Datasheet TDA1552Q-N4 Datasheet (Philips)

Page 1
DATA SH EET
Product specification File under Integrated Circuits, IC01
July 1994
INTEGRATED CIRCUITS
TDA1552Q
2 x 22 W BTL stereo car radio power amplifier
Page 2
Philips Semiconductors Product specification
2 x 22 W BTL stereo car radio power amplifier
TDA1552Q
GENERAL DESCRIPTION
The TDA1552Q is an integrated class-B output amplifier in a 13-lead single-in-line (SIL) plastic power package. The circuit contains 2 x 22 W amplifiers in Bridge Tied Load (BTL) configuration. The device is primarily developed for car radio applications.
Features
Requires very few external components
High output power
Low offset voltage at outputs
Fixed gain
Good ripple rejection
Mute/stand-by switch
Load dump protection
AC and DC short-circuit-safe to ground and V
P
Thermally protected
Reverse polarity safe
Capability to handle high energy on outputs (VP = 0 V)
Protected against electrostatic discharge
No switch-on/switch-off plop
Low thermal resistance
Flexible leads.
QUICK REFERENCE DATA
PACKAGE OUTLINE
13-lead SIL-bent-to-DIL; plastic power (SOT141R); SOT 141-6; 1996 July 23.
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Supply voltage range
operating V
P
6.0 14.4 18.0 V
non-operating V
P
−−30 V
load dump protected V
P
−−45 V
Repetitive peak output
current I
ORM
−−4A
Total quiescent current I
tot
80 160 mA
Stand-by current I
sb
0.1 100 µA
Switch-on current I
sw
−−60 µA
Input impedance |Z
I
| 506075k
Junction temperature T
j
−−150 °C
Stereo application
Output power RL = 4 ; THD = 10% P
o
20 22 W
Supply voltage ripple
rejection R
S
= 0
f = 100 Hz to 10 kHz RR 48 −−dB
DC output offset voltage |V
O
| −−150 mV Channel separation α 40 −−dB Channel unbalance |G
v
| −−1dB
Page 3
Philips Semiconductors Product specification
2 x 22 W BTL stereo car radio power amplifier
TDA1552Q
Fig.1 Block diagram.
handbook, full pagewidth
mute/stand-by
MLB952
output 1A
V
ref
x1
VA
stand-by
switch
V
P
mute switch
stand-by reference voltage
3
10
V
P1
V
P2
18 k
2
k
18 k
15 k
15 k
2
k
18 k
2
k
18 k
2
k
60 k
60 k
mute switch
VA
C
m
power stage
mute switch
VA
C
m
power stage
4
6
11
12
mute switch
VA
C
m
power stage
mute switch
VA
C
m
power stage
9
7
V
ref
258
ground (signal)
GND1 GND2
power ground (substrate)
output 2B
output 2A
not connected
output 1B
input 1
input 2
13
1
TDA1552Q
Page 4
Philips Semiconductors Product specification
2 x 22 W BTL stereo car radio power amplifier
TDA1552Q
PINNING
FUNCTIONAL DESCRIPTION
The TDA1552Q contains two identical amplifiers with differential input stages and can be used for bridge applications. The gain of each amplifier is fixed at 26 dB. A special feature of this device is:
Mute/stand-by switch
low stand-by current (< 100 µA)
low mute/stand-by switching current (low cost supply switch)
mute facility.
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
1 IP1 input 1 8 GND2 power ground 2 (substrate) 2 GND ground (signal) 9 OUT2B output 2B 3V
P1
positive supply voltage 1 10 V
P2
positive supply voltage 2 4 OUT1A output 1A 11 M/SS mute/stand-by switch 5 GND1 power ground 1 (substrate) 12 n.c. not connected 6 OUT1B output 1B 13 IP2 input 2 7 OUT2A output 2A
PARAMETER CONDITIONS SYMBOL MIN. MAX. UNIT
Supply voltage
operating V
P
18 V
non-operating V
P
30 V
load dump protected during 50 ms;
t
r
2.5 ms V
P
45 V
Non-repetitive peak output current I
OSM
6A
Repetitive peak output current I
ORM
4A
Storage temperature range T
stg
55 +150 °C
Junction temperature T
j
150 °C
AC and DC short-circuit-safe voltage V
PSC
18 V
Energy handling capability at outputs V
P
= 0 V 200 mJ
Reverse polarity V
PR
6V
Total power dissipation see Fig.2 P
tot
60 W
Page 5
Philips Semiconductors Product specification
2 x 22 W BTL stereo car radio power amplifier
TDA1552Q
Fig.2 Power derating curve.
Page 6
Philips Semiconductors Product specification
2 x 22 W BTL stereo car radio power amplifier
TDA1552Q
DC CHARACTERISTICS
V
P
= 14.4 V; T
amb
= 25 °C; measurements taken using Fig.3; unless otherwise specified
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Supply
Supply voltage range note 1 V
P
6.0 14.4 18.0 V
Total quiescent current I
tot
80 160 mA
DC output voltage note 2 V
O
6.9 V
DC output offset voltage |V
O
| −−150 mV
Mute/stand-by switch
Switch-on voltage level V
ON
8.5 −−V
Mute condition
V
mute
3.3 6.4 V
Output signal in mute V
I
= 1 V (max);
position f = 1 kHz V
O
−−2mV
DC output offset voltage
(between pins 4 to 6 and 7 to 9) |VO| −−150 mV
Stand-by condition
V
sb
0 2V
DC current in V
II
< 0.5 V I
sb
−−100 µA
stand-by condition 0.5 V V
II
< 2 V I
sb
−−500 µA
Switch-on current I
sw
25 60 µA
Supply current short-circuit
to GND note 3 I
P
5.5 mA
Page 7
Philips Semiconductors Product specification
2 x 22 W BTL stereo car radio power amplifier
TDA1552Q
AC CHARACTERISTICS
V
P
= 14.4 V; RL = 4 ; f = 1 kHz; T
amb
= 25 °C; measurements taken using Fig.3; unless otherwise specified
Notes to the characteristics
1. The circuit is DC adjusted at V
P
= 6 V to 18 V and AC operating at VP = 8.5 V to 18 V.
2. At 18 V < VP < 30 V the DC output voltage VP/2.
3. Conditions: a) V11 = 0 V b) short-circuit to GND c) switch V11 to MUTE or ON condition (rise time 10 µs).
4. Frequency response externally fixed.
5. Ripple rejection measured at the output with a source impedance of 0 (maximum ripple amplitude of 2 V).
6. Frequency f = 100 Hz.
7. Frequency between 1 kHz and 10 kHz.
8. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz.
9. Noise output voltage independent of R
S
(VI = 0 V).
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Output power THD = 0.5% P
o
15 17 W
THD = 10% P
o
20 22 W
Output power at V
P
= 13.2 V THD = 0.5% P
o
12 W
THD = 10% P
o
17 - W
Total harmonic distortion P
o
= 1 W THD 0.1 %
Power bandwidth THD = 0.5%
P
o
= 1 dB
w.r.t. 15 W B
w
- 20 to Hz 15000
Low frequency roll-off note 4
1 dB f
L
25 Hz
High frequency roll-off 1 dB f
H
20 −−kHz
Closed loop voltage gain G
v
25 26 27 dB
Supply voltage ripple rejection notes 5, 6 RR 42 −−dB
ON notes 5, 7 RR 48 −−dB mute notes 5, 6, 7 RR 48 −−dB stand-by notes 5, 6, 7 RR 80 −−dB
Input impedance |Z
i
| 506075k
Noise output voltage
(RMS value) ON R
S
= 0 ; note 8 V
no(rms)
- 70 120 µV
ON R
S
= 10 k; note 8 V
no(rms)
100 −µV
mute notes 8, 9 V
no(rms)
60 −µA
Channel separation α 40 −−dB Channel unbalance |G
v
|- 1dB
Page 8
Philips Semiconductors Product specification
2 x 22 W BTL stereo car radio power amplifier
TDA1552Q
APPLICATION INFORMATION
Fig.3 Application circuit diagram.
handbook, full pagewidth
MLB951
100
nF
mute/stand-by switch
12 11 3 10
220 nF
1
4
6
220 nF
13
9
7
58
V
P
TDA1552Q
2200 µF
14.4 V
not connected
R = 4
L
R = 4
L
60 k
60 k
reference
voltage
2
ground (signal)
input 2
input 1
power ground (substrate)
Page 9
Philips Semiconductors Product specification
2 x 22 W BTL stereo car radio power amplifier
TDA1552Q
PACKAGE OUTLINE
UNIT A e
1
A2bpcD
(1)
E
(1)
Z
(1)
deD
h
LL3m
REFERENCES
OUTLINE VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
mm
17.0
15.5
4.6
4.2
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
10 3.4
v
0.8
12.2
11.8
1.7
e
2
5.08
2.4
1.6
E
h
6
2.00
1.45
2.1
1.8
3.4
3.1
4.3
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
12.4
11.0
SOT141-6
0 5 10 mm
scale
Qj
0.25w0.03
x
D
L
E
A
c
A
2
m
L
3
Q
w M
b
p
1
d
D
Z
e
2
e
e
x
h
113
j
E
h
non-concave
view B: mounting base side
92-11-17 95-03-11
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
SOT141-6
v M
B
Page 10
July 1994 10
Philips Semiconductors Product specification
2 x 22 W BTL stereo car radio power amplifier
TDA1552Q
SOLDERING Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
(order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T
stg max
). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
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