Datasheet SPD13N05L, SPU13N05L Datasheet (Siemens)

Page 1
SIPMOS ® Power Transistor
• N channel
• Enhancement mode
• Avalanche-rated
• dv/dt rated
• 175°C operating temperature
SPD13N05L
LSPU13N05
Pin 1 Pin 2 Pin 3
G D S
Type
SPD13N05L 55 V 12.5 A 0.12 SPU13N05L 55 V 12.5 A 0.12
Maximum Ratings Parameter Symbol Values Unit
V
DS
I
D
R
DS(on
)
Ω Ω
Continuous drain current
T
= 25 °C
C
T
= 100 °C
C
Pulsed drain current
T
= 25 °C
C
Avalanche energy, single pulse
I
= 12.5 A, VDD = 25 V, RGS = 25
D
L = 666 µH, T
= 25 °C
j
Avalanche current,limited by T Avalanche energy,periodic limited by T
jmax
jmax
Reverse diode dv/dt
Package Ordering Code
P-TO252 Q67040 - S4124 - A2 P-TO251 Q67040 - S4116 - A2
I
D
A
12.5
8.8
I
Dpuls
50
E
AS
mJ
52
I
AR
E
AR
dv/dt
12.5 A
3.5 mJ kV/µs
I
= 12.5 A, VDS = 40 V, diF/dt = 200 A/µs
S
T
= 175 °C
jmax
Gate source voltage V Power dissipation
T
= 25 °C
C
Semiconductor Group 1 29/Jan/1998
GS
P
tot
6
±
14 V
35
W
Page 2
SPD13N05L
Maximum Ratings Parameter Symbol Values Unit
LSPU13N05
Operating temperature T Storage temperature T Thermal resistance, junction - case R Thermal resistance, junction - ambient (PCB mount)** R Thermal resistance, junction - ambient R
j stg
thJC thJA thJA
-55 ... + 175 °C
-55 ... + 175
4.3 K/W
50
100
IEC climatic category, DIN IEC 68-1 55 / 175 / 56
** when mounted on 1 " square PCB ( FR4 );for recommended footprint
Electrical Characteristics,
Parameter Symbol Values Unit
Static Characteristics
Drain- source breakdown voltage
V
= 0 V, ID = 0.25 mA, Tj = 25 °C
GS
Gate threshold voltage
V
GS=VDS, ID
= 20 µA
Zero gate voltage drain current
V
= 50 V, VGS = 0 V, Tj = -40 °C
DS
V
= 50 V, VGS = 0 V, Tj = 25 °C
DS
V
= 50 V, VGS = 0 V, Tj = 150 °C
DS
Gate-source leakage current
V
= 20 V, VDS = 0 V
GS
Drain-Source on-resistance
V
= 4.5 V, ID = 8.8 A
GS
V
= 10 V, ID = 8.8 A
GS
at Tj = 25°C, unless otherwise specified
min. typ. max.
V
(BR)DSS
55 - -
V
GS(th)
1.2 1.6 2
I
DSS
-
-
-
I
GSS
- 10 100
R
DS(on)
-
-
-
0.1
-
0.105
0.062
V
µA
0.1 1 100
nA
0.12
0.07
Semiconductor Group 2 29/Jan/1998
Page 3
SPD13N05L
LSPU13N05
Electrical Characteristics,
at Tj = 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
Dynamic Characteristics
Transconductance
V
2
DS
* ID * RDS(on)max, ID
= 8.8 A
Input capacitance
V
= 0 V, VDS = 25 V, f = 1 MHz
GS
Output capacitance
V
= 0 V, VDS = 25 V, f = 1 MHz
GS
Reverse transfer capacitance
V
= 0 V, VDS = 25 V, f = 1 MHz
GS
Turn-on delay time
V
= 30 V, VGS = 4.5 V, ID = 12.5 A
DD
R
= 16
G
Rise time
V
= 30 V, VGS = 4.5 V, ID = 12.5 A
DD
R
= 16
G
Turn-off delay time
V
= 30 V, VGS = 4.5 V, ID = 12.5 A
DD
R
= 16
G
Fall time
V
= 30 V, VGS = 4.5 V, ID = 12.5 A
DD
= 16
R
G
Gate charge at threshold
V
= 40 V, ID ≥ 0.1 A, VGS =0 to 1 V
DD
Gate charge at 5.0 V
V
= 40 V, ID = 12.5 A, VGS =0 to 5 V
DD
Gate charge total
V
= 40 V, ID = 12.5 A, VGS =0 to 10 V
DD
Gate plateau voltage
V
= 40 V, ID = 12.5 A
DD
g
fs
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
Q
g(th)
Q
g(5)
Q
g(total)
V
(plateau)
S
5 8 -
pF
- 317 400
- 97 120
- 54 70 ns
- 15 22
- 106 160
- 11 17
- 14 20 nC
- 0.37 0.56
- 7.85 12
- 13.5 20 V
- 4 -
Semiconductor Group 3 29/Jan/1998
Page 4
SPD13N05L
LSPU13N05
Electrical Characteristics,
at Tj = 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
Reverse Diode
Inverse diode continuous forward current
T
= 25 °C
C
Inverse diode direct current,pulsed
T
= 25 °C
C
Inverse diode forward voltage
V
= 0 V, IF = 25 A
GS
Reverse recovery time
V
= 30 V, I
R
F=lS, diF
/dt = 100 A/µs
Reverse recovery charge
V
= 30 V, I
R
F=lS, diF
/dt = 100 A/µs
I
I
V
t
Q
S
SM
SD
rr
A
- - 12.5
- - 50 V
- 1.15 1.8 ns
- 50 75
rr
µC
- 0.1 0.15
Semiconductor Group 4 29/Jan/1998
Page 5
SPD13N05L
LSPU13N05
Power dissipation
P
= ƒ(TC)
tot
36
W
P
tot
28
24
20
16
12
8
4
0
0 20 40 60 80 100 120 140 °C 180
Drain current
ID = ƒ(TC)
parameter: V
13
A
11
I
D
10
9 8 7 6 5 4 3 2 1
0
0 20 40 60 80 100 120 140 °C 180
T
C
GS
4 V
T
C
Safe operating area
ID = ƒ(VDS)
parameter: D = 0.01, TC = 25°C
2
10
I
=
D
/
DS
V
DC
1
10
A
I
D
DS(on)
1
10
10
10
R
0
-1 0
10
t
= 3.6µs
p
10 µs
100 µs
1 ms
10 ms
10
V
Transient thermal impedance
Z
= ƒ(tp)
th JC
parameter: D = tp / T
1
10
K/W
Z
thJC
2
V
DS
10
10
10
10
0
-1
D = 0.50
0.20
0.10
-2
0.05
0.02
single pulse
-3
-7
-6
-5
-4
10
10
10
10
10
-3
10
0.01
-2
-1
10
10 0 s
t
p
Semiconductor Group 5 29/Jan/1998
Page 6
SPD13N05L
LSPU13N05
Typ. output characteristics
ID = ƒ(VDS)
parameter: tp = 80 µs
28
P
= 35W
tot
A
24
I
22
D
20 18 16 14 12 10
8 6 4 2
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 V 5.0
j
k
i
l
h
VGS [V]
g
f
e
d
c
b
a
a 2.5 b 3.0 c 3.5 d 4.0 e 4.5 f 5.0 g 5.5 h 6.0 i 6.5 j 7.0 k 8.0 l 10.0
V
DS
Typ. drain-source on-resistance
R
DS (on)
= ƒ(ID)
parameter: tp = 80 µs, Tj = 25 °C
0.38
a
b
c
R
DS (on)
d
0.32
0.28
0.24
0.20
0.16
0.12
0.08
V
V
[V] =
[V] =
GS
GS
0.04
a
a
b
c
d
e
2.5
3.0
3.5
4.0
4.5
5.0
5.5
f
0.00 0 4 8 12 16 20 A 26
6.0
e
g
h
6.5
7.0
f
g
h
i
j
k
i
j
k
8.0
10.0
I
D
Typ. transfer characteristics ID = f (VGS)
parameter: tp = 80 µs
V
2 x
x R
ID
DS(on)max
45
A
35
30
25
20
15
10
5
0
0 1 2 3 4 5 6 7 8 V 10
I
DS
D
V
GS
Semiconductor Group 6 29/Jan/1998
Page 7
SPD13N05L
LSPU13N05
Drain-source on-resistance
R
DS (on)
= ƒ(Tj)
parameter: ID = 8.8 A, VGS = 4.5 V
0.38
0.32
R
DS (on)
0.28
0.24
0.20
98%
0.16
0.12
0.08
0.04
0.00
-60 -20 20 60 100 °C 180
typ
Gate threshold voltage
V
GS(th)
= f (Tj)
parameter:VGS=VDS,ID = 20µA
3.0 V
2.6
2.4
V
GS(th)
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-60 -20 20 60 100 140 V 200
T
j
max
typ
min
T
j
Typ. capacitances
C = f (V
DS
)
parameter:VGS = 0V, f = 1MHz
3
10
C
pF
2
10
1
10
0 5 10 15 20 25 30 V 40
Ciss
Coss
Crss
VDS
Forward characteristics of reverse diode
IF = ƒ(VSD)
parameter: Tj, tp = 80 µs
2
10
A
I
F
1
10
0
10
= 25 °C typ
T
j
= 175 °C typ
T
j
= 25 °C (98%)
T
j
Tj = 175 °C (98%)
-1
10
0.0 0.4 0.8 1.2 1.6 2.0 2.4 V 3.0
V
SD
Semiconductor Group 7 29/Jan/1998
Page 8
SPD13N05L
LSPU13N05
Avalanche energy EAS = f (Tj)
parameter:ID=12.5 A,VDD =25 V RGS =25 Ω , L = 666 µH
60
mJ
E
AS
40
30
20
10
0
20 40 60 80 100 120 140 °C 180
Typ. gate charge
VGS = ƒ(Q
parameter: I
16
V
V
GS
12
10
8
6
4
2
0
T
j
)
Gate
= 13 A
D puls
V
0,2
DS max
0 2 4 6 8 10 12 14 16 nC 20
0,8
V
DS max
Q
Gate
Drain-source breakdown voltage
V
(BR)DSS
V
(BR)DSS
= ƒ(Tj)
65
V
61
59
57
55
53
51
49
-60 -20 20 60 100 °C 180
T
j
Semiconductor Group 8 29/Jan/1998
Loading...