
FYD0504SA/FYD0504SATM
Schottky Barrier Rectifier
Features
• Low forward voltage drop
• High frequency properties and switching speed
• Guard ring for over-voltage protection
• “TM” is a packing option
Applications
• Switched mode power supply
• Freewheeling diodes
FYD0504SA/FYD0504SATM — Schottky Barrier Rectifier
October 2008
2. 4. Cathode
4
D-PAK
1 2 3
Absolute Maximum Ratings* T
Symbol Parameter Ratings Units
V
RRM
V
R
I
F(AV)
I
FSM
T
J, TSTG
* These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
Maximum Repetitive Reverse Voltage 40 V
Maximum DC Reverse Voltage 40 V
Average Rectified Forward Current @ TC = 135°C 5 A
Non-repetitive Peak Surge Current
Operating Junction and Storage Temperature -65 to +150 °C
Thermal Characteristics T
Symbol Parameter Value Units
R
qJC
Maximum Thermal Resistance, Junction to Case 3.5 °C/W
= 25°C unless otherwise noted
a
60Hz Single Half-Sine Wave
=25°C unless otherwise noted
C
1. Anode 3. Anode
80 A
Electrical Characteristics T
Symbol Parameter Value Units
V
FM
*
I
RM
*
* Pulse Test: Pulse Width=300ms, Duty Cycle=2%
© 2007 Fairchild Semiconductor Corporation www.fairchildsemi.com
FYD0504SA/FYD0504SATM Rev. 1.0.0 1
Maximum Instantaneous Forward Voltage
Maximum Instantaneous Reverse Current
=25 °C unless otherwise noted
C
IF = 5A
IF = 5A
IF = 10A
IF = 10A
@ rated VR TC = 25 °C
TC = 25 °C
TC = 125 °C
TC = 25 °C
TC = 125 °C
TC = 125 °C
0.55
V
0.49
0.67
0.65
mA
1
40

Typical Characteristics
FYD0504SA/FYD0504SATM — Schottky Barrier Rectifier
10
[A]
F
1
TJ=125 oC
Forward Current, I
0.1
0.01
0.0 0.5 1.0 1.5
TJ=75 oC
TJ=25 oC
Forward Voltage Drop, VF[V]
Figure 1. Typical Forward Voltage Characteristics
700
600
500
[pF]
400
J
300
200
TJ=25 oC
100
10
[mA]
R
1
0.1
0.01
Reverse Current, I
0.001
0 10 20 30 40
TJ=150 oC
TJ=125 oC
TJ=75 oC
TJ=25 oC
Reverse Voltage, VR[V]
Figure 2. Typical Reverse Current
vs. Reverse Voltage
10
C/W]
o
1
Junction Capacitance, C
100
90
80
0 10 20 30 40
Reverse Voltage, VR[V]
Figure 3. Typical Junction Capacitance
6
[A]
5
F(AV)
4
3
2
Square Wave
1
Duty Cycle=0.5
Average Forward Current, I
0
0 20 40 60 80 100 120 140 160
Case Temperature, TC[oC]
Figure 5. Forward Current Derating Curve
Transient Thermal Impedance [
100
1m 10m 100m 1 10
Pulse Duration [s]
Figure 4. Thermal Impedance Characteristics
100
[A]
80
FSM
60
40
20
Max. Forward Surge Current, I
0
1 10 100
Number of Cycles @ 60Hz
Figure 6. Non-Repetive Sureg Current
© 2007 Fairchild Semiconductor Corporation www.fairchildsemi.com
FYD0504SA/FYD0504SATM Rev. 1.0.0 2

Package Dimensions
FYD0504SA/FYD0504SATM — Schottky Barrier Rectifier
D-PAK
Dimensions in Millimeters
© 2007 Fairchild Semiconductor Corporation www.fairchildsemi.com
FYD0504SA/FYD0504SATM Rev. 1.0.0 3

TRADEMARKS
The following are registered and unregistered trademarks and service marks Fairchild Semiconductor owns or is authorized to use and
is not intended to be an exhaustive list of all such trademarks.
®
ACEx
Build it Now™
CorePLUS™
CROSSVOLT™
CTL™
Current Transfer Logic™
EcoSPARK
Fairchild
®
®
Fairchild Semiconductor
FACT Quiet Series™
®
FACT
®
FAST
FastvCore™
FPS™
®
FRFET
Global Power Resource
Green FPS™
Green FPS™ e-Series™
GTO™
i-Lo™
IntelliMAX™
ISOPLANAR™
MegaBuck™
MICROCOUPLER™
®
MicroFET™
MicroPak™
MillerDrive™
Motion-SPM™
OPTOLOGIC
OPTOPLANAR
®
SM
PDP-SPM™
Power220
®
®
®
Power247
POWEREDGE
Power-SPM™
PowerTrench
Programmable Active Droop™
QFET
QS™
QT Optoelectronics™
Quiet Series™
RapidConfigure™
SMART START™
SPM
STEALTH™
SuperFET™
SuperSOT™-3
SuperSOT™-6
®
®
®
®
SuperSOT™-8
SyncFET™
The Power Franchise
TinyBoost™
TinyBuck™
TinyLogic
®
®
TINYOPTO™
TinyPower™
®
TinyPWM™
TinyWire™
µSerDes™
®
UHC
UniFET™
VCX™
FYD0504SA/FYD0504SATM Schottky Barrier RectifierFYD0504SA/FYD0504SATM
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS
HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF
THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE
UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF
FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE
PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and (c) whose failure to perform
when properly used in accordance with instructions for use
2. A critical component is any component of a life support
device or system whose failure to perform can be reasonably
expected to cause the failure of the life support device or
system, or to affect its safety or effectiveness.
provided in the labeling, can be reasonably expected to result
in significant injury to the user.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative or In Design
This datasheet contains the design specifications for product development.
Specifications may change in any manner without notice.
This datasheet contains preliminary data; supplementary data will be pub-
Preliminary First Production
lished at a later date. Fairchild Semiconductor reserves the right to make
changes at any time without notice to improve design.
No Identification Needed Full Production
This datasheet contains final specifications. Fairchild Semiconductor reserves
the right to make changes at any time without notice to improve design.
This datasheet contains specifications on a product that has been discontin-
Obsolete Not In Production
ued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. I31
© 2008 Fairchild Semiconductor Corporation www.fairchildsemi.com
FYD0504SA/FYD0504SATM Rev. A1 4