Page 1
STP14NK60Z - STP14NK60ZFP
STB14NK60Z - STB14NK60Z-1 - STW14NK60Z
N-CHANNEL 600V-0.45Ω -13.5A TO-220/FP/D2PAK/I2PAK/TO-247
Zener-Protected SuperMESH™Power MOSFET
TYPE V
STP14NK60Z
STP14NK60ZFP
STB14NK60Z
STB14NK60Z-1
STW14NK60Z
■ TYPICAL R
■ EXTREMELY HIGHdv/dt CAPABILITY
■ 100% AVALANCHE TESTED
■ GATE CHARGE MINIMIZED
■ VERY LOW INTRINSICCAPACITANCES
■ VERY GOOD MANUFACTURING
600 V
600 V
600 V
600 V
600 V
(on) = 0.45 Ω
DS
DSS
R
DS(on)
< 0.5 Ω
< 0.5 Ω
< 0.5 Ω
< 0.5 Ω
< 0.5 Ω
I
D
13.5 A
13.5 A
13.5 A
13.5 A
13.5 A
Pw
160 W
40 W
160 W
160 W
160 W
REPEATIBILITY
DESCRIPTION
The SuperMESH™ series is obtained through an
extreme optimization of ST’s well established stripbased PowerMESH™ layout. In addition to pushing
on-resistance significantly down, special careis taken to ensure a very good dv/dt capability for the
most demanding applicat ions. Such series complements S T full range of high voltage MOSFETs i ncluding revolutionary MDm es h™ products.
TO-220 TO-220FP
3
2
1
2
1
I2PAK
D2PAK
TO-247
3
1
INTERNAL SCHEMATIC DIAGRAM
3
2
1
3
APPLICATIONS
■ HIGH CURRENT, HIGH SPEED SWITCHING
■ IDEAL FOR OFF-LINE POWER SUPPLIES,
ADAPTORS AND PFC
■ LIGHTING
ORDERING INFORMATION
SALES TYPE MARKING PACKAGE PACKAGING
STP14NK60Z P14NK60Z TO-220 TUBE
STP14NK60ZFP P14NK60ZFP TO-220FP TUBE
STB14NK60ZT4 B14NK60ZT4
STB14NK60Z-1 B14NK60Z-1
STW14NK60Z W14NK60Z TO-247 TUBE
2
PAK
D
2
I
PAK
TAPE & REEL
TUBE
1/14 January 2003
Page 2
STP14NK60Z - STP14NK60ZF P - STB14NK60Z - STB 14NK60Z- 1 - STW14NK60Z
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
STP14NK60Z STB14NK60Z
STB14NK60Z-1
STW14NK60Z
I
V
DM
P
V
DGR
V
I
I
TOT
DS
GS
D
D
Drain-source Voltage (VGS=0)
600 V
Drain-gate Voltage (RGS=20kΩ) 600
Gate- source Voltage ± 20 V
Drain Current (continuous) at TC= 25°C
Drain Current (continuous) at TC= 100°C
( )
Drain Current (pulsed) 54 54 (*) A
Total Dissipation at TC= 25°C
13.5 13.5 (*) A
8.5 8.5 (*) A
160 40 W
Derating Factor 1.28 0.32 W/°C
V
ESD(G-S)
Gate source ESD(HBM-C=100pF, R=1.5KΩ) 4000 V
dv/dt (1) Peak Diode Recovery voltage slope 4.5 V/ns
T
j
T
stg
( ) Pulse width limited by safe operating area
(1) I
≤ 13.5 A, di/dt ≤ 200 A/µs, V DD≤ V
SD
(*) Limited only by maximum temperature allowed
Operating Junction Temperature
Storage Temperature
(BR)DSS,Tj≤TJMAX.
-55 to 150 °C
STP14NK60ZFP
V
THERMAL DATA
2
TO-220/D
2
I
PAK/TO-247
PAK
TO-220FP
Rthj-case Thermal Resistance Junction-case Max 0.78 3.1 °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 62.5 50 °C/W
T
l
Maximum Lead Temperature For Soldering Purpose
300 °C
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Value Unit
I
AR
E
AS
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T
max)
j
Single Pulse Avalanche Energy
(starting T
=25°C,ID=IAR,VDD=50V)
j
12 A
300 mJ
GATE-SOURCE ZENER DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
BV
GSO
Gate-Source Breakdown
Igs=± 1mA (Open Drain) 30 V
Voltage
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES
The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s
ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be
applied from gate to source. In this respect the Zener voltage is appropriate to achie ve an efficient and
cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid t he
usage of external components.
2/14
Page 3
STP14NK60Z - STP14NK 60Z FP - STB14NK60Z - STB14N K 60Z-1 - STW14NK60Z
ELECTRICAL CHARACTERISTICS (T
=25°C UNLESS OTHERWISE SP ECIFIED)
CASE
ON/OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source
ID=1mA,VGS= 0 600 V
Breakdown Voltage
I
DSS
I
GSS
V
GS(th)
R
DS(on)
Zero Gate Voltage
Drain Current (V
GS
=0)
Gate-body Leakage
Current (V
DS
=0)
Gate Threshold Voltage
Static Drain-source On
V
= Max Rating
DS
VDS= Max Rating, TC= 125 °C
V
= ± 20 V ±10 µA
GS
V
DS=VGS,ID
= 100 µA
3 3.75 4.5 V
1
50
VGS=10V,ID= 6 A 0.45 0.5 Ω
Resistance
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
(1) Forward Transconductance VDS=15V,ID=6A 11 S
g
fs
C
oss eq.
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
(3) Equivalent Output
=25V,f=1MHz,VGS= 0 2220
V
DS
240
57
VGS=0V,VDS= 0V to 480 V 122 pF
Capacitance
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(on)
Q
Q
Q
Turn-on Delay Time
t
r
g
gs
gd
Rise Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
VDD=300V,ID=6A
RG= 4.7Ω VGS=10V
(Resistive Load see, Figure 3)
=480V,ID=12A,
V
DD
V
=10V
GS
26
18
75
13.2
38.6
µA
µA
pF
pF
pF
ns
ns
nC
nC
nC
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(off)
Turn-off Delay Time
t
f
Fall Time
VDD= 300 V, ID=6A
R
=4.7ΩV GS=10V
G
62
13
(Resistive Load see, Figure 3)
t
r(Voff)
t
t
= 480 V, ID=12A,
Off-voltage Rise Time
f
c
Fall Time
Cross-over Time
V
DD
RG=4.7Ω, V GS=10V
(Inductive Load see, Figure 5)
12
9.5
22
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
VSD(1)
t
rr
Q
rr
I
RRM
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse width limited by safe operating area.
3. C
Source-drain Current
(2)
Source-drain Current (pulsed)
Forward On Voltage
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
is defined as a constant equivalent capacitance giving the same charging time as C
oss eq.
.
V
DSS
ISD=12A,VGS=0
I
SD
VR=50V,Tj= 150°C
(see test circuit, Figure 5)
= 12 A, di/dt = 100 A/µs
664
6.8
20.5
when VDSincreases from 0 to 80%
oss
12
48
1.6 V
ns
ns
ns
ns
ns
A
A
ns
µ C
A
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Page 4
STP14NK60Z - STP14NK60ZF P - STB14NK60Z - STB 14NK60Z- 1 - STW14NK60Z
Safe Operating Area For TO-220/D2PAK/I2PAK
Safe Operating Area For TO-220FP
Thermal Impedance For TO-220/D2PAK/ I2PAK
Thermal Impedance For TO-220FP
Safe Operating Area For TO-247 Thermal Impedance For TO-247
4/14
Page 5
STP14NK60Z - STP14NK 60Z FP - STB14NK60Z - STB14N K 60Z-1 - STW14NK60Z
Output Characteristics
Transconductance Static Drain-source On Resistance
Transfer Characteristics
Gate Charge vs Gate-so urce Voltage
Capacitance Variations
5/14
Page 6
STP14NK60Z - STP14NK60ZF P - STB14NK60Z - STB 14NK60Z- 1 - STW14NK60Z
Normalized On Resistance vs Tem perature Normalized Gate Threshold Voltage vs Temp.
Source-drain Diode Forward Characteristics
Maximum Avalanche Energy vs Temperature
Normalized BVDSS vs Temperature
6/14
Page 7
STP14NK60Z - STP14NK 60Z FP - STB14NK60Z - STB14N K 60Z-1 - STW14NK60Z
Fig. 2: Unclamped Inductive Waveform Fig. 1: Unclamped Inductive Load Test Circuit
Fig. 3: Switching Times Test Circuit For
Resistive Load
Fig. 5: Test Circuit For Inductive Load Switching
And Diode Recovery T imes
Fig. 4: Gate Charge tes t Circuit
7/14
Page 8
STP14NK60Z - STP14NK60ZF P - STB14NK60Z - STB 14NK60Z- 1 - STW14NK60Z
TO-220 MECHANICAL DATA
DIM.
A 4.40 4.60 0.173 0.181
C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107
D1 1.27 0.050
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.067
F2 1.14 1.70 0.044 0.067
G 4.95 5.15 0.194 0.203
G1 2.4 2.7 0.094 0.106
H2 10.0 10.40 0.393 0.409
L2 16.4 0.645
L4 13.0 14.0 0.511 0.551
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.2 6.6 0.244 0.260
L9 3.5 3.93 0.137 0.154
DIA. 3.75 3.85 0.147 0.151
MIN. TYP. MAX. MIN. TYP. MAX.
mm inch
A
C
D
8/14
L5
Dia.
L7
D1
L6
L2
L9
F1
G1
F
H2
G
F2
L4
Page 9
STP14NK60Z - STP14NK 60Z FP - STB14NK60Z - STB14N K 60Z-1 - STW14NK60Z
TO-220FP MECHANICAL DATA
DIM.
A 4.4 4.6 0.173 0.181
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.7 0.017 0.027
F 0.75 1 0.030 0.039
F1 1.15 1.5 0.045 0.067
F2 1.15 1.5 0.045 0.067
G 4.95 5.2 0.195 0.204
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409
L2 16 0.630
L3 28.6 30.6 1.126 1.204
L4 9.8 10.6 .0385 0.417
L5 2.9 3.6 0.114 0.141
L6 15.9 16.4 0.626 0.645
L7 9 9.3 0.354 0.366
Ø 3 3.2 0.118 0.126
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
E
A
D
B
L3
L6
L7
¯
F1
F
G1
H
G
F2
123
L2
L5
L4
9/14
Page 10
STP14NK60Z - STP14NK60ZF P - STB14NK60Z - STB 14NK60Z- 1 - STW14NK60Z
D2PAK MECHANICAL DATA
DIM.
MIN. TYP MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.7 0.93 0.027 0.036
B2 1.14 1.7 0.044 0.067
C 0.45 0.6 0.017 0.023
C2 1.23 1.36 0.048 0.053
D 8.95 9.35 0.352 0.368
D1 8 0.315
E 10 10.4 0.393
E1 8.5 0.334
G 4.88 5.28 0.192 0.208
L 15 15.85 0.590 0.625
L2 1.27 1.4 0.050 0.055
L3 1.4 1.75 0.055 0.068
mm. inch
M 2.4 3.2 0.094 0.126
R 0.4 0.015
V2 0º 4º
3
10/14
1
Page 11
STP14NK60Z - STP14NK 60Z FP - STB14NK60Z - STB14N K 60Z-1 - STW14NK60Z
TO-262 (I2PAK) MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181
A1 2.49 2.69 0.098 0.106
B 0.7 0.93 0.027 0.036
B2 1.14 1.7 0.044 0.067
C 0.45 0.6 0.017 0.023
C2 1.23 1.36 0.048 0.053
D 8.95 9.35 0.352 0.368
e 2.4 2.7 0.094 0.106
E 10 10.4 0.393 0.409
L 13.1 13.6 0.515 0.531
L1 3.48 3.78 0.137 0.149
L2 1.27 1.4 0.050 0.055
mm inch
C
A
A1
C2
B2
B
e
E
L1
L2
D
L
11/14
Page 12
STP14NK60Z - STP14NK60ZF P - STB14NK60Z - STB 14NK60Z- 1 - STW14NK60Z
TO-247 MECHANICAL DATA
DIM.
A 4.85 5.15 0.19 0.20
D 2.20 2.60 0.08 0.10
E 0.40 0.80 0.015 0.03
F 1 1.40 0.04 0.05
F1 3 0.11
F2 2 0.07
F3 2 2.40 0.07 0.09
F4 3 3.40 0.11 0.13
G 10.90 0.43
H 15.45 15.75 0.60 0.62
L 19.85 20.15 0.78 0.79
L1 3.70 4.30 0.14 0.17
L2 18.50 0.72
L3 14.20 14.80 0.56 0.58
L4 34.60 1.36
L5 5.50 0.21
M 2 3 0.07 0.11
V
V2
Dia 3.55 3.65 0.14 0.143
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
5º 5º
60º 60º
12/14
Page 13
STP14NK60Z - STP14NK 60Z FP - STB14NK60Z - STB14N K 60Z-1 - STW14NK60Z
D2PAK FOOTPRINT
TAPE AND REEL SHIPMENT (suffix ”T4”)*
TUBE SHIPMENT (no suffix)*
REEL MECHANICAL DATA
DIM.
A 330 12.992
B 1.5 0.059
C 12.8 13.2 0.504 0.520
D 20.2 0795
G 24.4 26.4 0.960 1.039
N 100 3.937
T 30.4 1.197
mm inch
MIN. MAX. MIN. MAX.
TAPE MECHANICAL DATA
DIM.
A0 10.5 10.7 0.413 0.421
B0 15.7 15.9 0.618 0.626
D 1.5 1.6 0.059 0.063
D1 1.59 1.61 0.062 0.063
E 1.65 1.85 0.065 0.073
F 11.4 11.6 0.449 0.456
K0 4.8 5.0 0.189 0. 197
P0 3.9 4. 1 0.153 0.161
P1 11.9 12.1 0.468 0.476
P2 1.9 2. 1 0.075 0.082
R 50 1.574
T 0.25 0.35 0.0098 0.0137
W 23.7 24.3 0. 933 0.956
* on sales ty pe
mm inch
MIN. MAX. MIN. MAX.
BASE QTY BULK QTY
1000 1000
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Page 14
STP14NK60Z - STP14NK60ZF P - STB14NK60Z - STB 14NK60Z- 1 - STW14NK60Z
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the
consequences of u se of such inf ormat ion nor for any in fring ement of p aten ts or othe r ri ghts of th ird p arties whic h may resul t f rom
its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information
previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or
systems without express written approval of STMicroelectronics.
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