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HI-SINCERITY
MICROELECTRONICS CORP.
HSD882S
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HSD882S is suited for the output stage of 0.75W audio, voltage
regulator, and relay driver.
Spec. No. : HE6544
Issued Date : 1992.11.25
Revised Date : 2002.01.25
Page No. : 1/4
Absolute Maximum Ratings
• Maximum Temperatures
Stor age Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature...................................................................................... 150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)................................................................................ 750 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage......................................................................................... 40 V
VCEO Collector to Emitter Voltage...................................................................................... 30 V
VEBO Emitter to Base Voltage.............................................................................................. 5 V
IC Collector Current............................................................................................................... 3 A
TO-92
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO 40 - - V IC=100uA, IE=0
BVCEO 30 - - V IC=1mA, IB=0
BVEBO 5 - - V IE=10uA, IC=0
ICBO - - 1 uA VCB=30V, IE=0
IEBO - - 1 uA VEB=3V, IC=0
*VCE(sat) - - 0.5 V IC=2A, IB=200mA
*VBE(sat) - - 2 V IC=2A, IB=200mA
*hFE1 30 - - VCE=2V, IC=20mA
*hFE2 100 - 500 VCE=2V, IC=1A
fT - 90 - MHz VCE=5V, IC=0.1A, f=100MHz
Cob - 45 - pF VCB=10V, f=1MHz, IE=0
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
Classification of hFE
Rank Q P E
Range 100-200 160-320 250-500
HSD882S HSMC Product Specification
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HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6544
Issued Date : 1992.11.25
Revised Date : 2002.01.25
Page No. : 2/4
1000
125oC
25oC
100
hFE
hFE @ VCE=2V
10
1 10 100 1000 10000
Collector Current- IC (mA)
75oC
Sat uration Voltage & Collect or Cur rent
1000
Current Gain & Coll ector Curren t
75oC
1000
100
Satur ation Voltage ( m V)
125oC
10
1 10 100 1000 10000
Collector Current- IC (mA)
25oC
CE(sat)
V
@ IC=10I
Sat urati on Voltage & Collector Curren t
1000
Sat urati on Voltage & Col lector Current
75oC
B
75oC
100
125oC
Saturation Voltage (mV)
10
1 10 100 1000 10000
Collector Current- IC (mA)
25oC
CE(sat)
V
@ IC=40I
Sat urati on Voltage & Col lector Current
10000
1000
Saturation Voltage (mV)
100
25oC
125oC
1 10 100 1000 10000
Collector Current- IC (mA)
75oC
BE(sat)
V
@ IC=10I
100
Saturat ion Volt age ( m V)
B
10
1 10 100 1000 10000
125oC
Collector Current- IC (mA)
25oC
CE(sat)
V
@ IC=20I
B
Capacita nce & Rev erse-Biased Voltage
100
Cob
Capacitance (pF)
B
10
0.1 1 10 100
Reverse-Biased Vol tage (V)
HSD882S HSMC Product Specification
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HI-SINCERITY
)
MICROELECTRONICS CORP.
Spec. No. : HE6544
Issued Date : 1992.11.25
Revised Date : 2002.01.25
Page No. : 3/4
1000
Cutoff Frequency & Coll ect or Current
Cutoff Frequency (MHz)..
VCE=5V
100
1 10 100 1000
Collector Curren (mA)
Power Derating
800
700
600
100
Safe Operating Area
PT=1ms
10
PT=100ms
PT=1s
1
Collector Curr ent (mA
0.1
0.01
1 10 100
Forwar d Biased Voltage (V)
500
400
300
200
Power Dis s ip ation- PD (mW)
100
0
0 50 100 150 200
Ambient Temper ature- Ta(oC)
HSD882S HSMC Product Specification
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HI-SINCERITY
g
A
MICROELECTRONICS CORP.
TO-92 Dimension
Spec. No. : HE6544
Issued Date : 1992.11.25
Revised Date : 2002.01.25
Page No. : 4/4
A
α2
B
31
2
Marking:
HD
S
882
S
Date Code Control Code
Rank
α3
C
D
H
I
α1
G
Style: Pin 1.Emitter 2.Collector 3.Base
E
DIM
F
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code:
DIM
*: Typical
Min. Max. Min. Max.
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56
E - *0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family , flammability solid burning class: UL94V-0
α1
α2
α3
-
-
-
*5°
*2°
*2°
-
-
-
*5°
*2°
*2°
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HSD882S HSMC Product Specification
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