Datasheet MBRS 340T3G ONS Datasheet

Page 1
MBRS320T3, MBRS330T3,
)
MBRS340T3
Preferred Devices
Surface Mount Schottky Power Rectifier
These devices employ the Schottky Barrier principle in a large area metal−to−silicon power diode. State−of−the−art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity protection diodes, in surface mount applications where compact size and weight are critical to the system.
Features
Small Compact Surface Mountable Package with J−Bend Leads
Rectangular Package for Automated Handling
Highly Stable Oxide Passivated Junction
Very Low Forward Voltage Drop
(0.5 V Max @ 3.0 A, TJ = 25°C)
Excellent Ability to Withstand Reverse Avalanche Energy Transients
Guard−Ring for Stress Protection
Device Passes ISO 7637 Pulse #1
Pb−Free Packages are Available
Mechanical Characteristics
Case: Epoxy, Molded, Epoxy Meets UL 94 V−0
Weight: 217 mg (Approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Polarity: Notch in Plastic Body Indicates Cathode Lead
Device Meets MSL 1 Requirements
ESD Ratings: Machine Model, C > 400 V
Human Body Model, 3B > 8000 V
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SCHOTTKY BARRIER
RECTIFIERS
3.0 AMPERES
20, 30, 40 VOLTS
SMC
CASE 403
PLASTIC
MARKING DIAGRAM
AYWW
B3xG
G
B3x = Device Code x = 2, 3 or 4 A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location
ORDERING INFORMATION
Device Package Shipping
MBRS320T3 SMC 2500/Tape & Reel MBRS320T3G SMC
(Pb−Free) MBRS330T3 SMC 2500/Tape & Reel MBRS330T3G SMC
(Pb−Free) MBRS340T3 SMC 2500/Tape & Reel
MBRS340T3G SMC
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
Preferred devices are recommended choices for future use and best overall value.
2500/Tape & Reel
2500/Tape & Reel
2500/Tape & Reel
© Semiconductor Components Industries, LLC, 2006
January, 2006 − Rev. 8
1 Publication Order Number:
MBRS340T3/D
Page 2
MBRS320T3, MBRS330T3, MBRS340T3
10
)
10
0
MAXIMUM RATINGS
Rating Symbol MBRS320T3 MBRS330T3 MBRS340T3 Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage DC Blocking Voltage
Average Rectified Forward Current I
Nonrepetitive Peak Surge Current
(Surge applied at rated load conditions halfwave,
single phase, 60 Hz) Operating Junction Temperature T ISO 7637 Pulse #1
(100 V, 10W) ESD Ratings: Machine Model = C
ESD Ratings: Human Body Model = 3B
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Thermal Resistance, Junction−to−Lead
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 1)
(iF = 3.0 A, TJ = 25°C) Maximum Instantaneous Reverse Current (Note 1)
(Rated dc Voltage, TJ = 25°C)
(Rated dc Voltage, TJ = 100°C)
1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
V
RRM
V
RWM
V
F(AV)
I
FSM
R
q
V
i
20 30 40 V
R
3.0 @ TL = 110°C
A
4.0 @ TL = 105°C 80 A
J
− 65 to +125 °C 5000 Pulses
>400
V
>8000
JL
F
11 °C/W
V
0.50
R
mA
2.0 20
TJ = 125°C
1
, FORWARD CURRENT (AMPS)
F
I
0.1
0.20.0 0.4 0.6
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage
TYPICAL ELECTRICAL CHARACTERISTICS
1
TJ = 100°C
TJ = 25°C
TJ = −65°C
0.8
1.00.30.1 0.5 0.7 0.9
TJ = 125°C
, FORWARD CURRENT (AMPS)
F
I
0.1
VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (V
TJ = 100°C
TJ = 25°C
TJ = −65°C
0.20.0 0.4 0.6
0.30.1 0.5 0.7 0.9 1.
0.8
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2
Page 3
MBRS320T3, MBRS330T3, MBRS340T3
I
, REVERSE CURRENT (AMPS)
0
)
I
, AVERAGE FORWARD CURRENT (AMPS)
TYPICAL ELECTRICAL CHARACTERISTICS (continued)
1.E−01
1.E−02
1.E−03
1.E−04
1.E−05
R
1.E−06
O
TJ = 125°C
TJ = 100°C
TJ = 25°C
0202510 30
5
4.5 4
3.5 3
2.5 2
1.5 1
0.5 0
1.E−01
1.E−02
1.E−03
1.E−04
1.E−05
, MAXIMUM REVERSE CURRENT (AMPS
1.E−06
R
515 515
VR, REVERSE VOLTAGE (V)
35 40
I
TJ = 125°C
TJ = 100°C
TJ = 25°C
0202510 30
VR, REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current
, AVERAGE POWER DISSIPATION (W)
FO
P
1.8
1.6
1.4
1.2
0.8
0.6
0.4
0.2
2
SQUARE
IPK/IO = p
IPK/IO = 5
1
0
IO, AVERAGE FORWARD CURRENT (A)
WAVE
3.52.51.50.5
dc
SQUARE WAVE
IPK/IO = p
IPK/IO = 5
105 125
TL, LEAD TEMPERATURE (°C)
freq = 20 kHz
14525 45 65 85
Figure 5. Current Derating Figure 6. Forward Power Dissipation
40123
35 4
dc
4.5 5
700
TYPICAL CAPACITANCE AT 0 V = 658 pF
600
500
400
300
200
C, CAPACITANCE (pF)
100
0
4812
VR, REVERSE VOLTAGE (V)
Figure 7. Typical Capacitance
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3
TJ = 25°C
28 32 40
360162024
Page 4
MBRS320T3, MBRS330T3, MBRS340T3
PACKAGE DIMENSIONS
SMC
PLASTIC PACKAGE
CASE 403−03
ISSUE E
H
E
E
bD
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
4. 403−01 THRU −02 OBSOLETE, NEW STANDARD 403−03.
DIMAMIN NOM MAX MIN
A1 0.05 0.10 0.15 0.002
b 2.92 3.00 3.07 0.115 c 0.15 0.23 0.30 0.006 D 5.59 5.84 6.10 0.220 E 6.60 6.86 7.11 0.260
H
E
L 0.76 1.02 1.27 0.030
L1
MILLIMETERS
1.90 2.13 2.41 0.075
7.75 7.94 8.13 0.305 0.313 0.320
0.51 REF
INCHES
NOM MAX
0.084 0.095
0.004 0.006
0.118 0.121
0.009 0.012
0.230 0.240
0.270 0.280
0.040 0.050
0.020 REF
A
c
L1L
A1
SOLDERING FOOTPRINT*
4.343
0.171
3.810
0.150
2.794
0.110
SCALE 4:1
ǒ
inches
mm
Ǔ
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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MBRS340T3/D
4
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