Datasheet STPR320 Datasheet (SGS Thomson Microelectronics)

Page 1
ULTRA-FASTRECOVERY RECTIFIER DIODES
MAINPRODUCTCHARACTERISTICS
STPR320
I
F(AV)
V
RRM
3A
200 V
Tj (max) 150°C
(max) 0.99 V
V
F
trr (max) 30 ns
FEATURES
SUITEDFORSMPS LOWLOSSES LOW FORWARD AND REVERSERECOVERY
TIME HIGHSURGECURRENT CAPABILITY
DESCRIPTION
Low cost single chip rectifier suited for Switched Mode Power Supplies and high frequency DC to DCconverters.
Packagedin F126, this device is intended for use in low voltage, high frequency inverters, free wheelingandpolarityprotectionapplications.
F126
(JEDECDO-204AC)
ABSOLUTE MAXIMUM (limitingvalues)
Symbol Parameter Value Unit
V
RRM
I
F(AV)
Repetitivepeak reverse voltage 200 V Averageforwardcurrent Tl=60°C
3A
δ = 0.5
I
FSM
Surge non repetitiveforwardcurrent tp=10ms
30 A
sinusoidal
T
stg
Storagetemperaturerange - 65 to + 150 °C
Tj Maximumoperating junctiontemperature 150 °C
October 1999-Ed:1A
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STPR320
THERMAL RESISTANCE
Symbol Parameter Value Unit
R
th(j-l)
Junctionlead(L=5mm) 25 °C/W
STATICELECTRICAL CHARACTERISTICS
Symbol Parameters Test conditions Min. Typ. Max. Unit
I
*
R
Reverseleakage current
V
F**
Forwardvoltage drop
Pulse test : * tp= 5ms, δ <2%
** tp = 380 µs, δ <2%
T
=25°CV
j
T
= 100°C
j
R=VRRM
0.2 0.5 mA
10 µA
Tj= 125°CIF=3 A 0.8 0.99 V
= 125°CIF=6 A 0.95 1.20
T
j
=25°CI
T
j
=6 A 1.25
F
Toevaluate the conductionlossesuse the following equation: P= 0.78x I
F(AV)
+ 0.070 x I
F2(RMS)
RECOVERYCHARACTERISTICS
Symbol Test conditions Min. Typ. Max. Unit
trr T
tfr T
V
FP
Tj=25°CI
=25°CI
j
=25°CI
j
=0.5A
F
I
=1A
R
=3A
F
= 1.1x VFmax
V
FR
=3A dIF/dt = 50 A/µs3 V
F
Irr= 0.25A 30 ns
dI
/dt = 50 A/µs20ns
F
Fig. 1 :
Averageforward power dissipation versus
averageforwardcurrent.
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Fig. 2 :
Peakcurrentversus form factor.
Page 3
Fig. 3:
Average current versus ambient temperature(δ : 0.5) * circuit board e (Cu) = 35µm, S (cu) = 12mm L
(LEADS )
= 20mm
Fig. 4:
versusoverloadduration(maximum values).
2
Non repetitive surge peak forward current
STPR320
IF(av)(A)
3.5
3.0 Rth(j-a)=Rth(j-l)
2.5
2.0
1.5
1.0 Rth(j-a)=90 C/w *
0.5
0.0
0 25 50 75 100 125 150
Fig. 5:
Relative variation of thermal transient
o
=0.5
=tp/T
T
tp
impedancejunctionto caseversuspulse duration.
K=Zth(j-l)/Rth(j-l)
1
=0.5
=0.2
=0.1
0.1
IM(A)
20 18 16 14 12 10
8 6 4 2 0
0.001 0.01 0.1 1 10
Fig. 6:
Forward voltage drop versus forward
IM
=0.5
Tl=25 C
Tl=60 C
t(s)
current(maximum values).
o
o
T
SINGLE PULSE
0.01
tp(s)
=tp/T
0.001 0.01 0.1 1 10
Fig 7:
Junction capacitance versus reverse
voltageapplied(typicalvalues).
tp
Fig. 8:
H
RecoverychargesversusdI
F
/dt.
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Page 4
STPR320
Fig. 9: Peak reversecurrentversus dIF/dt.
Fig. 10: Dynamic parameters versus junction
temperature.
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PACKAGEMECHANICAL DATA
F126
STPR320
D
DIMENSIONS
REF.
A 6.05 6.20 6.35 0.238 0.244 0.250 B 2.95 3.00 3.05 0.116 0.118 0.120 C 26 31 1.024 1.220 D 0.76 0.81 0.86 0.030 0.032 0.034
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A
CC
D
B
Orderingtype Marking Package Weight Base qty
Delivery
mode
STPR320 STPR320 F126 0.4g 1000 Ammopack
Coolingmethod: by conduction(C) EpoxymeetsUL94,V0
Informationfurnishedis believed to be accurateandreliable.However, STMicroelectronics assumes no responsibility for the consequences of use ofsuch informationnor forany infringementofpatents or other rights ofthird parties which may result from itsuse.No license is grantedby implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice.Thispublicationsupersedesandreplaces all informationpreviously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap­proval of STMicroelectronics.
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