Page 1
1-524
V
CC
V
O
V
E
GND
H
Hermetically Sealed,
Very High Speed,
Logic Gate Optocouplers
Technical Data
Features
• Dual Marked with Device
Part Number and DESC
Drawing Number
• Manufactured and Tested on
a MIL-PRF-38534 Certified
Line
• QML-38534, Class H and K
• Three Hermetically Sealed
Package Configurations
• Performance Guaranteed
over -55°C to +125°C
• High Speed: 40 M bit/s
• High Common Mode
Rejection 500 V/µs
Guaranteed
• 1500 Vdc Withstand Test
Voltage
• Active (Totem Pole) Outputs
• Three Stage Output Available
• High Radiation Immunity
• HCPL-2400/30 Function
Compatibility
• Reliability Data
• Compatible with TTL, STTL,
LSTTL, and HCMOS Logic
Families
Applications
• Military and Space
• High Reliability Systems
• Transportation, Medical, and
Life Critical Systems
• Isolation of High Speed
Logic Systems
Each channel contains an AlGaAs
light emitting diode which is
optically coupled to an integrated
high gain photon detector. This
combination results in very high
HCPL-540X*
5962-89570
HCPL-543X
Functional Diagram
Multiple Channel Devices
Available
Single Channel DIP
Input Enable Output
On (H) L L
Off (L) L H
On (H) H Z
Off (L) H Z
Truth Tables
(Positive Logic)
Multichannel Devices
Input Output
On (H) H
Off (L) L
HCPL-643X
5962-89571
*See matrix for available extensions.
• Computer-Peripheral
Interfaces
• Switching Power Supplies
• Isolated Bus Driver
(Networking Applications)(5400/1 Only)
• Pulse Transformer
Replacement
• Ground Loop Elimination
• Harsh Industrial
Environments
• High Speed Disk Drive I/O
• Digital Isolation for A/D,
D/A Conversion
Description
These units are single and dual
channel, hermetically sealed
optocouplers. The products are
capable of operation and storage
over the full military temperature
range and can be purchased as
either standard product or with
full MIL-PRF-38534 Class Level
H or K testing or from the
appropriate DESC Drawing. All
devices are manufactured and
tested on a MIL-PRF-38534
certified line and are included in
the DESC Qualified Manufacturers List QML-38534 for Hybrid
Microcircuits.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
5965-3004E
Page 2
1-525
Selection Guide–Package Styles and Lead Configuration Options
Package 8 Pin DIP 8 Pin DIP 20 Pad LCCC
Lead Style Through Hole Through Hole Surface Mount
Channels 1 2 2
Common Channel None VCC, GND None
Wiring
HP Part # & Options
Commercial HCPL-5400 HCPL-5430 HCPL-6430
MIL-PRF-38534, Class H HCPL-5401 HCPL-5431 HCPL-6431
MIL-PRF-38534, Class K HCPL-540K HCPL-543K HCPL-643K
Standard Lead Finish Gold Plate Gold Plate Solder Pads
Solder Dipped Option #200 Option #200
Butt Cut/Gold Plate Option #100 Option #100
Gull Wing/Soldered Option #300 Option #300
SMD Part #
Prescript for all below 5962- 5962- 5962Either Gold or Solder 8957001PX 8957101PX 89571022X
Gold Plate 8957001PC 8957101PC
Solder Dipped 8957001PA 8957101PA 89571022A
Butt Cut/Gold Plate 8957001YC 8957101YC
Butt Cut/Soldered 8957001YA 8957101YA
Gull Wing/Soldered 8957001XA 8957101XA
data rate capability. The detector
has a threshold with hysteresis,
which typically provides 0.25 mA
of differential mode noise
immunity and minimizes the
potential for output signal
chatter. The detector in the single
channel units has a three state
output stage which eliminates the
need for a pull-up resistor and
allows for direct drive of a data
bus.
All units are compatible with TTL,
STTL, LSTTL, and HCMOS logic
families. The 35 ns pulse width
distortion specification guarantees a 10 MBd signaling rate at
+125°C with 35% pulse width
distortion. Figures 13 through 16
show recommended circuits for
reducing pulse width distortion
and optimizing the signal rate of
the product. Package styles for
these parts are 8 pin DIP through
hole (case outlines P), and
leadless ceramic chip carrier
(case outline 2). Devices may be
purchased with a variety of lead
bend and plating options. See
Selection Guide Table for details.
Standard Military Drawing (SMD)
parts are available for each
package and lead style.
Because the same electrical die
(emitters and detectors) are used
for each channel of each device
listed in this data sheet, absolute
maximum ratings, recommended
operating conditions, electrical
specifications, and performance
characteristics shown in the
figures are similar for all parts.
Occasional exceptions exist due
to package variations and limitations and are as noted. Additionally, the same package assembly
processes and materials are used
in all devices. These similarities
give justification for the use of
data obtained from one part to
represent other part’s performance for die related reliability and
certain limited radiation test
results.
Page 3
1-526
7
5
6
8
1
2
3
4
V
CC
GND
V
E
V
O
Functional Diagrams
8 Pin DIP 8 Pin DIP 20 Pad LCCC
Through Hole Through Hole Surface Mount
1 Channel 2 Channels 2 Channels
Note: All DIP devices have common VCC and ground. LCCC (leadless ceramic chip carrier) package has isolated channels with
separate VCC and ground connections.
Outline Drawings
V
CC
7
5
6
8
V
O1
GND
1
2
3
4
V
O2
GND
1
V
O2
19
20
2
3
V
O1
87
V
CC2
V
CC1
10
GND
2
15
13
12
20 Terminal LCCC Surface Mount, 2 Channels
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
1.78 (0.070)
2.03 (0.080)
1.02 (0.040) (3 PLCS)
4.95 (0.195)
5.21 (0.205)
8.70 (0.342)
9.10 (0.358)
1.78 (0.070)
2.03 (0.080)
0.51 (0.020)
0.64
(0.025)
(20 PLCS)
1.52 (0.060)
2.03 (0.080)
METALIZED
CASTILLATIONS (20 PLCS)
2.16 (0.085)
TERMINAL 1 IDENTIFIER
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
SOLDER THICKNESS 0.127 (0.005) MAX.
1.14 (0.045)
1.40 (0.055)
3.81 (0.150)
MIN.
4.32 (0.170)
MAX.
9.40 (0.370)
9.91 (0.390)
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
0.76 (0.030)
1.27 (0.050)
8.13 (0.320)
MAX.
7.36 (0.290)
7.87 (0.310)
0.20 (0.008)
0.33 (0.013)
7.16 (0.282)
7.57 (0.298)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
8 Pin DIP Through Hole, 1 and 2 Channel
Page 4
1-527
0.51 (0.020)
MIN.
5.57 (0.180)
MAX.
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
1.40 (0.055)
1.65 (0.065)
9.65 (0.380)
9.91 (0.390)
5° MAX.
5.57 (0.180)
MAX.
0.20 (0.008)
0.33 (0.013)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
Leadless Device MarkingLeaded Device Marking
Hermetic Optocoupler Options
Option Description
100 Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This
option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for
details).
200 Lead finish is solder dipped rather than gold plated. This option is available on commercial
and hi-rel product in 8 pin DIP. DESC Drawing part numbers contain provisions for lead
finish. All leadless chip carrier devices are delivered with solder dipped terminals as a
standard feature.
300 Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This
option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for
details). This option has solder dipped leads.
1.14 (0.045)
1.40 (0.055)
4.32 (0.170)
MAX.
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
7.36 (0.290)
7.87 (0.310)
0.20 (0.008)
0.33 (0.013)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
HP QYYWWZ
XXXXXX
XXXXXXX
XXX USA
* 50434
COUNTRY OF MFR.
HP FSCN*
HP LOGO
DESC SMD*
PIN ONE/
ESD IDENT
HP P/N
DESC SMD*
* QUALIFIED PARTS ONLY
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
HP QYYWWZ
XXXXXX
* XXXX
XXXXXX
USA 50434
DESC SMD*
HP FSCN*
HP LOGO
COUNTRY OF MFR.
HP P/N
PIN ONE/
ESD IDENT
DESC SMD*
* QUALIFIED PARTS ONLY
Page 5
1-528
Absolute Maximum Ratings
(No derating required up to +125°C)
Storage Temperature Range, TS.................................. -65°C to +150°C
Operating Temperature, TA......................................... -55°C to +125°C
Case Temperature, TC................................................................+170°C
Junction Temperature, TJ..........................................................+175°C
Lead Solder Temperature .............................................. 260°C for 10 s
Average Forward Current, I
F AVG
(each channel) ........................ 10 mA
Peak Input Current, I
F PK
(each channel) ............................... 20 mA
[1]
Reverse Input Voltage, VR (each channel) ....................................... 3 V
Supply Voltage, VCC............................................. 0.0 V min., 7.0 V max.
Average Output Current, IO............................ -25 mA min., 25 mA max.
(each channel)
Output Voltage, VO (each channel) .....................-0.5 V min., 10 V max.
Output Power Dissipation, PO (each channel) ........................... 130 mW
Package Power Dissipation, PD (each channel)......................... 200 mW
Single Channel Product Only
Three State Enable Voltage, VE...........................-0.5 V min., 10 V max.
Recommended Operating Conditions
Parameter Symbol Min. Max. Units
Input Current (High) I
F(ON)
610 mA
Supply Voltage, Output V
CC
4.75 5.25 V
Input Voltage (Low) V
F(OFF)
– 0.7 V
Fan Out (Each Channel) N – 5 TTL Loads
Single Channel Product Only
High Level Enable Voltage V
EH
2.0 V
CC
V
Low Level Enable Voltage V
EL
0 0.8 V
Note enable pin 7. An external 0.01 µF to 0.1 µF bypass capacitor must be connected
between VCC and ground for each package type.
ESD Classification
(MIL-STD-883, Method 3015)
HCPL-5400/01 .................................................................. (∆∆), Class 2
HCPL-5430/31 and HCPL-6430/31 ................................. (Dot), Class 3
CATHODE
8 Pin Ceramic DIP Single Channel Schematic
ANODE
V
O
V
E
Page 6
1-529
Electrical Characteristics
TA = -55° C to +125°C, 4.5 V ≤ VCC ≤ 5.25 V, 6 mA ≤ I
F(ON)
≤ 10 mA, 0 V ≤ V
F(OFF)
≤ 0.7 V,
unless otherwise specified.
Limits
Parameter Sym. Test Conditions Subgroups Min. Typ.* Max. Units Fig. Notes
Low Level Output Voltage VOLIOL = 8.0 mA (5 TTL Loads) 1, 2, 3 0.3 0.5 V 1 9
High Level Output Voltage VOHIOH = -4.0 mA 1, 2, 3 2.4 V 2 9
Output Leakage Current I
OHHVO
= 5.25 V, VF = 0.7 V 1, 2, 3 100 µA9
Logic High Single I
CCHVCC
= 5.25 V, VE = 0 V 1, 2, 3 17 26 mA
Channel (Single Channel Only)
Dual Channel 34 52 13
Logic Low Single I
CCL
1, 2, 3 19 26 mA
Channel
Dual Channel 38 52 13
Input Forward Voltage VFIF = 10 mA 1, 2, 3 1.0 1.35 1.85 V 4 9
Input Reverse Break- VRIR = 10 µA 1, 2, 3 3.0 4.8 V 9
down Voltage
Input-Output Insulation I
I-OVI-O
= 1500 Vdc, RH = 45%, 1 1.0 µA 2, 3
Leakage Current t = 5 s
Propagation Delay Time t
PHL
9, 10, 11 33 60 ns 5, 4, 9
Logic Low Output 6, 7
Propagation Delay Time t
PLH
9, 10, 11 30 60 ns 5, 4, 9
Logic High Output 6, 7
Pulse Width PWD 9, 10, 11 3 35 ns 5, 4, 9
Distortion 6, 7
Logic High Common |CMH|VCM = 50 V
P-P
, IF = 0 mA 9, 10, 11 500 3000 V/µs 11 5, 9,
Mode Transient Immunity 11
Logic Low Common |CML|VCM = 50 V
P-P
, IF = 6 mA 9, 10, 11 500 3000 V/µs 11 5, 9,
Mode Transient Immunity 11
Single Channel Product Only
Limits
Parameter Sym. Test Conditions Subgroups Min. Typ.* Max. Units Fig. Notes
Logic High Enable V
EH
1, 2, 3 2.0 V
Voltage
Logic Low Enable V
EL
1, 2, 3 0.8 V
Voltage
Logic High Enable I
EHVE
= 2.4 V 1, 2, 3 20 µA
VE = 5.25 V 1, 2, 3 100
Logic Low Enable I
ELVE
= 0.4 V 1, 2, 3 -0.28 -0.4 mA
Current
High Impedance State I
CCZVCC
= 5.25 V, 1, 2, 3 22 28 mA
Supply Current V
E
= 5.25 V
High Impedance State I
OZLVO
= 0.4 V, VE = 2 V 1, 2, 3 -20 µA
I
OZHVO
= 2.4 V, VE = 2 V 20
VO = 5.25 V, VE = 2 V 100
*All typical values are at VCC = 5 V, TA = 25°C, IF = 8 mA except where noted.
Group A
[10]
Current
Output Current
Group A
[10]
Supply
Current
Supply
Current
Page 7
1-530
Parameter Symbol Typ. Units Test Conditions Fig. Notes
Input Current Hysteresis I
HYS
0.25 mA VCC = 5 V 3
Input Diode Temperature ∆V
F
-1.11 mV/°CIF = 10 mA 4
Coefficient ∆T
A
Resistance (Input-Output) R
I-O
10
12
Ω V
I-O
= 500 V 2
Capacitance (Input-Output) C
I-O
0.6 pF f = 1 MHz, V
I-O
= 0 V 2
Logic Low Short Circuit I
OSL
65 mA VO = VCC = 5.25 V, 6, 9
Output Current IF = 10 mA
Logic High Short Circuit I
OSH
-50 mA VCC = 5.25 V, IF = 0 mA, 6, 9
Output Current VO = GND
Output Rise Time (10-90%) t
r
15 ns 5
Output Fall Time (90-10%) t
f
10 ns 5
Propagation Delay Skew t
PSK
30 ns 10 12
Power Supply Noise Immunity PSNI 0.5 V
P-P
48 Hz ≤ fac ≤ 50 MHz 7
Typical Characteristics
All typical values are at TA = 25°C, VCC = 5 V, IF = 8 mA, unless otherwise specified.
Single Channel Product Only
Parameter Symbol Typ. Units Test Conditions Fig. Notes
Input Capacitance C
IN
15 pF f = 1 MHz, VF = 0 V,
Pins 2 and 3
Output Enable Time to Logic High t
PZH
15 ns 8, 9
Output Enable Time to Logic Low t
PZL
30 ns 8, 9
Output Disable Time from Logic High t
PHZ
20 ns 8, 9
Output Disable Time from Logic Low t
PLZ
15 ns 8, 9
Dual and Quad Channel Product Only
Input Capacitance C
IN
15 pF f = 1 MHz, VO = 0 V
Input-Input Leakage Current I
I-I
0.5 nA RH = 45%, V
I-I
= 500 Vdc 8
Input-Input Resistance R
I-I
10
12
Ω V
I-I
= 500 V 8
Input-Input Capacitance C
I-I
1.3 pF f = 1 MHz, VF = 0 V 8
Page 8
1-531
Notes:
1. Not to exceed 5% duty factor, not to exceed 50 µsec pulse width.
2. All devices are considered two-terminal devices: measured between all input leads or terminals shorted together and all output leads
or terminals shorted together.
3. This is a momentary withstand test, not an operating condition.
4. t
PHL
propagation delay is measured from the 50% point on the rising edge of the input current pulse to the 1.5 V point on the falling
edge of the output pulse. The t
PLH
propagation delay is measured from the 50% point on the falling edge of the input current pulse to
the 1.5 V point on the rising edge of the output pulse. Pulse Width Distortion, PWD = |t
PHL
- t
PLH
|.
5. CML is the maximum slew rate of the common mode voltage that can be sustained with the output voltage in the logic low state
(V
O(MAX)
< 0.8 V). CMH is the maximum slew rate of the common mode voltage that can be sustained with the output voltage in the
logic high state (V
O(MIN)
> 2.0 V).
6. Duration of output short circuit time not to exceed 10 ms.
7. Power Supply Noise Immunity is the peak to peak amplitude of the ac ripple voltage on the VCC line that the device will withstand and
still remain in the desired logic state. For desired logic high state, V
OH(MIN)
> 2.0 V, and for desired logic low state, V
OL(MAX)
< 0.8 V.
8. Measured between adjacent input pairs shorted together for each multichannel device.
9. Each channel.
10. Standard parts receive 100% testing at 25°C (Subgroups 1 and 9). SMD and hi-rel parts receive 100% testing at 25, 125, and –55°C
(Subgroups 1 and 9, 2 and 10, 3 and 11, respectively).
11. Parameters are tested as part of device initial characterization and after design and process changes. Parameters are guaranteed to
limits specified for all lots not specifically tested.
12. Propagation delay skew is defined as the difference between the minimum and maximum propagation delays for any given group of
optocouplers with the same part number that are all switching at the same time under the same operating conditions.
13. The HCPL-6430 and HCPL-6431 dual channel parts function as two independent single channel units. Use the single channel
parameter limits.
Figure 1. Typical Logic Low Output
Voltage vs. Logic Low Output Current.
Figure 2. Typical Logic High Output
Voltage vs. Logic High Output Current.
Figure 3. Typical Output Voltage vs.
Input Forward Current.
Figure 4. Typical Diode Input Forward
Current Characteristic.
Page 9
1-532
Figure 8. Test Circuit for t
PHZ
, t
PZH
, t
PLZ
, and t
PZL
. (Single Channel Product Only).
Figure 5. Test Circuit for t
PLH
, t
PHL
, tr, and tf.
GND
V
CC
I
F
5.0 V
D.U.T.
1.3 KΩ
INPUT
MONITORING
NODE
PULSE GEN.
t
r
= t
f
=
5 ns
f = 500 kHz
25 % DUTY
CYCLE
30 pF
C2
THE PROBE AND JIG CAPACITANCES
ARE REPRESENTED BY C
1
AND C
2
.
ALL DIODES ARE 1N4150 OR EQUIVALENT.
V
O
OUTPUT
MONITORING
NODE
V
CC
2.5 KΩ
C1
15 pF
100 Ω
0.1 µF
GND
V
CC
I
F
5.0 V
D.U.T.
1.3 KΩ
PULSE
GENERATOR
Z
O
= 50 Ω
t
r
= t
f
=
5 ns
C1
30 pF
INPUT VE
MONITORING
NODE
V
CC
D
1
D
2
2.5 KΩ
D
3
D
4
S2
S1
V
O
8
7
6
5
1
2
3
4
0.1 µF
Figure 6. Typical Propagation Delay
vs. Ambient Temperature.
Figure 7. Typical Propagation Delay
vs. Input Forward Current.
Page 10
1-533
Figure 9. Typical Enable Propagation
Delay vs. Ambient Temperature.
(Single Channel Product Only).
Figure 11. Test Diagram for Common Mode
Transient Immunity and Typical Waveforms.
V
FF
GND
V
CC
V
CM
+–
PULSE GEN.
B
D.U.T.
I
F
OUTPUT VO
MONITORING
NODE
V
CC
= 5.0 V
† C
L
15 pF
+
–
A
0.1 µF*
Figure 10. Propagation Delay Skew,
t
PSK
, Waveform.
Figure 12. Operating Circuit for Burn-In and Steady State
Life Tests.
GND
V
CC
D.U.T.*
* FOR SINGLE CHANNEL UNITS,
GROUND ENABLE PIN.
CONDITIONS: I
F
= 10 mA
V
CC
= 5.25 V
V
IN
+–
I
F
IO = 25 mA
0.01 µF
T
A
= +125 °C
2.1 V
100 Ω TYP.
I
O
100 Ω
I
CC
V
DC
= 3.0 V
t
PSK
←
→
Page 11
1-534
MIL-PRF-38534 Class H,
Class K, and DESC SMD
Test Program
Hewlett-Packard’s Hi-Rel Optocouplers are in compliance with
MIL-PRF-38534 Classes H and K.
Class H devices are also in
compliance with DESC drawings
5962-89570, and 5962-89571.
Testing consists of 100% screening and quality conformance
inspection to MIL-PRF-38534.
Data Rate and PulseWidth Distortion
Definitions
Propagation delay is a figure of
merit which describes the finite
amount of time required for a
system to translate information
from input to output when
shifting logic levels. Propagation
delay from low to high (t
PLH
)
specifies the amount of time
required for a system’s output to
change from a Logic 0 to a Logic
1, when given a stimulus at the
input. Propagation delay from
high to low (t
PHL
) specifies the
amount of time required for a
system’s output to change from a
Logic 1 to a Logic 0, when given
a stimulus at the input (see
Figure 5).
When t
PLH
and t
PHL
differ in
value, pulse width distortion
results. Pulse width distortion is
defined as |t
PHL-tPLH
| and
determines the maximum data
rate capability of a distortionlimited system. Maximum pulse
width distortion on the order of
25-35% is typically used when
specifying the maximum data rate
capabilities of systems. The exact
figure depends on the particular
application (RS-232, PCM, T-1,
etc.).
These high performance optocouplers offer the advantages of
specified propagation delay (t
PLH
,
t
PHL
), and pulse width distortion
(|t
PLH-tPHL
|) over temperature
and power supply voltage ranges.
Figure 13. Recommended HCPL-5400 Interface Circuit.
GND
V
CC
HCPL-5400
226 Ω
V
CC1
= +5 V
TTL
LSTTL
STTL
HCMOS
TOTEM
POLE
OUTPUT GATE
(e.g. 54AS1000)
DATA
OUT
2
DATA
IN
1
GND 2
Y
0.1 µF
274 Ω
30 pF
A
GND 1
Y = A
V
CC2
= 5 V
Applications
Page 12
1-535
GND
V
CC
HCPL-5400
464 Ω
V
CC1
= +5 V
TTL
LSTTL
STTL
OPEN
COLLECTOR
OUTPUT
GATE
(e.g. 54S05)
DATA
OUT
2
DATA
IN
1
GND 2
Y
0.1 µF
A
GND 1
Y = A
V
CC2
= 5 V
STTL
Figure 14. Alternative HCPL-5400 Interface Circuit.
Figure 15. Recommended HCPL-5430 and HCPL-6430 Interface Circuit.
Figure 16. Alternative HCPL-5430 and HCPL-6430 Interface Circuit.
GND
V
CC
HCPL-5430
464 Ω
V
CC1
= +5 V
TTL
LSTTL
HCMOS
STTL
STTL OPEN COLLECTOR
OUTPUT GATE
(e.g. 54AS05)
DATA
OUT Y
DATA
IN A
GND 2
0.1 µF
GND 1
Y = A
V
CC2
= +5 V
TTL
LSTTL
HCMOS
STTL
DATA
OUT Y
DATA
IN A
464 Ω
1
2
2
GND
V
CC
HCPL-5430
226 Ω
V
CC1
= 5 V
TOTEM POLE
OUTPUT GATE
(e.g. 54AS1000)
DATA
OUT Y
DATA
IN A
1
GND 2
0.1 µF
30 pF
GND 1
Y = A
V
CC2
= +5 V
TTL
LSTTL
STTL
HCMOS
DATA
OUT Y
226 Ω
30 pF
274 Ω
274 Ω
DATA
IN A
TTL
LSTTL
STTL
HCMOS
Loading...