The 74F583 4-bit coded (BCD) full adder performs the addition of
two decimal numbers (A0–A3, B0–B3). The look-ahead generates
BCD carry terms internally, allowing the 74F583 to then do BCD
addition correctly . For BCD numbers 0 through 9 at A and B inputs,
the BCD sum forms at the output.
In addition of two BCD numbers totalling a number greater than 9, a
valid BCD number and carry will result. For input values larger than
9, the number is converted from binary to BCD. Binary to BCD
conversion occurs by grounding one set of inputs, An or Bn, and
applying a 4-bit binary number to the other set of inputs. If the input
is between 0 and 9, a BCD number occurs at the output. If the
binary input falls between 10 and 15, a carry term is generated. Both
the carry term and the sum are the BCD equivalent of the binary
input. Converting binary numbers greater than 16 may be achieved
by cascading 74F583s.
PIN CONFIGURATION
1
2
B2
3
B3
4
A3
5
C
n
6
C
n+4
7
S2
89
GND
TYPICAL
TYPE
PROPAGATION
DELAY
74F5839.0 ns45 mA
16B1
V
CC
15
A2
14
A1
13
A0
12
B0
11
S0
10
S1
S3
SF01436
SUPPLY CURRENT
TYPICAL
(TOTAL)
ORDERING INFORMA TION
COMMERCIAL RANGE
PACKAGE
VCC = 5 V ±10%
= 0°C to +70°C
T
amb
16-pin plastic DIPN74F583NSOT38-4
16-pin plastic SON74F583DSOT109-1
DRAWING
NUMBER
INPUT AND OUTPUT LOADING AND FAN-OUT TABLE
PINSDESCRIPTION74F (U.L.)
HIGH / LOW
A0–A3A operand inputs1.0 / 2.020 µA / 1.2 mA
B0–B3B operand inputs1.0 / 2.020 µA / 1.2 mA
C
n
C
n+4
Carry input1.0 / 1.020 µA / 0.6 mA
Carry output50 / 331.0 mA / 20 mA
S0–S3Sum outputs50 / 331.0 mA / 20 mA
NOTE:
One (1.0) FAST Unit Load is defined as 20 µA in the High state and 0.6 mA in the Low state.
LOGIC SYMBOL
= Pin 16
V
CC
GND = Pin 8
A0 B0 A1 B1 A2 B2 A3 B3
C
n
S0 S1 S2 S3
11 10 79
C
n+4
342151141213
65
SF01437
LOGIC SYMBOL (IEEE/IEC)
13
14
15
4
12
1
2
3
5
Σ (BCD)
0
P
3
0
Q
3
Σ
LOAD VALUE
HIGH / LOW
0
3
COCI
SF01438
11
10
7
9
6
1989 Apr 06853–1245 96263
2
Page 3
Philips SemiconductorsProduct specification
74F5834-bit BCD adder
LOGIC DIAGRAM
11
S0
12
B0
13
A0
1
B1
14
A1
2
B2
15
A2
3
B3
4
A3
5
C
n
10
S1
7
S2
9
S3
6
C
n+4
V
= PIN 16
CC
GND = PIN 8
1989 Apr 06
SF01435
3
Page 4
Philips SemiconductorsProduct specification
SYMBOL
PARAMETER
UNIT
SYMBOL
PARAMETER
TEST CONDITIONS
1
UNIT
VOHHigh-level output voltage
VOLLow-level output voltage
IILLow-level input current
74F5834-bit BCD adder
ABSOLUTE MAXIMUM RATINGS
Operation beyond the limits set forth in this table may impair the useful life of the device.
Unless otherwise noted, these limits are over the operating free-air temperature range.
SYMBOL
V
V
I
T
T
CC
V
IN
I
IN
OUT
OUT
amb
stg
Supply voltage–0.5 to +7.0V
Input voltage–0.5 to +7.0V
Input current–30 to +5mA
Voltage applied to output in High output state–0.5 to +V
Current applied to output in Low output state40mA
Operating free-air temperature range0 to +70°C
Storage temperature range–65 to +150°C
Over recommended operating free-air temperature range unless otherwise noted.
LIMITS
MINTYP
p
p
V
IK
I
I
I
IH
I
OS
I
CC
Input clamp voltageVCC = MIN, II = I
Input current at maximum input voltageVCC = MAX, VI = 7.0 V100µA
High-level input currentVCC = MAX, VI = 2.7 V20µA
p
Short circuit output current
Cn onlyVCC = MAX, VI = 0.5 V–0.6mA
An and BnVCC = MAX, VI = 0.5 V–1.2mA
3
Supply current (total)VCC = MAX4560mA
VCC = MIN, VIL = MAX
VIH = MIN, IOH = MAX
VCC = MIN, VIL = MAX
VIH = MIN, IOL = MAX
IK
VCC = MAX–60–150mA
±10% V
±5% V
±10% V
±5% V
2.5V
CC
2.73.4V
CC
CC
CC
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at V
3. Not more than one output should be shorted at a time. For testing I
= 5 V, T
CC
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
amb
= 25°C.
, the use of high-speed test apparatus and/or sample-and-hold
OS
of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, I
tests should be performed last.
OS
2
MAX
0.300.50V
0.300.50V
–0.73–1.2V
1989 Apr 06
4
Page 5
Philips SemiconductorsProduct specification
74F5834-bit BCD adder
AC ELECTRICAL CHARACTERISTICS
LIMITS
T
SYMBOLPARAMETERTEST CONDITION
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
Propagation delay
An or Bn to Sn
Propagation delay
An or Bn to Sn (INV)
Propagation delay
Cn to C
n+4
Propagation delay
An or Bn to C
n+4
Propagation delay
Cn to Sn
Propagation delay
Cn to Sn (INV)
Waveform 1
Waveform 2
Waveform 1, 2
Waveform 1, 2
Waveform 1
Waveform 2
= +25°C
amb
VCC = 5 V
C
= 50 pF; RL = 500 Ω
L
MINTYPMAXMINMAX
5.0
5.0
6.0
4.0
3.5
2.5
5.0
5.0
4.0
3.5
6.0
3.5
13.0
10.5
11.0
8.0
5.0
4.0
8.0
7.5
12.0
8.0
9.5
8.0
17.0
14.0
18.0
12.0
8.0
7.0
11.5
10.5
15.5
12.5
13.0
11.5
T
= 0°C to +70°C
amb
VCC = 5 V ±10%
C
= 50 pF; RL = 500 Ω
L
5.0
5.0
5.0
4.0
3.0
2.0
4.5
4.5
3.5
3.0
5.0
3.0
18.0
15.0
19.5
12.5
8.5
7.0
13.0
11.5
17.0
13.5
14.5
12.0
UNIT
ns
ns
ns
ns
ns
ns
AC WAVEFORMS
For all waveforms, VM = 1.5 V.
An, Bn, C
Sn, C
n+4
n
V
M
t
PLH
V
M
t
PHL
V
M
V
M
SF01439
Waveform 1. Propagation delay for non-inverting outputs
TEST CIRCUIT AND WAVEFORMS
V
CC
V
PULSE
GENERATOR
IN
R
T
Test Circuit for Totem-Pole Outputs
D.U.T.
V
OUT
R
C
L
L
NEGATIVE
PULSE
POSITIVE
PULSE
An, Bn, C
Sn, C
n+4
n
V
M
t
PHL
V
M
t
PLH
V
M
V
SF01440
Waveform 2. Propagation delay for inverting outputs
t
90%
10%
V
M
10%
t
THL (tf
t
TLH (tr
90%
V
M
w
10%
)
)
t
w
t
TLH (tr
t
THL (tf
)
)
90%
90%
V
M
V
M
10%
M
AMP (V)
0V
AMP (V)
0V
DEFINITIONS:
R
= Load resistor;
L
see AC ELECTRICAL CHARACTERISTICS for value.
= Load capacitance includes jig and probe capacitance;
SO16:plastic small outline package; 16 leads; body width 3.9 mmSOT109-1
1989 Apr 06
7
Page 8
Philips SemiconductorsProduct specification
74F5834-bit BCD adder
Data sheet status
Data sheet
status
Objective
specification
Preliminary
specification
Product
specification
Product
status
Development
Qualification
Production
Definition
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1]
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1989
All rights reserved. Printed in U.S.A.
Date of release: 04-00
Document order number:9397 750 07093
1989 Apr 06
8
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.