Datasheet SI2302DS Datasheet (Philips)

Page 1
M3D088

1. Description

2. Features

SI2302DS
N-channel enhancement mode field-effect transistor
Rev. 02 — 20 November 2001 Product data
N-channel enhancement mode field-effect transistor in a plastic package using TrenchMOS™1 technology.
Product availability:
SI2302DS in SOT23.
TrenchMOS™ technology
Very fast switching
Logic level compatible
Subminiature surface mount package.

3. Applications

Battery management
High speed switch
Low power DC to DC converter.

4. Pinning information

Table 1: Pinning - SOT23, simplified outline and symbol
Pin Description Simplified outline Symbol
1 gate (g) 2 source (s) 3 drain (d)
12
Top view
3
MSB003
SOT23
g
MBB076
d
s
1. TrenchMOS is a trademark of Koninklijke Philips Electronics N.V.
Page 2
Philips Semiconductors
SI2302DS
N-channel enhancement mode field-effect transistor

5. Quick reference data

Table 2: Quick reference data
Symbol Parameter Conditions Typ Max Unit
V I
D
P T R
DS
tot j DSon
drain-source voltage (DC) Tj=25to150°C 20 V drain current (DC) Tsp=25°C; VGS= 4.5 V 2.5 A total power dissipation Tsp=25°C 0.83 W junction temperature 150 °C drain-source on-state resistance VGS= 4.5 V; ID=3.6A 5685m
= 2.5 V; ID= 3.1 A 77 115 m
V
GS

6. Limiting values

Table 3: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
DS
V
GS
I
D
I
DM
P
tot
T
stg
T
j
Source-drain diode
I
S
drain-source voltage (DC) Tj=25to150°C 20 V gate-source voltage (DC) −±8V drain current (DC) Tsp=25°C; VGS= 4.5 V; Figure 2 and 3 2.5 A
=70°C; VGS= 4.5 V; Figure 2 2A
T
sp
peak drain current Tsp=25°C; pulsed; tp≤ 10 µs; Figure 3 10 A total power dissipation Tsp=25°C; Figure 1 0.83 W storage temperature 65 +150 °C operating junction temperature 65 +150 °C
source (diode forward) current (DC) Tsp=25°C 0.7 A
9397 750 09107
Product data Rev. 02 — 20 November 2001 2 of 12
© Koninklijke Philips Electronics N.V. 2001. All rights reserved.
Page 3
Philips Semiconductors
SI2302DS
N-channel enhancement mode field-effect transistor
120
P
der
(%)
80
40
0
0 50 100 150 200
P
P
der
tot
----------------------
P
tot 25 C°()
100%×= I
03aa17
T
(oC)
sp
Fig 1. Normalized total power dissipation as a
function of solder point temperature.
2
10
I
D
(A)
10
R
DSon
= V
DS
/ I
D
120
I
der
(%)
80
40
0
0 50 100 150 200
I
D
der
------------------ -
I
D25C°()
100%×=
03aa25
(oC)
T
sp
Fig 2. Normalized continuous drain current as a
function of solder point temperature.
03ae92
tp = 10 µs
1
10
10
-1
-2
-1
10
1 10 10
DC
1 ms
10 ms
100 ms
V
DS
(V)
2
Tsp=25°C; IDM is single pulse.
Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage.
9397 750 09107
Product data Rev. 02 — 20 November 2001 3 of 12
© Koninklijke Philips Electronics N.V. 2001. All rights reserved.
Page 4
Philips Semiconductors
SI2302DS
N-channel enhancement mode field-effect transistor

7. Thermal characteristics

Table 4: Thermal characteristics
Symbol Parameter Conditions Value Unit
R
th(j-sp)
thermal resistance from junction to solder point mounted on a metal clad substrate; Figure 4 150 K/W

7.1 Transient thermal impedance

10
Z
th(j-sp)
(K/W)
10
10
1
3
2
10
δ = 0.5
0.2
0.1
0.05
0.02
-4
single pulse
10
P
t
p
-3
10
-2
10
-1
1 10
03ae91
t
p
δ
=
T
t
T
t
(s)
p
Tsp=25°C
Fig 4. Transient thermal impedance from junction to solder point as a function of pulse duration.
9397 750 09107
© Koninklijke Philips Electronics N.V. 2001. All rights reserved.
Product data Rev. 02 — 20 November 2001 4 of 12
Page 5
Philips Semiconductors
SI2302DS
N-channel enhancement mode field-effect transistor

8. Characteristics

Table 5: Characteristics
Tj=25°C unless otherwise specified
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V
(BR)DSS
V
GS(th)
I
DSS
I
GSS
R
DSon
Dynamic characteristics
g
fs
Q
g(tot)
Q
gs
Q
gd
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
Source-drain diode
V
SD
drain-source breakdown voltage ID=10µA; VGS=0V 20 −−V gate-source threshold voltage ID= 1 mA; VDS=VGS; Figure 9 0.65 −−V drain-source leakage current VDS=20V; VGS=0V
=25°C 0.01 1.0 µA
T
j
=55°C −−10 µA
T
j
gate-source leakage current VGS= ±8 V; VDS=0V 10 100 nA drain-source on-state resistance VGS= 4.5 V; ID= 3.6 A; Figure 7 and 8 56 85 m
= 2.5 V; ID= 3.1 A; Figure 7 and 8 77 115 m
V
GS
forward transconductance VDS=5V; ID= 3.6 A 8 S total gate charge VDD=10V; VGS= 4.5 V; ID= 3.6 A; Figure 13 5.4 10 nC gate-source charge 0.65 nC gate-drain (Miller) charge 1.6 nC input capacitance VGS=0V; VDS= 10 V; f = 1 MHz; Figure 11 230 pF output capacitance 125 pF reverse transfer capacitance 80 pF turn-on delay time VDD=10V; RL= 5.5 ; VGS= 4.5 V; RG=6Ω− 12 20 ns rise time 23 35 ns turn-off delay time 50 100 ns fall time 34 50 ns
source-drain (diode forward) voltage IS= 1.6 A; VGS=0V;Figure 12 0.8 1.2 V
9397 750 09107
Product data Rev. 02 — 20 November 2001 5 of 12
© Koninklijke Philips Electronics N.V. 2001. All rights reserved.
Page 6
Philips Semiconductors
SI2302DS
N-channel enhancement mode field-effect transistor
DSon
03ae95
(V)
V
GS
03ad57
10
I
D
(A)
8
6
4
2
0
0 0.5 1 1.5
2.5 V3 V4.5 V
03ae93
2 V
V
= 1.5V
GS
V
(V)
DS
Tj=25°CT
Fig 5. Output characteristics: drain current as a
Fig 6. Transfer characteristics: drain current as a
function of drain-source voltage; typical values.
03ae94
R
0.1 Tj = 25 ºC VGS = 2.5 V
DSon
()
0.09
10
I
VDS > ID x R
D
(A)
8
6
4
2
0
0123
=25°C and 150 °C; VDS> ID× R
j
Tj = 150 ºC
DSon
25 ºC
function of gate-source voltage; typical values.
2
a
1.6
0.08 3 V
0.07
I
D
4.5 V
(A)
0.06
0.05
0246810
Tj=25°C
Fig 7. Drain-source on-state resistance as a function
of drain current; typical values.
1.2
0.8
0.4
0
-60 0 60 120 180
R
a
DSon
=
----------------------------
R
DSon 25 C°()
(ºC)
T
j
Fig 8. Normalized drain-source on-state resistance
factor as a function of junction temperature.
9397 750 09107
© Koninklijke Philips Electronics N.V. 2001. All rights reserved.
Product data Rev. 02 — 20 November 2001 6 of 12
Page 7
Philips Semiconductors
SI2302DS
N-channel enhancement mode field-effect transistor
1.2
V
GS(th)
(V)
0.8
0.4
0
-60 0 60 120 180
ID= 1 mA; VDS=V
typ
min
GS
03ag05
T
(ºC)
j
Fig 9. Gate-source threshold voltage as a function of
junction temperature.
3
10
C
(pF)
2
10
-1
10 I
D
(A)
-2
10
-3
10
-4
10
-5
10
-6
10
0 0.4 0.8 1.2
min typ
03ah78
V
(V)
GS
Tj=25°C; VDS=5V
Fig 10. Sub-threshold drain current as a function of
gate-source voltage.
03ae98
C
iss
C
oss
C
rss
10
10
-1
1 10 10
V
DS
(V)
2
VGS=0V;f=1MHz
Fig 11. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values.
9397 750 09107
Product data Rev. 02 — 20 November 2001 7 of 12
© Koninklijke Philips Electronics N.V. 2001. All rights reserved.
Page 8
Philips Semiconductors
SI2302DS
N-channel enhancement mode field-effect transistor
10
I
VGS = 0 V
S
(A)
8
6
4
2
0
0 0.4 0.8 1.2
150 ºC
Tj = 25 ºC
V
SD
03ae97
(V)
5
ID = 3.6 A
V
GS
(V)
Tj = 25 ºC
4
VDD = 10 V
3
2
1
0
0123456
Tj=25°C and 150 °C; VGS=0V ID= 3.6 A; VDD=10V
Fig 12. Source (diode forward) current as a function of
source-drain (diode forward) voltage; typical
Fig 13. Gate-source voltage as a function of gate
charge; typical values.
values.
03ae99
Q
(nC)
G
9397 750 09107
© Koninklijke Philips Electronics N.V. 2001. All rights reserved.
Product data Rev. 02 — 20 November 2001 8 of 12
Page 9
Philips Semiconductors
SI2302DS
N-channel enhancement mode field-effect transistor

9. Package outline

Plastic surface mounted package; 3 leads SOT23
D
3
A
A
1
12
e
1
b
p
e
w M
B
E
H
E
detail X
AB
Q
L
p
X
v M
A
c
0 1 2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT
1.1
mm
0.9
OUTLINE VERSION
SOT23 TO-236AB
1
A
max.
0.48
0.1
0.38
cD
b
p
0.15
3.0
0.09
2.8
IEC JEDEC EIAJ
e
E
1.4
1.9
1.2
REFERENCES
e
0.95
H
L
Qwv
1
2.5
2.1
p
E
0.55
0.45
0.15
0.45
0.2
0.1
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28 99-09-13
Fig 14. SOT23.
9397 750 09107
Product data Rev. 02 — 20 November 2001 9 of 12
© Koninklijke Philips Electronics N.V. 2001. All rights reserved.
Page 10
Philips Semiconductors
SI2302DS
N-channel enhancement mode field-effect transistor

10. Revision history

Table 6: Revision history
Rev Date CPCN Description
02 20011120 - Includes product data; second version; supersedes initial version 03 september 2001.
Table 5 “Characteristics” Correction to V
Figure 9 Correction to curves.
Figure 10 Correction to curves.
01 20010903 - Product specification; initial version.
GS(th)
conditions.
9397 750 09107
Product data Rev. 02 — 20 November 2001 10 of 12
© Koninklijke Philips Electronics N.V. 2001. All rights reserved.
Page 11
Philips Semiconductors
Philips Semiconductors

11. Data sheet status

SI2302DS
SI2302DS
N-channel enhancement mode field-effect transistor
N-channel enhancement mode field-effect transistor
Data sheet status
Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors
Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a
Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to
[1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[1]
Product status
12. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
[2]
Definition
reserves the right to change the specification in any manner without notice.
later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product.
make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A.

13. Disclaimers

Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
Contact information
For additional information, please visit http://www.semiconductors.philips.com. For sales office addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com. Fax: +31 40 27 24825
© Koninklijke Philips Electronics N.V. 2001. All rights reserved.
9397 750 09107
9397 750 09107
Product data Rev. 02 — 20 November 2001 11 of 12
Product data Rev. 02 — 20 November 2001 11 of 12
© Koninklijke Philips Electronics N.V. 2001. All rights reserved.
Page 12
Philips Semiconductors
Contents
1 Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
5 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
7 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4
7.1 Transient thermal impedance . . . . . . . . . . . . . . 4
8 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
10 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10
11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 11
12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
13 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
SI2302DS
N-channel enhancement mode field-effect transistor
© Koninklijke Philips Electronics N.V. 2001. Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Date of release: 20 November 2001 Document order number: 9397 750 09107
Loading...