This Power MOSFET is the second generation of
STMicroelectronics unique “ STripFET™” technology.The resulting transistor shows extremely low onresistance and minimal gate charge. The new PowerFLAT™ package allows a significant reduction in
board space without compromising performance.
APPLICATIONS
■ DC-DC CONVERTERS
PowerFLAT™(5x5)
(Chip Scale Package)
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
SymbolParameterValueUnit
V
DS
V
DGR
V
GS
I
(#)Drain Current (continuos) at TC= 25°C
D
I
DM
P
TOT
E
AS
T
stg
T
j
(●) Pulse width limited by safe operating area
(#) Limited by Wire Bonding
November 2002
Drain-source Voltage (VGS=0)
Drain-gate Voltage (RGS=20kΩ)
Gate- source Voltage± 16V
Drain Current (continuos) at TC= 100°C
()
Drain Current (pulsed)112A
Total Dissipation at TC= 25°C
Derating Factor0.64W/°C
(1)
Single Pulse Avalanche Energy2J
Storage Temperature
Max. Operating Junction Temperature
Source-drain Current (pulsed)112A
Forward On Voltage
Reverse Recovery Time
Reverse Recovery
ChargeReverse Recovery
Current
=15V,ID=14A
DD
= 4.7Ω VGS=4.5V
R
G
(see test circuit, Figure 3)
VDD=15V,ID=28A,
V
=5V
GS
VDD=15V,ID=14A,
RG=4.7Ω, VGS= 4.5 V
(see test circuit, Figure 3)
ISD=28A,VGS=0
= 28 A, di/dt = 100A/µs,
I
SD
V
=25V,Tj= 150°C
DD
(see test circuit, Figure 5)
25ns
32
43nC
13
18
42
35
1.2V
50
82
3.3
nC
nC
ns
ns
ns
nC
A
3/6
Page 4
STL28NF3LL
Fig. 2: Unclam ped Inductive WaveformFig. 1: Unclamped Inducti ve Load T es t Circuit
Fig. 3: Switching Times Test Circuit For
Resistive Load
Fig. 5: Test Circuit For Inductive Load Switching
And Diode Recovery Times
Fig. 4: Gate Charge test Circuit
4/6
Page 5
STL28NF3LL
PowerFLAT™(5x5) MECHANICAL DATA
DIM.
MIN.TYPMAX.MIN.TYP.MAX.
A0.901.000.0350.039
A10.020.050.0010.002
b0.430.510.580.0170.0200.023
c0.330.410.480.0130.0160.019
D5.000.197
E5.000.197
E23.103.183.250.1220.1250.128
e1.270.050
mm.inch
5/6
Page 6
STL28NF3LL
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility f or the
consequences of use of su ch in formation nor for any in fringement of paten ts or o ther rights of third parties w hich may result from
its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information
previously suppli ed. STMi croelect ronics pr oducts are not author ized for use as c ritical component s in li fe suppo rt devi ces or
systems without express written approval of STMicroelectronics.
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