Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6523
Issued Date : 1992.11.25
Revised Date : 2001.06.06
Page No. : 1/3
HSC1815
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HSC1815 is designed for use in driver stage of AF amplifier
general purpose amplification.
Absolute Maximum Ratings
Maximum Temperatures
•
Storage Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature................................................................................... +150 °C Maximum
Maximum Power Dissipation
•
Total Power Dissipation (Ta=25°C)............................................................................... 400 mW
Maximum Voltages and Currents (Ta=25°C)
•
VCBO Collector to Base Voltage ........................................................................................ 60 V
VCEO Collector to Emitter Voltage ..................................................................................... 50 V
VEBO Emitter to Base Voltage ............................................................................................. 5 V
IC Collector Current....................................................................................................... 150 mA
IB Base Current............................................................................................................... 50 mA
Characteristics
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO 60 - - V IC=100uA, IE=0
BVCEO 50 - - V IC=1mA, IB=0
BVEBO 5 - - V IE=10uA, IC=0
ICBO - - 100 nA VCB=60V, IE=0
IEBO - - 100 nA VEB=5V, IC=0
*VCE(sat) - - 250 mV IC=100mA, IB=10mA
*VBE(sat) - - 1 V IC=100mA, IB=10mA
*hFE1 120 - 700 VCE=6V, IC=2mA
*hFE2 25 - - VCE=6V, IC=150mA
fT 80 - - MHz VCE=10V, IC=1mA, f=100MHz
Cob - - 3.5 pF VCB=10V, f=1MHz, IE=0
(Ta=25°C)
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
Classification of hFE1
Rank Y GR BL
Range 120-240 200-400 350-700
HSC1815 HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6523
Issued Date : 1992.11.25
Revised Date : 2001.06.06
Page No. : 2/3
1000
Current Gain & Collector Curr ent
100
hFE
10
1
0.01 0.1 1 10 100 1000
10
Capacitance & Rev erse-Biased Voltage
Collector Curren t (m A )
VCE=6V
Saturation Voltage & Collector Curren t
1
BE(sat)
V
0.1
Saturation Voltage (mV)
0.01
0.01 0.1 1 10 100 1000
CE(sat)
V
Collector Current (mA)
@ IC=10I
@ IC=10I
B
B
Cut off Fr equency & Collector Cur rent
1000
100
VCE=10V
Cob
Capac itanc e (pF)
1
0.1 1 10 100
10000
1000
(mA)
C
100
Collector Curren t-I
10
1
1 10 100
Reverse-Biased Vol t ag e ( V)
Safe Operating Area
PT=1ms
PT=100ms
PT=1s
Forwar d Vol tage-VCE (V)
10
Cutoff Frequency (MHz)
1
1 10 100
Collector Current (mA)
PD-Ta
450
400
350
300
250
200
150
Power Dissipation-PD(mW)
100
50
0
0 50 100 150 200
Ambient Temper ature- Ta(oC)
HSC1815 HSMC Product Specification
Page 3
HI-SINCERITY
g
MICROELECTRONICS CORP.
TO-92 Dimension
A
Spec. No. : HE6523
Issued Date : 1992.11.25
Revised Date : 2001.06.06
Page No. : 3/3
α
2
Marking :
C
B
31
2
α
3
HSMC Logo
Part Number
Date Code
HSMC Logo
D
Part Number
H
α
I
1
G
Style : Pin 1.Emitter 2.Collector 3.Bas e
Product Series
Rank
Laser Mark
Product Series
Ink Mark
E
DIM
F
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code : A
DIM
Min. Max. Min. Max.
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H C 0.5000 - 12.70 - I D 0.0142 0.0220 0.36 0.56
E-*0.0500 -
1.27
*
F 0.1323 0.1480 3.36 3.76
Notes :
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your l ocal HSMC sales office.
1
α
2
α
3
α
-
-
-
0.1000 -
*
0.0500 -
*
5
°
*
2
°
*
2
°
*
-
-
-
*:Typical
2.54
*
1.27
*
5
°
*
2
°
*
2
°
*
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or applic ation assistance.
Head Office And Factory :
•
Head Office
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
•
Factory 1 :
Tel : 886-3-5983621~5 Fax : 886-3-5982931
HSC1815 HSMC Product Specification
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
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