Datasheet RHRP640CC, RHRP650CC, RHRP660CC Datasheet (Intersil)

Page 1
RHRP640CC, RHRP650CC, RHRP660CC
January 1998 File Number 4464
6A, 400V - 600V Hyperfast Dual Diodes
RHRP640CC, RHRP650CC and RHRP660CC are hyperfast dual diodes with soft recovery characteristics (t
< 30ns).
rr
They have half the recovery time of ultrafast diodes and are silicon nitride passivated ion-implanted hepaticas planar construction.
These devices are intended for use as freewheeling/clamping diodes and rectifiers in a variety of switching power supplies and otherpower switching applications. Their low stored charge and ultrafast soft recovery minimize ringing and electrical noise in many power switching circuits reducing power loss in the switching transistors.
Formerly developmental type TA49057.
Ordering Information
PART NUMBER PACKAGE BRAND
RHRP640CC TO-220AB RHRP640C RHRP650CC TO-220AB RHRP650C RHRP660CC TO-220AB RHRP660C
NOTE: When ordering, use the entire part number.
Features
• Hyperfast with Soft Recovery . . . . . . . . . . . . . . . .<30ns
• Operating Temperature . . . . . . . . . . . . . . . . . . . . 175
o
• Reverse Voltage Up To. . . . . . . . . . . . . . . . . . . . . . .600V
• Avalanche Energy Rated
• Planar Construction
• Related Literature
- TB334 “Guidelines for Soldering Surface Mount Components to PC Boards”
Applications
• Switching Power Supplies
• Power Switching Circuits
• General Purpose
Symbol
K
C
Package
CATHODE (FLANGE)
A
1
JEDEC TO-220AB
A
2
ANODE 2
CATHODE
ANODE 1
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
Page 2
RHRP640CC, RHRP650CC, RHRP660CC
Absolute Maximum Ratings (Per Leg) T
= 25oC, Unless Otherwise Specified
C
RHRP640CC RHRP650CC RHRP660CC UNITS
Peak Repetitive Reverse Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Working Peak Reverse Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
RRM
RWM
DC Blocking Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
Average Rectified Forward Current . . . . . . . . . . . . . . . . . . . . . . . . . . .I
F(AV)
400 500 600 V 400 500 600 V 400 500 600 V
R
666A
TC = 152oC
Repetitive Peak Surge Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
FSM
12 12 12 A
Square Wave, 20kHz
Nonrepetitive Peak Surge Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
FSM
60 60 60 A
Halfwave, 1 phase, 60Hz
Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .P
Avalanche Energy (See Figures 10 and 11). . . . . . . . . . . . . . . . . . . . . E
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .T
STG,TJ
D
AVL
50 50 50 W 10 10 10 mJ
-65 to 175 -65 to 175 -65 to 175
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s . . . . . . . . . . . . . . . . . . . . T
Package Body for 10s, see Tech Brief 334. . . . . . . . . . . . . . . . . . . . T
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Electrical Specifications (Per Leg) T
= 25oC, Unless Otherwise Specified
C
pkg
300
L
260
300 260
300 260
RHRP640CC RHRP650CC RHRP660CC
SYMBOL TEST CONDITION
V
F
IF = 6A - - 2.1 - - 2.1 - - 2.1 V
UNITSMIN TYP MAX MIN TYP MAX MIN TYP MAX
IF = 6A, TC = 150oC - - 1.7 - - 1.7 - - 1.7 V
I
R
VR = 400V - - 100 ------µA VR = 500V -----100---µA VR = 600V --------100µA VR = 400V, TC = 150oC--500------µA VR = 500V, TC = 150oC-----500---µA VR = 600V, TC = 150oC--------500µA
t
rr
IF = 1A, dIF/dt = 200A/µs- -30- -30- -30ns IF = 6A, dIF/dt = 200A/µs- -35- -35- -35ns
t
a
t
b
Q
RR
C
R
θJC
IF = 6A, dIF/dt = 200A/µs - 16 - - 16 - - 16 - ns IF = 6A, dIF/dt = 200A/µs - 8.5 - - 8.5 - - 8.5 - ns IF = 6A, dIF/dt = 200A/µs - 45 - - 45 - - 45 - nC VR = 10V, IF = 0A - 20 - - 20 - - 20 - pF
J
--3--3--3oC/W
DEFINITIONS
VF = Instantaneous forward voltage (pw = 300µs, D = 2%).
= Instantaneous reverse current.
I
R
t
= Reverse recovery time (See Figure 9), summation of ta + tb.
rr
= Time to reach peak reverse current (See Figure 9).
t
a
t
= Time from peak IRM to projected zero crossing of IRM based on a straight line from peak IRM through 25% of IRM (See Figure 9).
b
= Reverse recovery charge.
Q
RR
= Junction Capacitance.
C
J
R
= Thermal resistance junction to case.
θJC
pw = pulse width.
D = duty cycle.
o
C
o
C
o
C
2
Page 3
RHRP640CC, RHRP650CC, RHRP660CC
Typical Performance Curves
30
10
, FORWARD CURRENT (A)
F
I
1.0
0.5 0 0.5
175oC 25oC100oC
1.0 2.0
VF, FORWARD VOLTAGE (V)
1.5
2.5
3.0
1000
100
10
1
REVERSE CURRENT (µA)
0.1
R,
I
0.01 0 200 400 600300 500
100
VR, REVERSE VOLTAGE (V)
175oC
100oC
25oC
FIGURE 1. FORWARD CURRENT vs FORWARD VOLTAGE FIGURE 2. REVERSE CURRENT vs REVERSE VOLTAGE
30
25
20
15
10
t, RECOVERY TIMES (ns)
5
TC = 25oC, dIF/dt = 200A/µs
t
rr
t
a
t
b
50
40
30
20
t, RECOVERY TIMES (ns)
10
TC = 100oC, dIF/dt = 200A/µs
t
rr
t
a
t
b
0
0.5 IF, FORWARD CURRENT (A)
61
0
0.5 IF, FORWARD CURRENT (A)
FIGURE 3. trr,taAND tbCURVES vs FORWARD CURRENT FIGURE 4. trr,taAND tbCURVES vs FORWARD CURRENT
75
60
45
30
t, RECOVERY TIMES (ns)
15
0
0.5
TC = 175oC, dIF/dt = 200A/µs
t
rr
t
a
t
b
IF, FORWARD CURRENT (A)
61
6
5
4
3
2
1
0
(AV), AVERAGE FORWARD CURRENT (A)
F
I
145
140 150 160 170 175165
SQ. WAVE
155
TC, CASE TEMPERATURE (oC)
DC
FIGURE 5. trr,taAND tbCURVES vs FORWARD CURRENT FIGURE 6. CURRENT DERATING CURVE
61
3
Page 4
RHRP640CC, RHRP650CC, RHRP660CC
Typical Performance Curves (Continued)
50
40
30
20
10
, JUNCTION CAPACITANCE (pF)
J
C
0
0 50 100 150 200
FIGURE 7. JUNCTION CAPACITANCE vs REVERSE VOLTAGE
Test Circuits and Waveforms
VGE AMPLITUDE and
RG CONTROL dIF/dt
1 ANDt2
CONTROL I
F
L
t
V
, REVERSE VOLTAGE (V)
R
DUT
CURRENT
R
G
V
GE
t
1
t
2
IGBT
SENSE
+
V
DD
-
0
dI
F
I
F
dt
t
rr
t
a
t
b
0.25 I
RM
I
RM
FIGURE 8. trr TEST CIRCUIT FIGURE 9. trr WAVEFORMS AND DEFINITIONS
L = 20mH R < 0.1
= 1/2LI2 [V
E
AVL
Q
= IGBT (BV
1
Q
CES
1
R(AVL)
> DUT V
/(V
R(AVL)
R(AVL)
CURRENT
SENSE
DUT
- VDD)] )
LR
V
I
AVL
L
+
V
DD
I
L
IV
V
DD
­t
0
t
1
t
2
t
FIGURE 10. AVALANCHE ENERGY TEST CIRCUIT FIGURE 11. AVALANCHE CURRENT AND VOLTAGE
WAVEFORMS
4
Page 5
RHRP640CC, RHRP650CC, RHRP660CC
TO-220AB
3 LEAD JEDEC TO-220AB PLASTIC PACKAGE
ØP
Q
D
E
1
L
1
E
H
1
D
1
b
1
A
A
1
SYMBOL
A 0.170 0.180 4.32 4.57 -
A
1
TERM. 4
o
45
b 0.030 0.034 0.77 0.86 3, 4
b
1
c 0.014 0.019 0.36 0.48 2, 3 , 4
D 0.590 0.610 14.99 15.49 -
D
1
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
0.048 0.052 1.22 1.32 -
0.045 0.055 1.15 1.39 2, 3
- 0.160 - 4.06 -
E 0.395 0.410 10.04 10.41 -
L
o
60
1
2
e
e
1
b
c
E
1
- 0.030 - 0.76 -
e 0.100 TYP 2.54 TYP 5
3
J
1
e
1
H
1
J
1
0.200 BSC 5.08 BSC 5
0.235 0.255 5.97 6.47 -
0.100 0.110 2.54 2.79 6
L 0.530 0.550 13.47 13.97 -
L
1
0.130 0.150 3.31 3.81 2
ØP 0.149 0.153 3.79 3.88 -
Q 0.102 0.112 2.60 2.84 -
NOTES:
1. These dimensions are withinallowable dimensionsof Rev.J of JEDEC TO-220AB outline dated 3-24-87.
2. Lead dimension and finish uncontrolled in L1.
3. Lead dimension (without solder).
4. Add typically 0.002 inches (0.05mm) for solder coating.
5. Position oflead to bemeasured 0.250inches (6.35mm) frombot­tom of dimension D.
6. Position oflead to bemeasured 0.100inches (2.54mm) frombot­tom of dimension D.
7. Controlling dimension: Inch.
8. Revision 2 dated 7-97.
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5
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