Page 1
HT1613C
Timer with Dialer Interface
Block Diagram
Rev. 1.10 1 August 17, 2001
Features
·
Operating voltage: 1.2V~1.7V
·
Low operating current: 3mA (typ.)
·
Dialing number and conversation time display
·
Conversation timer (59 mins and 59 secs max.)
·
8 or 10-digit LCD display driver; 3V, 1/2 bias, 1/3 duty (8
digit hand-held calculator LCD used for 8-digit applica
-
tion)
·
Real time clock with stopwatch
·
Built-in dialer interface
·
12-hour or 24-hour format
·
Uses 32768Hz crystal
·
Two-button sequential operation for real time clock
setting
·
Pad options
-
Real time (RT)
-
Auto change to timer mode (ACT)
-
Extension phone number display (EPN)
·
Blinking cursor waits for dialing number
·
Last call time display
General Description
The HT1613C is a CMOS chip designed for dialer inter
faces driving 8 or 10 digit LCDs. Various functions, such
as real time clock, dialing number and conversation time
display are provided.
The HT1613C can display the real time or be blank by
default. When answering a telephone call, the timer is
activated to tell users how long the conversation has
taken. The HT1613C receives dialing data from the di
aler anddisplays the phone number on the LCD fromleft
to right each time a phone call is made. By adding a
TIMER key, the HT1613C can provide the stopwatch
and timer reset/hold functions. Refer to the functional
description for details.
Applications
·
Timers, clocks and watches
·
LCD display drivers
·
Telephone display interface
·
Instrument display
Patent Number: 84545 (R.O.C.)
Patent Pending: 08/214, 079 (U.S.A.)
T1
EPN
SK
SEG1
SEG30
TIM ER
S1
HK
Tim e
Base
Tim er
Shift
R egister
State
C ontrol
C ontrol
Circuit
Comm on
Circuit
D ecoder
&
MUX
Voltage
D oubler
Segm ent
Latch
&
Select
Scan
CKT
X1
X2
S2
IN T
COM 1
COM 2
COM 3
VA
VB
VC
RT
ACT
RES
12/24
DI
T2
Page 2
Pad Assignment
Chip size: 128 ´ 141 (mil)
2
* The IC substrate should be connected to VDD in the PCB layout artwork.
Pad Coordinates Unit: mil
Pad No. X Y Pad No. X Y Pad No. X Y
1
-57.91
45.52 19
-10.25 -61.96
37 58.10 28.84
2
-57.91
38.59 20 2.76
-61.96
38 58.10 36.19
3
-57.91
31.67 21 11.94
-62.50
39 58.10 43.53
4
-57.91
24.79 22 32.97
-62.50
40 58.10 50.87
5
-57.37
16.98 23 39.86
-62.50
41 58.10 58.22
6
-57.37
2.91 24 46.74
-62.50
42 37.26 63.04
7
-57.91 -8.60
25 58.10
-62.46
43 29.91 63.04
8
-57.91 -15.53
26 58.10
-55.04
44 22.57 63.04
9
-57.91 -22.49
27 58.10
-48.16
45 15.23 63.04
10
-57.91 -29.38
28 58.10
-36.30
46 7.88 63.04
11
-57.91 -36.26
29 58.10
-28.95
47 0.54 63.04
12
-57.91 -45.82
30 58.10
-21.61
48
-6.81
63.04
13
-57.91 -54.20
31 58.10
-15.22
49
-14.15
63.04
14
-57.91 -62.50
32 58.10
-7.88
50
-21.50
63.04
15
-47.20 -62.50
33 58.10
-0.54
51
-28.84
63.04
16
-33.43 -62.50
34 58.10 6.81 52
-36.18
63.04
17
-22.80 -62.46
35 58.10 14.15 53
-43.53
63.04
18
-16.37 -62.50
36 58.10 21.50 54
-50.87
63.04
HT1613C
Rev. 1.10 2 August 17, 2001
ACT
1
28
2
29
3
30
4
31
5
32
6
33
7
34
8
35
9
36
10
37
11
38
12
39
13
40
14
41
15
42
164317
44
18
45
19
46
20
47
21
48
224923
50
24
51
25
52
26
53
27
54
(0 ,0 )
SEG 15
SEG 16
SEG 17
SEG 18
SEG 19
SEG 20
SEG 21
SEG 22
SEG 23
SEG 24
SEG 25
SEG 26
SEG 27
RT
SEG14
SEG13
SEG12
SEG11
SEG10
SEG9
SEG8
SEG7
SEG6
SEG5
SEG4
SEG3
SEG2
SEG1
COM 3
COM 1
12/24
SEG28
SEG29
SEG30
COM 2
S2
X2
X1
TIM ER
S1
HK
IN T
T1
T2
SK
VSS
VA
VBVCVDD
DI
RES
EPN
Page 3
Pad Description
Pad Name I/O
Internal
Connection
Description
SEG1~SEG30 O CMOS OUT LCD segment signal output pads
COM1~COM3 O CMOS OUT LCD common signal output pads
HK
I
CMOS IN
Pull-high
Hook switch detector input
Active low
X1 I
OSCILLATOR
32768Hz crystal oscillator input
X2 O 32768Hz crystal oscillator output
T1
I
CMOS IN
Pull-high
Test pad (connected to VSS for production test)
T2
I
CMOS IN
Pull-high
Test pad (connected to VSS for production test)
INT
O NMOS OUT Interrupt output, 8Hz or 16Hz by mask option
TIMER I
CMOS IN
Pull-low
Timer reset and start/hold toggle control input pad
12/24
I
CMOS IN
Pull-low
12-hour or 24-hour format option pad, connected to VDD for 12-hour format
S1 I
CMOS IN
Pull-low
Clock setting switch
Active high
S2 I
CMOS IN
Pull-low
Clock adjusting switch
Active high
DI
I
CMOS IN
Pull-high
Serial data input pad (connected to the dialer)
Data should be valid at the falling edge of SK
SK
I
CMOS IN
Pull-high
Clock input pad (connected to the dialer)
RES
I
CMOS IN
Pull-high
System initialization pin (active low)
The pull-high resistance is 200kW typ.
RT I
CMOS
LATCH IN
Pull-low
Real time selection pin
VDD: With real time mode
Floating: Without real time mode
EPN
I
CMOS
LATCH IN
Pull-high
Extension phone number display selection pin
VSS: Without extension phone number display
Floating: With extension phone number display
ACT
I
CMOS
LATCH IN
Pull-high
In the dialing number display mode, auto change to timer mode selection
VSS: Auto change to timer mode
Floating: Manual change to timer mode
VA O CMOS OUT Voltage doubler, connected to external capacitor
VB O CMOS OUT Voltage doubler, connected to external capacitor
VC O CMOS OUT Voltage doubler, connected to external capacitor
VDD
¾¾
Positive power supply
VSS
¾¾
Negative power supply, ground
HT1613C
Rev. 1.10 3 August 17, 2001
Page 4
Approximate internal connection circuits
Absolute Maximum Ratings
Supply Voltage ............................................-0.3V to 5V
Storage Temperature ............................-50°Cto125°C
Input Voltage..............................V
SS
-0.3V to VDD+0.3V
Operating Temperature...........................-20°Cto75°C
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those
listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.
Electrical Characteristics
f
OSC
=32768Hz, Ta=25°C
Symbol Parameter
Test Conditions
Min. Typ. Max. Unit
V
DD
Conditions
V
DD
Operating Voltage
¾¾
1.2 1.5 1.7 V
V
IL
Input Low Voltage 1.2V~1.7V
¾
V
SS
¾
0.2V
DD
V
V
IH
Input High Voltage 1.2V~1.7V
¾
0.8V
DD
¾
V
DD
V
I
STB
Standby Current 1.5V
V
HK
=Floating (or VDD)
¾
0.1 1
mA
I
DD
Operating Current 1.5V No load
¾
310
mA
I
OL
Output Sink Current of INT 1.5V
V
O
=0.3V
500 1000
¾mA
t
A
Data Setup Time 1.5V
¾
1
¾¾ms
t
B
Data Hold on Time 1.5V
¾
2
¾¾ms
t
C
Inter Digit Time
1.5V
¾
5
¾¾ms
t
DB
Debounce Time
(HK
, S1, S2, TIMER)
1.5V
¾¾
31.25
¾
ms
R
HI1
Pull-high Resistance
(HK
,DI,SK)
1.5V
V
IN
=0V
¾
1
¾ MW
R
HI2
Pull-high Resistance (RES)
1.5V
V
IN
=0V
100 200 400
kW
R
LO
Pull-low Resistance
(TIMER, S1, S2, 12/24
)
1.5V
V
IN
=1.5V
¾
5
¾ MW
f
OSC
System Frequency 1.5V Crystal=32768Hz
¾
32768
¾
Hz
HT1613C
Rev. 1.10 4 August 17, 2001
CMOS LATCH IN
Pull-high
CMOS LATCH IN
Pull-low
PW R ON
15k
W
NMOS OUT
CMOS IN
Pull-low
CMOS IN
Pull-high
OSCILLATOR
CMOS OUT
X1
12pF
15pF
10M
W
V
DD
PW R ON
15k
W
X2
V
DD
Page 5
Functional Description
Operational flow chart
HT1613C
Rev. 1.10 5 August 17, 2001
EPN="0" ?
Power-on
RT="1" ?
Blank
Real time clock
HK="0" ?
Blinking" "
ACT="0" ?
Dialing?
Display no.
TIMER input?
Dialing?
Display no.
Over 10 secs?
TIMER input?
Reset timer &
start counting
Keep counting
Dialing?
TIMER input?
Hold timer
Dialing?
TIMER input?
TIMER input?
Display last timer value
Over 9 secs?
TIMER input?
Display no.
TIMER input?
Over 10 secs?
Display last
timer value
Over 9 secs?
NY
N
N
N
N
N
NY
N
N
N
Y
Y
Y
Y
Y
N
Y
Y
N
Y
Y
N
Y
N
N
Y
Y
N
N
Y
N
Y
N
Y
N
Y
N
Y
N
Y
N
Y
Y
Display no.
TIMER input?
Over 10 secs?
Y
Y
N
Y
Y
N
N
N
N
Y
Y
Y
Y
N
HK="0" ?
HK="0" ?
HK="0" ?
HK="0" ?
HK="0" ?
HK="0" ?
HK="0" ?
HK="0" ?
EPN="0" ?
N
Page 6
On-hook & Off-hook
Note: Block A shows the switches S1 and S2 that are used for setting and selecting when RT=VDD (Real time
mode). S1 and S2 are disabled when RT= floating (Blank mode).
Block B illustrates a timer mode when TIMER input ACT
= floating or when there¢s no data entry>10 secs
(ACT
=VSS). Once in the timer mode, the timer resets and starts to count the conversation time (ACT= float-
ing).
Block C displays blinking ²¾², after Off-hook, dialing data is received and displayed on the LCD from left to
right.
HT1613C
Rev. 1.10 6 August 17, 2001
(1 ) N o D a ta
E n try > 1 0 s e c s
(A C T = V S S )
(2) T IM E R input
(A C T=floating)
B lock A
B lock B
B lock C
R e c e iv e D ig it( s )
7 8
7
7 8 0
O n-hook
R eceive D ata
(E PN=floating)
00 00
Tim er M ode
O n-hook
00 01
00 02
11
26
10 25 37
S2
S2
S2
S1
S1
H our
M inute
R eal Tim e or B lank
D isplay the
Last Tim e
> 9 secs
< 9 secs a nd
O ff-hook
O ff-hook
Page 7
·
Data latch timing
HT1613C
Rev. 1.10 7 August 17, 2001
Data & Timing
·
For telephone application
The HT1613C is designed to display telephone num
-
bers derived from the HT93XXX series telephone dial
-
ers. The corresponding data is illustrated in the
following table.
·
For instrument or mC application
The HT1613C is also capable of displaying BCD data
generated from instrument or a mC system. The corre
-
sponding data and timing is shown in the Data latch
timing diagram. Before the data is transmitted to the
HT1613C, the HK
pin should be pulled-low or continu
-
ously kept low. The HT1613C is then ready to receive
the data. At the falling edge of the clock the data is
shifted in to the IC. After all the data is sent to the
HT1613C, the SK
pin is set low to avoid switching to
the timer mode.
Key-In
Data Code
Display
b3
b2
b1
b0
Blank
1
2
3
4
5
6
7
8
9
0
*
#
F
P
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
11
1
0
1
1
0
0
0
1
1
1
1
0
0
0
0
00
01
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
1
1
0
0
1
0
0
1
1
0
0
Blank
DI
SK
D ig it 1
D ig it 2
D ig it N
b3 b0b1b2 b3 b0b1b2 b0b1
t
A
t
B
t
C
Page 8
Application Circuits
For telephone interfacing (with batteries)
* The IC substrate should be connected to VDD in the PCB layout artwork.
HT1613C
Rev. 1.10 8 August 17, 2001
HK
HDI
EPN
0.1mF
TIM ER
32768H z
DO CLOCK
47k
W
HT93XXX Dialer
HFO
8 /1 0 -D ig it L C D
COM
SEG
COM
SEG
COM
30 2131
8050
S1
S2
1
28
2
29
3
30
4
31
5
32
6
33
7
34
8
35
9
36
10
37
11
38
12
39
13
40
14
41
15
42
16
43
17
44
18
45
19
46
20
47
21
48
22
49
23
50
24
51
25
52
26
53
27
54
H T1613C
HFI
330mF
10V
VSS
1A bridge
Ring
Tip
A92
HFI VDD
8050
A42
5.1V
10M
W
1N 4148´3
SK
DI
ACT
12/24
PO
HKS
RT
VDD
330k
W
270k
W
220k
W
100k
W
47k
W
2.7k
W
100k
W
47k
W
33k
W
O ff- h o o k
On-hook
1.5V
+
VSS
X1
X2
3.58M H z
HDI
0.1mF
0.02
m
F
Page 9
For telephone interfacing (without batteries)
* The IC substrate should be connected to VDD in the PCB layout artwork.
HT1613C
Rev. 1.10 9 August 17, 2001
HDI PO
0.1mF
32768H z
DO CLOCK
47k
W
HT93XXX Dialer
HFO
8/10-D ig it LC D
CO M SEGCOM SEG COM
30 2
131
8050
1
28
2
29
3
30
4
31
5
32
6
33
7
34
8
35
9
36
10
37
11
38
12
39
13
40
14
41
15
42
16
43
17
44
18
45
19
46
20
47
21
48
22
49
23
50
24
51
25
52
26
53
27
54
H T1613C
HFI
330mF
10V
VSS
1A bridge
Ring
Tip
A92
HFI VDD
8050
A42
5.1V
10M
W
1mF
TIM ER
1N 4148´6
EPN
SK
DI
ACT
HK
HKS
VDD
330k
W
270k
W
220k
W
100k
W
47k
W
20k
W
100k
W
2.7k
W
47k
W
33k
W
O ff- h o o k
On-hook
HDI
VSS
X1 X2
3.58M H z
0.1
m
F
0.02
m
F
Page 10
For instrument or mC use
* The IC substrate should be connected to VDD in the PCB layout artwork.
Note: To drive SK
,DI, and HK pin, an open drain NMOS output structure is recommended.
To driveSK
,DIand HK pin with a CMOS output structure, a voltage divider is needed (R=4.3kW, R1=10kW).
HT1613C
Rev. 1.10 10 August 17, 2001
TIM ER
DO CLOCK
VDD
8 /1 0 -D ig it L C D
CO M SEGCOM SEG CO M
30 2
131
S1
S2
1.5V
1
28
2
29
3
30
4
31
5
32
6
33
34
35
36
37
11
38
12
39
13
40
14
41
15
42
16
43
17
44
18
45
19
46
20
47
21
48
22
49
23
50
24
51
25
52
26
53
27
54
H T1613C
RT
HK
5V
VSS
In s tru m e n t o r mC S ystem
R1
R
R1
R
R1
R
EPN
SK
DI
ACT
7
8
9
10
32768H z
12/24
HK
+
VDD
0.1mF
0.1
m
F
Page 11
LCD Configurations
For 8-digit application
·
Segment electrode side
LCD driving system 1/2 bias, 1/3 duty, 3V
·
Common electrode side
·
LCD connection
HT1613C
Rev. 1.10 11 August 17, 2001
COM1COM3SEG7SEG8SEG9SEG10SEG11SEG12SEG13SEG14SEG15SEG16SEG17SEG18SEG19SEG20SEG21SEG22SEG23SEG24SEG25SEG26SEG27SEG28SEG29SEG30COM
2
COM1
COM2
COM3
789 27 28 29 3021 22 23 24 25 2615 16 17 18 19 2010 11 12 13 14SEG
Page 12
For 10-digit application
·
Segment electrode side
LCD driving system 1/2 bias, 1/3 duty, 3V
·
Common electrode side
·
LCD connection
HT1613C
Rev. 1.10 12 August 17, 2001
2
1178910
11 12
21
2019181716
151413
22 23 24 252627 28 30 2
4563
SEG
SEGCOM SEG SEG SEG SEG
SEG
SEG SEGSEG
SEGSEGSEGSEG
SEGSEGSEG
SEG SEG SEG SEG
SEG SEG
SEG SEG COM
SEG
29
SEG SEG SEG
SEG
COM
3
COM1
COM2
COM3
789 27 28 29 3021 22 23 24 25 2615 16 17 18 19 2010 11 12 13 14SEG 456123
Page 13
HT1613C
Rev. 1.10 13 August 17, 2001
Copyright Ó 2001 by HOLTEK SEMICONDUCTOR INC.
The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek as
sumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used
solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable
without further modification, nor recommends the use of its products for application that may present a risk to human life
due to malfunction or otherwise. Holtek¢s products are not authorized for use as critical components in life support devices
or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information,
please visit our web site at http://www.holtek.com.tw.
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No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan
Tel: 886-3-563-1999
Fax: 886-3-563-1189
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