Samsung's S3C8 series of 8-bit single-chip CMOS microcontrollers offers a fast and efficient CPU, a wide range
of integrated peripherals, and various mask-programmable ROM sizes. Among the major CPU features are:
— Efficient register-oriented architecture
— Selectable CPU clock sources
— Idle and Stop power-down mode release by interrupt
— Built-in basic timer with watchdog function
A sophisticated interrupt structure recognizes up to eight interrupt levels. Each level can have one or more
interrupt sources and vectors. Fast interrupt processing (within a minimum of six CPU clocks) can be assigned to
specific interrupt levels.
S3C821A/P821A MICROCONTROLLER
The S3C821A/P821A single-chip CMOS
microcontroller is fabricated using the highly
advanced CMOS process, based on Samsung’s
newest CPU architecture.
The S3C821A is a microcontroller with a 48-Kbyte
mask-programmable ROM embedded.
The S3P821A is a microcontroller with a 48-Kbyte
one-time-programmable ROM embedded.
Using a proven modular design approach, Samsung
engineers have successfully developed the
S3C821A/P821A by integrating the following
peripheral modules with the powerful SAM8 core:
— Six programmable I/O ports, including five 8-bit
ports and one 7-bit port, for a total of 47 pins.
— Twelve bit-programmable pins for external
interrupts.
— One 8-bit basic timer for oscillation stabilization
and watchdog functions (system reset).
— One 8-bit timer/counter and one 16-bit
timer/counter with selectable operating modes.
— Watch timer for real time.
— 4-input A/D converter
— Serial I/O interface
The S3C821A/P821A is versatile microcontroller for
cordless phone, pager, etc. They are currently
available in 80-pin TQFP and 80-pin QFP package.
OTP
The S3P821A is an OTP (One Time Programmable) version of the S3C821A microcontroller. The S3P821A
microcontroller has an on-chip 48-Kbyte one-time-programmable EPROM instead of a masked ROM. The
S3P821A is comparable to the S3C821A, both in function and in pin configuration.
1-1
Page 2
PRODUCT OVERVIEWS3C821A/P821A
FEATURES
CPU
•SAM8 CPU core
Memory
•Data memory: 1040-byte of internal register file
(Excluding LCD RAM)
•Program memory: 48-Kbyte internal program
memory (ROM)
External Interface
•64-Kbyte external data memory area
Instruction Execution Time
•750 ns at 8 MHz (minimum, Main oscillator)
•183 µs at 32,768 Hz (minimum, Sub oscillator)
Interrupts
•7 interrupt levels and 19 interrupt sources
•19 vectors
•Fast interrupt processing feature (for one
selected interrupt level)
I/O Ports
•Five 8-bit I/O ports (P0–P4) and one 7-bit I/O
port (P5) for a total of 47 bit-programmable pins
8-Bit Basic Timer
•One programmable 8-bit basic timer (BT) for
oscillation stabilization control or watchdog timer
(software reset) function
Watch Timer
•Time internal generation: 3.91 ms, 0.5 s at
32,768 Hz
•Four frequency outputs to BUZ pin
•Clock source generation for LCD
Timers and Timer/Counters
LCD Controller/Driver
•Up to 32 segment pins
•3, 4, and 8 common selectable
•Choice of duty cycle
•All dots can be switched on/off
•Internal resistor circuit for LCD bias
Serial Port
•One synchronous SIO
A/D Converter
•8-bit conversion resolution × 4 channel
•34 µs conversion time (4 MHz CPU clock, fxx/4)
Oscillation Sources
•Crystal, ceramic, or RC for main system clock
•Crystal or external oscillator for subsystem clock
•Main system clock frequency: 8 MHz
•Subsystem clock frequency: 32.768 kHz
Power-down Modes
•Main idle mode (only CPU clock stops)
•Sub idle mode
•Stop mode (main/sub system oscillation stops)
Operating Temperature Range
•– 40 °C to + 85 °C
Operating Voltage Range
•2.0 V to 5.5 V at 32 kHz (sub clock)-6 MHz
(main clock)
•2.2 V to 5.5 V at 8 MHz
Package Type
•80-pin TQFP, 80-pin QFP
•One 8-bit timer/counter (Timer 0) with three
operating modes: Interval, Capture, and PWM
•One 16-bit timer/counter (Timer 1) with two 8-bit
timer/counter modes
Pull-up resistors and open-drain outputs
are software assignable. Pull-up resistors
are automatically disabled for output
pins. Configurable as LCD segments/
external interface address and data lines
P1.0–1.7I/O4-bit-programmable I/O port.
Pull-up resistors and open-drain outputs
are software assignable. Pull-up resistors
are automatically disabled for output
pins. Configurable as LCD segments/
external interface address and data lines
P2.0
P2.1
P2.2
P2.3
P2.4
P2.5
P2.6
P2.7
P3.0–P3.3
I/O1-bit-programmable I/O port.
Pull-up resistors are software assignable,
and automatically disabled for output
pins. P2.0–P2.3 can alternately be used
as external interface lines. P2.4–P2.7 are
configurable as alternate functions or
external interrupts at falling edge with
noise filters.
I/O1-bit-programmable I/O port.
Pull-up resistors are software assignable,
and automatically disabled for output
P3.4–P3.6
pins. P3.0–P3.3 can alternately be used
as ADC. P3.7 is configurable as an
alternate function.
P3.7
P4.0–P4.7I/O1-bit-programmable I/O port.
Pull-up resistors and open-drain outputs
are software assignable. Pull-up resistors
are automatically disabled for output
pins. P4.0–P4.7 are configurable as
external interrupts at a selectable edge
with noise filters.
P5.0
P5.1
P5.2
P5.3
P5.4–P5.6
I/O1-bit-programmable I/O port.
Pull-up resistors are software assignable,
and automatically disabled for output
pins.
P5.0–P5.3 are configurable as alternate
functions. If SCK and SI are used as
input, these pins have noise filters.
In this section, S3C821A electrical characteristics are presented in tables and graphs. The information is
arranged in the following order:
— Absolute maximum ratings
— D.C. electrical characteristics
— Data retention supply voltage in Stop mode
— Stop mode release timing when initiated by an external interrupt
— Stop mode release timing when initiated by a Reset
— I/O capacitance
— A.C. electrical characteristics
— A/D converter electrical characteristics
— Input timing for external interrupts (P4, P2.4–P2.7)
— Input timing for RESET
— Serial data transfer timing
— Oscillation characteristics
— Oscillation stabilization time
— Operating voltage range
17-1
Page 14
ELECTRICAL DATAS3C821A/P821A
Table 17-1. Absolute Maximum Ratings
(TA = 25 °C)
ParameterSymbolConditionsRatingUnit
Supply voltage
Input voltage
Output voltage
Output current High
V
DD
I
V
V
OH
All I/O ports
IN
O
One I/O port active– 18mA
–– 0.3 to + 6.5V
– 0.3 toVDD + 0.3
–
– 0.3 to VDD + 0.3
V
V
All I/O ports active– 60
Output current Low
I
OL
One I/O port active+ 30 (peak value)mA
(note)
+ 15
Ports 0, 1, 2, and 3+ 100 (peak value)
(note)
+ 60
Ports 4 and 5+ 100 (peak value)
(note)
+ 60
Operating
T
A
–– 40 to + 85
°
C
temperature
Storage temperature
T
STG
–– 65 to + 150
°
C
NOTE: The values for Output Current Low (IOL) are calculated as Peak Value × Duty .
17-2
Page 15
S3C821A/P821AELECTRICAL DATA
Table 17-2. D.C. Electrical Characteristics
(T
= – 40 °C to + 85 °C, V
A
= 2.0 V to 5.5 V)
DD
ParameterSymbolConditionsMinTypMaxUnit
Operating Voltage
V
DD
f
OSC
= 8 MHz
2.2–5.5V
(Instruction clock = 1.33 MHz)
f
OSC
= 6 MHz
2.0
(Instruction clock = 1 MHz)
Input High
V
IH1
P0 and P1
0.7 V
DD
–
V
DD
V
voltage
Input Low voltage
Output High
voltage
Output Low
voltage
Input High
leakage current
Input Low
leakage current
Output High
leakage current
Output Low
leakage current
|V
COMi|
–
DD
voltage drop
V
V
V
V
V
V
V
I
LIH1
I
LIH2
I
LIL1
I
LIL2
I
LOH
I
LOL
V
IH2
IH3
IL1
IL2
IL3
OH
OL
DC
RESET, P2, P3, P4, and P5
X
XT
,
IN
IN
P0 and P10–
RESET, P2, P3, P4, and P5
X
XT
,
IN
IN
V
= 3 V; IOH = – 200 µA
DD
All output pins
V
= 3 V; IOL= 1 mA
DD
All output pins
VIN = V
DD
All input pins except those specified
below for I
VIN = V
X
,
IN
V
IN
X
OUT
= 0 V
DD
LIH2
XT
,
and XT
,
IN
OUT
All input pins except those specified
below for I
V
= 0 V
IN
X
X
,
IN
OUT
V
= V
OUT
and RESET
LIL2
XT
,
,
IN
DD
and XT
OUT
All output pins
V
= 0 V
OUT
All output pins
VDD = 2.7 V to 5.5 V
– 15 µA per common pin
= – 40 °C to + 85 °C, VDD = 2.7 V to 5.5 V, VSS = 0 V)
A
ParameterSymbolConditionsMinTypMaxUnit
Resolution–8–bit
Total accuracy
Conversion time
(1)
Analog input voltage
Analog input impedance
Analog reference voltage
Analog ground
Analog input current
t
V
AV
AV
I
CON
IAN
R
AN
REF
ADIN
VDD = 5.12 V
AV
AV
8 bit conversion
34 x n/fxx
SS
AV
= 5.12 V
REF
= 0 V
SS
= VDD = 5V
REF
––
17–170
(2)
n=1,4,8,16
,
–
AV
SS
–
–21,000–
–2.5–
–
V
SS
–
––10
± 2
AV
REF
V
DD
VSS + 0.3
LSB
µs
V
MΩ
V
V
µA
NOTES:
1."Conversion time" is the time required from the moment a conversion operation starts until it ends.
2.fxx is a selected system clock for peripheral hardware.
17-8
Page 21
S3C821A/P821AELECTRICAL DATA
RESET
NOTE
t
INTL
0.2 V
: The unit t
0.8 V
DD
means one CPU clock period.
CPU
DD
t
INTH
Figure 17-3. Input Timing for External Interrupts
t
RSL
0.2 V
DD
SCK
SI
SO
t
KSO
Figure 17-4. Input Timing for RESETRESET
t
KCY
t
KL
t
SIK
INPUT DATA
OUTPUT DATA
t
KSI
t
KH
0.8 V
0.2 V
DD
DD
0.8 V
0.2 V
DD
DD
Figure 17-5. Serial Data Transfer Timing
17-9
Page 22
ELECTRICAL DATAS3C821A/P821A
OUT
OUT
Table 17-7. Main System Oscillation Characteristics
(TA = – 40 °C + 85 °C)
OscillatorClock CircuitParameter
Crystal
Ceramic
External clock
RC
C1
C2
C1
C2
X
X
X
X
Main oscillation
IN
frequency
OUT
Main oscillation
IN
frequency
XIN input
X
X
IN
OUT
frequency
Frequency3.0 V0.4–2
X
IN
R
X
OUT
Condition (VDD)
MinTypMaxUnit
2.2 V–5.5 V0.4–8MHz
2.0 V–5.5 V0.4–6
2.2 V–5.5 V0.4–8
2.0 V–5.5 V0.4–6
2.2 V–5.5 V0.4–8
2.0 V–5.5 V0.4–6
Table 17-8. Subsystem Oscillation Characteristics
(TA = – 40 °C + 85 °C)
OscillatorClock CircuitParameter
Crystal
External clock
17-10
C1
C2
XT
XT
XT
XT
IN
OUT
Sub oscillation
frequency
IN
XT
IN
frequency
input
Condition (VDD)
MinTypMaxUnit
2.0 V–5.5 V3232.76835kHz
2.0 V–5.5 V32–500kHz
Page 23
S3C821A/P821AELECTRICAL DATA
Table 17-9. Main Oscillation Stabilization Time
(TA = – 40 °C + 85 °C, VDD = 2.0 V to 5.5 V)
OscillatorTest ConditionMinTypMaxUnit
Crystalfx > 400 kHz––20ms
Ceramic
Oscillation stabilization occurs when VDD is equal
––10ms
to the minimum oscillator voltage range.
External clock
XIN input High and Low width (tXH, tXL)
1 / f
25–500ns
x
t
XL
X
IN
Figure 17-6. Clock Timing Measurement at X
t
XH
VDD – 0.1 V
0.1 V
IN
Table 17-10. Sub Oscillation Stabilization Time
(TA = – 40 °C + 85 °C, VDD = 2.0 V to 5.5 V)
OscillatorTest ConditionMinTypMaxUnit
Crystal–––10s
External clock
XTIN input High and Low width (tXH, tXL)
1 / f
1–18
xt
µs
XT
t
XTL
IN
Figure 17-7. Clock Timing Measurement at XT
t
XTH
VDD – 0.1 V
0.1 V
IN
17-11
Page 24
ELECTRICAL DATAS3C821A/P821A
INSTRUCTION
CLOCK
1.33 MHz
1.00 MHz
8.33 kHz
INSTRUCTION CLOCK = 1/6n x oscillator frequency (n = 1, 2, 8, 16)
1546
237
2.25.5
SUPPLY VOLTAGE (V)
f
x
(Main oscillation
frequency)
8 MHz
6 MHz
400 kHz
Figure 17-8. Operating Voltage Range
17-12
Page 25
S3C821A/P821AMECHANICAL DATA
18MECHANICAL DATA
OVERVIEW
The S3C821A microcontroller is currently available in 80-pin QFP and TQFP package.
23.90
± 0.3
± 0.3
17.90
± 0.2
14.00
#80
0.80
#1
20.00
± 0.2
80-QFP-1420C
0.35
± 0.1
±
0.15 MAX
(0.80)
(1.00)
0−8°
0.15
0.10 MAX
± 0.20
0.80
0.05 MIN
2.65
± 0.10
3.00 MAX
+0.10
- 0.05
NOTE: Dimensions are in millimeters.
Figure 18-1. 80-Pin QFP Package Demensions
0.80
± 0.20
18-1
Page 26
MECHANICAL DATAS3C821A/P821A
14.00BSC
−
12.00BSC
0
7°
0.09−0.20
80-TQFP-1212
14.00BSC
12.00BSC
0.60 ± 0.15
#80
#1
0.50
NOTE: Dimensions are in millimeters.
Figure 18-2. 80-Pin TQFP Package Demensions
0.17−0.27
±
0.08 MAX M
0.05-0.15
1.00 ± 0.05
1.20 MAX
(1.25)
18-2
Page 27
S3C821A/P821AS3P821A OTP
20S3P821A OTP
OVERVIEW
The S3P821A single-chip CMOS microcontroller is the OTP (One Time Programmable)version of the S3C821A
microcontroller. It has an on-chip OTP ROM instead of a masked ROM. The EPROM is accessed by serial data
format.
The S3P821A is fully compatible with the S3C821A, both in function and in pin configuration. Because of its
simple programming requirements, the S3P821A is ideal as an evaluation chip for the S3C821A.
Table 20-1. Descriptions of Pins Used to Read/Write the EPROM
Main ChipDuring Programming
Pin NamePin NamePin No.I/OFunction
P2.0SDAT8 (10)I/OSerial data pin. Output port when reading and
input port when writing. Can be assigned as a
Input/push-pull output port.
P2.1SCLK9 (11)I/OSerial clock pin. Input only pin.
V
PP
TEST14 (16)IPower supply pin for EPROM cell writing
(indicates that OTP enters into the writing mode).
When 12.5 V is applied, OTP is in writing mode
and when 5 V is applied, OTP is in reading
mode. (Option)
RESETRESET
V
DD1/VSS1
V
DD1/VSS1
17 (19)IChip Initialization
10 (12)/11 (13)–Logic power supply pin. V
should be tied to + 5
DD
V during programming.
NOTE: ( ) means 80 QFP package.
Table 20-2. Comparison of S3P821A and S3C821A Features
CharacteristicS3P821AS3C821A
Program Memory48-K byte EPROM48-K byte mask ROM
Operating Voltage (VDD)2.0 V to 5.5 V2.0 V to 5.5 V
OTP Programming ModeVDD = 5 V, V
(TEST) = 12.5 V
PP
Pin Configuration80 QFP/80 TQFP80 QFP/80 TQFP
EPROM ProgrammabilityUser Program 1 timeProgrammed at the factory
OPERATING MODE CHARACTERISTICS
When 12.5 V is supplied to the VPP (TEST) pin of the S3P821A, the EPROM programming mode is entered. The
operating mode (read, write, or read protection) is selected according to the input signals to the pins listed in
Table 20-3 below.
Table 20-3. Operating Mode Selection Criteria
V
DD
V
PP
(TEST)
REG/
MEMMEM
ADDRESS
(A15–A0)
R/WMODE
5 V5 V00000H1EPROM read
12.5 V00000H0EPROM program
12.5 V00000H1EPROM verify
12.5 V10E3FH0EPROM read protection
NOTE: "0" means Low level; "1" means High level.
20-4
Page 31
S3C821A/P821AS3P821A OTP
Table 20-4. D.C. Electrical Characteristics
(T
= – 40 °C to + 85 °C, V
A
= 2.0 V to 5.5 V)
DD
ParameterSymbolConditionsMinTypMaxUnit
Operating VoltageV
DD
f
OSC
= 8 MHz
2.2–5.5V
(Instruction clock = 1.33 MHz)
f
OSC
= 6 MHz
2.0
(Instruction clock = 1 MHz)
Input High
V
IH1
P0 and P10.7 V
DD
–V
DD
V
voltage
Input Low voltageV
Output High
voltage
Output Low
voltage
Input High
I
leakage current
I
Input Low
leakage current
Output High
I
leakage current
Output Low
leakage current
|V
DD–COMi
|
voltage drop
V
IH2
V
IH3
V
V
V
OH
V
LIH1
LIH2
I
LIL1
I
LIL2
LOH
I
LOL
V
IL1
IL2
IL3
OL
DC
RESET, P2, P3, P4, and P5
X
XT
,
IN
IN
P0 and P10–0.3 V
RESET, P2, P3, P4, and P5
X
XT
,
IN
IN
V
= 3 V; IOH = – 200 µA
DD
All output pins
V
= 3 V; IOL= 1 mA
DD
All output pins
VIN = V
DD
All input pins except those specified
below for I
VIN = V
X
,
IN
V
IN
X
OUT
= 0 V
DD
LIH2
XT
,
and XT
,
IN
OUT
All input pins except those specified
below for I
V
= 0 V
IN
X
X
,
IN
OUT
V
= V
OUT
and RESET
LIL2
XT
,
,
IN
DD
and XT
OUT
All output pins
V
= 0 V
OUT
All output pins
VDD = 2.7 V to 5.5 V
– 15 µA per common pin