Datasheet ISP1107W, ISP1107DH, ISP1107, ISP1106W, ISP1105 Datasheet (Philips)

ISP1105/1106/1107

Advanced Universal Serial Bus transceivers

Rev. 06 — 30 November 2001 Product data

1. General description

The ISP1105/1106/1107 range of Universal Serial Bus (USB) transceivers are fully
compliant with the
portable electronics devices such as mobile phones, digital still cameras, Personal
Digital Assistants (PDA) and Information Appliances (IA).

They allow USB Application Specific ICs (ASICs) and Programmable Logic Devices
(PLDs) with power supply voltages from 1.65 V to 3.6 V to interface with the physical
layer of the Universal Serial Bus. They have an integrated 5 V to 3.3 V voltage
regulator for direct powering via the USB supply V

The ISP1105/1106/1107 range can be used as a USB device transceiver or a USB
host transceiver. They can transmit and receive serial data at both full-speed
(12 Mbit/s) and low-speed (1.5 Mbit/s) data rates.

ISP1105 allows single/differential input modes selectable by a MODE input and it is
available in HBCC16 package. ISP1106 allows only differential input mode and is
available in both TSSOP16 and HBCC16 packages. ISP1107 allows only
single-ended input mode and is available in both TSSOP16 and HBCC16 packages.

Universal Serial Bus Specification Rev. 1.1

.

BUS

. They are ideal for

2. Features

■ Complies with

■ Integrated bypassable 5 V to 3.3 V voltage regulator for powering via USB V

■ V

■ Used as a USB device transceiver or a USB host transceiver

■ Supports full-speed (12 Mbit/s) and low-speed (1.5 Mbit/s) serial data rates

■ Stable RCV output during SE0 condition

■ Two single-ended receivers with hysteresis

■ Low-power operation

■ Supports an I/O voltage range from 1.65 V to 3.6 V

■ 4 kV on-chip ESD protection

■ Full industrial operating temperature range −40 to +85 °C

■ Available in small TSSOP16 (except ISP1105) and HBCC16 packages.

disconnection indication through VP and VM

BUS

Universal Serial Bus Specification Rev. 1.1

BUS

Philips Semiconductors

3. Applications

■ Portable electronic devices, such as:

◆ Mobile phone

◆ Digital still camera

◆ Personal Digital Assistant (PDA)

◆ Information Appliance (IA).

4. Ordering information

Table 1: Ordering information

Type number Package

Name Description Version

ISP1105W
ISP1106W
ISP1107W

ISP1106DH
ISP1107DH

[1]

HBCC16 plastic, heatsink bottom chip carrier; 16 terminals; body 3 × 3 × 0.65 mm SOT639-2

TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1

ISP1105/1106/1107

Advanced USB transceivers

[1] The ground terminal of ISP1105W is connected to the exposed diepad (heatsink).

4.1 Ordering options

Table 2: Selection guide

Product Package(s) Description

ISP1105 HBCC16 Supports both single-ended and differential input modes
ISP1106 TSSOP16 or HBCC16 Supports only the differential input mode
ISP1107 TSSOP16 or HBCC16 Supports only the single-ended input mode

[1] Refer to Table 5 and Table 6.
[2] Refer to Table 6.
[3] Refer to Table 5.

[2]

[3]

[1]

9397 750 08872

Product data Rev. 06 — 30 November 2001 2 of 24

© Koninklijke Philips Electronics N.V. 2001. All rights reserved.

Philips Semiconductors

5. Functional diagram

V

CC(I/O)

SOFTCON

SPEED

VMO/FSE0

VPO/VO

MODE

SUSPND

OE

RCV

VP

ISP1105/1106/1107

Advanced USB transceivers

3.3 V

VOLTAGE

REGULATOR

(3)
(3)
(4)

LEVEL

SHIFTER

ISP1105
ISP1106
ISP1107

V
V

V

pu(3.3)

D+
D−

CC(5.0)
reg(3.3)

33 Ω

33 Ω

(1)

(1)

(1%)

(1%)

1.5 kΩ

(2)

VM

MBL301

GND

(1) Use a 39 Ω resistor (1%) for a USB v2.0 compliant output impedance range.
(2) Connect to D− for low-speed operation.
(3) Pin function depends on device type see Section 7.2.
(4) Only for ISP1105.

Fig 1. Functional diagram (combined ISP1105, ISP1106 and ISP1107).

9397 750 08872

© Koninklijke Philips Electronics N.V. 2001. All rights reserved.

Product data Rev. 06 — 30 November 2001 3 of 24

Philips Semiconductors

6. Pinning information

6.1 Pinning

ISP1105/1106/1107

Advanced USB transceivers

SUSPND

VM

VP

RCV

OE

Bottom view

5

4

3

2

1

CC(I/O)

V

MODE

ISP1105W

GND
(exposed diepad)

141516

pu(3.3)

V

SOFTCON

SPEED

876

CC(5.0)

V

9

10

11

12

13

D−

D+

VPO/VO

VMO/FSE0

V

reg(3.3)

MBL303

SUSPND

VM

VP

RCV

OE

Bottom view

5

4

3

2

1

CC(I/O)

V

GND

ISP1106W
ISP1107W

pu(3.3)

V

SOFTCON

SPEED

876

*

141516

CC(5.0)

V

9

10

11

12

13

D−

D+
VPO/VO*

VMO/FSE0

V

reg(3.3)

MBL304

The asterisk (*) denotes that the signal names VO and
FSE0 apply to the ISP1107W.

Fig 2. Pinning diagram HBCC16 (ISP1105). Fig 3. Pinning diagram HBCC16 (ISP1106 and

ISP1107).

*

V

16

V

15
14

VMO/FSE0*

13

VPO/VO

12

D+

11

D−

10

SPEED

9

V

CC(5.0)
reg(3.3)

*

CC(I/O)

V

pu(3.3)

SOFTCON

OE

RCV

VP

VM

SUSPND

GND

1
2
3
4

ISP1106DH
ISP1107DH

5
6
7
8

MBL302

*

The asterisk (*) denotes that the signal names VO and FSE0 apply to the ISP1107DH.

Fig 4. Pinning diagram TSSOP16 (ISP1106 and ISP1107).

9397 750 08872

Product data Rev. 06 — 30 November 2001 4 of 24

© Koninklijke Philips Electronics N.V. 2001. All rights reserved.

Philips Semiconductors

ISP1105/1106/1107

Advanced USB transceivers

6.2 Pin description

Table 3: Pin description

CC(I/O)

[1]

Pin Type Description
ISP1105

HBCC16

ISP1106/7
HBCC16

ISP1106/7
TSSOP16

active LOW); enables the transceiver to transmit data on
the USB bus

); driven LOW when input SUSPND is HIGH; the

V

CC(I/O)

output state of RCV is preserved and stable during an SE0
condition

to V

); for external detection of single-ended zero

CC(I/O)

(SE0), error conditions, speed of connected device; driven
HIGH when no supply voltage is connected to V
V

reg(3.3)

to V

); for external detection of single-ended zero

CC(I/O)

(SE0), error conditions, speed of connected device; driven
HIGH when no supply voltage is connected to V
V

reg(3.3)

HIGH level enables low-power state while the USB bus is
inactive and drives output RCV to a LOW level

level enables the differential input mode (VPO, VMO)
whereas a LOW level enables a single-ended input mode
(VO, FSE0). see Table 5 and Table 6

[2]

6 8 - ground supply

779- supply voltage for digital I/O pins (1.65 to 3.6 V). When

V

is not connected, the (D+, D−) pins are in

CC(I/O)

three-state. This supply pin is totally independent of
V

CC(5.0)

and V

and must never exceed the V

reg(3.3)

voltage.

adjusts the slew rate of differential data outputs D+ and D−
according to the transmission speed:

LOW: low-speed (1.5 Mbit/s)
HIGH: full-speed (12 Mbit/s)

low-speed mode connect to pin V

full-speed mode connect to pin V

via a 1.5 kΩ resistor

pu(3.3)

via a 1.5 kΩ resistor

pu(3.3)

Schmitt trigger); see Table 5 and Table 6

Schmitt trigger); see Table 5 and Table 6

CC(I/O)

CC(I/O)

CC(I/O)

CC(5.0)

CC(5.0)

); a

); a HIGH

reg(3.3)

CC(I/O)

,

CC(I/O)

,

CC(I/O)

and

and

Symbol

OE113I input for output enable (CMOS level with respect to V

RCV224Odifferentialdatareceiveroutput(CMOSlevel with respect to

VP335Osingle-ended D+ receiver output (CMOS level with respect

VM446Osingle-ended D− receiver output (CMOS level with respect

SUSPND 557I suspend input (CMOS level with respect to V

MODE 6 I mode input (CMOS level with respect to V

GND ­V

SPEED 8 8 10 I speed selection input (CMOS levelwith respect to V

D− 9 9 11 AI/O negative USB data bus connection (analog, differential); for

D+ 10 10 12 AI/O positive USB data bus connection (analog, differential); for

VPO/VO 11 11 13 I driver data input (CMOS level with respect to V

VMO/FSE0 12 12 14 I driver data input (CMOS level with respect to V

,

);

9397 750 08872

Product data Rev. 06 — 30 November 2001 5 of 24

© Koninklijke Philips Electronics N.V. 2001. All rights reserved.

Philips Semiconductors

ISP1105/1106/1107

Advanced USB transceivers

Table 3: Pin description

Symbol

[1]

Pin Type Description
ISP1105

HBCC16

V

reg(3.3)

13 13 15 - Internalregulator option: regulated supply voltage output

…continued

ISP1106/7
HBCC16

ISP1106/7
TSSOP16

(3.0 to 3.6 V) during 5 V operation; a decoupling capacitor
of at least 0.1 µF is required

Regulator bypass option: used as a supply voltage input
for 3.3 V operation. (3.3 V ±10%)

V

CC(5.0)

14 14 16 - Internal regulator option: supply voltage input

(4.0 to 5.5 V); can be connected directly to USB supply
V

BUS

V

pu(3.3)

Regulator bypass option: connect to V

15 15 1 - pull-up supply voltage (3.3 V ±10%); connect an external

reg(3.3)

1.5 kΩ resistor on D+ (full-speed) or D− (low-speed); pin
function is controlled by input SOFTCON:

SOFTCON = LOW — V

floating (high impedance);

pu(3.3)

ensures zero pull-up current
SOFTCON = HIGH — V

to V

reg(3.3)

= 3.3 V;internally connected

pu(3.3)

SOFTCON 16 16 2 I software controlled USB connection input; a HIGH level

applies 3.3 V to pin V

, which is connected to an

pu(3.3)

external 1.5 kΩ pull-up resistor; this allows USB
connect/disconnect signalling to be controlled by software

[1] Symbol names with an overscore (e.g. NAME) indicate active LOW signals.
[2] Down bonded to the exposed diepad.

7. Functional description

7.1 Function selection

Table 4: Function table

SUSPND OE (D+, D−) RCV VP/VM Function

L L driving &

receiving
L H receiving
H L driving inactive

H H high-Z

[1] Signal levels on (D+, D−) are determined by other USB devices and external pull-up/down resistors.
[2] In ‘suspend’ mode (SUSPND = HIGH) the differential receiver is inactive and output RCV is always

LOW. Out-of-suspend (‘K’) signalling is detected via the single-ended receivers VP and VM.

[3] During suspend, the slew-rate control circuit of low-speed operation is disabled. The (D+, D−) lines

are still driven to their intended states, without slew-rate control. This is permitted because driving
during suspend is used to signal remote wake-up by driving a ‘K’ signal (one transition from idle to
‘K’ state) for a period of 1 to 15 ms.

[1]

[1]

inactive

active active normal driving

(differential receiver active)

active active receiving

[2]

active driving during ‘suspend’

(differential receiver inactive)

[2]

active low-power state

[3]

9397 750 08872

Product data Rev. 06 — 30 November 2001 6 of 24

© Koninklijke Philips Electronics N.V. 2001. All rights reserved.

Philips Semiconductors

7.2 Operating functions

Table 5: Driving function using single-ended input data interface (OE = L) [for

ISP1105/1106/1107

Advanced USB transceivers

ISP1107 and ISP1105 (MODE = L)]

FSE0 VO Data

L L differential logic 0

L H differential logic 1
H L SE0
H H SE0

Table 6: Driving function using differential input data interface (

and ISP1105 (MODE = H)]

VMO VPO Data

L L SE0

L H differential logic 1
H L differential logic 0
H H illegal state

Table 7: Receiving function (

(D+, D−) RCV VP

differential logic 0 L L H
differential logic 1 H H L

SE0 RCV*

[1] VP = VM = H indicates the sharing mode (V
[2] RCV* denotes the signal level on output RCV just before SE0 state occurs. This level is stable during

the SE0 period.

OE=H)

[2]

CC(5.0)/Vreg(3.3)

is disconnected).

OE = L) [for ISP1106

[1]

LL

7.3 Power supply configurations

The ISP1105/1106/1107 can be used with different power supply configurations,
which can be changed dynamically. An overview is given in Table 9.

VM

[1]

Normal mode — Both V
For 5 V operation, V

CC(5.0)

CC(I/O)

and V

CC(5.0)

or (V

CC(5.0)

and V

) are connected.

reg(3.3)

is connected to a 5 V source (4.0 to 5.5 V). The internal
voltage regulator then produces 3.3 V for the USB connections. For 3.3 V operation,
both V

CC(5.0)

and V

are connected to a 3.3 V source (3.0 to 3.6 V). V

reg(3.3)

CC(I/O)

is
independently connected to a voltage source (1.65 V to 3.6 V), depending on the
supply voltage of the external circuit.

Disable mode — V

is not connected, V

CC(I/O)

CC(5.0)

or (V

CC(5.0)

and V

reg(3.3)

) are
connected. In this mode, the internal circuits of the ISP1105/1106/1107 ensure that
the (D+, D−) pins are in three-state and the power consumption drops to the
low-power (suspended) state level. Some hysteresis is built into the detection of
V

Sharing mode — V

CC(I/O)

lost.

is connected, (V

CC(I/O)

CC(5.0)

and V

) are not connected. In

reg(3.3)

this mode, the (D+,D−) pins are made three-state and the ISP1105/1106/1107 allows
external signals of up to 3.6 V to share the (D+, D−) lines. The internal circuits of the
ISP1105/1106/1107 ensure that virtually no current (maximum 10 µA) is drawn via
the (D+, D−) lines. The power consumption through pin V

9397 750 08872

Product data Rev. 06 — 30 November 2001 7 of 24

© Koninklijke Philips Electronics N.V. 2001. All rights reserved.

CC(I/O)

drops to the

Philips Semiconductors

low-power (suspended) state level. Both the VP and VM pins are driven HIGH to
indicate this mode. Pin RCV is made LOW. Some hysteresis is built into the detection
of V

Table 8: Pin states in Disable or Sharing mode

Pins Disable mode state Sharing mode state

V

CC(5.0)/Vreg(3.3)

V

CC(I/O)

V

pu(3.3)

(D+, D−) high impedance high impedance
(VP, VM) invalid
RCV invalid
Inputs (VO/VPO, FSE0/VMO,

SPEED, MODE
SOFTCON)

[1] High impedance or driven LOW.
[2] ISP1105 only.

reg(3.3)

lost.

[2]

, SUSPND,OE,

ISP1105/1106/1107

Advanced USB transceivers

5 V input / 3.3 V output

3.3 V input / 3.3 V input
not present 1.65 V to 3.6 V input

high impedance (off) high impedance (off)

[1]
[1]

high impedance high impedance

not present

H

L

Table 9: Power supply configuration overview

V

CC(5.0)

V

reg(3.3)

or

V

CC(I/O)

Configuration Special characteristics

connected connected Normal mode ­connected not connected Disable mode (D+, D−) and V

pu(3.3)

impedance; VP, VM, RCV:

[1]

invalid

not connected connected Sharing mode (D+, D−) and V

pu(3.3)

impedance;
VP, VM driven HIGH;
RCV driven LOW

[1] High impedance or driven LOW.

7.4 Power supply input options

The ISP1105/1106/1107 range has two power supply input options:
Internal regulator — V

used to supply the internal circuitry with 3.3 V (nominal). The V

3.3 V output reference.
Regulator bypass — V

internal regulator is bypassed and the internal circuitry is supplied directly from the
V

power supply. The voltage range is 3.0 to 3.6 V to comply with the USB

reg(3.3)

specification.

is connected to 4.0 to 5.5 V. The internal regulator is

CC(5.0)

reg(3.3)

CC(5.0)

and V

are connected to the same supply. The

reg(3.3)

high

high

pin becomes a

The supply voltage range for each input option is specified in Table 10.

9397 750 08872

Product data Rev. 06 — 30 November 2001 8 of 24

© Koninklijke Philips Electronics N.V. 2001. All rights reserved.

Philips Semiconductors

ISP1105/1106/1107

Advanced USB transceivers

Table 10: Power supply input options

Input option V
Internal

regulator

Regulator
bypass

CC(5.0)

supply input for internal
regulator
(4.0 to 5.5 V)

connected to V

reg(3.3)

with maximum voltage
drop of 0.3 V

V

reg(3.3)

voltage reference
output
(3.3 V, 300µA)

supply input
(3.0 V to 3.6 V)

V

CC(I/O)

supply input for digital
I/O pins
(1.65 V to 3.6 V)

supply input for digital
I/O pins
(1.65 V to 3.6 V)

(2.7 to 3.6 V)

8. Limiting values

Table 11: Absolute maximum ratings

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

V

CC(5.0)

V

CC(I/O)

V

reg(3.3)

V

I

I

latchup

V

esd

T

stg

supply voltage −0.5 +6.0 V
I/O supply voltage −0.5 +4.6 V
regulated supply voltage −0.5 +4.6 V
DC input voltage −0.5 V

CC(I/O)

+ 0.5 V
latch-up current VI=−1.8 to 5.4 V - 100 mA
electrostatic discharge voltage

[1]

ILI<1µA

pins D+,D−,V

, GND

V

reg(3.3)

CC(5.0)

,

- ±4000 V

other pins - ±2000 V

storage temperature −40 +125 °C

[1] Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ resistor (Human Body Model). Refer to

EIA/JESD22-A114-A

.

EIA/JEDEC Standard specification

Table 12: Recommended operating conditions

Symbol Parameter Conditions Min Typ Max Unit

V

CC(5.0)

supply voltage (Internal

5 V operation 4.0 5.0 5.5 V

regulator option)

V

reg(3.3)

supply voltage (Regulator

3.3 V operation 3.0 3.3 3.6 V

bypass option)

V

CC(I/O)

V

I

V

I(AI/O)

I/O supply voltage 1.65 - 3.6 V
input voltage 0 - V
input voltage on analog I/O

0 - 3.6 V

CC(I/O)

V

pins (D+/D−)

T

amb

operating ambient temperature −40 - +85 °C

9397 750 08872

Product data Rev. 06 — 30 November 2001 9 of 24

© Koninklijke Philips Electronics N.V. 2001. All rights reserved.

Philips Semiconductors

ISP1105/1106/1107

Advanced USB transceivers

9. Static characteristics

Table 13: Static characteristics: supply pins

VCC= 4.0 to 5.5 V or V
combinations; T

=−40 to+85°C; unless otherwise specified.

amb

Symbol Parameter Conditions Min Typ Max Unit

V

reg(3.3)

regulated supply voltage
output

I

CC

I

CC(I/O)

I

CC(idle)

operating supply current full-speed transmitting and receiving

operating I/O supply current full-speedtransmittingand receiving

supply current during
full-speed idle and SE0

I

CC(I/O)(static)

I

CC(susp)

I

CC(dis)

I

CC(I/O)(sharing)

static I/O supply current full-speed idle, SE0 or suspend - - 20 µA
suspend supply current SUSPND = HIGH
disable mode supply current V
sharing mode I/O supply

current

I

Dx(sharing)

sharing mode load current
on pins D+ and D−

V

th(reg3.3)

regulated supply voltage
detection threshold

V

hys(reg3.3)

regulated supply voltage
detection hysteresis

V

th(I/Osup)

I/O supply voltage detection
threshold

V

hys(I/Osup)

I/O supply voltage detection
hysteresis

= 3.0 to 3.6 V; V

reg(3.3)

= 1.65 to 3.6 V; V

CC(I/O)

Internal regulator option;

≤ 300 µA

I

load

at 12 Mbit/s; C

= 50 pF on D+/D−

L

= 0 V; see Table 10 for valid voltage level

GND

[1]

[2]

3.0

3.3 3.6 V

-48

-12

[3]

[3]

at 12 Mbit/s
full-speed idle: VD+> 2.7 V,

< 0.3 V; SE0: VD+< 0.3 V,

V

D−

< 0.3 V

V

D−

not connected

CC(I/O)

V

or V

CC(5.0)

V

or V

CC(5.0)

SOFTCON = LOW; V

1.65 V ≤ V

2.7 V ≤ V

CC(I/O)

reg(3.3)

not connected - - 20 µA

reg(3.3)

not connected;

reg(3.3)

≤ V

= 3.6 V

Dx

reg(3.3)

≤ 3.6 V

;

[4]

- - 500 µA

[4]

--20µA

[4]

--20µA

--10µA

supply lost - - 0.8 V

[5]

supply present 2.4

V

V

= 1.8 V - 0.45 - V

CC(I/O)

= 2.7 to 3.6 V

reg(3.3)

--V

supply lost - - 0.5 V
supply present 1.4 - - V

V

= 3.3 V - 0.45 - V

reg(3.3)

mA

mA

[1] I
[2] In ‘suspend’ mode, the minimum voltage is 2.7 V.
[3] Characterized only, not tested in production.
[4] Excluding any load current and V
[5] When V

9397 750 08872

Product data Rev. 06 — 30 November 2001 10 of 24

includes the pull-up resistor current via pin V

load

pu(3.3)/Vsw

< 2.7 V, the minimum value for V

CC(I/O)

.

pu(3.3)

source current to the 1.5 kΩ and 15 kΩ pull-up and pull-down resistors (200 µA typ.).

th(reg3.3)(present)

is 2.0 V.

© Koninklijke Philips Electronics N.V. 2001. All rights reserved.

Philips Semiconductors

ISP1105/1106/1107

Advanced USB transceivers

Table 14: Static characteristics: digital pins

V

Symbol Parameter Conditions Min Typ Max Unit

V

Input levels

V
V

Output levels

V

V

Leakage current

I

Example 1: V

Input levels

V
V

Output levels

V

V

Example 2: V

Input levels

V
V

Output levels

V

V

Example 3: V

Input levels

V
V

Output levels

V

V

Capacitance

C

= 1.65 to 3.6 V; V

CC(I/O)

= 1.65 to 3.6 V

CC(I/O)

IL
IH

OL

OH

LI

IL
IH

OL

OH

IL
IH

OL

OH

IL
IH

OL

OH

IN

=0V; T

GND

LOW-level input voltage - - 0.3V
HIGH-level input voltage 0.6V

LOW-level output voltage

HIGH-level output voltage

=−40 to+85°C; unless otherwise specified.

amb

CC(I/O)

= 100 µA - - 0.15 V

I

OL

= 2 mA - - 0.4 V

I

OL

= 100 µAV

I

OH

= 2 mA V

I

OH

CC(I/O)
CC(I/O)

CC(I/O)

-- V

− 0.15 - - V

− 0.4 - - V

input leakage current - - ±1 µA

= 1.8 V ± 0.15 V

CC(I/O)

LOW-level input voltage - - 0.5 V
HIGH-level input voltage 1.2 - - V

= 100 µA - - 0.15 V

I

LOW-level output voltage

HIGH-level output voltage

= 2.5 V ± 0.2 V

CC(I/O)

OL

= 2 mA - - 0.4 V

I

OL

= 100 µA 1.5 - - V

I

OH

= 2 mA 1.25 - - V

I

OH

LOW-level input voltage - - 0.7 V
HIGH-level input voltage 1.7 - - V

= 100 µA - - 0.15 V

I

LOW-level output voltage

HIGH-level output voltage

= 3.3 V ± 0.3 V

CC(I/O)

OL

= 2 mA - - 0.4 V

I

OL

= 100 µA 2.15 - - V

I

OH

= 2 mA 1.9 - - V

I

OH

LOW-level input voltage - - 0.9 V
HIGH-level input voltage 2.15 - - V

= 100 µA - - 0.15 V

I

LOW-level output voltage

HIGH-level output voltage

OL

= 2 mA - - 0.4 V

I

OL

= 100 µA 2.85 - - V

I

OH

= 2 mA 2.6 - - V

I

OH

input capacitance pin to GND - - 10 pF

V

9397 750 08872

Product data Rev. 06 — 30 November 2001 11 of 24

© Koninklijke Philips Electronics N.V. 2001. All rights reserved.

Philips Semiconductors

ISP1105/1106/1107

Advanced USB transceivers

Table 15: Static characteristics: analog I/O pins (D+, D−)

VCC= 4.0 to 5.5 V or V

Symbol Parameter Conditions Min Typ Max Unit

Input levels

Differential receiver

V

DI

V

CM

differential input sensitivity |V
differential common mode

voltage

Single-ended receiver

V

IL

V

IH

V

hys

LOW-level input voltage - - 0.8 V
HIGH-level input voltage 2.0 - - V
hysteresis voltage 0.4 - 0.7 V

Output levels

V

OL

V

OH

LOW-level output voltage RL= 1.5 kΩ to +3.6 V - - 0.3 V
HIGH-level output voltage RL=15kΩ to GND 2.8

Leakage current

I

LZ

OFF-state leakage current - - ±1 µA

Capacitance

C

IN

transceiver capacitance pin to GND - - 20 pF

Resistance

Z
Z

DRV
DRV2

driver output impedance steady-state drive
driver output impedance for

USB 2.0

Z

INP

R

SW

input impedance 10 - - MΩ
internal switch resistance at

pin V

pu(3.3)

Termination

[4]

V

TERM

termination voltage for
upstream port pull-up (R

= 3.0 to 3.6 V; V

reg(3.3)

GND

I(D+)

=0V; T

− V

=−40 to+85°C; unless otherwise specified.

amb

| 0.2 - - V

I(D−)

includes VDI range 0.8 - 2.5 V

steady-state drive

[1]

[2]

34 39 44 Ω

[3]

40.5 45 49.5 Ω

- 3.6 V

--10Ω

[5]

PU

3.0

)

- 3.6 V

[1] V

OH(min)=Vreg(3.3)

[2] Includes external resistors of 33 Ω±1% on both D+ and D−.
[3] Includes external resistors of 39 Ω±1% on both D+ and D−. This range complies with
[4] This voltage is available at pins V
[5] In ‘suspend’ mode the minimum voltage is 2.7 V.

9397 750 08872

Product data Rev. 06 — 30 November 2001 12 of 24

− 0.2 V.

reg(3.3)

and V

pu(3.3)

Universal Serial Bus Specification Rev. 2.0

.

© Koninklijke Philips Electronics N.V. 2001. All rights reserved.

.

Philips Semiconductors

10. Dynamic characteristics

ISP1105/1106/1107

Advanced USB transceivers

Table 16: Dynamic characteristics: analog I/O pins (D+, D−)

VCC= 4.0 to 5.5 V or V
combinations; T

=−40 to+85°C; unless otherwise specified.

amb

= 3.0 to 3.6 V; V

reg(3.3)

= 1.65 to 3.6 V; V

CC(I/O)

[1]

= 0 V; see Table 10 for valid voltage level

GND

Symbol Parameter Conditions Min Typ Max Unit

Driver characteristics

Full-speed mode (SPEED = HIGH)

t

FR

rise time CL= 50 to 125 pF;

10 to 90% of |V

OH

− VOL|;

4 - 20 ns

see Figure 5

t

FF

fall time CL= 50 to 125 pF;

90 to 10% of |V

OH

4 - 20 ns

− VOL|;

see Figure 5

FRFM differential rise/fall time

FR/tFF

)

V

CRS

matching (t
output signal crossover

voltage

excluding the first transition
from Idle state

excluding the first transition
from Idle state; see Figure 8

90 - 111.1 %

[2]

1.3 - 2.0 V

Low-speed mode (SPEED = LOW)

t

LR

rise time CL= 50 to 600 pF;

10 to 90% of |V

OH

− VOL|;

75 - 300 ns

see Figure 5

t

LF

fall time CL= 50 to 600 pF;

90 to 10% of |V

OH

− VOL|;

75 - 300 ns

see Figure 5

LRFM differential rise/fall time

V

CRS

matching (t
output signal crossover

LR/tLF

)

voltage

excluding the first transition
from Idle state

excluding the first transition
from idle state; see Figure 8

80 - 125 %

[2]

1.3 - 2.0 V

Driver timing

Full-speed mode (SPEED = HIGH)

t

PLH(drv)

t

PHL(drv)

driver propagation delay LOW-to-HIGH; see Figure 8 --18ns
(VO/VPO, FSE0/VMO to

HIGH-to-LOW; see Figure 8 --18ns

D+,D−)

t

PHZ

t

PLZ

t

PZH

t

PZL

driver disable delay HIGH-to-OFF; see Figure 6 --15ns
(OE to D+,D−) LOW-to-OFF; seeFigure 6 --15ns
driver enable delay OFF-to-HIGH; see Figure 6 --15ns
(OE to D+,D−) OFF-to-LOW; see Figure 6 --15ns

Low-speed mode (SPEED = LOW)

Not specified: low-speed delay timings are dominated by the slow rise/fall times t

and tLF.

LR

9397 750 08872

Product data Rev. 06 — 30 November 2001 13 of 24

© Koninklijke Philips Electronics N.V. 2001. All rights reserved.

Philips Semiconductors

ISP1105/1106/1107

Advanced USB transceivers

Table 16: Dynamic characteristics: analog I/O pins (D+, D−)

VCC= 4.0 to 5.5 V or V
combinations; T

=−40 to+85°C; unless otherwise specified.

amb

= 3.0 to 3.6 V; V

reg(3.3)

= 1.65 to 3.6 V; V

CC(I/O)

[1]

…continued

GND

= 0 V; see Table 10 for valid voltage level

Symbol Parameter Conditions Min Typ Max Unit

Receiver timings (full-speed and low-speed mode)

Differential receiver

t

PLH(rcv)

t

PHL(rcv)

propagation delay LOW-to-HIGH; see Figure 7 --15ns
(D+,D− to RCV) HIGH-to-LOW; see Figure 7 --15ns

Single-ended receiver

t

PLH(se)

t

PHL(se)

[1] Test circuit: see Figure 11.
[2] Characterized only, not tested. Limits guaranteed by design.

V

OH

V

OL

propagation delay LOW-to-HIGH; see Figure 7 --18ns
(D+,D− to VP, VM) HIGH-to-LOW; see Figure 7 --18ns

1.65 V

0.9 V

t

PHZ

t

PLZ

V

−0.3 V

OH

V

+0.3 V

OL

MGS966

tFR, t

10%

logic input

90%

tFF, t

10%

LF

V

MGS963

V

LR

90%

0 V

OH

differential

data lines

OL

0.9 V

t
t

V

PZH
PZL

CRS

Fig 5. Rise and fall times. Fig 6. Timing of OE to D+, D−.

2.0 V

differential

data lines

0.8 V

V

OH

logic output

V

OL

V

CRS

t

PLH(rcv)

t

PLH(se)

0.9 V

V

CRS

t

PHL(rcv)

t

PHL(se)

0.9 V

MGS965

1.65 V

0 V

V

OH

V

logic input

differential

data lines

OL

0.9 V

t

PLH(drv)

V

CRS

0.9 V

t

PHL(drv)

V

CRS

Fig 7. Timing of D+, D− to RCV, VP, VM. Fig 8. Timing of VO/VPO, FSE0/VMO to D+, D−.

MGS964

9397 750 08872

© Koninklijke Philips Electronics N.V. 2001. All rights reserved.

Product data Rev. 06 — 30 November 2001 14 of 24

Philips Semiconductors

11. Test information

D.U.T.

33 Ω

ISP1105/1106/1107

Advanced USB transceivers

test point

(1)

500 Ω

50 pF

V = 0 V for t
V=V

reg(/3.3)

PZH

for t

, t

PHZ

, t

PZL

PLZ

(1) Complies with USB 1.1. For USB 2.0 a resistor of 39 Ω must be used.

Fig 9. Load for enable and disable times.

test point

D.U.T.

25 pF

MGS968

Fig 10. Load for VM, VP and RCV.

V

pu(3.3)

(1)

D.U.T.

1.5 kΩ

D+/D−

33 Ω

test point

(2)

C

L

V

MBL142

15 kΩ

MGS967

Load capacitance:

CL= 50 pF or 125 pF (full-speed mode, minimum or maximum timing)

CL= 50 pF or 600 pF (low-speed mode, minimum or maximum timing)
(1) Full-speed mode: connected to D+, low-speed mode: connected to D−.
(2) Complies with USB 1.1. For USB 2.0 a resistor of 39 Ω must be used.

Fig 11. Load for D+, D−.

9397 750 08872

Product data Rev. 06 — 30 November 2001 15 of 24

© Koninklijke Philips Electronics N.V. 2001. All rights reserved.

Philips Semiconductors

12. Package outline

ISP1105/1106/1107

Advanced USB transceivers

HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm

terminal 1
index area

e

4

D

e

1

D

h

e

59

B

A

E

y

1

e

E

e

h

2

detail X

C

b

f

b

2

v

M

w

M

b

1

b

2

v

M

w

M

C

y

w

v

ACCB

M
M

v

w

ACCB

ACCB

M
M

SOT639-2

ACCB

1/2 e

4

113

1/2 e

DIMENSIONS (mm are the original dimensions)

A

max.

0.8

A

0.10

0.05

1bA2

0.7

0.6

0.33

0.33

0.27

0.27

IEC JEDEC JEITA

UNIT

mm

OUTLINE
VERSION

SOT639-2 MO-217

Fig 12. HBCC16 package outline.

16

3

e

3

0 2.5 5 mm

b

0.38

0.32

D

2

3.1

2.9

b

1

X

E

D

h

3.1

1.45

2.9

1.35

REFERENCES

scale

E

1.45

1.35

e

e

2.5

e

2

3

2.45

h

0.5

1

2.5

A

2

A

e

4

2.45

EUROPEAN

PROJECTION

A

1

0.23

0.17

f

0.08

yy

0.1 0.05 0.2

ISSUE DATE

01-11-13

1

we

v

9397 750 08872

© Koninklijke Philips Electronics N.V. 2001. All rights reserved.

Product data Rev. 06 — 30 November 2001 16 of 24

Philips Semiconductors

ISP1105/1106/1107

Advanced USB transceivers

TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm

D

c

y

Z

16

pin 1 index

9

A

2

18

w M

b

e

p

A

1

E

H

E

L

detail X

SOT403-1

A

X

v M

A

Q

(A )

3

A

θ

L

p

0 2.5 5 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT A1A2A3b

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

A

max.

0.15

mm

1.10

OUTLINE
VERSION

SOT403-1 MO-153

0.05

0.95

0.25

0.80

IEC JEDEC EIAJ

p

0.30

0.19

(1)E(2) (1)

cD

0.2

5.1

0.1

4.9

REFERENCES

eHELLpQZywv θ

4.5

4.3

0.65

6.6

6.2

0.75

0.50

0.4

0.3

EUROPEAN

PROJECTION

0.13 0.10.21.0

0.40

0.06

ISSUE DATE

95-04-04
99-12-27

o

8

o

0

Fig 13. TSSOP16 package outline.

9397 750 08872

Product data Rev. 06 — 30 November 2001 17 of 24

© Koninklijke Philips Electronics N.V. 2001. All rights reserved.

Philips Semiconductors

13. Packaging

The ISP1105/1106/1107W (HBCC16 package) is delivered on a Type A carrier tape,
see Figure 14. The tape dimensions are given in Table 17.

The reel diameter is 330 mm. The reel is made of polystyrene (PS) and is not
designed for use in a baking process.

The cumulative tolerance of 10 successive sprocket holes is ±0.02 mm. The camber
must not exceed 1 mm in 100 mm.

ISP1105/1106/1107

Advanced USB transceivers

Type A

4

Type B

4

P1

A0

direction of feed

A0

P1

direction of feed

K0

K0

MLC338

dth

W

B0

W

elongated
sprocked hole

B0

Fig 14. Carrier tape dimensions.

Table 17: Type A carrier tape dimensions for ISP1105/1106/1107W

Dimension Value Unit

A

0

B

0

K

0

P

1

3.3 mm

3.3 mm

1.1 mm

8.0 mm

W 12.0 ±0.3 mm

9397 750 08872

Product data Rev. 06 — 30 November 2001 18 of 24

© Koninklijke Philips Electronics N.V. 2001. All rights reserved.

Philips Semiconductors

14. Soldering

14.1 Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our

Packages

There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is recommended.

14.2 Reflow soldering

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.

ISP1105/1106/1107

Advanced USB transceivers

Data Handbook IC26; Integrated Circuit

(document order number 9398 652 90011).

Typical reflow peak temperatures range from 215 to 250 °C. The top-surface
temperature of the packages should preferable be kept below 220 °C for thick/large
packages, and below 235 °C small/thin packages.

14.3 Wave soldering

Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.

To overcome these problems the double-wave soldering method was specifically
developed.

If wave soldering is used the following conditions must be observed for optimal
results:

• Use a double-wave soldering method comprising a turbulent wave with high

upward pressure followed by a smooth laminar wave.

• For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be

parallel to the transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

• For packages with leads on four sides, the footprint must be placed at a 45° angle

to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.

9397 750 08872

Product data Rev. 06 — 30 November 2001 19 of 24

© Koninklijke Philips Electronics N.V. 2001. All rights reserved.

Philips Semiconductors

During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the
need for removal of corrosive residues in most applications.

14.4 Manual soldering

Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320 °C.

14.5 Package related soldering information

Table 18: Suitability of surface mount IC packages for wave and reflow soldering

Package Soldering method

BGA, HBGA, LFBGA, SQFP, TFBGA not suitable suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP,

HTSSOP, HVQFN, SMS
PLCC
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

ISP1105/1106/1107

Advanced USB transceivers

methods

Wave Reflow

not suitable

[3]

, SO, SOJ suitable suitable

[2]

[3][4]
[5]

suitable

suitable
suitable

[1]

[1] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the

maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the

Circuit Packages; Section: Packing Methods

[2] These packages are not suitablefor wave soldering as a solder joint between the printed-circuit board

and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top
version).

[3] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[4] Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger

than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[5] Wave soldering is only suitable forSSOP and TSSOP packages with a pitch (e) equaltoor larger than

0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

9397 750 08872

Product data Rev. 06 — 30 November 2001 20 of 24

.

Data Handbook IC26; Integrated

© Koninklijke Philips Electronics N.V. 2001. All rights reserved.

Philips Semiconductors

15. Additional soldering information

15.1 (H)BCC packages: footprint

The surface material of the terminals on the resin protrusion consists of a 4-layer
metal structure (Au, Pd, Ni and Pd). The Au + Pd layer (0.1 µm min.) ensures
solderability, the Ni layer (5 µm min.) prevents diffusion, and the Pd layer on top
(0.5 µm min.) ensures effective wire bonding.

Terminal PCB land Solder resist mask Stencil mask

Normal

b

1

b

1

0.05

ISP1105/1106/1107

Advanced USB transceivers

All dimensions in mm

0.05

Solder land

Solder resist

Corner

Cavity

b

b

2

b

2

E

h

D

h

b

b

2

b

2

E

h

D

h

0.05

0.05

0.05

0.05

0.05

0.1

(4×)

0.05

0.05

0.3 (8×)

Cavity: exposed diepad, either functioning as heatsink or as ground connection; only for HBCC packages.

Fig 15. (H)BCC footprint and solder resist mask dimensions.

15.2 (H)BCC packages: reflow soldering profile

The conditions for reflow soldering of (H)BCC packages are as follows:

For exact dimensions
see package outline
drawing (SOT639-2)

0.05

Stencil print thickness:

0.1 to 0.12 mm

Solder stencil

004aaa123

• Preheating time: minimum 90 s at T = 145 to 155 °C

• Soldering time: minimum 90 s (BCC) or minimum 100 s (HBCC) at T > 183 °C

• Peak temperature:

– Ambient temperature: T

amb(max)

– Device surface temperature: T

9397 750 08872

Product data Rev. 06 — 30 November 2001 21 of 24

= 260 °C

case(max)

= 255 °C.

© Koninklijke Philips Electronics N.V. 2001. All rights reserved.

Philips Semiconductors

ISP1105/1106/1107

Advanced USB transceivers

16. Revision history

Table 19: Revision history

Rev Date CPCN Description

06 20011130 - Product data; sixth version. Supersedes ISP1105_1106_1107-05 of 3 Sept 2001 (9397

750 08643). Modifications:

• Changed the HBCC16 package version from SOT639-1 to SOT639-2 in:

– Table 1 “Ordering information” on page 2.
– Section 12 “Package outline” on page 16.
– Figure 15 “(H)BCC footprint and solder resist mask dimensions.” on page 21.

• Section 7.4 “Power supply input options”: Removed the last sentence “The internal

regulator is not used in single-ended mode and is shutdown.” from the Internal regulator
definition.

05 20010903 - Product data; fifth version. Supersedes ISP1105_1106_1107-04 of 2 Aug 2001 (9397

750 08643). Modifications:

• Replaced front-page logo with new USB basic-speed logo.

04 20010802 - Preliminary data; fourth version. Supersedes ISP1105_1106_1107-03 of 4 July 2001

(9397 750 08515). Modifications:

• Section 1 “General description”: removed backward compatibility with PDIUSBP11A.

• Section 2 “Features”:

– Removed backward compatibility with PDIUSBP11A.
– Added ‘on-chip’ for the ESD protection.
– Changed the I/O voltage range from ‘1.8 V, 2.5 V or 3.3 V’ into ‘1.65 V to 3.6 V’.

• Section 6.2 “Pin description”: changed the description for pin V

• Section 7.3 “Power supply configurations”: changed V

3.3 V’ into ‘1.65 to 3.6 V’ in the description of Normal mode, in Table 8 and in Table 10.

range from ‘1.8 V, 2.5 V or

CC(I/O)

• Table 13 “Static characteristics: supply pins”: removed table note for I

USB On-The-Go specification

.

• Table 14 “Static characteristics: digital pins”: changed the commonly supported types of

into examples.

V

CC(I/O)

• Section 15.1 “(H)BCC packages: footprint”: added paragraph on terminal composition.

• Section 15.2 “(H)BCC packages: reflow soldering profile”: changed peak temperature

from 220 °C ±5 °C to 260 °C (ambient) and 255 °C (device surface).

03 20010704 - Preliminary data; third version. Supersedes ISP1107-02 of 5 February 2001

(9397 750 07879). Modification:

• ISP1107, ISP1106 and ISP1105 combined into one datasheet.

02 20010205 - Objective specification; second version. Supersedes ISP1107-01 of 23 February 2000

(9397 750 06899). ISP1107 stand-alone datasheet only.

01 20000223 - Objective specification; initial version. ISP1107 stand-alone datasheet only.

CC(I/O)

.

referencing the

CC

9397 750 08872

Product data Rev. 06 — 30 November 2001 22 of 24

© Koninklijke Philips Electronics N.V. 2001. All rights reserved.

Philips Semiconductors

17. Data sheet status

ISP1105/1106/1107

Advanced USB transceivers

Data sheet status

Objective data Development This datasheet contains datafrom the objectivespecification forproduct development.Philips Semiconductors

Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a

Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to

[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at

URL http://www.semiconductors.philips.com.

[1]

Product status

18. Definitions

Short-form specification — The data in a short-form specification is

extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.

Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.

Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warrantythat such applications will be suitable for
the specified use without further testing or modification.

[2]

Definition

reserves the right to change the specification in any manner without notice.

later date. Philips Semiconductors reserves the right to change the specification without notice, in order to
improve the design and supply the best possible product.

make changes at any time in order to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change Notification (CPCN) procedure
SNW-SQ-650A.

19. Disclaimers

Life support — These products are not designed for use in life support

appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes — Philips Semiconductors reserves the right to
make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve
design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
licence or title under any patent, copyright, or mask work right to these
products, and makes no representations orwarranties that these products are
free frompatent, copyright, ormask work right infringement, unless otherwise
specified.

Contact information

For additional information, please visit http://www.semiconductors.philips.com.
For sales office addresses, send e-mail to: [e-mail]. Fax: [phone]

9397 750 08872

Product data Rev. 06 — 30 November 2001 23 of 24

© Koninklijke Philips Electronics N.V. 2001. All rights reserved.

Philips Semiconductors

Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3 Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4.1 Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 2

5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3

6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5

7 Functional description . . . . . . . . . . . . . . . . . . . 6

7.1 Function selection. . . . . . . . . . . . . . . . . . . . . . . 6

7.2 Operating functions. . . . . . . . . . . . . . . . . . . . . . 7

7.3 Power supply configurations. . . . . . . . . . . . . . . 7

7.4 Power supply input options. . . . . . . . . . . . . . . . 8

8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9

9 Static characteristics. . . . . . . . . . . . . . . . . . . . 10

10 Dynamic characteristics . . . . . . . . . . . . . . . . . 13

11 Test information. . . . . . . . . . . . . . . . . . . . . . . . 15

12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16

13 Packaging. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

14 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

14.1 Introduction to soldering surface mount

packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

14.2 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 19

14.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 19

14.4 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 20

14.5 Package related soldering information . . . . . . 20

15 Additional soldering information . . . . . . . . . . 21

15.1 (H)BCC packages: footprint . . . . . . . . . . . . . . 21

15.2 (H)BCC packages: reflow soldering profile. . . 21

16 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 22

17 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 23

18 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

19 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

ISP1105/1106/1107

Advanced USB transceivers

© Koninklijke Philips Electronics N.V. 2001.
Printed in The Netherlands

All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.

The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.

Date of release: 30 November 2001 Document order number: 9397 750 08872