Datasheet HSC945 Datasheet (HSMC)

HI-SINCERITY

MICROELECTRONICS CORP.

HSC945

NPN EPITAXIAL PLANAR TRANSISTOR

Description

The HSC945 is designed for using driver stage of AP amplifier and
low speed switching applications.

Spec. No. : HE6517
Issued Date : 1995.02.11
Revised Date : 2002.12.16
Page No. : 1/4

Absolute Maximum Ratings

• Maximum Temperatures

Stor age Temperature............................................................................................ -50 ~ +150 °C

Junction Temperature...................................................................................... 150 °C Maximum

• Maximum Power Dissipation

Total Power Dissipation (Ta=25°C)................................................................................ 250 mW

• Maximum Voltages and Currents (Ta=25°C)

VCBO Collector to Base Voltage......................................................................................... 60 V

VCEO Collector to Emitter Voltage...................................................................................... 50 V

VEBO Emitter to Base Voltage.............................................................................................. 5 V

IC Collector Current........................................................................................................ 100 mA

IB Base Current................................................................................................................ 50 mA

TO-92

Characteristics (Ta=25°C)

Symbol Min. Typ. Max. Unit Test Conditions

BVCBO 60 - - V IC=100uA, IE=0
BVCEO 50 - - V IC=1mA. IB=0
BVEBO 5 - - V IE=10uA. IC=0

ICBO - - 100 nA VCB=60V, IE=0
IEBO - - 100 nA VEB=5V, IB=0

*VCE(sat) - 0.1 0.3 V IC=100mA, IB=10mA

*hFE1 50 - - VCE=6V, IC=0.1mA
*hFE2 135 - 600 VCE=6V, IC=1mA

fT 150 - 600 MHz VCE=6V, IC=10mA, f=100MHz

Cob - - 4 pF VCB=10V, f=1MHz, IE=0

*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%

Classification of hFE2

Rank Q P K

Range 135-270 200-400 300-600

HSC945 HSMC Product Specification

HI-SINCERITY

MICROELECTRONICS CORP.

Characteristics Curve

Spec. No. : HE6517
Issued Date : 1995.02.11
Revised Date : 2002.12.16
Page No. : 2/4

1000

125oC

hFE

100

1 10 100

25oC

Collector Current-IC (mA)

75oC

hFE @ VCE=6V

Sat urati on Voltage & Coll ector Cu rrent

1000

25oC

Current Gai n & Collector Current

1000

CE(sat)

V

100

Satur ation Voltage ( m V)

10

0.1 1 10 100

B

@IC=10I

125oC

25oC

Collector Current- IC (mA)

75oC

On Vol tage & Col lector Current

1

BE(sat)

V

@ IC=10I

Sat urati on Voltage & Collector Curren t

B

75oC

125oC

Saturat ion Voltag e ( m V)

BE(sat)

V

@ IC=10I

100

0.1 1 10 100

Collector Current- IC (mA)

Ca pacitance & Reverse-Biased Volta ge

10

Cob

Capacitance (Pf )

On Volta ge ( m V)

B

0.1

0.1 1 10 100

Collector Current (mA)

Cutoff Frequency & Collector Current

1000

fT @ VCE=5V

100

Cutoff Frequency (MHz)...

1

0.1 1 10 100

Reverse Biased Volt ag e ( V)

10

1 10 100

Collector Curren t (m A)

HSC945 HSMC Product Specification

HI-SINCERITY

)

MICROELECTRONICS CORP.

Spec. No. : HE6517
Issued Date : 1995.02.11
Revised Date : 2002.12.16
Page No. : 3/4

10000

Safe Operating Area

PT=1ms

1000

100

Collect or Current (m A

PT=100ms

PT=1s

10

1

1 10 100

Forwar d Voltage (mV)

300

PD-Ta

250

200

150

100

Power Dis s ip ation- PD (mW)

50

0

0 50 100 150 200

Ambient Temper ature- Ta(oC)

HSC945 HSMC Product Specification

HI-SINCERITY

g

A

MICROELECTRONICS CORP.

TO-92 Dimension

Spec. No. : HE6517
Issued Date : 1995.02.11
Revised Date : 2002.12.16
Page No. : 4/4

A

α2

B

31

2

Marking:

HC

S

495

Date Code Control Code

Rank

α3

C

D

H

I

α1

G

Style: Pin 1.Emitter 2.Collector 3.Base

E

DIM

F

Inches Millimeters Inches Millimeters

Min. Max. Min. Max.

3-Lead TO-92 Plastic Package

HSMC Packa

e Code:

DIM

*: Typical

Min. Max. Min. Max.
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56
E-*0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76

Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.

2.Controlling dimension: millimeters.

3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.

Material:

• Lead: 42 Alloy; solder plating

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0

α1
α2
α3

-

-

-

*5°
*2°
*2°

-

-

-

*5°
*2°
*2°

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.

• HSMC reserves the right to make changes to its products without notice.

• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Head Office And Factory:

• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: [phone] Fax: [phone]

• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: [phone]~5 Fax: [phone]

HSC945 HSMC Product Specification