The HD74CDC857 is a high-performance, low-skew, low-jitter, phase locked loop clock driver. It is
specifically designed for use with DDR (Double Data Rate) synchronous DRAMs.
Features
• Supports 100 MHz to 150 MHz operation range
• Distributes one differential clock input pair to ten differential clock outputs pairs
• SSTL_2 (Stub Series Terminated Logic) differential inputs and LVCMOS reset (G) input
• Supports spread spectrum clock
• External feedback pins (FBIN, FBIN) are used to synchronize the outputs to the clock input
• Supports both 3.3 V/2.5V analog supply voltage (AVCC), and 2.5 V V
• No external RC network required
• Sleep mode detection
• 48pin TSSOP (Thin Shrink Small Outline Package)
Note: 1. 200 MHz (Max) ver. will be available by 4Q/’99
Input clamp currentI
Output clamp currentI
Continuous output currentI
Supply current through each V
or GND I
DDQ
V
IK
OK
O
VDDQ
DDQ
I
O
or I
Maximum power dissipation
at Ta = 55°C (in still air)
Storage temperatureT
stg
Notes:Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage
to the device. These are stress ratings only, and functional operation of the device at these or
any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute maximum rated conditions for extended periods may affect device
reliability.
1. The input and output negative voltage ratings may be exceeded if the input and output clamp
current ratings are observed.
–0.5 to 4.6V
–0.5 to 4.6V
–0.5 to V
DD
V
+0.5
–50mAVI < 0
–50mAVO < 0
±50mAVO = 0 to V
±100mA
GND
0.7W
–65 to +150°C
DDQ
3
Page 4
HD74CDC857
Q
Q
Recommended Operating Conditions
ItemSymbol MinTypMaxUnit Conditions
Supply voltageAV
(1)2.3—2.7Vf
CC
AVCC (2)3.0—3.6f
Output supply voltageV
DC input signal voltage
*1
High level input voltageV
Low level input voltageV
High level input voltageV
Low level input voltageV
Differential input signal voltage *2V
0—70°C
Notes:Unused inputs must be held high or low to prevent them from floating.
Feedback inputs (FBIN, FBIN) may float when the device is in low power mode.
1. DC input signal voltage specifies the allowable dc execution of differential input.
2. Differential input signal voltage specifies the differential voltage |VTR–VCP| required for
switching, where VTR is the true input level and VCP is the complementary input level.
3. Differential cross point voltage is expected to track variations of V
and is the voltage at which
DDQ
the differential signals must be crossing. (See figure1-1)
4. V
is the reference DC level, when using single clock input. When CLK (pin#13) is single ended
ref
input, CLK (pin#14) must be set V
. (See figure1-2)
ref
= 100 to 150 MHz
CLK
= 130 to 150 MHz
CLK
DDQ
4
Page 5
VTR
VCP
V
ID
Crossing point
Figure 1-1 Differential input levels
HD74CDC857
V
DDQ
GND
CLK
CLK
Figure 1-2 Single input levels
V
DDQ
V
ref
GND
CLK
*4
CLK
V
ref
5
Page 6
HD74CDC857
Logic Diagram
G
CLK
CLK
FBIN
FBIN
AV
CC
PLL
Y0
Y0
Y1
Y1
Y2
Y2
Y3
Y3
Y4
Y4
Y5
Y5
Y6
Y6
Y7
Y7
Y8
Y8
Y9
Y9
FBOUT
FBOUT
Note: All inputs and outputs are associated with V = 2.5 V.
DDQ
6
Page 7
HD74CDC857
CC
CC
Pin Function
Pin nameNo.TypeDescription
AGND17Ground Analog ground. AGND provides the ground reference for the
analog circuitry.
AV
CC
CLK, CLK13, 14IClock input. CLK provides the clock signal to be distributed by the
FBIN, FBIN35, 36IFeedback input. FBIN provides the feedback signal to the internal
FBOUT, FBOUT 32, 33OFeedback output. FBOUT is dedicated for external feedback. It
G37IOutput bank enable. G is the output enable for all outputs. When
GND1, 7, 8, 18,
V
DDQ
Y3, 5, 10, 20,
Y2, 6, 9, 19,
16PowerAnalog power supply. AVCC provides the power reference for the
analog circuitry. In addition, AV
for test purposes. When AV
can be used to bypass the PLL
is strapped to ground, PLL is
bypassed and CLK is buffered directly to the device outputs.
HD74CDC857 clock driver. CLK is used to provide the reference
signal to the integrated PLL that generates the clock output
signals. CLK must have a fixed frequency and fixed phase for the
PLL to obtain phase lock. Once the circuit is powered up and a
valid CLK signal is applied, a stabilization time is required for the
PLL to phase lock the feedback signal to its reference signal.
PLL. FBIN must be hard-wired to FBOUT to complete the PLL.
The integrated PLL synchronizes CLK and FBIN so that there is
nominally zero phase error between CLK and FBIN.
switches at the same frequency as CLK. When externally wired to
FBIN, FBOUT completes the feedback loop of the PLL.
G is low, VCO will stop and all outputs are disabled to a high
impedance state. When G will be returned high, PLL will resynchroniz to CLK frequency and all outputs are enabled.
Ground Ground
24, 25, 31,
41, 42, 48
4, 11, 12,
PowerPower supply
15, 21, 28,
34, 38, 45
OClock outputs. These outputs provide low-skew copies of CLK.
22, 27, 29,
39, 44, 46
OClock outputs. These outputs provide low-skew copies of CLK.
23, 26, 30,
40, 43, 47
7
Page 8
HD74CDC857
Electrical Characteristics
ItemSymbol MinTyp *1MaxUnitTest Conditions
Input clamp
voltage
CLK, CLK
FBIN, FBIN, G
Output voltageV
Input currentI
Input capacitanceC
Note:1. For conditions shown as Min or Max, use the appropriate value specified under recommended
operating conditions.
Switching Characteristics
V
IK
OH
——–1.2VII = –18 mA, V
= 2.3 V
DDQ
VCC–0.2 ——VIOH = –100 µA, VCC = 2.3 to 2.7 V
1.95——IOH = –8 mA, VCC = 2.3 V
1.70——IOH = –16 mA, VCC = 2.3 V
V
OL
——0.2IOL = 100 µA, VCC = 2.3 to 2.7 V
——0.35IOL = 8 mA, VCC = 2.3 V
——0.55IOL = 16 mA, VCC = 2.3 V
Slew rate1.2——V/ns See figure 2
Stabilization time——0.1msSee figure 2, 3
Note:1. 200 MHz (Max) ver. will be available by 4Q/’99.
8
Page 9
HD74CDC857
Differential clock outputs are directly terminated by a 120 Ω resistor. Figure 2 is typical usage conditions
of outputs load.
V
DDQ
V
DDQ
Device
under
test
OUT
R =
T
120 Ω
OUT
Figure 2 Differential signal using direct termination resistor
V
IH
V +0.35 V
Differential cross
point voltage
V
0.5 × V
ref
V
IH
V
IL
DDQ
1.7 V
0.8 V
ref
V
ref
V –0.35 V
ref
V
IL
Figure 3 CLKIN waveforms
9
Page 10
HD74CDC857
(Differential input)
CLKIN
FBIN
t
(phase error)
CLKIN
(Single input)
FBIN
FBOUT
Yx
Yx
Yx'
t
(phase error)
t
sk(o)
V
ref
10
Yx
Yx
t
sk(o)
t
sk(diff)
Figure 4 Timings
Page 11
Package Dimensions
12.50
+0.3
–0.1
HD74CDC857
Unit : mm
2548
+0.3
–0.1
6.10
124
+0.1
0.20
–0.05
0.50
0.08
M
0.65 Max
0.10
0.05 Min
1.20 max
8.10 ± 0.3
0.15 ± 0.05
Hitachi code
EIAJ code
JEDEC code
10° Max
0.50 ± 0.1
TTP-48DC
—
—
11
Page 12
HD74CDC857
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URLNorthAmerica : http:semiconductor.hitachi.com/
For further information write to:
Hitachi Semiconductor
(America) Inc.
179 East Tasman Drive,
San Jose,CA 95134
Tel: <1> (408) 433-1990
Fax: <1>(408) 433-0223
Europe: http://www.hitachi-eu.com/hel/ecg
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Asia (Taiwan): http://www.hitachi.com.tw/E/Product/SICD_Frame.htm
Asia (HongKong): http://www.hitachi.com.hk/eng/bo/grp3/index.htm
Japan: http://www.hitachi.co.jp/Sicd/indx.htm
Hitachi Europe GmbH
Electronic components Group
Dornacher Straße 3
D-85622 Feldkirchen, Munich
Germany
Tel: <49> (89) 9 9180-0
Fax: <49> (89) 9 29 30 00
Hitachi Europe Ltd.
Electronic Components Group.
Whitebrook Park
Lower Cookham Road
Maidenhead
Berkshire SL6 8YA, United Kingdom
Tel: <44> (1628) 585000
Fax: <44> (1628) 778322
Hitachi Asia (Hong Kong) Ltd.
Group III (Electronic Components)
7/F., North Tower, World Finance Centre,
Harbour City, Canton Road, Tsim Sha Tsui,
Kowloon, Hong Kong
Tel: <852> (2) 735 9218
Fax: <852> (2) 730 0281
Telex: 40815 HITEC HX
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