Datasheet STL28NF3LL Datasheet (SGS Thomson Microelectronics)

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STL28NF3LL
N-CHANNEL 30V - 0.0055-28APowerFLAT™
LOW GATE CHARGE STripFET™ MOSFET
PRELIMINARY DATA
TYPE V
STL28NF3LL 30 V < 0.0065 28 A
TYPICAL R
IMPROVED DIE-TO-FOOTPRINT RATIO
VERY LOW PROFILE PACKAGE
DS
DSS
(on) = 0.0055
R
DS(on)
I
D
DESCRIPTION
This Power MOSFET is the second generation of STMicroelectronics unique “ STripFET™” technolo­gy.The resulting transistor shows extremely low on­resistance and minimal gate charge. The new Pow­erFLAT™ package allows a significant reduction in board space without compromising performance.
APPLICATIONS
DC-DC CONVERTERS
PowerFLAT™(5x5)
(Chip Scale Package)
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
DS
V
DGR
V
GS
I
(#) Drain Current (continuos) at TC= 25°C
D
I
DM
P
TOT
E
AS
T
stg
T
j
() Pulse width limited by safe operating area (#) Limited by Wire Bonding
November 2002
Drain-source Voltage (VGS=0) Drain-gate Voltage (RGS=20kΩ) Gate- source Voltage ± 16 V
Drain Current (continuos) at TC= 100°C
()
Drain Current (pulsed) 112 A Total Dissipation at TC= 25°C Derating Factor 0.64 W/°C
(1)
Single Pulse Avalanche Energy 2 J Storage Temperature Max. Operating Junction Temperature
(1) Starting Tj= 25°C, ID= 14A, VDD=18V
30 V 30 V
28
17.5
80 W
–55 to 150 °C
A A
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STL28NF3LL
THERMAL DATA
Rthj-case Thermal Resistance Junction-case Max 1.56 °C/W
Rthj-pcb (#) Thermal Resistance Junction-ambient Max 31.2 °C/W
(*) When mounted on 1inch² FR4 Board, 2oz of Cu, t10 sec.
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED) OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source Breakdown Voltage
I
DSS
I
GSS
Zero Gate Voltage Drain Current (V
GS
Gate-body Leakage Current (V
DS
=0)
=0)
ON (1)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GS(th)
R
DS(on)
Gate Threshold Voltage Static Drain-source On
Resistance
ID= 250 µA, VGS= 0 30 V
V
= Max Rating
DS
VDS= Max Rating, TC= 125 °C V
= ± 16V ±100 nA
GS
V
DS=VGS,ID
VGS=10V,ID=14A
= 4.5 V, ID= 14A
V
GS
= 250µA
1V
0.0055 0.0065
0.0065 0.0095
A
10 µA
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
(1) Forward Transconductance VDS=15V,ID=14A 32 S
g
fs
C
iss
C
oss
C
rss
Input Capacitance Output Capacitance 890 pF Reverse Transfer
Capacitance
V
=25V,f=1MHz,VGS=0
DS
2780 pF
195 pF
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STL28NF3LL
ELECTRICAL CHARACTERISTICS (CONTINUED)
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
t
d(on)
Q Q Q
t
r
g gs gd
Turn-on Delay Time Rise Time 82 ns Total Gate Charge
Gate-Source Charge Gate-Drain Charge
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(off)
t
f
Turn-off-Delay Time Fall Time
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
VSD(1)
t
rr
Q
rr
I
RRM
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse width limited by safe operating area.
Source-drain Current 28 A
(2)
Source-drain Current (pulsed) 112 A Forward On Voltage Reverse Recovery Time
Reverse Recovery ChargeReverse Recovery Current
=15V,ID=14A
DD
= 4.7VGS=4.5V
R
G
(see test circuit, Figure 3) VDD=15V,ID=28A,
V
=5V
GS
VDD=15V,ID=14A, RG=4.7Ω, VGS= 4.5 V (see test circuit, Figure 3)
ISD=28A,VGS=0
= 28 A, di/dt = 100A/µs,
I
SD
V
=25V,Tj= 150°C
DD
(see test circuit, Figure 5)
25 ns
32
43 nC 13 18
42 35
1.2 V
50 82
3.3
nC nC
ns ns
ns
nC
A
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STL28NF3LL
Fig. 2: Unclam ped Inductive WaveformFig. 1: Unclamped Inducti ve Load T es t Circuit
Fig. 3: Switching Times Test Circuit For
Resistive Load
Fig. 5: Test Circuit For Inductive Load Switching And Diode Recovery Times
Fig. 4: Gate Charge test Circuit
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STL28NF3LL
PowerFLAT(5x5) MECHANICAL DATA
DIM.
MIN. TYP MAX. MIN. TYP. MAX.
A 0.90 1.00 0.035 0.039
A1 0.02 0.05 0.001 0.002
b 0.43 0.51 0.58 0.017 0.020 0.023
c 0.33 0.41 0.48 0.013 0.016 0.019
D 5.00 0.197
E 5.00 0.197
E2 3.10 3.18 3.25 0.122 0.125 0.128
e 1.27 0.050
mm. inch
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STL28NF3LL
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility f or the consequences of use of su ch in formation nor for any in fringement of paten ts or o ther rights of third parties w hich may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously suppli ed. STMi croelect ronics pr oducts are not author ized for use as c ritical component s in li fe suppo rt devi ces or systems without express written approval of STMicroelectronics.
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