Datasheet STP9NC65FP, STP9NC65 Datasheet (SGS Thomson Microelectronics)

Page 1
STP9NC65
STP9NC65FP
N-CHANNEL 650V - 0.75- 8A TO-220/TO-220FP
PowerMesh™II MOSFET
TYPE V
DSS
STP9NC65 650 V < 0.90 STP9NC65FP 650 V < 0.90
TYPICAL R
100% AVALANCHE TESTED
NEW HIGH VOLTAGE BENCHMARK
GATE CHARGE MINIMIZED
(on) = 0.75
DS
R
DS(on)
I
D
Ω Ω
8 A 8 A
DESCRIPTION
The PowerMESH generation of MESH OVERLAY
II is the evolution of the first
™. The layout re-
finements introduced greatly improve the Ron*area figure of merit while keeping the device at the lea d­ing edge for what concerns swithing speed, gate charge and ruggedness.
APPLICATIONS
HIGH CURRENT, HIGH SPEED SWITCHING
SWITH MODE POWER SUPPLI ES ( SMPS)
DC-AC CONVERTERS FOR WELDING
EQUIPMENT AND UNINTERRUPTIBLE POWER SUPPLIES AND MOTOR DRIVES
TO-220 TO-220FP
(Available Upon Request)
INTERNAL SCHEMATIC DIAGRAM
3
2
1
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
STP9NC65 STP9NC65FP
V
DS
V
DGR
V
GS
I
D
I
D
I
DM
P
TOT
dv/dt (1) Peak Diode Recovery voltage slope 3.5 V/ns
V
ISO
T
stg
T
j
(•)Pu l se width limite d by safe operating area (*) Limited only by maximum temperature allowed
Drain-source Voltage (VGS = 0) Drain-gate Voltage (RGS = 20 kΩ)
650 V 650 V
Gate- source Voltage ±30 V
Drain Current (continuos) at TC = 25°C Drain Current (continuos) at TC = 100°C
()
Drain Current (pulsed) 32 32(*) A Total Dissipation at TC = 25°C
8 8(*) A 5 5(*) A
140 40 W
Derating Factor 1.12 0.32 W/°C
Insulation Withstand Voltage (DC) - 2000 V Storage Temperature –65 to 150 °C Max. Operating Junction Temperature 150 °C
(1)ISD ≤8A, di/dt ≤100A/µs, VDD ≤ V
(BR)DSS
, Tj ≤ T
JMAX.
1/9February 2001
Page 2
STP9NC65/FP
THERMA L D ATA
TO-220 TO-220FP
Rthj-case Thermal Resistance Junction-case Max 0.89 3.12 °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 62.5 °C/W
Rthc-sink Thermal Resistance Case-sink Typ 0.5 °C/W
T
l
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Value Unit
I
AR
E
AS
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED) OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
I
DSS
I
GSS
Maximum Lead Temperature For Soldering Purpose 300 °C
Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by T
max)
j
Single Pulse Avalanche Energy (starting T
Drain-source
= 25 °C, ID = IAR, VDD = 50 V)
j
ID = 250 µA, VGS = 0 650 V
8A
850 mJ
Breakdown Voltage
= Max Rating
Zero Gate Voltage Drain Current (V
GS
Gate-body Leakage Current (V
DS
= 0)
= 0)
V
DS
V
= Max Rating, TC = 125 °C
DS
V
= ±30V ±100 nA
GS
A
50 µA
ON
(1)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
V
GS(th)
R
DS(on)
Gate Threshold Voltage Static Drain-source On
= VGS, ID = 250µA
DS
VGS = 10V, ID = 4.5 A
234V
0.75 0.90
Resistance
I
D(on)
On State Drain Current VDS > I
D(on)
x R
DS(on)max,
8A
VGS=10V
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
(1) Forward Transconductance VDS > I
g
fs
C
iss
C
oss
C
rss
Input Capacitance Output Capacitance 196 pF Reverse Transfer
Capacitance
ID= 4.5A
V
DS
D(on)
x R
DS(on)max,
= 25V, f = 1 MHz, VGS = 0
10 S
1400 pF
31 pF
2/9
Page 3
STP9NC65/FP
ELECTRICAL CHARACTERISTICS (CONTINUED)
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
t
d(on)
Q Q Q
t
r
g gs gd
Turn-on Delay Time Rise Time 15 ns Total Gate Charge
Gate-Source Charge 10.5 nC Gate-Drain Charge 19.5 nC
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(off)
t
t
r(Voff)
t
t
f
f
c
Turn-Off Delay Time Fall Time 30 ns Off-voltage Rise Time
Fall Time 12 ns Cross-over Time 24 ns
= 325 V, ID = 4.5 A
DD
RG= 4.7Ω VGS = 10 V (see test circuit, Figure 3)
V
= 520V, ID = 9 A,
DD
VGS = 10V
V
= 325V, ID = 4.5 A,
DD
RG=4.7Ω, V
GS
= 10V
(see test circuit, Figure 3) V
= 520V, ID = 9 A,
DD
R
=4.7Ω, V
G
GS
= 10V
(see test circuit, Figure 5)
28 ns
44 62 nC
53 ns
15 ns
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
VSD (1)
t
rr
Q
rr
I
RRM
Note: 1. Pulsed: Pu l se duration = 300 µs, duty cyc l e 1.5 %.
2. Pulse width li mited by safe operating area.
Source-drain Current 8 A
(2)
Source-drain Current (pulsed) 32 A Forward On Voltage Reverse Recovery Time
Reverse Recovery Charge 5.14 µC
ISD = 8 A, VGS = 0 I
= 9 A, di/dt = 100A/µs
SD
V
= 100V, Tj = 150°C
DD
(see test circuit, Figure 5)
610 ns
Reverse Recovery Current 17 A
1.6 V
Safe Operating Area for TO-220 Safe Operating Area for TO-220FP
3/9
Page 4
STP9NC65/FP
Thermal Impedance for TO-220
Output Characteristics
Thermal Impedance for TO-220FP
Transfer Characteristics
Transconductance Static Drain-source On Resistance
4/9
Page 5
STP9NC65/FP
Gate Charge vs Gate-source Voltage
Normalized Gate Thereshold Voltage vs Temp. Normalized On Resistance vs Temperature
Capacitance Variations
Source-drain Diode Forward Characteristics
5/9
Page 6
STP9NC65/FP
Fig. 2: Unclamped Inductive WaveformFig. 1: Unclamped Inductive Load Test Circuit
Fig. 3: Switching Times Test Circuit For
Resistive Load
Fig. 5: Test Circuit For Inductive Load Switching And Diode Recovery Times
Fig. 4: Gate Charge test Circuit
6/9
Page 7
E
TO-220 MECHANICAL DATA
STP9NC65/FP
DIM.
A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107
D1 1.27 0.050
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.067 F2 1.14 1.70 0.044 0.067
G 4.95 5.15 0.194 0.203 G1 2.4 2.7 0.094 0.106 H2 10.0 10.40 0.393 0.409 L2 16.4 0.645 L4 13.0 14.0 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.2 6.6 0.244 0.260 L9 3.5 3.93 0.137 0.154
DIA. 3.75 3.85 0.147 0.151
MIN. TYP. MAX. MIN. TYP. MAX.
mm inch
A
C
D
L5
Dia.
L7
D1
L6
L2
L9
F1
G1
F
H2
G
F2
L4
P011C
7/9
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STP9NC65/FP
TO-220FP MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.7 0.017 0.027
F 0.75 1 0.030 0.039 F1 1.15 1.7 0.045 0.067 F2 1.15 1.7 0.045 0.067
G 4.95 5.2 0.195 0.204 G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409 L2 16 0.630 L3 28.6 30.6 1.126 1.204 L4 9.8 10.6 0.385 0.417 L6 15.9 16.4 0.626 0.645 L7 9 9.3 0.354 0.366
Ø 3 3.2 0.118 0.126
mm inch
E
A
D
8/9
B
L3
L6
L7
¯
F1
F
G1
H
G
F2
123
L2
L4
Page 9
STP9NC65/FP
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