Smart Power High-Side-Switch
for Industrial Applications
Features
• Short-circuit protection
• Input protection
• Overtemperature protection with hysteresis
• Overload protection
• Overvoltage protection
• Switching inductive load
• Clamp of negative output voltage with inductive loads
• Undervoltage shutdown
• Maximum current internally limited
• Electrostatic discharge (ESD) protection
• Reverse battery protection
Package: PG-SOT 223
Type
ISP 452
1
)
Ordering code
SP000219823
Application
• µC compatible power switch for 12 V DC grounded loads for industrial applications
• All types of resistive, inductive and capacitive loads
• Replaces electromechanical relays and discrete circuits
4
3
2
1
General Description
• N channel vertical power FET with charge pump, ground referenced CMOS compatible input, monolithically
integrated in Smart SIPMOS® technology.
•Providing embedded protection functions.
1
)
With resistor R
limited by connected load.
=150 Ω in GND connection, resistor in series with IN connections, reverse load current
GND
Page 1 of 10 2006-03-01
Page 2
ISP 452
Block diagram
+ V
bb
4
OUT
1
Load
IN3
ESDDiode
R
Voltage
source
V
Logic
Voltage
sensor
in
ESD
Logic
Overvoltage
protection
Charge pump
Level shifter
Rectifier
Current
limit
Gate
protection
Limit for
unclamped
ind. loads
Temperature
sensor
GND
MINI-PROFET
2
Signal GND
Load GND
Pin Symbol Function
1 OUT O Protected high-side power output
2 GND - Logic ground
3 IN I Input, activates the power switch in case of logical high signal
4 Vbb + Positive power supply voltage
Page 2 2006-03-01
Page 3
ISP 452
Maximum Ratings
at Tj = 25 °C unless otherwise specified
Parameter Symbol Values Unit
Supply voltage Vbb 40V
Load current self-limited IL I
2
Maximum input voltage
)
VIN -5.0...V
L(SC)
bb
A
V
Maximum input current IIN ±5 mA
Inductive load switch-off energy dissipation,
single pulse I
L = 0.5A, Tj, start = 150°C
0.5J
E
AS
(not tested, specified by design)
3
Load dump protection
R
=2 Ω , td=400ms, IN= low or high, U
I
)
V
LoadDump
= U
+ Vs
A
= 13.5 V
A
V
Load dump
4
)
V
(not tested, specified by design)
R
= 24 Ω
L
R
= 80 Ω
L
Electrostatic discharge capability (ESD)
5
)
PIN 3
V
±1
ESD
PIN 1,2,4
Junction Temperature
Operating temperature range
Storage temperature range
Max. power dissipation (DC)
At VIN > Vbb, the input current is not allowed to exceed ±5 mA.
3
)
Supply voltages higher than V
A resistor for the protection of the input is integrated.
4
)
V
Load dump
5
)
HBM according to MIL-STD 883D, Methode 3015.7
6
)
Device on epoxy pcb 40 mm x 40 mm x 1.5 mm with 6 cm2 copper area for Vbb connection
is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839
require an external current limit for the GND pin, e.g. with a 150 Ω resistor in the GND connection.
bb(AZ)
6)
R
R
thJS
thJA
770K/W
Page 3 2006-03-01
Page 4
ISP 452
Electrical Characteristics
Parameter and Conditions Symbol Values Unit
at Tj = 25 °C, Vbb = 13.5V unless otherwise specified
Load Switching Capabilities and Characteristics
On-state resistance (pin 4 to 1)
I
= 0.5 A, Vin = high Tj = 25°C
L
T
7
OUT
)
= 0.5 V
Nominal load current (pin 4 to 1)
ISO Standard: VT
= 85 °C
S
ON = V
bb
-V
= 150°C
j
Turn-on time to 90% V
Turn-off time to 10% V
R
= 24 Ω
L
Slew rate on
10 to 30% V
OUT
, R
= 24 Ω
L
Slew rate off
70 to 40% V
, RL= 24 Ω
OUT
Input
Allowable input voltage range, (pin 3 to 2) V
Input turn-on threshold voltage
T
= -40...+150°C
j
Input turn-off threshold voltage
T
= -40...+150°C
j
Input thresho ld hysteresis ∆V
Off state input current (pin 3) VIN(off) = 1.2 V
T
= -40...+150°C
j
On state input current (pin 3) VIN(on) = 3.0 V to V
T
= -40...+150°C
j
Input resistance RIN 1.5 2.8 3.5kΩ
OUT
OUT
bb
R
ON
min typ max
--
--
0.7 -- --A
I
L(ISO)
t
on
t
off
dV /dt
-dV/dt
IN
V
IN(T+)
V
IN(T-)
I
IN(off)
I
IN(on)
-- 2 4 V/µs
on
-- 2 4V/µs
off
-3.0 -- V
-- -- 3.5V
1.5 -- --V
-- 0.5 --V
IN(T)
10 -- 60µA
10 -- 100µA
--
--
0.16
--
60
60
0.2
Ω
0.4
100
µs
150
bb
V
7
)
I
is limited by current limitation, see I
L(ISO)
L(SC)
Page 4 2006-03-01
Page 5
ISP 452
Parameter and Conditions Symbol Values Unit
at Tj = 25 °C, Vbb = 13.5V unless otherwise specified
Operating Parameters
8
Operating voltage
)
Tj =-40...+150°C V
Undervoltage shutdown Tj =-40...+150°C V
Undervoltage restart Tj =-40...+25°C
T
=+150°C
j
Undervoltage restart of charge pumpe
see diagram page 9
Undervoltage hysteresis
∆V
bb(under)
= V
bb(u rst)
- V
bb(under)
Overvoltage shutdown Tj =-40...+150°C V
Overvoltage restart Tj =-40...+150°C V
Overvoltage hysteresis Tj =-40...+150°C∆V
Standby current (pin 4), Vin = low Tj =-40...+150°C I
Operating current (pin 2), Vin = 5 V I
Leakage current (pin 1) Vin = low Tj =-40...+25°C
T
=150°C
j
min typ max
5.0 -- 34V
bb(on)
bb(under)
V
bb(u rst)
3.5 -- 5V
-- -- 6.5
7.0
V
∆V
I
-- 5.6 7V
bb(ucp)
bb(under)
34 -- 42V
bb(over)
33 -- -- V
bb(o rst)
-- 0.7 --V
bb(over)
-- 10 25 µA
bb(off)
-- 1 1.6mA
GND
-- 2 5
L(off)
-- 0.3 --V
µA
7
V
8
)
At supply voltage increase up to V
= 5.6 V typ without charge pump, V
bb
≈Vbb - 2 V
OUT
Page 5 2006-03-01
Page 6
ISP 452
Parameter and Conditions Symbol Values Unit
at Tj = 25 °C, Vbb = 13.5V unless otherwise specified
Protection Functions
Current limit (pin 4 to 1) T
V
= 20V T
bb
= -40...+150°C
j
= 25°C
j
Overvoltage protection Ibb=4mA Tj =-40...+150°C V
Output clamp (ind. load switch off)
at V
The information herein is given to describe certain components and shall not be considered as a guarantee
of characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,
regarding circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your
nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide
(see address list).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the
types in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device
or system. Life support devices or systems are intended to be implanted in the human body, or to support
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health
of the user or other persons may be endangered.
Page 10 2006-03-01
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