Datasheet ISP1107 Datasheet (Philips)

ISP1107

Advanced Universal Serial Bus transceiver

Rev. 01 — 23 February 2000 Objective specification

1. General description

The ISP1107 is a Universal Serial Bus (USB) transceiver that is fully compliant with
the

Universal Serial Bus Specification Rev. 1.1

devices such as mobile phones, digital still cameras and personal digital assistants. It
allows 1.8 V, 2.5 V and 3.3 V USB Application Specific ICs (ASICs) and
Programmable Logic Devices (PLDs) to interface with the physical layer of the
Universal Serial Bus. It has an integrated 5 V to 3.3 V voltage regulator allowing
direct powering from the USB supply V

The ISP1107 can be used as a USB device transceiver or a USB host transceiver. It
can transmit and receive serial data at both full-speed (12 Mbit/s) and low-speed
(1.5 Mbit/s) data rates. The ISP1107 is compatible with the industry-standard Philips
Semiconductors USB transceiver PDIUSBP11A.

BUS

. It is ideal for portable electronics

.

2. Features

■ Complies with

■ Integrated 5 V to 3.3 V voltage regulator allowing direct powering from USB V

c

c

■ Used as a USB device transceiver or a USB host transceiver

■ Supports full-speed (12 Mbit/s) and low-speed (1.5 Mbit/s) serial data rates

■ Slew-rate controlled differential data driver

■ Differential input receiver with wide common-mode range and very high input

sensitivity

■ Stable RCV output during SE0 condition

■ Two single-ended receivers with hysteresis

■ Low-power operation

■ Three I/O voltage levels: 1.8 V, 2.5 V and 3.3 V

■ Backward compatible with PDIUSBP11A

■ Higher than 8 kV ESD protection

■ Full industrial operating temperature range −40 to +85 °C

■ Available in small TSSOP16 and BCC16 packages.

Universal Serial Bus Specification Rev. 1.1

BUS

Philips Semiconductors

ISP1107

Advanced USB transceiver

3. Applications

■ Portable electronic devices, such as

◆ mobile phones

◆ digital still cameras

◆ personal digital assistants (PDA)

◆ Internet appliances (IA).

4. Ordering information

Table 1: Ordering information

Type number Package

Name Description Version

[1]

ISP1107xx BCC16
ISP1107DH TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1

[1] In development.

plastic bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm SOTxxx

5. Functional diagram

handbook, full pagewidth

V

CC(I/O)

SOFTCON

OE

FSE0

VO

SUSPND

RCV

VP

VM

LEVEL

SHIFTER

3.3 V

ISP1107

VOLTAGE

REGULATOR

GND

V

CC(5.0)

V

reg(3.3)

V

pu(3.3)

D+
D−

MGS962

33 Ω
33 Ω

(1)

(1)

(1%)
(1%)

1.5 kΩ

(2)

(1) Use a 39 Ω resistor (1%) for a USB v2.0 compliant output impedance range.
(2) Connect to D− for low-speed operation.

Fig 1. Functional diagram.

9397 750 06899

Objective specification Rev. 01 — 23 February 2000 2 of 19

© Philips Electronics N.V. 2000. All rights reserved.

Philips Semiconductors

6. Pinning information

6.1 Pinning

ISP1107

Advanced USB transceiver

page

Fig 2. Pinning diagram BCC16

V

SOFTCON

SUSPND

Fig 3. Pinning diagram TSSOP16.

pu(3.3)

OE

RCV

VP

VM

GND

1
2
3
4

ISP1107DH

5
6
7
8

16
15
14
13
12
11
10

9

MGS961

(to be added).

6.2 Pin description

Table 2: Pin description

Symbol Pin Type Description

V

pu(3.3)

SOFTCON 2 I software controlled USB connection input; a HIGH level

OE 3 I output enable input (CMOS level re. V

RCV 4 O differential data receiver output (CMOS level re. V

VP 5 O single-ended D+ receiver output (CMOS level re. V

VM 6 O single-ended D− receiver output (CMOS level re. V

SUSPND 7 I suspend input (CMOSlevel re.V

1 - pull-up supply voltage (3.3 V ± 10%); used to connect an

external 1.5 kΩ resistor on D+ (full-speed) or D− (low-speed);
pin function is controlled by input SOFTCON:

SOFTCON = LOW — V
SOFTCON = HIGH — V

applies 3.3 V to pin V

pu(3.3)

floating (high impedance)

pu(3.3)

= 3.3 V

pu(3.3)

, which is connected to an external

1.5 kΩ pull-up resistor; this allows USB connect/disconnect
signalling to be controlled by software

enables the transceiver to transmit data on the USB bus

CC(I/O)

driven LOW when input SUSPND is HIGH; the output state of
RCV is preserved and stable during an SE0 condition

used for external detection of single-ended zero (SE0), error
conditions, speed of connected device; driven HIGH when
V

CC(5.0)/Vreg(3.3)

are not connected to any voltage supply

used for external detection of single-ended zero (SE0), error
conditions, speed of connected device; driven HIGH when no
supply voltage is connected to V

or V

CC(5.0)

); a HIGHlevel enables

CC(I/O)

low-power state while the USB bus is inactive and drives
output RCV to a LOW level

V

CC(5.0)

V

reg(3.3)

FSE0
VO
D+
D−
SPEED
V

CC(I/O)

, active LOW);

reg(3.3)

CC(I/O)

CC(I/O)

CC(I/O)

);

);

);

9397 750 06899

Objective specification Rev. 01 — 23 February 2000 3 of 19

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Philips Semiconductors

ISP1107

Advanced USB transceiver

Table 2: Pin description

…continued

Symbol Pin Type Description

GND 8 - ground supply
V

CC(I/O)

9 - supply voltage for digital I/O pins (1.65 to 3.6 V). Three

voltage levels are supported: 1.8 V ± 0.15 V, 2.5 V ± 0.2 V
and 3.3 V ± 0.3V; when V

is not connected, the D+/D−

CC(I/O)

pins are in three-state

SPEED 10 I speed selection input (CMOS level re. V

CC(I/O)

); adjusts the
slew rate of differential data outputs D+ and D− according to
the transmission speed:

LOW: low-speed (1.5 Mbit/s)
HIGH: full-speed (12 Mbit/s)

D− 11 AI/O negative USB data bus connection (analog, differential); for

low-speed mode connect to pin V

via a 1.5 kΩ resistor

pu(3.3)

D+ 12 AI/O positive USB data bus connection (analog, differential); for

full-speed mode connect to pin V

VO 13 I differential driver data input (CMOS level re. V

via a 1.5 kΩ resistor

pu(3.3)

CC(I/O)

, Schmitt

trigger); see Table 4

FSE0 14 I differential driver data input (CMOS level re. V

CC(I/O)

, Schmitt

trigger); see Table 4

V

reg(3.3)

15 - regulated supply voltage output (3.0 to 3.6 V) during 5 V

operation; used as supply voltage input for 3.3 V operation
(3.3 V ± 10%)

V

CC(5.0)

16 - supply voltage for 5 V operation (4.0 to 5.5 V); can be

connected directly to USB supply V

during 3.3 V operation

V

reg(3.3)

; connect this pin to

BUS

7. Functional description

7.1 Function selection

Table 3: Function table

SUSPND OE D+/D− RCV VP/VM Function

L L driving &

receiving

L H receiving

H L driving inactive

H H high-Z

[1] Signal levels on D+/D− are determined by other USB devices and external pull-up/down resistors.
[2] In ‘suspend’ mode (SUSPND = HIGH) the differential receiver is inactive and output RCV is always

LOW. Out-of-suspend (‘K’) signalling is detected via the single-ended receivers VP and VM.

[3] During suspend, the slew-rate control circuit of low-speed operation is disabled. The D+/D− are still

driven to their intended states, without slew-rate control. This is permitted because driving during
suspend is used to signal remote wakeup by driving a ‘K’ signal (one transition from idle to ‘K’ state)
for a period of 1 to 15 ms.

9397 750 06899

Objective specification Rev. 01 — 23 February 2000 4 of 19

[1]

active active normal driving

(differential receiver active)

[1]

active active receiving

[2]

active driving during ‘suspend’

(differential receiver inactive)

inactive

[2]

active low-power state

© Philips Electronics N.V. 2000. All rights reserved.

[3]

Philips Semiconductors

7.2 Operating functions

Table 4: Driving function (OE = L)

ISP1107

Advanced USB transceiver

FSE0 VO Data

L L differential logic 0

L H differential logic 1
H L SE0
H H SE0

Table 5: Receiving function (

D+/D− RCV VP VM

differential logic 0 L L H
differential logic 1 H H L

SE0 RCV*

[1] RCV* denotes the signal level on output RCV just before SE0 state occurs. This level is kept stable

during the SE0 period.

OE=H)

[1]

LL

7.3 Power supply configurations

The ISP1107 can be used with different power supply configurations, which can be
changed dynamically. An overview is given in Table 6.

Normal mode — Both V
operation, V

is connected to a 5 V source (4.0 to 5.5 V). The internal voltage

CC(5.0)

regulator then produces 3.3 V for the USB connections. For 3.3 V operation, both
V

CC(5.0)

and V

are connected to a 3.3 V source (3.0 - 3.6 V). V

reg(3.3)

independently connected to a 1.8 V, 2.5 V or 3.3 V source, depending on the supply
voltage of the external circuit.

Disable mode — V

CC(I/O)

mode, the ISP1107’s internal circuits ensure that the D+/D− pins are in three-state
and the power consumption drops to the low-power (suspended) state level.

and V

CC(I/O)

CC(5.0)/Vreg(3.3)

is not connected, V

are connected. For 5 V

CC(5.0)/Vreg(3.3)

are connected. In this

CC(I/O)

is

Sharing mode — V

is connected, V

CC(I/O)

CC(5.0)/Vreg(3.3)

are not connected. In this
mode, the D+/D− pins are made three-state and the ISP1107 allows external signals
of up to 3.6 V to share the D+/D− lines. The ISP1107’s internal circuits ensure that
virtually no current is drawn via the D+/D− lines. The power consumption through pin
V

drops to the low-power (suspended) state level. Both the VP and VM pins are

CC(I/O)

driven HIGH to indicate this mode.

Table 6: Power supply configuration overview

V

CC(5.0)/Vreg(3.3)

connected connected Normal mode ­connected not connected Disable mode D+/D− high impedance
not connected connected Sharing mode D+/D− are high impedance;

9397 750 06899

Objective specification Rev. 01 — 23 February 2000 5 of 19

V

CC(I/O)

Configuration Special characteristics

VP/VM are driven HIGH

© Philips Electronics N.V. 2000. All rights reserved.

Philips Semiconductors

ISP1107

Advanced USB transceiver

8. Limiting values

Table 7: Absolute maximum ratings

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

V

CC(5.0)

V

CC(I/O)

V

reg(3.3)

V

I

I

latchup

V

esd

T

stg

[1] Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ resistor (Human Body Model).

supply voltage −0.5 +6.0 V
I/O supply voltage −0.5 +4.6 V
regulated supply voltage −0.5 +4.6 V
DC input voltage −0.5 V

CC(I/O)

+ 0.5 V
latchup current VI=−1.8 to 5.4 V - 100 mA
electrostatic discharge voltage

[1]

ILI<1µA

pins D+, D− - ±8000 V
other pins - ±2000 V

storage temperature −40 +125 °C

Table 8: Recommended operating conditions

Symbol Parameter Conditions Min Typ Max Unit

V

CC(5.0)

V

CC(I/O)

V

reg(3.3)

V

I

V

I(AI/O)

supply voltage 5 V operation 4.0 5.0 5.5 V
I/O supply voltage 1.65 - 3.6 V
regulated supply voltage 3.3 V operation 3.0 3.3 3.6 V
input voltage 0 - V
input voltage on analog I/O

0 - 3.6 V

CC(I/O)

V

pins (D+/D−)

T

amb

operating ambient temperature −40 - +85 °C

9397 750 06899

Objective specification Rev. 01 — 23 February 2000 6 of 19

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Philips Semiconductors

ISP1107

Advanced USB transceiver

9. Static characteristics

Table 9: Static characteristics: supply pins

VCC= 4.0 to 5.5 V; V

Symbol Parameter Conditions Min Typ Max Unit

V

reg(3.3)

I

CC

I

CC(idle)

regulated supply voltage unloaded 3.0
operating supply current full-speed transmitting and receiving

supply current during
full-speed idle and SE0

I

CC(susp)

I

CC(dis)

suspend supply current SUSPND = HIGH
disable mode supply current V

ICC(I/O) operating I/O supply current full-speed transmittingand receiving

I

CC(I/O)(static)

I

CC(I/O)(sharing

static I/O supply current full-speed idle, SE0 or suspend - - 10 µA

) sharing mode I/O supply

current

I

Dx(sharing

) sharing mode load current

on pins D+ and D−

= 1.65 to 3.6 V; V

CC(I/O)

=0V; T

GND

at 12 Mbit/s; C

=−40 to+85°C; unless otherwise specified.

amb

= 50 pF on D+/D−

L

full-speed idle: D+ > 2.7 V,
D− < 0.3 V; SE0: D+ < 0.3 V,
D− < 0.3 V

not connected

CC(I/O)

at 12 Mbit/s

V

CC(5.0)/Vreg(3.3)

V

CC(5.0)/Vreg(3.3)

SOFTCON = LOW; V

not connected

not connected;

= 3.6 V

Dx

[1]

3.3 3.6 V

-610

[3]

- - 500 µA

[3]

--20µA

[3]

--20µA

- 0.3 1

[3]

--10µA

[3]

--5µA

[2]

mA

[2]

mA

[1] In ‘suspend’ mode, the minimum voltage is 2.7 V.
[2] Characterized only, not tested in production.
[3] Excluding V

source current to 1.5 kΩ and 15 kΩ pull-up and pull-down resistors (200 µA typ.).

pu(3.3)

Table 10: Static characteristics: digital pins

VCC= 4.0 to 5.5 V; V

= 1.65 to 3.6 V; V

CC(I/O)

GND

=0V; T

=−40 to+85°C; unless otherwise specified.

amb

Symbol Parameter Conditions Min Typ Max Unit

V

= 1.65 to 3.6 V

CC(I/O)

Input levels

V

IL

V

IH

LOW-level input voltage - - 0.3V
HIGH-level input voltage 0.6V

CC(I/O)

-- V

CC(I/O)

V

Output levels

= 100 µA - - 0.15 V

I

V

OL

V

OH

LOW-level output voltage

HIGH-level output voltage

OL

= 4 mA - - 0.4 V

I

OL

= 100 µAV

I

OH

= 4 mA V

I

OH

− 0.15 - - V

CC(I/O)

− 0.4 - - V

CC(I/O)

Leakage current

I

LI

V

CC(I/O)

input leakage current - - ±1 µA

= 1.8 V ± 0.15 V

Input levels

V

IL

V

IH

LOW-level input voltage - - 0.5 V
HIGH-level input voltage 1.2 - - V

9397 750 06899

Objective specification Rev. 01 — 23 February 2000 7 of 19

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Philips Semiconductors

ISP1107

Advanced USB transceiver

Table 10: Static characteristics: digital pins

VCC= 4.0 to 5.5 V; V

= 1.65 to 3.6 V; V

CC(I/O)

…continued

=0V; T

GND

=−40 to+85°C; unless otherwise specified.

amb

Symbol Parameter Conditions Min Typ Max Unit

Output levels

= 100 µA - - 0.15 V

I

V

OL

V

OH

V

CC(I/O)

LOW-level output voltage

HIGH-level output voltage

= 2.5 V ± 0.2 V)

OL

= 4 mA - - 0.4 V

I

OL

= 100 µA 1.5 - - V

I

OH

= 4 mA 1.25 - - V

I

OH

Input levels

V

IL

V

IH

LOW-level input voltage - - 0.7 V
HIGH-level input voltage 1.7 - - V

Output levels

= 100 µA - - 0.15 V

I

V

OL

V

OH

V

CC(I/O)

LOW-level output voltage

HIGH-level output voltage

= 3.3 V ± 0.3 V

OL

= 4 mA - - 0.4 V

I

OL

= 100 µA 2.15 - - V

I

OH

= 4 mA 1.9 - - V

I

OH

Input levels

V

IL

V

IH

LOW-level input voltage - - 0.9 V
HIGH-level input voltage 2.15 - - V

Output levels

= 100 µA - - 0.2 V

I

V

OL

V

OH

LOW-level output voltage

HIGH-level output voltage

OL

= 4 mA - - 0.4 V

I

OL

= 100 µA 2.85 - - V

I

OH

= 4 mA 2.6 - - V

I

OH

Table 11: Static characteristics: analog I/O pins (D+, D−)

VCC= 4.0 to 5.5 V; V

= 1.65 to 3.6 V; V

CC(I/O)

GND

=0V; T

=−40 to+85°C; unless otherwise specified.

amb

Symbol Parameter Conditions Min Typ Max Unit

Input levels

Differential receiver

V

DI

V

CM

differential input sensitivity |V
differential common mode

− V

I(D+)

| 0.2 - - V

I(D−)

includes VDI range 0.8 - 2.5 V

voltage

Single-ended receiver

V

IL

V

IH

V

hys

LOW-level input voltage - - 0.8 V
HIGH-level input voltage 2.0 - - V
hysteresis voltage 0.4 - 0.7 V

Output levels

V

OL

V

OH

LOW-level output voltage RL= 1.5 kΩ to + 3.6 V - - 0.3 V
HIGH-level output voltage RL=15kΩ to GND 2.8 - 3.6 V

Leakage current

I

LZ

9397 750 06899

Objective specification Rev. 01 — 23 February 2000 8 of 19

OFF-state leakage current - - ±1 µA

© Philips Electronics N.V. 2000. All rights reserved.

Philips Semiconductors

ISP1107

Advanced USB transceiver

Table 11: Static characteristics: analog I/O pins (D+, D−)

VCC= 4.0 to 5.5 V; V

= 1.65 to 3.6 V; V

CC(I/O)

GND

=0V; T

…continued

=−40 to+85°C; unless otherwise specified.

amb

Symbol Parameter Conditions Min Typ Max Unit

Capacitance

C

IN

transceiver capacitance pin to GND - - 20 pF

Resistance

Z
Z

DRV
DRV2

driver output impedance steady-state drive
driver output impedance for

steady-state drive

[1]

34 39 44 Ω

[2]

41 45 49 Ω

USB 2.0

Z

INP

R

SW

input impedance 10 - - MΩ
internal switch resistance at

pin V

pu(3.3)

--10Ω

Termination

[3]

V

TERM

[1] Includes external resistors of 33 Ω±1% on both D+ and D−.
[2] Includes external resistors of 39 Ω±1% on both D+ and D−. This range complies with
[3] This voltage is available at pins V
[4] In ‘suspend’ mode the minimum voltage is 2.7 V.

termination voltage for
upstream port pull-up (R

reg(3.3)

)

PU

and V

pu(3.3)

.

[4]

3.0

Universal Serial Bus Specification Rev. 2.0

- 3.6 V

.

10. Dynamic characteristics

Table 12: Dynamic characteristics: analog I/O pins (D+, D−)

VCC= 4.0 to 5.5 V; V

= 1.65 to 3.6 V; V

CC(I/O)

GND

=0V; T

[1]

=−40 to+85°C; unless otherwise specified.

amb

Symbol Parameter Conditions Min Typ Max Unit

Driver characteristics

Full-speed mode

t

FR

rise time CL= 50 to 125 pF;

10 to 90% of |V

OH

− VOL|;

4 - 20 ns

see Figure 4

t

FF

fall time CL= 50 to 125 pF;

90 to 10% of |V

OH

− VOL|;

4 - 20 ns

see Figure 4

FRFM differential rise/fall time

V

CRS

matching (t
output signal crossover

FR/tFF

)

voltage

excluding the first transition
from Idle state

excluding the first transition
from Idle state; see Figure 7

90 - 111.1 %

[2]

1.3 - 2.0 V

Low-speed mode

t

LR

rise time CL= 200 to 600 pF;

10 to 90% of |V

OH

− VOL|;

75 - 300 ns

see Figure 4

t

LF

fall time CL= 200 to 600 pF;

90 to 10% of |V

OH

− VOL|;

75 - 300 ns

see Figure 4

LRFM differential rise/fall time

matching (t

LR/tLF

)

excluding the first transition
from Idle state

80 - 125 %

9397 750 06899

Objective specification Rev. 01 — 23 February 2000 9 of 19

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Philips Semiconductors

ISP1107

Advanced USB transceiver

[1]

Table 12: Dynamic characteristics: analog I/O pins (D+, D−)

VCC= 4.0 to 5.5 V; V

= 1.65 to 3.6 V; V

CC(I/O)

GND

=0V; T

amb

Symbol Parameter Conditions Min Typ Max Unit

V

CRS

output signal crossover
voltage

excluding the first transition
from idle state; see Figure 7

Driver timing

Full-speed mode

t

PLH(drv)

t

PHL(drv)

t

PHZ

t

PLZ

t

PZH

t

PZL

driver propagation delay
(VO, FSE0 to D+,D−)

driver disable delay

OE to D+,D−)

(
driver enable delay

OE to D+,D−)

(

LOW-to-HIGH; seeFigure 7 --15ns
HIGH-to-LOW; see Figure 7 --15ns
HIGH-to-OFF; see Figure 5 --10ns
LOW-to-OFF; seeFigure 5 --10ns
OFF-to-HIGH; see Figure 5 --15ns
OFF-to-LOW; see Figure 5 --15ns

Low-speed mode

Not specified: low-speed delay timings are dominated by the slow rise/fall times t

Receiver timings (full-speed and low-speed mode)

Differential receiver

t

PLH(rcv)

t

PHL(rcv)

propagation delay
(D+,D− to RCV)

LOW-to-HIGH; seeFigure 6 --15ns

HIGH-to-LOW; see Figure 6 --15ns

Single-ended receiver

t

PLH(se)

t

PHL(se)

propagation delay
(D+,D− to VP, VM)

LOW-to-HIGH; seeFigure 6 --15ns

HIGH-to-LOW; see Figure 6 --15ns

…continued

=−40 to+85°C; unless otherwise specified.

[2]

1.3 - 2.0 V

and tLF.

LR

[1] Test circuit: see Figure 10.
[2] Characterized only, not tested. Limits guaranteed by design.

1.65 V

logic input

tFR, t

V

OH

V

OL

LR

90%

10%

90%

tFF, t

10%

LF

V

MGS963

V

0 V

OH

differential
data lines

OL

0.9 V

t
t

V

PZH
PZL

CRS

V

OH

V

OL

Fig 4. Rise and fall times. Fig 5. Timing of OE to D+, D−.

2.0 V

differential

data lines

0.8 V

V

OH

logic output

V

OL

V

CRS

t

PLH(rcv)

t

PLH(se)

0.9 V

V

CRS

t

PHL(rcv)

t

PHL(se)

0.9 V

MGS965

1.65 V

0 V

V

OH

V

logic input

differential

data lines

OL

0.9 V

t

PLH(drv)

V

CRS

Fig 6. Timing of D+, D− to RCV, VP, VM. Fig 7. Timing of VO, FSE0 to D+, D−.

0.9 V

t

PHZ

t

PLZ

−0.3 V

+0.3 V

0.9 V

t

PHL(drv)

MGS966

V

CRS

MGS964

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Objective specification Rev. 01 — 23 February 2000 10 of 19

Philips Semiconductors

11. Test information

ISP1107

Advanced USB transceiver

33 Ω

test point

(1)

500 Ω

50 pF

V = 0 V for t
V=V

reg(/3.3)

handbook, halfpage

, t

PZH

PHZ

for t

, t

PZL

PLZ

D.U.T.

(1) Complies with USB 1.1. For USB 2.0 a resistor of 39 Ω must be used.

Fig 8. Load for enable and disable times.

handbook, halfpage

D.U.T.

test point

25 pF

MGS968

Fig 9. Load for VM, VP and RCV.

handbook, halfpage

V

pu(3.3)

V

MBL142

(1)

D.U.T.

1.5 kΩ

D+/D−

33 Ω

test point

(2)

C

L

Load capacitance:

CL= 50 pF or 125 pF (full-speed mode, minimum or maximum timing)

CL= 200 pF or 600 pF (low-speed mode, minimum or maximum timing)
(1) Full-speed mode: connected to D+, low-speed mode: connected to D−.
(2) Complies with USB 1.1. For USB 2.0 a resistor of 39 Ω must be used.

Fig 10. Load for D+, D−.

15 kΩ

MGS967

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Objective specification Rev. 01 — 23 February 2000 11 of 19

Philips Semiconductors

12. Package outline

Fig 11. BCC16 package outline (to be added).

ISP1107

Advanced USB transceiver

9397 750 06899

Objective specification Rev. 01 — 23 February 2000 12 of 19

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Philips Semiconductors

ISP1107

Advanced USB transceiver

TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm

D

c

y

Z

16

pin 1 index

9

A

2

18

w M

b

e

p

A

1

E

H

E

L

detail X

SOT403-1

A

X

v M

A

Q

(A )

3

A

θ

L

p

0 2.5 5 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT A1A2A

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

A

max.

0.15

mm

1.10

OUTLINE

VERSION

SOT403-1 MO-153

0.05

0.95

0.80

IEC JEDEC EIAJ

0.25

b

3

p

0.30

0.19

(1)E(2) (1)

cD

0.2

5.1

0.1

4.9

REFERENCES

eHELLpQZywv θ

4.5

4.3

0.65

6.6

6.2

0.75

0.50

0.4

0.3

EUROPEAN

PROJECTION

0.13 0.10.21.0

0.40

0.06

ISSUE DATE

95-04-04
99-12-27

o

8

o

0

Fig 12. TSSOP16 package outline.

9397 750 06899

Objective specification Rev. 01 — 23 February 2000 13 of 19

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Philips Semiconductors

13. Soldering

13.1 Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our

Packages

There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering is not always suitable for surface mount ICs, or for printed-circuit boards
with high population densities. In these situations reflow soldering is often used.

13.2 Reflow soldering

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example, infrared/convection heating in a
conveyor type oven. Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating method.

ISP1107

Advanced USB transceiver

Data Handbook IC26; Integrated Circuit

(document order number 9398 652 90011).

Typical reflow peak temperatures range from 215 to 250 °C. The top-surface
temperature of the packages should preferable be kept below 230 °C.

13.3 Wave soldering

Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.

To overcome these problems the double-wave soldering method was specifically
developed.

If wave soldering is used the following conditions must be observed for optimal
results:

Use a double-wave soldering method comprising a turbulent wave with high

•

upward pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):

•

– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be

parallel to the transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45° angle

•

to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.

During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.

9397 750 06899

Objective specification Rev. 01 — 23 February 2000 14 of 19

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Philips Semiconductors

Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the
need for removal of corrosive residues in most applications.

13.4 Manual soldering

Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320 °C.

13.5 Package related soldering information

Table 13: Suitability of surface mount IC packages for wave and reflow soldering

Package Soldering method

BGA, LFBGA, SQFP, TFBGA not suitable suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP,

HTSSOP, SMS
PLCC
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

ISP1107

Advanced USB transceiver

methods

Wave Reflow

not suitable

[3]

, SO, SOJ suitable suitable

[2]

[3] [4]
[5]

suitable

suitable
suitable

[1]

[1] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the

maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the

Circuit Packages; Section: Packing Methods

[2] These packages are not suitable for wave soldering as a solder joint between the printed-circuit board

and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top
version).

[3] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[4] Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger

than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[5] Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

.

Data Handbook IC26; Integrated

9397 750 06899

Objective specification Rev. 01 — 23 February 2000 15 of 19

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Philips Semiconductors

14. Revision history

Table 14: Revision history

Rev Date CPCN Description

01 20000223 Objective specification; initial version.

ISP1107

Advanced USB transceiver

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Objective specification Rev. 01 — 23 February 2000 16 of 19

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Philips Semiconductors

15. Data sheet status

ISP1107

Advanced USB transceiver

Datasheet status Product status Definition

Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may

change in any manner without notice.

Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips

Semiconductors reserves the right to make changes at any time without notice in order to improve design and
supply the best possible product.

Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any

time without notice in order to improve design and supply the best possible product.

[1] Please consult the most recently issued data sheet before initiating or completing a design.

16. Definitions

Short-form specification — The data in a short-form specification is

extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.

Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.

Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.

[1]

17. Disclaimers

Life support — These products are not designed for use in life support

appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes — Philips Semiconductors reserves the right to
make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve
design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
licence or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products
are free from patent, copyright, or mask work right infringement, unless
otherwise specified.

9397 750 06899

© Philips Electronics N.V. 2000 All rights reserved.

Objective specification Rev. 01 — 23 February 2000 17 of 19

Philips Semiconductors

Advanced USB transceiver

Philips Semiconductors - a worldwide company

ISP1107

Argentina: see South America
Australia: Tel. [phone], Fax. [phone]
Austria: Tel. [phone], Fax. [phone]
Belarus: Tel. [phone], Fax. [phone]
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Tel. [phone], Fax. [phone]
Canada: Tel. [phone]
China/Hong Kong: Tel. [phone], Fax. [phone]
Colombia: see South America
Czech Republic: see Austria
Denmark: Tel. [phone], Fax. [phone]
Finland: Tel. [phone], Fax. [phone]
France: Tel. [phone], Fax. [phone]
Germany: Tel. [phone], Fax. [phone]
Hungary: see Austria
India: Tel. [phone], Fax. [phone]
Indonesia: see Singapore
Ireland: Tel. [phone], Fax. [phone]
Israel: Tel. [phone], Fax. [phone]
Italy: Tel. [phone], Fax [phone]
Japan: Tel. [phone], Fax. [phone]
Korea: Tel. [phone], Fax. [phone]
Malaysia: Tel. [phone], Fax. [phone]
Mexico: Tel. [phone]
Middle East: see Italy

Netherlands: Tel. [phone], Fax. [phone]
New Zealand: Tel. [phone], Fax. [phone]
Norway: Tel. [phone], Fax. [phone]
Philippines: Tel. [phone], Fax. [phone]
Poland: Tel. [phone], Fax. [phone]
Portugal: see Spain
Romania: see Italy
Russia: Tel. [phone], Fax. [phone]
Singapore: Tel. [phone], Fax. [phone]
Slovakia: see Austria
Slovenia: see Italy
South Africa: Tel. [phone], Fax. [phone]
South America: Tel. [phone], Fax. [phone]
Spain: Tel. [phone], Fax. [phone]
Sweden: Tel. [phone], Fax. [phone]
Switzerland: Tel. [phone], Fax. [phone]
Taiwan: Tel. [phone], Fax. [phone]
Thailand: Tel. [phone], Fax. [phone]
Turkey: Tel. [phone], Fax. [phone]
Ukraine: Tel. [phone], Fax. [phone]
United Kingdom: Tel. [phone], Fax. [phone]
United States: Tel. [phone]
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: Tel. [phone], Fax. [phone]

For all other countries apply to: Philips Semiconductors,

International Marketing & Sales Communications,
Building BE, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. [phone]

Internet: http://www.semiconductors.philips.com

(SCA69)

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Objective specification Rev. 01 — 23 February 2000 18 of 19

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Philips Semiconductors

Contents

1 General description . . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2

6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3

6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

7 Functional description . . . . . . . . . . . . . . . . . . . 4

7.1 Function selection. . . . . . . . . . . . . . . . . . . . . . . 4

7.2 Operating functions. . . . . . . . . . . . . . . . . . . . . . 5

7.3 Power supply configurations. . . . . . . . . . . . . . . 5

8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6

9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7

10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 9

11 Test information. . . . . . . . . . . . . . . . . . . . . . . . 11

12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12

13 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

13.1 Introduction to soldering surface mount

packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

13.2 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 14

13.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 14

13.4 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 15

13.5 Package related soldering information. . . . . . 15

14 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 16

15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 17

16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

17 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

ISP1107

Advanced USB transceiver

© Philips Electronics N.V. 2000. Printed in The Netherlands

All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.

The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.

Date of release: 23 February 2000 Document order number: 9397 750 06899