when a higher output voltage swing is needed. The device is primarily developed for car radio applications.
QUICK REFERENCE DATA
ORDERING INFORMATION
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
P
supply voltage DC biased 6.0 14.4 18 V
non operating −−30 V load dump −−50 V
I
ORM
repetitive peak output current −−4A
I
q(tot)
total quiescent current RL= ∞−95 150 mA
I
stb
standby current 150µA
Z
i
input impedance 60 k
P
o
output power RL = 4 ; EIAJ 36 W
THD 10% 21 23 W
G
v
voltage gain 31 32 33 dB
CMRR common mode rejection ratio f = 1 kHz; R
s
=0Ω−80 dB
SVRR supply voltage ripple rejection f = 1 kHz; R
s
=0 45 55 dB
∆V
O
DC output offset voltage −−150 mV
α
cs
channel separation Rs=0k 40 60 dB
∆G
v
channel unbalance −−1dB
TYPE
NUMBER
PACKAGE
NAME DESCRIPTION VERSION
TDA1561Q DBS13P plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) SOT141-6
Page 3
1997 Aug 14 3
Philips Semiconductors Preliminary specification
2 × 23 W high efficiency car radio power amplifier
TDA1561Q
BLOCK DIAGRAM
Fig.1 Block diagram.
handbook, full pagewidth
MLD214
REFERENCE
SOURCES
MUTE/STANDBY
THERMAL/
SHORT-CIRCUIT
PROTECTION
HIGHER
TEMPERATURE
BTL DISABLE
0.5V
P
MUTE
R
MUTE
R
7
V
P
12
3
13
2
1
IN1
IN2
CIN
MODE
1/2R
HV
4
GND1
10
GND2
6
5
11
9
8
OUT2
OUT2
OUT1
OUT1
C
TDA1561Q
P
11
Page 4
1997 Aug 14 4
Philips Semiconductors Preliminary specification
2 × 23 W high efficiency car radio power amplifier
TDA1561Q
PINNING
SYMBOL PIN DESCRIPTION
IN1 1 input 1 HV
P
2 half supply voltage control input MODE 3 mute/standby/operating/SE-only GND1 4 ground 1 OUT1 5 inverting output 1 OUT1 6 non-inverting output 1 V
P
7 supply voltage OUT2 8 inverting output 2 OUT2 9 non-inverting output 2 GND2 10 ground 2 C
11
11 electrolytic capacitor for
single-ended (SE) mode CIN 12 common input IN2 13 input 2
Fig.2 Pin configuration.
handbook, halfpage
MLD215
1 2 3 4 5 6 7 8
9 10 11 12 13
TDA1561Q
IN1
HV
GND1
OUT1
V
MODE
OUT1
OUT2
11
C
CIN
IN2
GND2
OUT2
P
P
Page 5
1997 Aug 14 5
Philips Semiconductors Preliminary specification
2 × 23 W high efficiency car radio power amplifier
TDA1561Q
FUNCTIONAL DESCRIPTION
The TDA1561Q contains two identical amplifiers with differential inputs. At low output power (up to output amplitudes of 3 V (RMS) at VP= 14.4 V), the device operates as a normal SE amplifier. When a larger output voltage swing is needed, the circuit switches internally to BTL operation.
With a sine wave input signal the dissipation of a conventional BTL amplifier up to 2 W output power is more than twice the dissipation of the TDA1561Q (see Fig.9).
In normal use, when the amplifier is driven with music-like signals, the high (BTL) output power is only needed for a small percentage of time. Under the assumption that a music signal has a normal (Gaussian) amplitude distribution, the dissipation of a conventional BTL amplifier with the same output power is approximately 70% higher (see Fig.10).
The heatsink has to be designed for use with music signals. With such a heatsink, the thermal protection will disable the BTL mode when the junction temperature exceeds 145 °C. In this case the output power is limited to 5 W per amplifier.
The gain of each amplifier is internally fixed at 32 dB. With the MODE pin, the device can be switched to the following modes:
Standby with low standby current (<50 µA)
Mute condition, DC adjusted
On, operation
SE-only, operation (BTL disabled).
The device is fully protected against short-circuiting of the output pins to ground and to the supply voltage. It is also protected against short-circuiting the loudspeaker and high junction temperatures. In the event of a permanent short-circuit condition to ground or the supply voltage, the output stage will be switched off causing a low dissipation. With permanent short-circuiting of the loudspeaker, the output stage will be repeatedly switched on and off. The duty cycle in the ‘on’ condition is low enough to prevent excessive dissipation.
To avoid plops during switching from ‘mute’ to ‘on’ or from ‘on’ to ‘mute/standby’ while an input signal is present, a built-in zero-crossing detector allows only switching at zero input voltage. However, when the supply voltage drops below 6 V (e.g. engine start), the circuit mutes immediately avoiding clicks coming from electronic circuitry preceding the power amplifier.
The voltage of the SE electrolytic capacitor (pin 11) is always kept at 0.5V
P
by means of a voltage buffer (see Fig.1). The value of this capacitor has an important influence on the output power in SE mode, especially at low signal frequencies, a high value is recommended to minimize dissipation at low frequencies.
Page 6
1997 Aug 14 6
Philips Semiconductors Preliminary specification
2 × 23 W high efficiency car radio power amplifier
TDA1561Q
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
THERMAL CHARACTERISTICS
Note
1. The value of R
th(c-h)
depends on the application (see Fig.3).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
P
supply voltage operating 18 V
non operating 30 V load dump; tr> 2.5 ms 50 V
V
P(sc)
short-circuit safe voltage 18 V
V
rp
reverse polarity voltage 6V
I
OSM
non-repetitive peak output current 6A
I
ORM
repetitive peak output current 4A
P
tot
total power dissipation 60 W
T
stg
storage temperature 55 +150 °C
T
vj
virtual junction temperature 150 °C
T
amb
operating ambient temperature 40 −°C
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th(j-c)
thermal resistance from junction to case see note 1 1.3 K/W
R
th(j-a)
thermal resistance from junction to ambient 40 K/W
Page 7
1997 Aug 14 7
Philips Semiconductors Preliminary specification
2 × 23 W high efficiency car radio power amplifier
TDA1561Q
Heatsink design
There are two parameters that determine the size of the heatsink. The first is the rating for the virtual junction temperature and the second is the ambient temperature at which the amplifier must still deliver its full power in the BTL mode.
With a conventional BTL amplifier, the maximum power dissipation with a music-like signal (at each amplifier) will be approximately two times 5 W. At a virtual junction temperature of 150 °C and a maximum ambient temperature of 60 °C, R
th(vj-c)
= 1.3 K/W and
R
th(c-h)
= 0.2 K/W, the thermal resistance of the heatsink
should be:
Compared to a conventional BTL amplifier, the TDA1561Q has a higher efficiency. The thermal resistance of the heatsink should be:
150 60
25×
----------------------
1.3 0.2 7.5 K/W=
1.7
150 60
25×
----------------------


1.3 0.2 13.8 K/W=
Fig.3 Thermal equivalent resistance network.
handbook, halfpage
3.6 K/W
0.6 K/W
3.6 K/W
virtual junction
OUT 1 OUT 1
case
3.6 K/W
0.6 K/W
3.6 K/W
OUT 2 OUT 2
MGC424
0.1 K/W
Page 8
1997 Aug 14 8
Philips Semiconductors Preliminary specification
2 × 23 W high efficiency car radio power amplifier
TDA1561Q
DC CHARACTERISTICS
V
P
= 14.4 V; T
amb
=25°C; measured in Fig.6; unless otherwise specified.
Note
1. The circuit is DC biased at V
P
= 6 to 18 V and AC operating at VP=8to18V.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supplies
V
P
supply voltage note 1 6.0 14.4 18.0 V
I
q
quiescent current RL= ∞−95 150 mA
I
stb
standby current 150µA
V
C
average electrolytic capacitor voltage at pin 11
7.1 V
∆V
O
DC output offset voltage on state −−150 mV
mute state −−50 mV Mode select switch (see Fig.4) V
ms
voltage at mode select pin (pin 3)
standby condition 0 1V
mute condition 2 3V
on condition (SE/BTL mode) 4 5.5 V
on condition (SE mode only) 7.5 V
P
V
I
ms
switch current through pin 3 Vms=5V −−40 µA
Protection
T
dis
BTL disable temperature 145 −°C
Fig.4 Switching levels of mode select switch.
handbook, halfpage
,,,,,
,
0
MLD216
V
1
2
3
4
5
6
7
8
P
SE Only
SE/BTL
Standby
Mute
Page 9
1997 Aug 14 9
Philips Semiconductors Preliminary specification
2 × 23 W high efficiency car radio power amplifier
TDA1561Q
AC CHARACTERISTICS
V
P
= 14.4 V; RL=4Ω; C11= 1000 µF; f = 1 kHz; T
amb
=25°C; measured in Fig.6; unless otherwise specified.
Notes
1. The distortion is measured with a bandwidth of 10 Hz to 30 kHz.
2. Frequency response externally fixed (input capacitors determine low frequency roll-off).
3. The SE to BTL switch voltage level depends on V
P
.
4. Noise output voltage measured with a bandwidth of 20 Hz to 20 kHz.
5. Noise output voltage is independent of Rs (see Fig.6)(Vi= 0 V).
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
P
o
output power THD = 1% 15 18 W
THD = 10% 21 23 W EIAJ 36 W V
P
= 13.2 V; THD = 0.5% 14 W
V
P
= 13.2 V; THD = 10% 20 W
THD total harmonic distortion P
o
= 1 W; f = 1 kHz; note 1 0.1 %
P
d
dissipated power see Figs 9 and 10 W
B
p
power bandwidth THD = 1%; Po= 1dB
with respect to 15 W
20 to 15000
Hz
f
ro(l)
low frequency roll-off 1 dB; note 2 25 Hz
f
ro(h)
high frequency roll-off 1 dB 130 −−kHz
G
v
closed loop voltage gain 31 32 33 dB
SVRR supply voltage ripple rejection R
s
=0Ω; V
ripple
= 2 V (p-p) on; f = 1 kHz 45 60 dB mute; f = 1 kHz 90 dB standby; f = 100 Hz to 10 kHz 80 −−dB
CMRR common mode rejection ratio R
s
=0Ω; f = 1 kHz 80 dB
Z
i
input impedance 45 60 75 k
∆Z
i
mismatch in input impedance 1 %
V
SE-BTL
SE to BTL switch voltage level note 3 3 V
V
out
output voltage-mute (RMS value) Vi= 1 V (RMS) 50 100 µV
V
n(o)
noise output voltage on; Rs=0Ω; note 4 160 300 µV
on; R
s
=10kΩ; note 4 170 −µV
mute; note 5 20 −µV
α
cs
channel separation Rs=0 40 60 dB
∆G
v
channel unbalance −−1dB
Page 10
1997 Aug 14 10
Philips Semiconductors Preliminary specification
2 × 23 W high efficiency car radio power amplifier
TDA1561Q
TEST AND APPLICATION INFORMATION
Fig.5 Test diagram.
handbook, full pagewidth
220 nF
470 nF
4
8
9
11
5
6
73
1
2
12
13
10
220 nF
4
3.9
1000 µF
(16 V)
100 nF
3.9
10 nF
0.5V
P
0.5R
s
MLD223
TDA1561Q
4
3.9
10 nF
3.9
100 nF
input 2
input 1
R
s
R
s
1000 µF
16 V
220 nF
IN1
HV
P
GND1
OUT1
V
P
MODE
OUT1
OUT2
C
11
CIN
IN2
GND2
OUT2
Page 11
1997 Aug 14 11
Philips Semiconductors Preliminary specification
2 × 23 W high efficiency car radio power amplifier
TDA1561Q
Fig.6 Application diagram.
handbook, full pagewidth
220 nF
100 nF
2 x 220 nF
4
8
9
11
5
6
73
1
2
12
13
power ground
signal ground
10
220 nF
1000 µF
16 V
100 nF
4
3.9
1000 µF
(16 V)
10 nF
3.9
100 nF
0.5V
P
MLD213
TDA1561Q
4
3.9
10 nF
3.9
100 nF
IN1
HV
P
GND1
OUT1
V
P
MODE
OUT1
OUT2
C
11
CIN
IN2
GND2
OUT2
(1)
R
s
R
s
0.5R
s
Connect Boucherot filter to pin 4 respectively pin 10 with the shortest possible connection.
Page 12
1997 Aug 14 12
Philips Semiconductors Preliminary specification
2 × 23 W high efficiency car radio power amplifier
TDA1561Q
handbook, full pagewidth
MGK182
Mode select
gnd
mss
Vp
GND
In1 In2sgnd
Cool Power
m
Out 2Out 1
TDA1561Q
4 × 220 nF
86.36
43.18
Fig.7 PCB layout (component side) for the application of Fig.6.
Dimensions in mm.
Page 13
1997 Aug 14 13
Philips Semiconductors Preliminary specification
2 × 23 W high efficiency car radio power amplifier
TDA1561Q
handbook, full pagewidth
MGK183
Mode
gnd
mss
Vp
GND
In2 In1sgnd
m
Out1Out2
86.36
43.18
Fig.8 PCB layout (soldering side) for the application of Fig.6.
Dimensions in mm.
Page 14
1997 Aug 14 14
Philips Semiconductors Preliminary specification
2 × 23 W high efficiency car radio power amplifier
TDA1561Q
INTERNAL PIN CONFIGURATIONS
PIN NAME EQUIVALENT CIRCUIT
1,12,13 IN1, CIN, IN2
2HV
P
3 MODE
pin 1
pin 12
pin 13
V
P
MLD217
handbook, halfpage
MLD218
pin 2
handbook, halfpage
MLD221
pin 3
V
P
Page 15
1997 Aug 14 15
Philips Semiconductors Preliminary specification
2 × 23 W high efficiency car radio power amplifier
TDA1561Q
5, 9 OUT1, OUT2
6, 8 OUT1, OUT2
11 C
11
PIN NAME EQUIVALENT CIRCUIT
handbook, halfpage
MLD220
V
P
pins 5, 9
handbook, halfpage
MLD219
V
P
pins 6, 8
MLD222
pin 11
Page 16
1997 Aug 14 16
Philips Semiconductors Preliminary specification
2 × 23 W high efficiency car radio power amplifier
TDA1561Q
ADDITIONAL APPLICATION INFORMATION
Fig.9 Dissipation; sine wave driven.
handbook, halfpage
010
P
o
(W)
25
0
5
10
15
20
2
P
d
(W)
468
MBH692
(1)
(2)
Input signal 1 kHz, sinusoidal; VP= 14.4 V. (1) For a conventional BTL amplifier. (2) For TDA1561Q.
Fig.10 Dissipation; pink noise through IEC-268
filter.
handbook, halfpage
010
P
o
(W)
25
0
5
10
15
20
2
P
d
(W)
468
MBH693
(1)
(2)
(1) For a conventional BTL amplifier.
(2) For TDA1561Q.
Fig.11 IEC-268 filter.
430
input output
330
3.3 k
3.3 k
10 k
91 nF
68 nF
470 nF2.2 µF 2.2 µF
MGC428
Page 17
1997 Aug 14 17
Philips Semiconductors Preliminary specification
2 × 23 W high efficiency car radio power amplifier
TDA1561Q
handbook, full pagewidth
220 nF
pink noise
100 nF
2×
220 nF
4
8
9
11
5
6
73
1
2
12
13
10
220 nF
4
3.9
1000 µF
(16 V)
10 nF
3.9
100 nF
1/2V
P
on condition
MGC427
TDA1561Q
4
3.9
10 nF
3.9
100 nF
IEC-268 FILTER
IN1
HV
P
GND1
OUT1
V
P
MODE
OUT1
OUT2
C
11
CIN
IN2
GND2
OUT2
Fig.12 Test and application diagram for dissipation measurements with a music-like signal (pink noise).
Fig.13 DC output voltage as a function of VP.
handbook, halfpage
08 24
V
P
(V)
V
O
(V)
12
0
4
8
16
MBH694
Vms=5V.
Fig.14 Quiescent current as a function of VP.
handbook, halfpage
08 24
V
P
(V)
I
q
(mA)
125
0
25
50
75
100
16
MBH695
Vms= 5 V; RI= .
Page 18
1997 Aug 14 18
Philips Semiconductors Preliminary specification
2 × 23 W high efficiency car radio power amplifier
TDA1561Q
Fig.15 IP as a function of Vms (pin 3).
handbook, halfpage
02 86
off mute
V
MODE
(V)
I
P
(mA)
160
0
40
80
120
4
MBH696
SE/BTL SE only
VP= 14.4 V; Vin= 0 mV; RI= .
Fig.16 Ims as a function of Vms.
handbook, halfpage
02 86
V
MODE
(V)
I
MODE
(µA)
80
64
0
16
32
48
4
MBH697
Fig.17 Output power as a function of VP.
handbook, halfpage
8.4 10.8 1815.6
(3)
(2)
(1)
VP (V)
P
o
(W)
60
0
20
40
13.2
MBH698
Both channels driven. (1) EIAJ. (2) THD = 10%. (3) THD = 1%.
Fig.18 THD + noise as a function of Po.
handbook, halfpage
10
2
10
1
10
1
10
2
MBH699
10
2
10
1
1
THD + N
(%)
10
Po (W)
10
2
(1)
(2)
(3)
(1) f = 10 kHz. (2) f = 1 kHz. (3) f = 100 Hz.
Page 19
1997 Aug 14 19
Philips Semiconductors Preliminary specification
2 × 23 W high efficiency car radio power amplifier
TDA1561Q
Fig.19 THD + noise as a function of frequency.
handbook, halfpage
10
1
10
1
10
2
MBH700
10 10
2
10
3
10
4
f (Hz)
THD + N
(%)
10
5
(1)
(2)
(1) Po=10W. (2) Po=1W.
Fig.20 Power bandwidth at THD = 1%.
handbook, halfpage
16
18
20
14
12
10
MBH701
10 10
2
10
3
10
4
f (Hz)
B
p
(W)
10
5
(1) (2)
(1) For OUT2. (2) For OUT1.
Fig.21 Gain as a function of frequency.
handbook, halfpage
32
34
36
30
28
26
MBH702
10 10
2
10
3
10
4
f (Hz)
G
v
(dB)
10
6
10
5
Vin=50mV.
Fig.22 SVRR as a function of frequency.
handbook, halfpage
120
100
80
60
40
20
MBH703
10 10
2
10
3
10
4
f (Hz)
SVRR
(dB)
10
5
on
mute
off
V
ripple(p-p)
=2V.
Page 20
1997 Aug 14 20
Philips Semiconductors Preliminary specification
2 × 23 W high efficiency car radio power amplifier
TDA1561Q
Fig.23 Channel separation as a function of
frequency.
handbook, halfpage
100
60
40
20
0
MBH704
10 10
2
10
3
10
4
f (Hz)
α
cs
(dB)
10
5
(2)
(1)
(1) Po=1W. (2) Po=10W.
Fig.24 Mode select circuit.
handbook, halfpage
MBH690
47 µF
10 k
MODE5 V/40 µA
Page 21
1997 Aug 14 21
Philips Semiconductors Preliminary specification
2 × 23 W high efficiency car radio power amplifier
TDA1561Q
Fig.25 Output waveforms.
handbook, full pagewidth
MBH691
0 1 2 t (ms) 3
1/2 V
P
1/2 V
P
0
V
P
V
P
V
P
0
V
P
V
load
(1) (2) (3)
V
master
V
slave
0
See Fig.5: V
load=V6−V5
or V8− V
9
V
master=V6
or V
8
V
slave=V5
or V
9
Page 22
1997 Aug 14 22
Philips Semiconductors Preliminary specification
2 × 23 W high efficiency car radio power amplifier
TDA1561Q
PACKAGE OUTLINE
UNIT A e
1
A2bpcD
(1)
E
(1)
Z
(1)
deD
h
LL3m
REFERENCES
OUTLINE VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
mm
17.0
15.5
4.6
4.2
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
10 3.4
v
0.8
12.2
11.8
1.7
e
2
5.08
2.4
1.6
E
h
6
2.00
1.45
2.1
1.8
3.4
3.1
4.3
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
12.4
11.0
SOT141-6
0 5 10 mm
scale
Qj
0.25w0.03
x
D
L
E
A
c
A
2
m
L
3
Q
w M
b
p
1
d
D
Z
e
2
e
e
x
h
113
j
E
h
non-concave
view B: mounting base side
95-03-11 97-12-16
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
SOT141-6
v M
B
Page 23
1997 Aug 14 23
Philips Semiconductors Preliminary specification
2 × 23 W high efficiency car radio power amplifier
TDA1561Q
SOLDERING Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
(order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T
stg max
). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Page 24
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© Philips Electronics N.V. 1997 SCA55 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
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Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341
Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327
Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494
South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 São Paulo, SÃO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849
Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381
Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010,
Fax. +43 160 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773
Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381
China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 0044 Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615800, Fax. +358 9 61580920 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381 Middle East: see Italy
Printed in The Netherlands 547027/1200/05/pp24 Date of release: 1997Aug 14 Document order number: 9397 750 02732
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