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HI-SINCERITY
MICROELECTRONICS CORP.
HSD1616A
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HSD1616A is designed for audio frequency pow er ampli fier and
medium speed switching applications.
Spec. No. : HE6534
Issued Date : 1998.06.01
Revised Date : 2002.02.18
Page No. : 1/4
Absolute Maximum Ratings
• Maximum Temperatures
Stor age Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature...................................................................................... 150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)................................................................................ 750 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage....................................................................................... 120 V
VCEO Collector to Emitter Voltage...................................................................................... 60 V
VEBO Emitter to Base Voltage.............................................................................................. 6 V
IC Collector Current (DC)...................................................................................................... 1 A
IC Collector Current *(Pulse)................................................................................................. 2 A
TO-92
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO 120 - - V IC=100uA
BVCEO 60 - - V IC=1mA
BVEBO 6 - - V IE=10uA
ICBO - - 100 nA VCB=60V
IEBO - - 100 nA VEB=6V
*VCE(sat) - 150 300 mV IC=1A, IB=50mA
*VBE(sat) - 0.9 1.2 V IC=1A, IB=50mA
VBE(on) 600 - 700 mV VCE=2V, IC=50mA
*hFE1 135 - 600 VCE=2V, IC=100mA
*hFE2 81 - - VCE=2V, IC=1A
fT 100 160 - MHz VCE=2V, IC=100mA
Cob - - 19 pF IE=0, VCB=10V, f=1MHz
ton - 0.07 - uS VCE=10V, IC=100mA
ts - 0.95 - uS IB1=-IB2=10mA
tf - 0.07 - uS VBE(off)=-2~-3V
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
Classification of hFE1
Rank Y G L
Range 135-270 200-400 300-600
HSD1616A HSMC Product Specification
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HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6534
Issued Date : 1998.06.01
Revised Date : 2002.02.18
Page No. : 2/4
1000
100
hFE
10
Current Gain & Collec tor Current
125oC
25oC
1 10 100 1000 10000
75oC
hFE @ VCE=2V
Collector Current- IC (mA)
Sat ura tion Voltage & C ollector C urrent
1000
25oC
1000
100
125oC
25oC
10
Satur ation Voltage ( m V)
1
1 10 100 1000 10000
Collector Current- IC (mA)
75oC
CE(sat)
V
@ IC=20I
ON Voltage & Collector Current
1000
25oC
Sat urati on Voltage & Collector Curren t
B
75oC
125oC
Saturation Voltage (mV)
100
1 10 100 1000 10000
100
Capacitance (Pf)
Capacita nce & Rev erse-Bia sed Voltage
Collector Current- IC (mA)
Cob
BE(sat)
V
@ IC=20I
75oC
125oC
ON Voltage ( m V)
BE(ON)
V
B
100
1 10 100 1000 10000
Collector Current- IC (mA)
@ VCE=2V
Cutoff Frequency & Collector Current
1000
fT @ VCE=2V
100
Cutoff Fr equen cy ( M Hz)...
10
0.1 1 10 100
Reverse Biased Volt a ge ( V)
10
1 10 100 1000
Collector Current (mA)
HSD1616A HSMC Product Specification
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HI-SINCERITY
)
MICROELECTRONICS CORP.
Spec. No. : HE6534
Issued Date : 1998.06.01
Revised Date : 2002.02.18
Page No. : 3/4
10000
1000
Collector Current (mA
PT=1ms
PT=100ms
PT=1s
100
10
1
1 10 100
Forwar d Voltage (V)
Safe Operating Area
800
Power Derating
700
600
500
400
300
200
Power Dis s ip ation- PD (mW)
100
0
0 50 100 150 200
Ambient Temper ature- Ta (oC)
HSD1616A HSMC Product Specification
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HI-SINCERITY
g
A
MICROELECTRONICS CORP.
TO-92 Dimension
Spec. No. : HE6534
Issued Date : 1998.06.01
Revised Date : 2002.02.18
Page No. : 4/4
A
α2
B
31
2
Marking:
HD
S
611
6A
Date Code Control Code
Rank
α3
C
D
H
I
α1
G
Style: Pin 1.Emitter 2.Collector 3.Base
E
DIM
F
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code:
DIM
*: Typical
Min. Max. Min. Max.
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56
E - *0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family , flammability solid burning class: UL94V-0
α1
α2
α3
-
-
-
*5°
*2°
*2°
-
-
-
*5°
*2°
*2°
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or appli cation assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HSD1616A HSMC Product Specification
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