Datasheet FYP1045DN Datasheet (Fairchild Semiconductor)

Page 1
Features
• Low forward voltage drop
• High frequency properties and switching speed
• Guard ring for over-voltage protection
FYP1045DN
FYP1045DN
Applications
• Switched mode power supply
• Freewheeling diodes
1 2 3
TO-220
1. Anode 2.Cathode 3. Anode
SCHOTTKY BARRIER RECTIFIER
Absolute Maximum Ratings T
Symbol Parameter Value Units
V
RRM
V
R
I
F(AV)
I
FSM
T
J, TSTG
Maximum Repetitive Reverse Voltage 45 V Maximum DC Reverse Voltage 45 V Average Rectified Forward Current @ TC = 130°C10 A Non-repetitive Peak Surge Current (per diode)
60Hz Single Half-Sine Wave
Operating Junction and Storage Temperature -65 to +150 °C
Symbol Parameter Value Units
R
θJC
Maximum Thermal Resistance, Junction to Case (per diode) 3.0 °C/W
Electrical Characteristics
Symbol Parameter Value Units
V
FM
*
I
RM
*
* Pulse Test: Pulse Width=300µs, Duty Cycle=2%
Maximum Instantaneous Forward Voltage
Maximum Instantaneous Reverse Current
= 5A
I
F
I
= 5A
F
= 10A
I
F
= 10A
I
F
@ rated V
=25°°°°C unless otherwise noted
C
(per diode)
TC = 25 °C
R
T
= 25 °C
C
T
= 125 °C
C
= 25 °C
T
C
= 125 °C
T
C
= 125 °C
T
C
80 A
0.55
0.49
0.70
0.65
1
40
V
mA
©2002 Fairchild Semiconductor Corporation Rev. A, September 2002
Page 2
Typical Characteristics
FYP1045DN
10
[A]
F
1
TJ=125 oC
Forward C u rre nt, I
0.1
0.01
0.0 0.5 1.0 1.5
TJ=75 oC
TJ=25 oC
Forward Voltage Drop, VF[V]
Figure 1. Typical Forward Volta ge C haracteristics
(per diode)
700 600
500 400
[pF]
J
300
200
TJ=25 oC
100
10
[mA]
R
1
0.1
0.01
Reverse Current, I
1E-3
0 10203040
TJ=150 oC
TJ=125 oC
TJ=75 oC
TJ=25 oC
Reverse Voltage, VR[V]
Figure 2. Typical Reverse Current
vs. Reverse Voltage (p er diode)
10
C/W]
o
1
Juntion Capacitance, C
100
90 80
0 10203040
Reverse Voltage, VR[V]
Figure 3. Typical Junction Capacitance
(per diode)
12
[A]
10
F(AV)
8
6
4
2
Average Forward Current, I
0
0 20 40 60 80 100 120 140 160
Case Temperature, TC[oC]
DC
Figure 5. Forward Current Derating Curve
Transient Thermal Impedance [
100µ 1m 10m 100m 1 10
Pulse Duration [s]
Figure 4. Thermal Impedance Characte rist ics
(per diode)
100
[A]
80
FSM
60
40
20
Max. Forward Su rge Cu rren t, I
0
1 10 100
Number of Cycles @ 60Hz
Figure 6. Non-Repetitive Surge Current
(per diode)
©2002 Fairchild Semiconductor Corporation Rev. A, September 2002
Page 3
Package Dimensions
±0.10
(1.70)
1.30
±0.20
9.20 (1.46)
±0.20
(1.00)
1.27
13.08
±0.10
9.90 (8.70)
ø3.60
TO-220
±0.20
±0.10
(45°)
1.52
(3.70)(3.00)
±0.10
±0.10
2.80
±0.20
15.90
18.95MAX.
±0.30
10.08
4.50
1.30
±0.20
+0.10 –0.05
FYP1045DN
2.54TYP
[2.54
±0.20
]
10.00
±0.20
0.80
2.54TYP
[2.54
±0.10
±0.20
+0.10
0.50
–0.05
2.40
±0.20
]
Dimensions in Millimeters
©2002 Fairchild Semiconductor Corporation Rev. A, September 2002
Page 4
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACEx™ ActiveArray™ Bottomless™ CoolFET™ CROSSVOLT™ DOME™ EcoSPARK™
2
CMOS™
E EnSigna™
FACT™ FACT Quiet series™
®
FAST FASTr™ FRFET™ GlobalOptoisolator™ GTO™ HiSeC™
2
C™
I Across the board. Around the world.™ The Power Franchise™ Programmable Active Droop™
ImpliedDisconnect™ ISOPLANAR™ LittleFET™ MicroFET™ MicroPak™ MICROWIRE™ MSX™ MSXPro™ OCX™ OCXPro™ OPTOLOGIC
®
OPTOPLANAR™
PACMAN™ POP™ Power247™ PowerTrench
®
QFET™ QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ RapidConnect™ SILENT SWITCHER SMART START™
SPM™ Stealth™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic™ TruTranslation™ UHC™ UltraFET
®
VCX™
®
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative or In
Design
Preliminary First Production This datasheet contains preliminary data, and
No Identification Needed Full Production This datasheet contains final specifications. Fairchild
Obsolete Not In Production This datasheet contains specifications on a product
©2002 Fairchild Semiconductor Corporation Rev. I1
This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.
supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Semiconductor reserves the right to make changes at any time without notice in order to improve design.
that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
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