Datasheet STW13NK100Z Specification

Page 1
N-channel 1000V - 0.56Ω - 13A - TO-247
Zener - Protected SuperMESH™ PowerMOSFET
General features
V
Typ e
STW13NK100Z 1000 V < 0.70 13 A 350W
Extremely high dv/dt capability
100% avalanche tested
Very low intrinsic capacitances
Very good manufacturing repeatibility
DSS
(@Tjmax)
Description
R
DS(on)ID
P
STW11NK100Z
STW13NK100Z
W
TO-247
The SuperMESH™ series is obtained through an extreme optimization of ST’s well established strip-based PowerMESH™ layout. In addition to pushing on-resistance significantly down, special care is taken to ensure a very good dv/dt capability for the most demanding applications. Such series complements ST full range of high voltage MOSFETs including revolutionary MDmesh™ products.
Applications
Switching application
Order codes
Part number Marking Package Packaging
STW13NK100Z W13NK100Z TO-247 Tube
Internal schematic diagram
August 2006 Rev 5 1/14
www.st.com
14
Page 2
Contents STW13NK100Z
Contents
1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Protection features of gate-to-source zener diodes . . . . . . . . . . . . . . . . . . 4
2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2/14
Page 3
STW13NK100Z Electrical ratings

1 Electrical ratings

Table 1. Absolute maximum ratings

Symbol Parameter Value Unit
V
I
V
V
DM
P
DS
DGR
GS
I
D
I
D
(1)
TOT
Drain-source voltage (VGS = 0) 1000 V
Drain-gate voltage (RGS = 20KΩ) 1000 V
Gate-source voltage ± 30 V
Drain current (continuous) at TC = 25°C 13 A
Drain current (continuous) at TC=100°C 8.2 A
Drain current (pulsed) 52 A
Total dissipation at TC = 25°C 350 W
Derating Factor 2.7 W/°C
V
ESD (G-S)
dv/dt
T
J
T
stg
1. Pulse width limited by safe operating area
2. ISD 8.3 A, di/dt 200A/µs, VDD V
Gate source ESD(HBM-C=100pF, R=1,5KΩ) 6000 V
(2)
Peak diode recovery voltage slope 4 V/ns
Operating junction temperature Storage temperature
, Tj ≤ T
(BR)DSS
JMAX
-55 to 150 °C

Table 2. Thermal data

Symbol Parameter Value Unit
R
thj-case
R
thj-a
T
Thermal resistance junction-case Max 0.36 °C/W
Thermal resistance junction-ambient Max 50 °C/W
Maximum lead temperature for soldering
l
purpose
300 °C

Table 3. Avalanche characteristics

Symbol Parameter Value Unit
I
AR
E
Avalanche current, repetitive or not-repetitive (pulse width limited by Tj Max)
Single pulse avalanche energy
AS
(starting Tj=25°C, Id=Iar, Vdd=50V)
13 A
700 mJ
3/14
Page 4
Electrical ratings STW13NK100Z

Table 4. Gate-source zener diode

Symbol Parameter Test conditions Min. Typ. Max. Unit
BV
Gate-source breakdown voltage Igs=± 1mA (Open Drain) 30 V
GSO

1.1 Protection features of gate-to-source zener diodes

The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the usage of external components.
4/14
Page 5
STW13NK100Z Electrical characteristics

2 Electrical characteristics

(T
=25°C unless otherwise specified)
CASE

Table 5. On/off states

Symbol Parameter Test conditions Min. Typ. Max. Unit
V
(BR)DSS
I
DSS
I
GSS
V
GS(th)
R
DS(on)
Drain-source breakdown voltage
Zero gate voltage drain current (V
GS
= 0)
Gate body leakage current (VGS = 0)
Gate threshold voltage V
Static drain-source on resistance
= 1mA, VGS= 0 1000 V
I
D
V
= Max rating,
DS
= Max rating,
V
DS
Tc = 125°C
V
= ± 20V ±10 µA
GS
= VGS, ID = 150 µA 3 3.75 4.5 V
DS
= 10V, ID = 6.5 A 0.56 0.70
V
GS
1
10

Table 6. Dynamic

Symbol Parameter Test conditions Min. Typ. Max. Unit
(1)
g
fs
C
C
C
C
osseq
t
d(on)
t
d(off)
Q Q Q
1. Pulsed: pulse duration=300µs, duty cycle 1.5%
2. C
oss eq.
increases from 0 to 80% V
Forward transconductance V
Input capacitance
iss
Output capacitance
oss
Reverse transfer
rss
capacitance
Equivalent output
(2)
.
capacitance
Turn-on delay time
t
Rise time
r
Off-voltage rise time
t
Fall time
f
Total gate charge
g
Gate-source charge
gs
Gate-drain charge
gd
is defined as a constant equivalent capacitance giving the same charging time as C
DSS
=15V, ID = 6.5 A 14 S
DS
=25V, f=1 MHz, VGS=0
V
DS
=0, V
V
GS
=500 V, ID= 7A,
V
DD
=4.7Ω, VGS=10V
R
G
=0V to 800V 227 pF
DS
(see Figure 16)
=800V, ID = 13A
V
DD
=10V
V
GS
6000
455 100
45 35
145
45
190
30
100
266 nC
when VDS
oss
µA µA
pF pF pF
ns ns ns ns
nC nC
5/14
Page 6
Electrical characteristics STW13NK100Z

Table 7. Source drain diode

Symbol Parameter Test conditions Min Typ. Max Unit
I
SD
I
SDM
V
SD
t
Q
I
RRM
t
Q
I
RRM
1. Pulse width limited by safe operating area
2. Pulsed: pulse duration=300µs, duty cycle 1.5%
Source-drain current 13 A
(1)
Source-drain current (pulsed) 52 A
(2)
Forward on voltage ISD=8.3A, VGS=0 1.6 V
Reverse recovery time
rr
Reverse recovery charge
rr
Reverse recovery current
Reverse recovery time
rr
Reverse recovery charge
rr
Reverse recovery current
=13 A,
I
SD
di/dt = 100A/µs,
=100 V, Tj=25°C
V
DD
(see Figure 18)
=13 A,
I
SD
di/dt = 100A/µs,
=100V, Tj=150°C
V
DD
(see Figure 18)
820
12.7 31
1050
17.8 34
ns µC
A
ns µC
A
6/14
Page 7
STW13NK100Z Electrical characteristics

2.1 Electrical characteristics (curves)

Figure 1. Safe operating area Figure 2. Thermal impedance
Figure 3. Output characterisics Figure 4. Transfer characteristics
7/14
Page 8
Electrical characteristics STW13NK100Z
Figure 5. Transconductance Figure 6. Static drain-source on resistance
Figure 7. Gate charge vs gate-source voltage Figure 8. Capacitance variations
Figure 9. Normalized gate threshold voltage
8/14
vs temperature
Figure 10. Normalized on resistance vs
temperature
Page 9
STW13NK100Z Electrical characteristics
Figure 11. Source-drain diode forward
characteristics
Figure 13. Maximum avalanche
energy vs temperature
Figure 12. Normalized B
vs temperature
VDSS
9/14
Page 10
Test circuit STW13NK100Z

3 Test circuit

Figure 14. Unclamped Inductive load test
circuit
Figure 16. Switching times test circuit for
resistive load

Figure 15. Unclamped Inductive waveform

Figure 17. Gate charge test circuit

Figure 18. Test circuit for inductive load
switching and diode recovery times
10/14
Page 11
STW13NK100Z Package mechanical data

4 Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
11/14
Page 12
Package mechanical data STW13NK100Z
TO-247 MECHANICAL DATA
DIM.
A 4.85 5.15 0.19 0.2 0
A1 2.20 2.60 0.086 0.102
b 1.0 1.40 0.039 0.055
b1 2.0 2.40 0.079 0.094
b2 3.0 3.40 0.118 0.134
c 0.40 0.80 0.015 0.03
D 19.85 20.15 0.781 0.793
E 15.45 15.75 0.608 0.620
e5.45 0.214
L 14.20 14.80 0.560 0.582
L1 3.70 4.30 0.14 0.17
L2 18.50 0.728
øP 3.55 3.65 0 .140 0.143
øR 4.50 5.50 0.17 7 0.216
S5.50 0.216
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
12/14
Page 13
STW13NK100Z Revision history

5 Revision history

Table 8. Revision history

Date Revision Changes
22-Jun-2004 1 Target document
09-Sep-2004 2 Preliminary document
28-Jan-2005 3 Complete version with curves
18-Sep-2005 4 Figure 12 changed
01-Aug-2006 5 New template, no content change
13/14
Page 14
STW13NK100Z
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2006 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
14/14
Loading...