The FSL117MRIN is an integrated Pulse Width
Modulation (PWM) controller and 700V SenseFET
specifically designed for offline Switched-Mode Power
Supplies (SMPS) with minimal external components.
The PWM controller includes an integrated fixedfrequency oscillator, Line Over-Voltage Protection
(LOVP), Under-Voltage Lockout (UVLO), Leading-Edge
Blanking (LEB), optimized gate driver, internal soft-start,
temperature-compensated precise current sources for
loop compensation, and self-protection circuitry.
Compared with a discrete MOSFET and PWM controller
solution, the FSL117MRIN can reduce total cost,
component count, size, and weight; while
simultaneously increasing efficiency, productivity, and
system reliability. This device provides a basic platform
for cost-effective design of a flyback converter.
FSL117MRIN — Green-Mode Fairchild Power Switch (FPS™)
Figure 3. Pin Assignments (Top View)
Pin Definitions
Pin # Name Description
1 GND
2 V
3 FB
4 V
5 V
6
7
Drain
8
Ground. This pin is the control ground and the SenseFET source.
Power Supply. This pin is the positive supply input, which provides the internal operating
CC
current for both startup and steady-state operation.
Feedback. This pin is internally connected to the inverting input of the PWM comparator.
The collector of an opto-coupler is typically tied to this pin. For stable operation, a capacitor
should be placed between this pin and GND. If the voltage of this pin reaches 7V, the
overload protection triggers, which shuts down the FPS.
Line Over-Voltage Input. This pin is the input pin of line voltage. The voltage, which is
divided by resistors, is input of this pin. If this pin voltage higher than V
IN
triggers, which shuts down the FPS Do not leave this pin floating. If LOVP is not used, this pin
should be connected directly to the GND.
Startup. This pin is connected directly, or through a resistor, to the high-voltage DC link.
At startup, the internal high-voltage current source supplies internal bias and charges the
STR
external capacitor connected to the V
source (I
SenseFET Drain. High-voltage power SenseFET drain connection.
FSL117MRIN — Green-Mode Fairchild Power Switch (FPS™)
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol Parameter Min. Max. Unit
V
V
STR
V
Drain Pin Voltage 700 V
DS
V
V
CC
V
Feedback Pin Voltage -0.3 10.0 V
FB
VIN VIN Pin Voltage -0.3 10.0 V
I
Drain Current Pulsed
DM
EAS Single Pulsed Avalanche Energy
PD
T
J
T
Storage Temperature -55 +150
STG
ESD
Notes:
5. Non-repetitive rating: pulse width is limited by maximum junction temperature.
6. L=51mH, starting TJ=25C.
7. Infinite cooling condition (refer to the SEMI G30-88).
8. Although this parameter guarantees IC operation, it does not guarantee all electrical characteristics.
Pin Voltage 700 V
STR
Pin Voltage 26 V
CC
(5)
4 A
(6)
50 mJ
Total Power Dissipation (T
=25C)
C
(7)
1.5 W
Maximum Junction Temperature +150
Operating Junction Temperature
Electrostatic
Discharge Capability
Human Body Model, JESD22-A114 5
Charged Device Model, JESD22-C101 2
(8)
-40
+125
C
C
C
kV
Thermal Impedance
TA=25°C unless otherwise specified. All items are tested with the standards JESD 51-2 and 51-10.
Symbol Parameter Value Unit
JA Junction-to-Ambient Thermal Impedance
JC Junction-to-Case Thermal Impedance
Notes:
9. Free standing without heat sink; without copper clad. (Measurement condition: Just before junction temperature
TJ enter into OTP.)
10. Measured on the DRAIN pin close to plastic interface.
1. Startup: At startup, an internal high-voltage current
source supplies the internal bias and charges the
external capacitor (C
illustrated in Figure 18. When V
FSL117MRIN begins switching and the internal highvoltage current source is disabled. Normal switching
operation continues and the power is supplied from the
auxiliary transformer winding unless VCC goes below the
stop voltage of 7.5V.
Figure 18. Startup Block
2. Soft-Start: The internal soft-start circuit increases the
PWM comparator inverting input voltage, together with
the SenseFET current, slowly after startup. The typical
soft-start time is 15ms. The pulse width to the power
switching device is progressively increased to establish
the correct working conditions for transformers,
inductors, and capacitors. The voltage on the output
capacitors is progressively increased to smoothly
establish the required output voltage. This helps prevent
transformer saturation and reduces stress on the
secondary diode during startup.
) connected to the VCC pin, as
Vcc
reaches 12V, the
CC
3. Feedback Control: This device employs current-
mode control, as shown in Figure 19. An opto-coupler
(such as the FOD817) and shunt regulator (such as the
KA431) are typically used to implement the feedback
network. Comparing the feedback voltage with the
voltage across the R
resistor makes it possible to
SENSE
control the switching duty cycle. When the reference pin
voltage of the shunt regulator exceeds the internal
reference voltage of 2.5V, the opto-coupler LED current
increases, pulling down the feedback voltage and
reducing drain current. This typically occurs when the
input voltage is increased or the output load is decreased.
3.1 Pulse-by-Pulse Current Limit: Because current-
mode control is employed, the peak current through
the SenseFET is limited by the inverting input of the
PWM comparator (V
*), as shown in Figure 19.
FB
Assuming that the 90A current source flows only
through the internal resistor (3R + R = 27k), the
cathode voltage of diode D2 is about 2.5V. Since D1
is blocked when the feedback voltage (VFB) exceeds
2.5V, the maximum voltage of the cathode of D2 is
clamped at this voltage. Therefore, the peak value of
the current through the SenseFET is limited.
3.2 Leading-Edge Blanking (LEB): At the instant the
internal SenseFET is turned on, a high-current spike
usually occurs through the SenseFET, caused by
primary-side capacitance and secondary-side rectifier
reverse recovery. Excessive voltage across the R
SENSE
resistor leads to incorrect feedback operation in the
current-mode PWM control. To counter this effect, the
FSL117MRIN employs a leading-edge blanking (LEB)
circuit. This circuit inhibits the PWM comparator for
t
(300ns) after the SenseFET is turned on.
LEB
FSL117MRIN — Green-Mode Fairchild Power Switch (FPS™)
4. Protection Circuits: The FSL117MRIN has several
self-protective functions, such as Overload Protection
(OLP), Abnormal Over-Current Protection (AOCP),
Output-Short Protection (OSP), Over-Voltage Protection
(OVP), and Thermal Shutdown (TSD). All the
protections are implemented as auto-restart. Once a
fault condition is detected, switching is terminated and
the SenseFET remains off. This causes VCC to fall.
When V
B
B falls to the Under-Voltage Lockout (UVLO)
CC
stop voltage of 7.5V, the protection is reset and the
startup circuit charges the VCC capacitor. When VCC
reaches the start voltage of 12.0V, the FSL117MRIN
resumes normal operation. If the fault condition is not
removed, the SenseFET remains off and V
drops to
CC
stop voltage again. In this manner, the auto-restart can
alternately enable and disable the switching of the
power SenseFET until the fault condition is eliminated.
Because these protection circuits are fully integrated
into the IC without external components, the reliability is
improved without increasing cost.
blocked and the 2.0µA current source starts to charge
CFB slowly up. In this condition, VFB continues
increasing until it reaches 7.0V, when the switching
operation is terminated, as shown in Figure 21. The
delay for shutdown is the time required to charge C
FB
from 2.5V to 7.0V with 2.0µA. A 25 ~ 50ms delay is
typical for most applications. This protection is
implemented as Auto-Restart Mode.
FSL117MRIN — Green-Mode Fairchild Power Switch (FPS™)
Figure 20. Auto-Restart Protection Waveforms
4.1 Overload Protection (OLP): Overload is defined
as the load current exceeding its normal level due to
an unexpected abnormal event. In this situation, the
protection circuit should trigger to protect the SMPS.
However, even when the SMPS is in normal
operation, the overload protection circuit can be
triggered during load transition. To avoid this
undesired operation, the overload protection circuit is
designed to trigger only after a specified time to
determine whether it is a transient situation or a true
overload situation. Because of the pulse-by-pulse
current-limit capability, the maximum peak current
through the SenseFET is limited and, therefore, the
maximum input power is restricted with a given input
voltage. If the output consumes more than this
maximum power, the output voltage (V
) decreases
OUT
below the set voltage. This reduces the current
through the opto-coupler LED, which also reduces the
opto-coupler transistor current, thus increasing the
feedback voltage (VFB). If VFB exceeds 2.5V, D1 is
Figure 21. Overload Protection
4.2 Abnormal Over-Current Protection (AOCP):
When the secondary rectifier diodes or the
transformer pins are shorted, a steep current with
extremely high di/dt can flow through the SenseFET
during the minimum turn-on time. Overload protection
is not enough to protect the FSL117MRIN in that
abnormal case; since severe current stress is
imposed on the SenseFET until OLP is triggered. The
internal AOCP circuit is shown in Figure 22. When the
gate turn-on signal is applied to the power SenseFET,
the AOCP block is enabled and monitors the current
through the sensing-resistor. The voltage across the
resistor is compared with a preset AOCP level. If the
sensing resistor voltage is greater than the AOCP
level, the set signal is applied to the S-R latch,
resulting in the shutdown of the SMPS.
4.3. Output-Short Protection (OSP): If the output is
shorted, steep current with extremely high di/dt can
flow through the SenseFET during the minimum turnon time. Such a steep current creates high-voltage
stress on the drain of the SenseFET when turned off.
To protect the device from this abnormal condition,
OSP is included. It is comprised of detecting V
SenseFET turn-on time. When the V
is higher than
FB
FB
2.0V and the SenseFET turn-on time is lower than
1.0s, the FSL117MRIN recognizes this condition as
an abnormal error and shuts down PWM switching
until VCC reaches V
again. An abnormal condition
START
output short is shown in Figure 23.
and
4.6 Line Over-Voltage Protection (LOVP): If the line
input voltage is increased until unwanted level, high
line input voltage brings high-voltage stress on the
entire system. To protect from this abnormal
condition, LOVP is included. It is comprised of
detecting V
using divided resistors. When VIN is
IN
higher than 1.95V, this condition is recognized as an
abnormal error and PWM switching shuts down until
decreases to around 1.89V (60mV hysteresis).
V
IN
FSL117MRIN — Green-Mode Fairchild Power Switch (FPS™)
Figure 23. Output-Short Protection
4.4 Over-Voltage Protection (OVP): If the
secondary-side feedback circuit malfunctions or a
solder defect causes an opening in the feedback path,
the current through the opto-coupler transistor
becomes almost zero. Then VFB climbs up in a similar
manner to the overload situation, forcing the preset
maximum current to be supplied to the SMPS until the
overload protection is triggered. Because more
energy than required is provided to the output, the
output voltage may exceed the rated voltage before
the overload protection is triggered, resulting in the
breakdown of the devices in the secondary side. To
prevent this situation, an OVP circuit is employed. In
general, the V
and the FSL117MRIN uses V
monitoring the output voltage. If V
an OVP circuit is triggered, resulting in the termination
of the switching operation. To avoid undesired
activation of OVP during normal operation, V
be designed to be below 24.5V.
4.5 Thermal Shutdown (TSD): The SenseFET and
the control IC on a die in one package makes it easier
for the control IC to detect the temperature of the
SenseFET. If the temperature exceeds ~140C, the
thermal shutdown is triggered and stops operation.
The FSL117MRIN operates in auto-restart mode until
the temperature decreases to around 75C, when
normal operation resumes.
is proportional to the output voltage
CC
instead of directly
CC
exceeds 24.5V,
CC
should
CC
Figure 24. Line Over-Voltage Protection
5. Soft Burst Mode: To minimize power dissipation in
Standby Mode, the FSL117MRIN enters Burst Mode.
As the load decreases, the feedback voltage
decreases. The device automatically enters Burst
Mode when the feedback voltage drops below V
BURL
(300mV), as shown in Figure 25. At this point,
switching stops and the output voltages start to drop
at a rate dependent on standby current load. This
causes the feedback voltage to rise. Once it passes
V
(450mV), switching resumes. Feedback voltage
BURH
then falls and the process repeats. Burst Mode
alternately enables and disables switching of the
SenseFET, reducing switching loss in Standby Mode.
Fluctuating switching frequency of an SMPS can
reduce EMI by spreading the energy over a wide
frequency range. The amount of EMI reduction is
directly related to the switching frequency variation,
which is limited internally. The switching frequency is
determined randomly by external feedback voltage
and an internal free-running oscillator at every
switching instant. This random frequency fluctuation
scatters the EMI noise around typical switching
frequency (67kHz) effectively and can reduce the cost
of the input filter included to meet the EMI
requirements (e.g. EN55022).
Figure 26. Random Frequency Fluctuation
FSL117MRIN — Green-Mode Fairchild Power Switch (FPS™)
FSL117MRIN — Green-Mode Fairchild Power Switch (FPS™)
9.83
9.00
6.67
6.096
8.255
7.61
3.60
3.00
3.683
3.20
0.356
0.20
5.08 MAX
0.33 MIN
(0.56)
2.54
0.56
0.355
1.65
1.27
7.62
NOTES: UNLESS OTHERWISE SPECIFIED
A) THIS PACKAGE CONFORMS TO
JEDEC MS-001 VARIATION BA
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS ARE EXCLUSIVE OF BURRS,
MOLD FLASH, AND TIE BAR EXTRUSIONS.
D) DIMENSIONS AND TOLERANC
ES PER
ASME Y14.5M-1994
E) DRAWING FILENAME AND REVSION: MKT-N08FREV2.
7.62
9.957
7.87
Figure 27. 8-Lead, Dual Inline Package, 8DIP.
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: