Page 1
Ordering number : EN6030
SPI-336-99-T1
Ultraminiature photoreflector supporting reflow soldering
(Single transistor type)
Features
• Infrared LED plus Phototransistor (single)
• DIP type
• Compact type : 3.4 (L) ✕ 2.7 (W) ✕ 1.5 (H) mm
• Visible light cut type
• Taping type
Absolute Maximum Ratings at Ta=25°C, 65%RH (as per JIS C7032)
Parameter Symbol Rating Unit
Input LED
Output
Phototransistor
Forward Current I
Reverse Voltage V
Power Dissipation P
Collector-Emitter Voltage V
Emitter-Collector Voltage V
Collector Curren I
Power Dissipation P
Operating Temperature Topr --20 to +80 °C
Storage Temperature Tstg --30 to +100 °C
F
R
D
CEO
ECO
C
C
Infrared LED
SPI-336-99-T1
50 mA
5V
70 mW
20 V
5V
20 mA
70 mW
Electro-Optical Characteristics at Ta=25°C, 65%RH
Parameter Symbol Condition Min. Typ. Max. Unit
Input
Output Dark Current I
Forward Voltage V
Reverse Current I
CEO
Collector Output I
Coupled
Leakage Current I
Collector Emitter VCE(sat) IF=10mA, IC=50µA -- -- 0.5 V
LEAKIF
Rise Time tr
Fall Time tf
1
*
Location of reflector is shown in Fig. 1.
2
*
No reflector
3
*
Table of Classification of Collector Output
Class A B C D
Ic (µA) 1100 to 450 600 to 260 350 to 150 200 to 80
IF=10mA 1.0 1.2 1.6 V
F
VR= 5 V -- -- 1 0 µ A
R
IF=0mA, VCE=10V -- -- 200 nA
IF=10mA, VCE=5V
C
=10mA, VCE=5V
VCC=5V, RL=100Ω
IC=1mA
1
*
2
*
80 - - 1100 µA
-- -- 1 µA
-- 5 -- µs
-- 5 -- µs
Fig. 1 Location of Reflector
AL V .E. film
Glass plate (t=1mm)
SANYO Electric Co.,Ltd. Semiconductor Company
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN
72199 GI, (MI
)
No.6030 1/6
Page 2
SPI-336-99-T1
Typical Characteristics
CAUTION
These numerical value show the electrical and optical characteristics of this product, and not assure this contents.
Forward Current vs. Ambient Temperature
60
50
(mA)Collector Current I
40
F
30
20
Forward Current I
10
0
--25 0 25 50 75 100
Ambient Temperature Ta (°C)
Forward Current vs. Forward Voltage
500
Ta=75°C
50°C
25°C
0°C
--25°C
(mA)
F
100
50
Power Dissipation vs. Ambient Temperature
(Rating) (Rating)
120
100
80
60
40
Power Dissipation P (mW)Relative Collector Current (%)
20
0
--25 0 25 50 75 100
Ambient Temperature Ta (°C)
Collector vs. Forward Current
500
V
=5V
CE
Ta=25°C
400
(µA)
C
300
10
Forward Current I
5
1
0 0.5 1 1.5 2
Forward Voltage VF (V)
Collector Current vs. Collector-emitter Voltage
1000
Ta=25°C
800
(µA)
C
600
400
200
0
0510
Collector-emitter Voltage VCE (V)
IF=20mA
15mA
10mA
5mA
200
Collector Current I
100
0
048121620
Forward Current IF (mA)
Relative Collector Current vs. Ambient Temperature
140
IF=10mA
VCE=5V
120
100
80
60
40
--25 0 25 50 75 100
Ambient Temperature Ta (°C)
No.6030 2/6
Page 3
SPI-336-99-T1
Typical Characteristics
CAUTION
These numerical value show the electrical and optical characteristics of this product, and not assure this contents.
Collector-emitter Saturation Voltage vs.
Ambient Temperature
0.24
(V)
CE (sat)
Collector-emitter Saturation V oltage V
IF=10mA
IC=50µA
0.22
0.20
0.18
0.16
0.14
--25 0 25 50 75 100
Ambient Temperature Ta (°C)
Collector Dark Current vs. Ambient Temperature
-6
10
5
VCE=10V
(A)
-7
10
5
CEO
-8
10
5
-9
10
5
Collector Dark Current I
-10
10
--25 0 25 50 75 100
Ambient Temperature Ta (°C)
Response Time vs. Load Resistance Test Circuit for Response Time
1000
IFP=20mA
500
VCC=5V
Ta=25°C
100
)
S
50
Response (µ
10
5
tf
I
V
FP
tr
R
D
CC
I
FP
V
out
R
L
tr
V
out
tf
90%
10%
1
0.1 0.5 1 5 10 50 100
Load Resistance RL (kΩ)
Relative Collector Current vs. Distance
120
100
80
60
40
Relative Collector Current (%)
20
0
012345
Distance between sensor and Al evaporation d (mm)
IF=10mA
VCE=5V
Ta=25°C
Relative Collector Current vs.
PPC paper Moving Distance
120
100
d
80
60
40
Relative Collector Current (%)
20
0
--4 --2 0 2 4 6
1
PPC paper Moving Distance (mm)
IF=10mA,VCE=5V
Ta=25°C,d=1mm
2
–
0
+
0
–
+
1
2
No.6030 3/6
Page 4
2
1.6
14
C0.6
SPI-336-99-T1
Pin No.
0.4
Pin connection
1. LED Anode
2. LED Cathode
3 .Ph. Tr Collector
4. Ph. Tr Emitter
0.6
2
3.4
3
0.4
4.3 ± 0.5
(3.47)
2.7
10.5
0.2
+ 0.1
-- 0.05
0.05
Tolerance : ±0.2
Unit : mm
No.6030 4/6
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SPI-336-99-T1
0.5mm
0.5mm
Package dimensions and Pin connection
As stated in the sttached paper. (No.6030 4/6)
Soldering conditions
(1) Reflow soldering
The temperature of the reflow furnace is to be set in accordance with the following temperature profile.
Soldering must be done only two time.
Temperature : On the topsurface of product
Reflow type : Hot air
Max 240°C
200°C
Max 165°C
Max 10sec
Max 120sec
Max 60sec
(2) Manusl soldering
Temperature : Max. 290°C (Soldering iron tip temperature)
Time : Max. 3 sec
Clearance : Min. 0.5mm from package
PRECAUTIONS
(1) Bending a lead should avoid. However, when bending is necessary, take care the next items.
q Bending a lead must be done before soldering.
w Bending a lead must be done in the states of fixing leads and no stress for the regin part. Because it is possible that
stress for the regin part cause troubles such as gold wire breaking and so on.
e A lead must be bend at intervals of 0.5mm from the case edge.
r Do not bend the same position of leads more than twice.
(2) The hole pitch of a circuit board must fit to the lead pitch.
(3) Take core the following when soldering.
q Do not heat a product under any stress (a twist and so on) to leads.
w Do not heat a product in the states of operating force to the regin part.
(4) Use the flux which contain no chlorine, have no corrosion and do not need washing.
(5) Be careful that flux or other chemicals do not attach to the luminous surface and passive surface.
(6) Precautions of the product after the open dry packing
q The product after the open dry packing should be stored in the dry packing again.
The product should be kept under the conditions below, if the product is not stored in the dry paking.
Temperature : 5 to 30°C
Humidity : Max 70%RH
Term : Max 7days
w The product to be out the term without dry packing must be practiced baking.
Baking conditions : +60±5°C, 10 to 20Hr
(7) The reflow conditions must be confirmed that no problem by your reflow furnace.
No.6030 5/6
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SPI-336-99-T1
CAUTION
1. No products described or contained herein are intended for use in surgical implants, life-support systems,
aerospace equipment, nuclear power control systems, vehicles, disaster / crime-prevention equipment or
the like, and the failure of which may directly or indirectly cause injury, death or property loss.
2. Anyone purchasing any products described or contained herein for an above-mentioned use shall:
1) Accept full responsibility and indemnify and defend SANYO ELECTRIC CO.,LTD., it’s affiliates,
subsidiaries and distributors or any of their officers and employees, jointly and severally, against any
and all claims and litigation and all damages, costs and expenses associated with such use.
2) Not impose any responsibility for any fault or negligence which may be cited in any such claim or
litigation on SANYO ELECTRIC CO., LTD., it’s affiliates, subsidiaries and distributors or any of
their officers and employees jointly or severally.
3. Information (including circuit diagrams and circuit parameters) disclosed herein is for example only; it is not
guaranteed for mass production, SANYO believes the information disclosed herein is accurate and reliable,
but no guarantees are made or implied regarding it’s use or any infringements of intellectual property rights
or other rights of third parties.
Precautionary instructions in handling gallium arsenic products
Special precautions must be taken in handling this product because it contains, gallium arsenic, which is
designated as a toxic substance by law. Be sure to adhere strictly to all applicable laws and regulations
enacted for this substance, particularly when it comes to disposal.
Manufactured by ; Tottori SANYO Electric Co., Ltd.
LED Division
5-318, Tachikawa-cho, Tottori City, 680-8634 Japan
TEL: +81-857-21-2137 FAX: +81-857-21-2161
No.6030 6/6
PS
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