Reverse VoltageV
Power DissipationP
Collector-Emitter VoltageV
Output
Phototransistor
Emitter-Collector VoltageV
Collector CurrenI
Power DissipationP
Operating TemperatureTopr--20 to +80°C
Storage TemperatureTstg--30 to +85°C
1
Soldering T emperature
1
*
Soldering conditions : time : max. 3sec; clearance : min. 1mm from lower stay
*
F
R
D
CEO
ECO
C
C
T sol260°C
GaAs Infrared LED
SPI-238-18
(single-transistor type)
50mA
5V
70mW
20V
5V
20mA
70mW
Electro-Optical Characteristics at Ta=25°C, 65%RH
ParameterSymbolConditionMin.Typ.Max.Unit
Input
Forward VoltageV
Reverse CurrentI
OutputDark CurrentI
Collector Output CurrentI
Coupled
Collector Emitter
Saturation Voltage
Rise Timetr
Fall Timetf
1
*
Measurement Circuit of Collector Current
CEO
VCE(sat)IF=10mA, IC=20µA----0.5V
IF=10mA
IF=10mA1.01.151.4V
F
VR= 5 V----1 0µ A
R
IF=0mA, VCE=10V--10200nA
IF=10mA, VCE=5V
C
VCC=5V, RL=100Ω
IC=1mA
SANYO Electric Co.,Ltd. Semiconductor Company
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN
1
*
40200400µA
--10--µs
--1 0--µs
VCE=5V
Ic
A
72199 GI, (MI
)
No.6026 1/6
Page 2
SPI-238-18
Typical Characteristics
CAUTION
These numerical value show the electrical and optical characteristics of this product, and not assure this contents.
Forward Current vs. Ambient Temperature
60
50
(mA)Collector Current I
40
F
30
20
Forward Current I
10
0
--250255075100
Ambient Temperature Ta (°C)
(Rating)(Rating)
Forward Current vs. Forward Voltage
500
Ta=75°C
100
(mA)
50
F
10
5
Forward Current I
50°C
25°C
0°C
--25°C
Power Dissipation vs. Ambient Temperature
120
100
80
60
40
Power Dissipation P (mW)Relative Collector Current (%)
20
0
--250255075100
Ambient Temperature Ta (°C)
Collector vs. Forward Current
500
VCE=5V
Ta=25°C
400
(µA)
C
300
200
Collector Current I
100
1
00.511.52
Forward Voltage VF (V)
Collector Current vs. Collector-emitter Voltage
500
Ta=25°C
400
(µA)
C
300
200
100
0
0510
Collector-emitter Voltage VCE (V)
IF=20mA
15mA
10mA
5mA
0
0 4 8 121620
Forward Current IF (mA)
Relative Collector Current vs. Ambient Temperature
140
IF=10mA
VCE=5V
120
100
80
60
40
--250255075100
Ambient Temperature Ta (°C)
No.6026 2/6
Page 3
SPI-238-18
Typical Characteristics
CAUTION
These numerical value show the electrical and optical characteristics of this product, and not assure this contents.
Collector-emitter Saturation Voltage vs.
Ambient Temperature
0.14
(V)
CE (sat)
Collector-emitter Saturation V oltage V
IF=10mA
IC=20µA
0.12
0.10
0.08
0.06
0.04
--250255075100
Ambient Temperature Ta (°C)
Collector Dark Current vs. Ambient Temperature
-6
10
VCE=10V
5
-7
(A)
10
5
CEO
-8
10
5
-9
10
5
Collector Dark Current I
-10
10
--250255075100
Ambient Temperature Ta (°C)
Response Time vs. Load ResistanceTest Circuit for Response Time
1000
IFP=20mA
500
VCC=5V
Ta=25°C
100
)
S
50
Response (µ
10
5
1
0.10.5 15 1050 100
tf
I
V
FP
CC
tr
I
R
D
R
L
FP
V
out
V
out
tr
10%
90%
tf
Load Resistance RL (kΩ)
Relative Collector Current vs. Shield Distance (1)Relative Collector Current vs. Shield Distance (2)
120
100
IF=10mA
VCE=5V
Ta=25°C
80
60
Shield
--
Detector center
40
d
+
0
120
100
IF=10mA
VCE=5V
Ta=25°C
80
Shield
--
60
d
40
0
+
Detector center
Relative Collector Current (%)
20
0
--2--10123
Shield Distance d (mm)
Relative Collector Current (%)
20
0
--2--10123
Shield Distance d (mm)
No.6026 3/6
Page 4
0.6, Max 0.1
SPI-238-18
Pin No.
1
Pin connection
1. Ph. Tr Collector
2. Common (Cathode)
3. LED Anode
1.5
3
2.4
2.5
3.5
5.5
❈ recommended mounting dimension (S=5/1)
t=1.6mm
5
2
3--ø0.8 ± 0.05
Ph.TrLED
6 ± 0.3
3 ± 0.3
1
1.5
1
C0.5
Optical C /L
Injection gate
2.5
2.8
2.7
0.25
4.95
4.1
0.25
4.5
4.5 ± 0.33 -- 0.4
5.9 ± 0.3
3.2
1.5
0.3, Max 0.1
3.2 ± 0.3
2.5
Tolerance : ±0.2
Unit : mm
No.6026 4/6
Page 5
SPI-238-18
Package dimensions and Pin connection
As stated in the sttached paper. (No.6026 4/6)
Soldering conditions
(1) Temperature : Max. 260°C
(2) Time: Max. 3 sec
(3) Clearance: Min. 1mm from stay (include PCB thickness)
PRECAUTIONS
(1) Bending a lead should avoid. However, when bending is necessary, take care the next items.
q Bending a lead must be done before soldering.
w Bending a lead must be done in the states of fixing leads and no stress for the regin part. Because it is possible that
stress for the regin part cause troubles such as gold wire breaking and so on.
e A lead must be bend under the stay.
r Do not bend the same position of leads more than twice.
(2) The hole pitch of a circuit board must fit to the recommended mounting dimension.
(3) Two stays coupling LED and Ph. Tr should be isolated from any PCB pattern or any lead.
(4) Take core the following when soldering.
q Do not heat a product under any stress (a twist and so on) to leads.
w Do not heat a product in the states of operating force to the regin part.
(5) Use the flux which contain no chlorine, have no corrosion and do not need washing.
(6) Be careful that flux or other chemicals do not attach to the luminous surface and passive surface.
Min. 1mm
No.6026 5/6
Page 6
SPI-238-18
CAUTION
1. No products described or contained herein are intended for use in surgical implants, life-support systems,
aerospace equipment, nuclear power control systems, vehicles, disaster / crime-prevention equipment or
the like, and the failure of which may directly or indirectly cause injury, death or property loss.
2. Anyone purchasing any products described or contained herein for an above-mentioned use shall:
1) Accept full responsibility and indemnify and defend SANYO ELECTRIC CO.,LTD., it’s affiliates,
subsidiaries and distributors or any of their officers and employees, jointly and severally, against any
and all claims and litigation and all damages, costs and expenses associated with such use.
2) Not impose any responsibility for any fault or negligence which may be cited in any such claim or
litigation on SANYO ELECTRIC CO., LTD., it’s affiliates, subsidiaries and distributors or any of
their officers and employees jointly or severally.
3. Information (including circuit diagrams and circuit parameters) disclosed herein is for example only; it is not
guaranteed for mass production, SANYO believes the information disclosed herein is accurate and reliable,
but no guarantees are made or implied regarding it’s use or any infringements of intellectual property rights
or other rights of third parties.
Precautionary instructions in handling gallium arsenic products
Special precautions must be taken in handling this product because it contains, gallium arsenic, which is
designated as a toxic substance by law. Be sure to adhere strictly to all applicable laws and regulations
enacted for this substance, particularly when it comes to disposal.
Manufactured by ; Tottori SANYO Electric Co., Ltd.
LED Division
5-318, Tachikawa-cho, Tottori City, 680-8634 Japan
TEL: +81-857-21-2137 FAX: +81-857-21-2161
No.6026 6/6
PS
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