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HI-SINCERITY
MICROELECTRONICS CORP.
HSD471A
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HSD471A is designed for use in drive and output stage of
frequency amplifier applications.
Spec. No. : HE6518
Issued Date : 1993.02.24
Revised Date : 2002.02.20
Page No. : 1/4
Absolute Maximum Ratings
• Maximum Temperatures
Stor age Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature...................................................................................... 150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)................................................................................ 800 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage......................................................................................... 40 V
VCEO Collector to Emitter Voltage...................................................................................... 30 V
VEBO Emitter to Base Voltage.............................................................................................. 5 V
IC Collector Current............................................................................................................... 1 A
TO-92
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO 40 - - V IC=100uA, IE=0
BVCEO 30 - - V IC=10mA, IB=0
BVEBO 5 - - V IE=100uA, IC=0
ICBO - - 100 nA VCB=30V, IE=0
*VCE(sat) - - 0.5 V IC=1A, IB=100mA
*VBE(sat) - - 1.2 V IC=1A, IB=100mA
*hFE 70 - 400 VCE=1V, IC=100mA
fT - 130 - MHz VCE=6V, IC=10mA
Cob - 16 - pF VCB=6V, f=1MHz, IE=0
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
Classification of hFE
Rank O Y GR
Range 70-140 120-240 200-400
HSD471A HSMC Product Specification
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HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6518
Issued Date : 1993.02.24
Revised Date : 2002.02.20
Page No. : 2/4
1000
Cur rent G ain & C o llector Current
125oC
hFE
25oC
100
1 10 100 1000
1000
Sat uration Voltage & Collect or Cur rent
25oC
75oC
hFE @ VCE=1V
Collector Current- IC (mA)
1000
Sat urati on Voltage & Collector Curren t
CE(sat)
V
100
Satur ation Voltage ( m V)
10
1 10 100 1000
100
Capa citance & Reverse- Bi ased Voltage
B
@ IC=10I
Collector Current- IC (mA)
75oC
25oC125oC
125oC
Saturat ion Volta ge ( m V)
100
1 10 100 1000
1000
100
Cutoff Frequency (MHz)...
Collector Current- IC (mA)
Cutoff Frequency & Ic
75oC
VCE=6V
BE(sat)
V
@ IC=10I
10
Capacitance (pF)
B
1
0.1 1 10 100 1000
10000
PT=1ms
PT=100ms
PT=1s
10
(mA)
C
Collector Current-I
1000
100
Cob
Reverse Biased Volt ag e ( V)
Sa fe Op erating Area
10
1 10 100 1000
Collector Current (mA)
1
1 10 100
Forwar d Biased Vol t age - VCE (V)
HSD471A HSMC Product Specification
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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6518
Issued Date : 1993.02.24
Revised Date : 2002.02.20
Page No. : 3/4
260
240
220
200
180
C)
o
160
140
120
100
Temperature(
80
60
40
20
0
0 50 100 150 200 250 300
900
800
700
600
Power Tem perature Der ating
10+/-2 sec
40+/-20 sec
150+/-30
Time(sec)
IR Reflow Profile
300
Tempera ture Profile for Dip Soldering
250
200
C)
o
150
Temperature(
100
120+/-20 sec
50
0
0 50 100 150 200 250 300 350
Time(sec)
10+/-2 sec
500
400
300
200
PD , Power Dissipation (mW)
100
0
0 20 40 60 80 100 120 140 160
Ta , Case Temperature (oC)
HSD471A HSMC Product Specification
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HI-SINCERITY
g
A
MICROELECTRONICS CORP.
TO-92 Dimension
Spec. No. : HE6518
Issued Date : 1993.02.24
Revised Date : 2002.02.20
Page No. : 4/4
A
α2
B
31
2
Marking:
HD
S
741
A
Date Code Control Code
Rank
α3
C
D
H
I
α1
G
Style: Pin 1.Emitter 2.Collector 3.Base
E
DIM
F
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code:
DIM
*: Typical
Min. Max. Min. Max.
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56
E - *0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
α1
α2
α3
-
-
-
*5°
*2°
*2°
-
-
-
*5°
*2°
*2°
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HSD471A HSMC Product Specification
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