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INTEGRATED CIRCUITS
74F378
Hex D flip-flop with enable
Product specification
IC15 Data Handbook
1989 Oct 05
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Philips Semiconductors Product specification
74F378Hex D flip-flop with enable
FEA TURES
•6-bit high-speed parallel register
•Positive edge-triggered D-type inputs
•Fully buffered common Clock and Enable inputs
•Input clamp diodes limit high speed termination effects
•Fully TTL and CMOS compatible
DESCRIPTION
The 74F378 has six edge-triggered D-type flip-flops with individual
D inputs and Q outputs. The common buffered Clock (CP) input
loads all flip-flops simultaneously when the Enable (E
The register is fully edge-triggered. The state of each D input, one
setup time before the Low-to-High clock transition is transformed to
the corresponding flop-flop’s Q output. The E
one setup time prior to the Low-to-High clock transition for
predictable operation.
PIN CONFIGURATION
16
V
CC
15
Q5
14
D5
13
D4
12
Q4
11
D3
107
Q3
98
CP
GND
Q0
D0
D1
Q1
D2
Q2
1
E
2
3
4
5
6
) input is Low.
input must be stable
TYPE TYPICAL f
max
TYPICAL SUPPL Y
CURRENT (TOTAL)
74F378 100MHz 35mA
ORDERING INFORMATION
COMMERCIAL
DESCRIPTION
16–pin plastic DIP N74F378N SOT38-4
16–pin plastic SO N74F378D SOT109-1
RANGE
= 5V ±10%,
V
CC
T
= 0°C to +70°C
amb
PKG DWG #
SF00927
INPUT AND OUTPUT LOADING AND FAN OUT TABLE
PINS DESCRIPTION 74F (U.L.)
HIGH/LOW
D0 – D5 Data inputs 1.0/1.0 20µA/0.6mA
CP Clock pulse input (active rising edge) 1.0/1.0 20µA/0.6mA
E Enable input (active low) 1.0/1.0 20µA/0.6mA
Q0 – Q5 Data outputs 50/33 1.0mA/20mA
NOTE:
One (1.0) FAST unit load is defined as: 20µA in the High state and 0.6mA in the Low state.
LOAD VALUE
HIGH/LOW
1989 Oct 05 853–0067 97804
2
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Philips Semiconductors Product specification
74F378Hex D flip-flop with enable
LOGIC SYMBOL
9
1
V
= Pin 16
CC
GND = Pin 8
LOGIC DIAGRAM
1
E
34 6111314
D0 D1 D2 D3 D4 D5
CP
E
Q0 Q1 Q2 Q3 Q4 Q5
2 5 7 101215
D0
3
D1
SF00916
4
IEC/IEEE SYMBOL
1
G1
9
3
4
6
11
13
14
D2
6
D3
11
D4
13
1C2
2D
D5
14
2
5
7
10
12
15
SF00917
9
CP
V
= Pin 16
CC
GND = Pin 8
DQ
CP
DQ
CP
2
Q0
FUNCTION TABLE
INPUTS OUTPUTS
E CP Dn Qn
l ↑ h H Load “1”
l ↑ l L Load “0”
h
H
H = High-voltage level
h = High-voltage level one setup time
prior to the Low-to-High clock transition
L = Low-voltage level
l = Low-voltage level one setup time
prior to the Low-to-High clock transition
X = Don’t care
↑ = Low-to-High clock transition
↑
X
X
X
no change
no change
DQ
5
Q1
OPERATING
MODE
Hold (do nothing)
CP
7
Q2
DQ
CP
Q3
DQ
10
CP
Q4
12
DQ
CP
15
Q5
SF00918
1989 Oct 05
3
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Philips Semiconductors Product specification
SYMBOL
PARMETER
UNIT
SYMBOL
PARAMETER
VOHHigh-l
VOLLow-level output voltage
3
ICCSupply current (total)
V
MAX
74F378Hex D flip-flop with enable
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limit set forth in this table may impair the useful life of the device. Unless otherwise noted these limits are over the
operating free-air temperature range.)
SYMBOL PARAMETER RATING UNIT
V
CC
V
IN
I
IN
V
OUT
I
OUT
T
amb
T
stg
RECOMMENDED OPERATING CONDITIONS
V
CC
V
IH
V
IL
I
IK
I
OH
I
OL
T
amb
Supply voltage –0.5 to +7.0 V
Input voltage –0.5 to +7.0 V
Input current –30 to +5 mA
Voltage applied to output in High output state –0.5 to V
Current applied to output in Low output state
CC
40 mA
Operating free-air temperature range 0 to +70
Storage temperature range –65 to +150
V
°C
°C
LIMITS
SYMBOL
MIN NOM MAX
Supply voltage 4.5 5.0 5.5 V
High-level input voltage 2.0 V
Low-level input voltage 0.8 V
Input clamp current –18 mA
High-level output current –1 mA
Low-level output current
Operating free-air temperature range 0 70
20 mA
°C
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
TEST LIMITS UNIT
CONDITIONS
VCC = MIN, VIL = MAX,
evel output voltage
VIH = MIN, IOH = MAX
p
V
IK
I
I
I
IH
I
IL
I
OS
Input clamp voltage VCC = MIN, II = I
Input current at maximum input voltage VCC = MAX, VI = 7.0V 100 µA
High-level input current VCC = MAX, VI = 2.7V 20 µA
Low-level input current VCC = MAX, VI = 0.5V –0.6 mA
Short-circuit output current
pp
I
CCH
I
CCL
VCC = MIN, VIL = MAX, ±10%V
VIH = MIN, IOL = MAX
IK
VCC = MAX –60 –150 mA
=
CC
Notes:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at V
3. Not more than one output should be shorted at a time. For testing I
= 5V, T
CC
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
amb
= 25°C.
, the use of high-speed test apparatus and/or sample-and-hold
OS
of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, I
tests should be performed last.
OS
1
±10%V
±5%V
±5%V
MIN TYP2MAX
2.5 V
CC
2.7 3.4 V
CC
CC
CC
0.30 0.50 V
0.30 0.50 V
–0.73 –1.2 V
32 45 mA
35 45 mA
1989 Oct 05
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Philips Semiconductors Product specification
74F378Hex D flip-flop with enable
AC ELECTRICAL CHARACTERISTICS
LIMITS
T
= +25°C T
amb
SYMBOL PARAMETER TEST VCC = +5.0V VCC = +5.0V ± 10% UNIT
CONDITION CL = 50pF, RL = 500Ω CL = 50pF, RL = 500Ω
MIN TYP MAX MIN MAX
f
MAX
t
PLH
t
PHL
Maximum clock frequency Waveform 1 80 100 80 MHz
Propagation delay
CP to Qn
Waveform 1
3.0
3.5
5.5
6.0
7.5
8.5
AC SETUP REQUIREMENTS
LIMITS
T
= +25°C T
SYMBOL PARAMETER TEST VCC = +5.0V VCC = +5.0V ± 10% UNIT
CONDITION CL = 50pF, RL = 500Ω CL= 50pF, RL = 500Ω
t
(H)
s
t
(L)
s
t
(H)
h
t
(L)
h
t
(H)
s
t
(L)
s
t
(H)
h
t
(L)
h
t
(H)
w
t
(L)
w
Setup time, High or Low
Dn to CP
Hold time, High or Low
Dn to CP
Setup time, High or Low
E to CP
Hold time, High or Low
E to CP
CP Pulse width,
High or Low
Waveform 2
Waveform 2
Waveform 2
Waveform 2
Waveform 1
amb
MIN TYP MAX MIN MAX
4.0
4.0
0
0
4.0
10.0
0
0
4.0
6.0
= 0°C to +70°C
amb
3.0
3.5
= 0°C to +70°C
amb
4.0
4.0
0
0
4.0
10.0
0
0
4.0
6.0
8.5
9.5
ns
ns
ns
ns
ns
ns
AC WAVEFORMS
For all waveforms, VM = 1.5V.
The shaded areas indicate when the input is permitted to change for predictable output performance.
1/f
MAX
CP
Qn
V
M
tw(H)
PHL
V
M
tw(L)t
V
M
V
M
t
PLH
Waveform 1. Propagation Delay, Clock Input to Output,
Clock Pulse Width, and Maximum Clock Frequency
V
M
SF00919
Dn
En
CP
V
MVM
V
M
t
s
V
M
Waveform 2. Data and Enable Setup Time and Hold Times
V
M
t
h
V
V
M
M
th=0 th=0
ts(H)ts(L)
V
M
SF00920
1989 Oct 05
5
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Philips Semiconductors Product specification
74F378Hex D flip-flop with enable
TEST CIRCUIT AND WAVEFORM
V
CC
PULSE
GENERATOR
V
IN
R
T
D.U.T.
V
OUT
R
C
L
L
Test Circuit for Totem-Pole Outputs
DEFINITIONS:
= Load resistor;
R
L
see AC ELECTRICAL CHARACTERISTICS for value.
C
= Load capacitance includes jig and probe capacitance;
L
see AC ELECTRICAL CHARACTERISTICS for value.
R
= Termination resistance should be equal to Z
T
pulse generators.
OUT
of
NEGATIVE
PULSE
POSITIVE
PULSE
family
74F
90%
10%
amplitude
t
w
V
M
10%
)
t
THL (tf
)
t
TLH (tr
90%
V
M
t
TLH (tr
t
THL (tf
t
w
Input Pulse Definition
INPUT PULSE REQUIREMENTS
V
rep. rate
M
3.0V 1.5V
1MHz 500ns
10%
)
)
90%
t
w
V
M
V
M
90%
10%
t
TLHtTHL
2.5ns 2.5ns
AMP (V)
0V
AMP (V)
0V
SF00006
1989 Oct 05
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Philips Semiconductors Product specification
74F378Hex D flip-flop with enable
DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4
1989 Oct 05
7
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Philips Semiconductors Product specification
74F378Hex D flip-flop with enable
SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
1989 Oct 05
8
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Philips Semiconductors Product specification
74F378Hex D flip-flop with enable
NOTES
1989 Oct 05
9
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Philips Semiconductors Product specification
74F378Hex D flip-flop with enable
Data sheet status
Data sheet
status
Objective
specification
Preliminary
specification
Product
specification
Product
status
Development
Qualification
Production
Definition
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1]
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print code Date of release: 10-98
Document order number: 9397-750-05122
yyyy mmm dd
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