DYNDynamic Output Signal (out 1)VCC= 5V2,5V
DYNDynamic Output Signal (out 1)VCC= 4.75V2,3V
DYNDynamic Output Signal (out 2,3)VCC=5V
BW00dB Gain Bandwidth at -3dBVIN=1V
BW66dB Gain Bandwidth at - 3dBV
CT*Crosstalk between Input 1, 2, 3, 5 and Output 2,3V
CT*Crosstalk between Input 4, and Output 2,3V
CT*Crosstalk between Input 1, 2, 3, 5 and Output 1V
CT*Crosstalk between Input 4 and Output 1V
Z
OUT
G
0
G
6
DCOUTDC Output Voltage0.7V
DPH10Differential Phase 0dB OutputV
DPHL6Differential Phase 6dB OutputV
DGAIN0Differential Gain 0dB OutputV
DGAIN6Differential Gain 6dB OutputV
Low Level Output VoltageI = 3 mA0,4V
Output Resistance at High Level30kΩ
70
100
3
2.8
1023MHz
1019MHz
0.25
0.5
1.5%
1.8%
CC
o
C/W
o
C/W
6400-02.TBL
PP
PP
PP
PP
V
PP
V
PP
V
6400-03.TBL
3/9
Page 4
STV6400
2
I
C BUS CHARACTERISTICS
SymbolParameterTest ConditionsMin.Max.Unit
SCL
V
Low Level Input Voltage- 0.3+ 1.5V
IL
V
f
SDA
V
V
V
TIMING
t
LOW
t
HIGH
t
SU, DAT
t
HD, DAT
t
SU, STO
t
t
HD, STA
t
SU, STA
High Level Input Voltage3.0VCC+ 0.5V
IH
I
Input Leakage CurrentVI= 0 to V
LI
Clock Frequency0100kHz
SCL
t
Input Rise Time1.5V to 3V1000ns
R
t
Input Fall Time1.5V to 3V300ns
F
Input Capacitance10pF
C
I
Low Level Input Voltage- 0.3+ 1.5V
IL
High Level Input Voltage3.0VCC+ 0.5V
IH
I
Input Leakage CurrentVI= 0 to V
LI
C
Input Capacitance10pF
I
Input Rise Time1.5V to 3V1000ns
t
R
t
Input Fall Time1.5V to 3V300ns
F
Low Level Output VoltageIOL= 3mA0.4V
OL
Output Fall Time3V to 1.5V250ns
t
F
C
Load Capacitance400pF
L
CC
CC
-10+10µA
-10+10µA
Clock Low Period4.7µs
Clock High Period4.0µs
Data Set-up Time250ns
Data Hold Time0340ns
Set-up Time from Clock High to Stop4.0µs
Start Set-up Time following a Stop4.7µs
BUF
Start Hold Time4.0µs
Start Set-up Time following Clock Low-to High Transition4.7µs
6400-04.TBL
Figure 1 : I2C BusTiming
SDA
t
BUF
SCL
SDA
4/9
t
HD,STA
t
LOW
t
r
t
SU,STAt
t
HD,DAT
t
HIGH
t
f
t
SU,DAT
SU,STO
6400-03.EPS
Page 5
SOFTWARE SPECIFICATION
2
C Address Byte
I
92 HEXA
DATABYTE
B7B6B5B4B3B2B1B0
XX00
XX01
XX10
XX11
0
0
0
0
1
1
1
1
X
X
X
X
X
X
X
X
X
X
1/0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
X
1/0
X
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1/0
X
X
Remark : The letter ”X” meansdont’t care.
Example : XX00X100means.The switch 1 is connected to Videoinput 5
Example : XX11X011means.Digital buffer 1 is at high level
Digital buffer 2is at high level
Digital buffer 3is at low level
STV6400
SWITCH1
POSITION 1 VIDEO IN 1
POSITION 2 VIDEO IN 2
POSITION 3 VIDEO IN 3
POSITION 4 VIDEO IN 4
POSITION 5 VIDEO IN 5
POSITION 6 MUTE
NOT ALLOWED
NOT ALLOWED
SWITCH2
POSITION 1 VIDEO IN 3
POSITION 2 VIDEO IN 4
POSITION 3 VIDEO IN 5
NOT ALLOWED
SWITCH2
POSITION 1 VIDEO IN 1
POSITION 2 VIDEO IN 2
POSITION 3 VIDEO IN 4
POSITION 4 VIDEO IN 5
The starting conditionupon power-on is undetermined.
In this case 4 words of 16 bits are necessary to fix the deviceconfiguration.
In other case only oneword of 16 bits is necessaryto modifyone configurationof the device.
5/9
Page 6
STV6400
INPUT/OUTPUTPIN CONFIGURATION
Pins 4-6-8-10-12 Video Input
Pins 4-6
8-10-12
Pins 5-7-13 Digital Buffer Output
Pins 5
7-13
Pins 9 -11 Bus Inputs
ESD
PROT
Pins
9-11
SDA
only
6400-04.EPS
6400-06.EPS
Pins3-14 SupplyVoltage
3
V
30kΩ
CC
GROUND
14
CIRCUIT
ESD
PROT
Pins 2-15-16-18-19-20 Video Outputs and PV
Pins 18
19-20
4pF
1pF
5.4k
5kΩ
Ω
Pins 2
CC
15-16
6400-05.EPS
6400-08.EPS
6400-07.EPS
6/9
Page 7
TYPICALAPPLICATION
POWER
V
CC
STV6400
V
CC
GNDSDASCL
TUNER
OUT2
PERITV1
OUT3
PERITV2
CAMCORDER
SATELLITE
DECODER
A = -6dBG = 0dB
IN1
IN2
IN3
IN4
IN5
6dB
6dB
A
STV6400
Mute
2
IC
DECODER
G
DIGITAL
BUFFER
DIGITAL
BUFFER
DIGITAL
BUFFER
OUT1
PROCESSING
TO AUDIO
CMOS
SWITCHING
MAIN
6400-09.EPS
7/9
Page 8
STV6400
PACKAGE MECHANICALDATA
20 PINS- PLASTICDIP20 (0.25)
PM-DIP20.EPS
Dimensions
Min.Typ.Max.Min.Typ.Max.
MillimetersInches
a10.2540.010
B1.391.650.0550.065
b0.450.018
b10.250.010
D25.41.000
E8.50.335
e2.540.100
e322.860.900
F7.10.280
I3.930.155
L3.30.130
Z1.340.053
DIP20.TBL
8/9
Page 9
PACKAGE MECHANICALDATA
20 PINS- PLASTICMICROPACKAGE (SO)
STV6400
PM-SO20.EPS
Dimensions
Min.Typ.Max.Min.Typ.Max.
MillimetersInches
A2.650.104
a10.10.30.0040.012
a22.450.096
b0.350.490.0140.019
b10.230.320.0090.013
C0.50.020
c145
o
(typ.)
D12.613.00.4960.512
E1010.650.3940.419
e1.270.050
e311.430.450
F7.47.60.2910.299
L0.51.270.0200.050
M0.750.030
S8
Information furnished is believed to be accurateand reliable. However, SGS-THOMSON Microelectronicsassumes no responsibility
for the consequences of use of such information nor for any infringement ofpatents or other rights of third partieswhich may result
from its use. No licence isgranted by implication or otherwise under any patentor patent rights of SGS-THOMSON Microelectronics.
Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life
support devices or systems without express written approval of SGS-THOMSON Microelectronics.
1996 SGS-THOMSON Microelectronics - All Rights Reserved
Purchase of I
2
I
C Patent. Rights to use these components in a I2C system,is granted provided that the system conformsto
Australia - Brazil -Canada - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco
The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
2
C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips
2
the I
C Standard Specifications as defined by Philips.
SGS-THOMSON Microelectronics GROUP OF COMPANIES
o
(Max.)
SO20.TBL
9/9
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