R1, R2—Setting of Retract voltage
R10134 kΩPWM time off for Spindle driver
R102, R103—Setting of VCM driver gain
R106100 kΩTime constant for Soft switching
R107—Phase compensation for VCM driver
R108TBDfor Watch dog timer
Rnf0.33 ΩCurrent sensing for Spindle driver
Rs0.33 ΩCurrent sensing for VCM driver
Rx, Ry15 Ωfor Filter VCCA12 and VCC5
Rf—Snubber for VCM driver
C1014.7 µF5V power supply by passing
C102470 pFPWM time off for Spindle driver
C1030.047 µFPWM filter for Spindle driver
C1041000 pFPWM filter for VCM driver
C1050.22 µFDelay for POR
C1072.2 µFCapacitor for Retract voltage supply
C1082.2 µFfor Booster
C1090.1 µFfor Booster
C110390 pFTime constant for Oscillation
C1110.47 µFPhase compensation for Spindle driver
C1120.47 µF12V power supply by passing
C1130.003 µFTime constant for Soft switching
C1141.0 µF12V power supply by passing
C1150.47 µF12V power supply by passing
C116—Phase compensation for VCM driver
C1170.47 µFReference output by passing
C1180.02 µFPrevent from oscillation during PWM drive
C119TBDfor Watch dog timer
C1200.01 µFReduction of noise from 12V power supply for VCM driver
C1214.4 µFReduction of noise from 12V power supply for VCM driver
C131220 pF(Option) Filter for POR12VADJ
C132220 pF(Option) Filter for POR5VADJ
C133 *4.7 µFReduction of noise from 12V power supply for VCM driver
ValuePurpose
11
Page 12
HA13571FR
External Components (cont)
Reccomended
Parts No.
Cf—Snubber for VCM Driver
D1 to D3TBDPower rectification for Retract driver
SBD1 *HRU0302APrevent of malfunction for Retract driver
Note: Retract circuit sometime will be malfunctioning by means of negative voltage on the terminal
VCMREF (pin 52) in the following sequence.
If you want to countermeasure this, you need to avoid the following sequence or to attach the
Schottky Barrier Diode (SBD1) between terminal VCMREF and GND. (see figure 2)
1. Spindle motor driver is active and VCM driver is disable by (VPCNTL = Middle).
2. Power supply goes to low level after above condition 1 and retract circuit becomes active by
(POR = L).
ValuePurpose
C117
0.47µF
37 VREFOUT
C133
4.7µF
Figure 2
52VCMREF
C120
0.01µF
SBD1
HRU0302A
12
Page 13
HA13571FR
Absolute Maximum Ratings (Ta = 25°C)
ItemSymbolRatingUnitNotes
Supply voltage +12VVcc12–0.3 to 13.5V1
Supply voltage +5VVcc5–0.3 to 6V1
Output voltage +12V (DC)Vsdrv (DC)–0.3 to 15V5
Output voltage +12V (PEAK)Vsdrv (PEAK)–2.0 to 17V5, 6
Output voltage +5VVout–0.3 to 6V7
Output current spindle driverIospn (DC)2.2A2
Output current VCM driverIovcm (DC)1.5A2
Input voltageVi–0.3 to Vcc5V3
Power dissipationP
Junction temperatureTj160°C1
Storage temperatureTstg–55 to +125°C
Notes: 1. Operating range are as follows.
Vcc12 = 10.8 to 13.2 V
VccA12 = 10.4 to 13.2 V
Vcc5 = 4.3 to 5.5 V
Tjopr = 0 to 130°C
2. Refer to ASO shown below. Operating locus must be within the ASO.
3. Applied to pin SCNTL1, SCNTL2, SCNTL3, SMODE, SIPWM, VPCNTL, VIPWML and VIPWMH.
4. Thermal resistance θj-a ≤ 25°C/W with 4 layer multi glass-epoxy board.
5. Applied to pin SDRVN, SDRVU, SDRVV, SDRVW, VCMN and VCMP.
6. PEAK time must be shorter than 1 ms.
7. Applied to pin PORN and TEMP.
T
5W4
2.2
2.0
1.0
0.5
0.2
Corrector Current Ic (A)
0.1
The voltage between Corrector and Emitter Vce (V)The voltage between Corrector and Emitter Vce (V)
Hysteresis on Vcc12Hv12—200±60mVVCC12
Hysteresis on Vcc5Hv5—50±15mVVCC5
POR12VADJ voltageV12adj—1.86 ±2%V19.2kΩ/3.52kΩPOR12V
POR5VADJ voltageV5adj—1.54±2%V9.6kΩ/4.27kΩPOR5V
Output low level
voltage
Output high level
voltage
PORN pull-up
resistance
Charge current for
CPOR
CPOR threshold
voltage
POR delayTdpor—40—msCpor = 0.22µFPORN
Power supply Max.
pulse duration
Warning temperature Twar130145160°C2
Shut-down
temperature
Difference
temperature
Thermal hysteresisThys—30±10°C1
Pull-up resistnaceRpu2—50±20% kΩ
Leakage currentIlk2——±10µAVcc5 = 6V, Vo = 6V
Vt12—9.0±0.3VVcc5 = 5VVCC12
Vt5—4.5±0.1VVcc12 = 12VVCC5
Vol——0.5VIol = 2mA, Vcc5 = 4.35V
Vcc12 = 8.7V
VohVcc5
–0.15
Rpu—15±20% kΩ
Icpor5812µACPOR
Vcpor—1.4—V
Trpulse5.0——µs
Tsoff145160175°C2
∆T101520°CTsoff – Twar2
——VVcc5 = 4.7V, Vcc12 = 9.5V
Note:1. Guaranteed by design.
2. Function test only.
ble pinsNote
ADJ
ADJ
PORN
20
Page 21
Package Dimensions
16.4 ± 0.2
16.0 ± 0.2
14.0
HA13571FR
Unit: mm
( ) : reference value
(12.2)
4160
61
16.4 ± 0.2
16.0 ± 0.2
80
0.22 ± 0.05
*
0.20 ± 0.04
0.08
2.25
0.60
0.08
*Dimension including the plating thickness
Base material dimension
40
0.5
(12.2)
21
201
M
1.40
+0.03
−0.07
1.70 Max
0.50 ± 0.2
1.0
0°− 8°
0.17± 0.05
0.15 ± 0.04
*
0.07
Hitachi Code
JEDEC
EIAJ
Weight
(reference value)
FP-80TA
1.3 g
21
Page 22
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
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For further information write to:
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(America) Inc.
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Tel: <1> (408) 433-1990
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Asia (Taiwan): http://www.hitachi.com.tw/E/Product/SICD_Frame.htm
Asia (HongKong): http://www.hitachi.com.hk/eng/bo/grp3/index.htm
Japan: http://www.hitachi.co.jp/Sicd/indx.htm
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Taipei Branch Office
3F, Hung Kuo Building. No.167,
Tun-Hwa North Road, Taipei (105)
Tel: <886> (2) 2718-3666
Fax: <886> (2) 2718-8180
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
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7/F., North Tower, World Finance Centre,
Harbour City, Canton Road, Tsim Sha Tsui,
Kowloon, Hong Kong
Tel: <852> (2) 735 9218
Fax: <852> (2) 730 0281
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