Datasheet HD74HC173 Datasheet (HIT)

Page 1
HD74HC173
4-bit D-type Register (with 3-state Outputs)
Description
The four D type Flip-Flops operate synchronously from a common clock. The 3-state outputs allow the device to be used in bus organized systems. The outputs are placed in the 3-stage mode when either of the output disable pins are in the logic high level.
The input disable allows the flip-flops to remain in their present states without having to disrupt the clock. If either of the 2 input disables are taken to a logic high level, the Q outputs are fed back to the inputs, forcing the flip-flops to remain in the same state. Clearing is enabled by taking the clear input to a logic high level. The data outputs change state on the positive going edge of the clock.
Features
• High Speed Operation: tpd (Clock to Q) = 14 ns typ (CL = 50 pF)
• High Output Current: Fanout of 10 LSTTL Loads
• Wide Operating Voltage: VCC = 2 to 6 V
• Low Input Current: 1 µA max
• Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C)
Function Table
Inputs
Data Enable
Clear Clock G
HXXXXL LLXXXQ L HXXQ
L XHXQ L LLLL L LLHH
Note: When either M or N (or both) is (are) high the output is disabled to the high-impedance state;
however sequential operation of the flip-flops is not affected.
1
G
2
Data D Output Q
0
0
0
Page 2
HD74HC173
Pin Arrangement
Output Control
Output
1Q
2Q
3Q
4Q
Clock
GND
1
M
Output
2
N
3
4
5
6
Control
1Q
2Q
3Q
4Q
7
CK
Clear
1D
2D
3D
4D
Data Enable
8
16
15
14
13
12
11
10
9
V
CC
Clear
1D
2D
3D
4D
2
G
G1
Data Input
Data Enable Input
(Top view)
Absolute Maximum Ratings
Item Symbol Rating Unit
Supply voltage range V Input voltage V Output voltage V DC current drain per pin I DC current drain per VCC, GND ICC, I DC input diode current I DC output diode current I Power dissipation per package P
CC
IN
OUT
OUT
GND
IK
OK
T
Storage temperature Tstg –65 to +150 °C
–0.5 to +7.0 V –0.5 to VCC + 0.5 V –0.5 to VCC + 0.5 V
±35 mA ±75 mA ±20 mA ±20 mA
500 mW
2
Page 3
Block Diagram
1D
2D
3D
4D G
G2
HD74HC173
V
DQ C
R
C
DQ C
R
C
DQ C
R
C
DQ C
R
1
C
Q
Q
Q
Q
CC
1Q
V
CC
2Q
V
CC
3Q
V
CC
4Q
Clock
Clear
Control M
Control N
3
Page 4
HD74HC173
DC Characteristics
Ta = –40 to
Ta = 25°C
Item Symbol V
Input voltage V
IH
(V) Min Typ Max Min Max Unit Test Conditions
CC
2.0 1.5 — — 1.5 — V
4.5 3.15 — — 3.15 —
6.0 4.2 — — 4.2 —
V
IL
2.0 — — 0.5 — 0.5 V
4.5 — — 1.35 — 1.35
6.0 — — 1.8 — 1.8
Output voltage V
OH
2.0 1.9 2.0 — 1.9 — V Vin = VIH or VILIOH = –20 µA
4.5 4.4 4.5 — 4.4 —
6.0 5.9 6.0 — 5.9 —
4.5 4.18 — — 4.13 — IOH = –6 mA
6.0 5.68 — — 5.63 — IOH = –7.8 mA
V
OL
2.0 — 0.0 0.1 — 0.1 V Vin = VIH or VILIOL = 20 µA
4.5 — 0.0 0.1 — 0.1
6.0 — 0.0 0.1 — 0.1
4.5 — — 0.26 — 0.33 IOL = 6 mA
6.0 — — 0.26 — 0.33 IOL = 7.8 mA
Off-state output
I
OZ
6.0 — — ±0.5 — ±5.0 µA Vin = VIH or VIL,
current Input current Iin 6.0 — — ±0.1 — ±1.0 µA Vin = VCC or GND Quiescent supply
I
CC
6.0 — — 4.0 — 40 µA Vin = VCC or GND, Iout = 0 µA
current
+85°C
Vout = V
or GND
CC
4
Page 5
AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = –40 to
Ta = 25°C
Item Symbol V
Maximum clock f
max
(V) Min Typ Max Min Max Unit Test Conditions
CC
2.0 — — 5 — 4 MHz
frequency 4.5 — — 27 — 21
6.0 — — 32 — 25 Propagation delay t time t
PLH
PHL
2.0 — — 175 — 220 ns Clock to Q
4.5 — 14 35 — 44
6.0 — — 30 — 37
t
PHL
2.0 — — 150 — 190 ns Clear to Q
4.5 — 14 30 — 38
6.0 — — 26 — 33 Enable time t
ZH
t
ZL
2.0 — — 150 — 190 ns
4.5 — 12 30 — 38
6.0 — — 26 — 33 Disable time t
HZ
t
LZ
2.0 — — 150 — 190 ns
4.5 — 12 30 — 38
6.0 — — 26 — 33 Setup time t
su
2.0 100 — — 125 — ns
4.5 20 4 — 25 —
6.0 17 – — 21 — Removal time t
rem
2.0 90 — — 115 — ns
4.5 18 0 — 23 —
6.0 15 — — 20 — Hold time t
h
2.0 5 — — 5 — ns
4.5 5 –2 — 5 —
6.0 5 — — 5 — Pulse width t
w
2.0 80 — — 100 — ns
4.5 16 4 — 20 —
6.0 14 — — 17 — Output rise/fall t time t
TLH
THL
2.0 — — 60 — 75 ns
4.5 — 4 12 — 15
6.0 — — 10 — 13 Input capacitance Cin — — 5 10 — 10 pF
+85°C
HD74HC173
5
Page 6
19.20
20.00 Max
16 9
1.3
Unit: mm
6.30
7.40 Max
81
1.11 Max
2.54 ± 0.25
0.48 ± 0.10
5.06 Max
2.54 Min
0.51 Min
Hitachi Code JEDEC EIAJ Weight
7.62
+ 0.13
0.25
– 0.05
0° – 15°
(reference value)
DP-16 Conforms Conforms
1.07 g
Page 7
16
Unit: mm
10.06
10.5 Max 9
5.5
1
0.80 Max
1.27
*0.42 ± 0.08
0.40 ± 0.06
*Dimension including the plating thickness
Base material dimension
8
0.12
0.10 ± 0.10
0.15
M
2.20 Max
7.80
0.20 ± 0.04
*0.22 ± 0.05
0.70 ± 0.20
Hitachi Code JEDEC EIAJ
(reference value)
Weight
+ 0.20 – 0.30
1.15
0° – 8°
FP-16DA — Conforms
0.24 g
Page 8
16
Unit: mm
9.9
10.3 Max 9
1
1.27
0.635 Max
*0.42 ± 0.08
0.40 ± 0.06
*Dimension including the plating thickness
Base material dimension
8
0.25
+ 0.11
– 0.04
0.14
0.15
3.95
1.75 Max
M
6.10
1.08
0.20 ± 0.03
*0.22 ± 0.03
0.60
Hitachi Code JEDEC EIAJ Weight
+ 0.10 – 0.30
0° – 8°
+ 0.67 – 0.20
(reference value)
FP-16DN Conforms Conforms
0.15 g
Page 9
Cautions
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2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.
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