Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
HSD1609S
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HSD1609S is designed for low frequency high voltage amplifier
applications, complementary pair with HSB1109S.
Spec. No. : HE6515
Issued Date : 1993.03.15
Revised Date : 2002.01.15
Page No. : 1/4
Absolute Maximum Ratings
• Maximum Temperatures
Stor age Temperature............................................................................................ -50 ~ +150 °C
Junction Temperature...................................................................................... 150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)................................................................................ 900 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage....................................................................................... 160 V
VCEO Collector to Emitter Voltage.................................................................................... 160 V
VEBO Emitter to Base Voltage.............................................................................................. 5 V
IC Collector Current........................................................................................................ 100 mA
TO-92
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO 160 - - V IC=10uA, IE=0
BVCEO 160 - - V IC=1mA, IB=0
BVEBO 5 - - V IE=10uA, IC=0
ICBO - 10 uA VCB=140V, IE=0
*VCE(sat) - - 2 V IC=30mA, IB=3mA
VBE(on) - - 1.5 V VCE=5V, IC=10mA
*hFE1 60 - 320 VCE=5V, IC=10mA
*hFE2 30 - - VCE=5V, IC=1mA
fT - 140 - MHz VCE=5V, IC=10mA
Cob - 3.8 - pF IE=0, VCB=10V, f=1MHZ
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
Classification of hFE1
Rank B C D
Range 60-120 100-200 160-320
HSD1609S HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6515
Issued Date : 1993.03.15
Revised Date : 2002.01.15
Page No. : 2/4
10000
Current Gain & Collector Current
1000
100
hFE
10000
1000
10
125oC
25oC
1
0.1 1 10 100 1000
Collector Current IC (mA)
75oC
hFE @ VCE=5V
Sat urati on Voltage & Col lector Current
1000
100
Satur ation Voltage ( m V)
10
Sat urati on Voltage & Collector Curren t
75oC
125oC
25oC
CE(sat)
V
@ IC=10I
0.1 1 10 100 1000
Collector Current IC (mA)
ON Voltage & C ollector Current
1000
25oC
B
100
Saturat ion Volta ge ( m V)
10
0.1 1 10 100 1000 10000
125oC
25oC
Collect o r Current IC (mA)
75oC
CE(sat)
V
@ IC=20I
Cutoff Frequency & Ic
1000
fT
100
Cutoff Fr equen cy ( M Hz)..
125oC
ON Voltage ( m V)
B
100
0.1 1 10 100 1000
Collector Current IC (mA)
75oC
BE(ON)
V
@ IC=5V
Ca pacitance & Reverse-Biased Volta ge
10
Cob
Capacitance (PF)
10
1 10 100 1000
Collector Current ( m A )
1
0.1 1 10 100 1000
Reverse Biased Volt ag e ( V)
HSD1609S HSMC Product Specification
Page 3
HI-SINCERITY
)
MICROELECTRONICS CORP.
Spec. No. : HE6515
Issued Date : 1993.03.15
Revised Date : 2002.01.15
Page No. : 3/4
10
PT=1ms
PT=100ms
1
PT=1s
0.1
Collector Current (mA
0.01
0.001
1 10 100 1000
Safe Operati ng Area
Forwar d Voltage (V)
1000
Power Derating
900
800
700
600
500
400
300
Power Dissipation-PD(mW)
200
100
0
0 20 40 60 80 100 120 140 160
Ambient Temper ature- Ta(oC)
HSD1609S HSMC Product Specification
Page 4
HI-SINCERITY
g
A
MICROELECTRONICS CORP.
TO-92 Dimension
Spec. No. : HE6515
Issued Date : 1993.03.15
Revised Date : 2002.01.15
Page No. : 4/4
C
A
α2
B
31
2
α3
D
H
I
α1
G
Marking:
HSMC Logo
Part Number
Date Code
HSMC Logo
Part Number
Style: Pin 1.Emitter 2.Collector 3.Base
Product Series
Rank
Laser Mark
Product Series
Ink Mark
E
DIM
F
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code:
DIM
*: Typical
Min. Max. Min. Max.
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56
E - *0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
α1
α2
α3
-
-
-
*5°
*2°
*2°
-
-
-
*5°
*2°
*2°
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HSD1609S HSMC Product Specification
Loading...