ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
ParameterSymbolLimitUnit
Drain-Source VoltageV
Gate-Source VoltageV
Continuous Drain Current(TJ = 150_C)
Pulsed Drain Current
Continuous Source Current (Diode Conduction)
Power Dissipation
Operating Junction and Storage Temperature RangeTJ, T
a
_
b
TA= 25_C
TA= 70_C
TA= 25_C
TA= 70_C
THERMAL RESISTANCE RATINGS
ParameterSymbolLimitUnit
Maximum Junction-to-Ambient
Maximum Junction-to-Ambient
Notes
a. Pulse width limited by maximum junction temperature.
b. Surface Mounted on FR4 Board, t v 5 sec.
c. Surface Mounted on FR4 Board.
For SPICE model information via the Worldwide Web: http://www.vishay.com/www/product/spice.htm
b
c
DS
GS
I
D
I
DM
I
S
P
D
stg
R
thJA
-20
"8
-2.3
-1.5
-10
-1.6
1.25
0.8
-55 to 150_C
100
166
_C/W
A
W
Document Number: 70627
S-31990—Rev. E, 13-Oct-03
www.vishay.com
1
Page 2
Si2301DS
ID ^ -2.8 A
ID ^ -1.0 A, V
=
V
T
Off Ti
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
ParameterSymbolTest ConditionsMinTypMaxUnit
Static
Limits
Drain-Source Breakdown VoltageV
Gate-Threshold VoltageV
Gate-Body LeakageI
Zero Gate Voltage Drain CurrentI
On-State Drain Current
Drain-Source On-Resistance
Forward Transconductance
Diode Forward VoltageV
Dynamic
Total Gate ChargeQ
Gate-Source ChargeQ
Gate-Drain ChargeQ
Input CapacitanceC
Output CapacitanceC
Reverse Transfer CapacitanceC
b
Switching
Turn-On Time
-
urn-
me
a
a
a
c
(BR)DSS
I
r
DS(on)
t
t
GS(th)
GSS
DSS
D(on)
g
fs
SD
g
gs
gd
iss
oss
rss
d(on)
t
r
d(off)
t
f
VGS = 0 V, ID = -250 mA-20
VDS = VGS, ID = -250 mA- 0.45
VDS = 0 V, VGS = "8 V"100nA
VDS = -20 V, VGS = 0 V-1
VDS = -20 V, VGS = 0 V, TJ = 55_C-10
VDS v -5 V, VGS = -4.5 V-6
VDS v -5 V, VGS = -2.5 V-3
VGS = -4.5 V, ID = -2.8 A0.1050.130
VGS = -2.5 V, ID = -2.0 A0.1450.190
VDS = -5 V, ID = -2.8 A6.5S
IS = -1.6 A, VGS = 0 V-0.80-1.2V
5.810
VDS = -6 V, VGS = -4.5 V
I
^ -2.8 A
D
VDS = -6 V, VGS = 0, f = 1 MHz
VDD = -6 V, RL = 6 W
RG = 6 W
GEN
-
- 4.5
0.85
1.70
415
223
87
13.025
36.060
4270
3460
V
mA
A
W
nC
pF
ns
Notes
a. Pulse test: PW v300 ms duty cycle v2%.
b. For DESIGN AID ONLY, not subject to production testing.
c. Switching time is essentially independent of operating temperature.
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2
Document Number: 70627
S-31990—Rev. E, 13-Oct-03
Page 3
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Si2301DS
Vishay Siliconix
10
8
6
4
- Drain Current (A)I
D
2
0
012345
Output CharacteristicsTransfer Characteristics
VGS = 5, 4.5, 4, 3.5, 3 V
2.5 V
0, 0.5, 1 V
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
0.6
0.5
W )
0.4
- On-Resistance (r
DS(on)
0.3
0.2
0.1
VGS = 2.5 V
VGS = 4.5 V
1.5 V
2 V
10
8
6
4
- Drain Current (A)I
D
2
0
0.00.51.01.52.02.53.0
VGS - Gate-to-Source Voltage (V)
TC = -55_C
25_C
Capacitance
1000
800
600
C
iss
400
C - Capacitance (pF)
200
C
oss
C
rss
125_C
0.0
0246810
5
VDS = 6 V
I
= 2.8 A
D
4
3
2
- Gate-to-Source Voltage (V)
1
GS
V
0
02468
Document Number: 70627
S-31990—Rev. E, 13-Oct-03
ID - Drain Current (A)
Gate Charge
Qg - Total Gate Charge (nC)
W )
(Normalized)
- On-Resistance (r
DS(on)
0
036912
V
- Drain-to-Source Voltage (V)
DS
On-Resistance vs. Junction Temperature
1.8
VGS = 4.5 V
I
= 2.8 A
1.6
1.4
1.2
1.0
0.8
0.6
D
-50050100150
- Junction Temperature (_C)
T
J
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Page 4
Si2301DS
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
10
Source-Drain Diode Forward VoltageOn-Resistance vs. Gate-to-Source Voltage
TJ = 150_C
- Source Current (A)I
S
1
0.20.40.60.81.01.21.41.6
VSD - Source-to-Drain Voltage (V)VGS - Gate-to-Source Voltage (V)
All product specifications and data are subject to change without notice.
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(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
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