Datasheet FPBL15SH60 Datasheet (Fairchild Semiconductor)

Page 1
FPBL15SH60
Smart Power Module (SPM)
General Description
FPBL15SH60 is an advanced smart power module (SPM) that Fairchild has newly developed and designed to provide very compact and low cost, yet high performance ac motor drives mainly targeting high speed low-power inverter­driven application like washing machines. It combines optimized circuit protection and drive matched to low-loss IGBTs. Highly effective short-circuit current detection/ protection is realized through the use of advanced current sensing IGBT chips that allow continuous monitoring of the IGBTs current. System reliability is further enhanced by the integrated under-voltage lock-out protection. The high speed built-in HVIC provides opto-coupler-less IGBT gate driving capability that further reduce the overall size of the inverter system design. In addition the incorporated HVIC facilitates the use of single-supply drive topology enabling the FPBL15SH60 to be driven by only one drive supply voltage without negative bias.
FPBL15SH60
Features
• UL Certified No. E209204
• 600V-15A 3-phase IGBT inverter bridge including control ICs for gate driving and protection
• Single-grounded power supply due to built-in HVIC
• Typical switching frequency of 15kHz
• Inverter power rating of 0.75kW / 100~253 Vac
• Isolation rating of 2500Vrms/min.
• Very low leakage current due to using ceramic substrate
• Adjustable current protection level by varying series resistor value with sense-IGBTs
Applications
• AC 100V ~ 253V three-phase inverter drive for small power (0.75kW) ac motor drives
• Home appliances applications requiring high switching frequency operation like washing machines drive system
• Application ratings:
- Power : 0.75kW / 100~253 Vac
- Switching frequency : Typical 15kHz (PWM Control)
- 100% load current : 5A (Irms)
- 150% load current : 7.5A (Irms)
External View and Marking Information
Top View Bottom View
57 mm
55 mm
Device Name
Version, Lot Code
Marking
Fig. 1.
©2002 Fairchild Semiconductor Corporation
Rev. C, February 2002
Page 2
Integrated Power Functions
• 600V-15A IGBT inverter for three-phase DC/AC power conversion (Please refer to Fig. 3)
Integrated Drive, Protection and System Control Functions
• For inverter high-side IGBTs: Gate drive circuit, High voltage isolated high-speed level shifting
• For inverter low-side IGBTs: Gate drive circuit, Short circuit protection (SC)
• Fault signaling: Corresponding to a SC fault (Low-side IGBTs) or a UV fault (Low-side supply)
• Input interface: 5V CMOS/LSTTL compatible, Schmitt trigger input
Control circuit under-voltage (UV) protection Note) Available bootstrap circuit example is given in Figs. 10, 15 and 16.
Control supply circuit under-voltage (UV) protection
Pin Configuration
Top View
V
S(U)
V
B(U)
V
CC(UH)
IN
V
COM
IN IN
IN
C
CC(L)
(UL) (VL)
(WL)
V
FOD
C
R
NC NC
NC
(L)
FO
SC
SC
(UH)
V
S(V)
V
B(V)
V
CC(VH)
IN
(VH)
COM
V
S(W)
V
B(W)
V
CC(WH)
IN
(WH)
FPBL15SH60
(H)
WVUNP
Fig. 2.
Pin Descriptions
Pin Number Pin Name Pin Description
1V
CC(L)
2COM 3IN 4IN 5IN 6V 7C 8C
9R 10 NC No Connection 11 NC No Connection 12 NC No Connection 13 W Output Terminal for W Phase 14 V Output Terminal for V Phase 15 U Output Terminal for U Phase 16 N Negative DC–Link Input
©2002 Fairchild Semiconductor Corporation
(UL) (VL)
(WL)
FO
FOD
SC SC
Low-side Common Bias Voltage for IC and IGBTs Driving Low-side Common Supply Ground
(L)
Signal Input Terminal for Low-side U Phase Signal Input T erminal for Low-side V Phase Signal Input T erminal for Low-side W Phase Fault Output Terminal Capacitor for Fault Output Duration Time Selection Capacitor (Low-pass Filter) for Short-current Detection Input
Resistor for Short-circuit Current Detection
Rev. C, February 2002
Page 3
Pin Descriptions (Continued)
Pin Number Pin Name Pin Description
17 P Positive DC–Link Input 18 IN 19 V 20 V 21 V
(WH)
CC(WH)
B(W) S(W)
22 COM 23 IN 24 V 25 V 26 V
CC(VH)
B(V) S(V)
27 IN 28 V 29 V 30 V
CC(UH)
B(U) S(U)
(VH)
(UH)
Signal Input Terminal for High-side W Phase High-side Bias Voltage for W Phase IC High-side Bias Voltage for W Phase IGBT Driving High-side Bias Voltage Ground for W Phase IGBT Driving High-side Common Supply Ground
(H)
Signal Input Terminal for High-side V Phase High-side Bias Voltage for V Phase IC High-side Bias Voltage for V Phase IGBT Driving High-side Bias Voltage Ground for V Phase IGBT Driving Signal Input Terminal for High-side U Phase High-side Bias Voltage for U Phase IC High-side Bias Voltage for U Phase IGBT Driving High-side Bias Voltage Ground for U Phase IGBT Driving
Internal Equivalent Circuit and Input/Output Pins
(1) V
(2) COM
(3) IN
(4) IN
(5) IN
(6) V
FO
(7) C
FOD
(8) C
SC
(9) R
SC
(10) NC (11) NC (12) NC
CC(L)
(L)
(UL)
(VL)
(WL)
V
CC
COM
IN
(UL)
IN
(VL)
IN
(WL)
V
(FO)
C
(FOD)
C
(SC)
(L)
Uout
Vout
Wout
VB HO VS
VB HO VS
VB HO VS
Vcc
COM
Vcc
COM
Vcc
COM
FPBL15SH60
(29) V
B(U)
(28) V
CC(UH)
IN
IN
IN
(27) IN
(UH)
(30) V
S(U)
(25) V
B(V)
(24) V
CC(VH)
(23) IN
(VH)
(22) COM (26) V
S(V)
(20) V
B(W)
(19) V
CC(WH)
(18) IN
(WH)
(21) V
S(W)
(H)
WVUN
(13)
Note
1. Inverter low-side ( (1) - (12) pins) is composed of three sense-IGBTs including freewheeling diodes for each IGBT and one control IC which has gate driving, current sensing and protection functions.
2. Inverter power side ( (13) - (17) pins) is composed of two inverter dc-link input terminals and three inverter output terminals.
3. Inverter high-side ( (18) - (30) pins) is composed of three normal-IGBTs including freewheeling diodes and three drive ICs for each IGBT.
(14) (15) (16)
P
(17)
Fig. 3.
©2002 Fairchild Semiconductor Corporation
Rev. C, February 2002
Page 4
Absolute Maximum Ratings
Inverter Part
Supply Voltage V Supply Voltage (Surge) V Collector-Emitter Voltage V Each IGBT Collector Current ± I Each IGBT Collector Current (Peak) ± I Collector Dissipation P Operating Junction Temperature T
Note
1. It would be recommended that the average junction temperature should be limited to TJ ≤ 125°C (@TC ≤ 100°C) in order to guarantee safe operation.
(TC = 25°C, Unless Otherwise Specified)
Item Symbol Condition Rating Unit
DC
PN(Surge)
CES
Applied to DC - Link 450 V Applied between P- N 500 V
600 V
TC = 25°C (Note Fig. 4) 15 A
C
TC = 25°C (Note Fig. 4) 30 A
CP
TC = 25°C per One Chip 47 W
C
(Note 1) -55 ~ 150 °C
J
FPBL15SH60
Control Part
(TC = 25°C, Unless Otherwise Specified)
Item Symbol Condition Rating Unit
Control Supply Voltage V High-side Control Bias Voltage V
Applied between V
CC
Applied between V
BS
V
Input Signal Voltage V
Applied between IN
IN
IN Fault Output Supply Voltage V Fault Output Current I Current Sensing Input Voltage V
Applied between VFO - COM
FO
Sink Current at VFO Pin 5 mA
FO
Applied between CSC - COM
SC
Total System
Item Symbol Condition Rating Unit
Self Protection Supply Voltage Limit (Short Circuit Protection Capability)
Module Case Operation Temperature T Storage T emperature T Isolation Voltage V
V
DC(PROT)
S(W)
(UL)
STG
ISO
, IN
(VL)
, IN
(WL)
CC(H)
- V
B(U)
(UH)
- COM
- COM
, IN
S(U)
(VH)
(L)
, V
(WH)
CC(L)
- V
- COM
- COM
S(V)
, V
B(W)
(H)
(L)
-
-0.3~VCC+0.5 V
-0.3~VCC+0.5 V
(H)
, V
B(V)
, IN
(L)
(L)
Applied to DC - Link,
= VBS = 13.5 ~ 16.5V
V
CC
T
= 125°C, Non-repetitive, less than 6µs
J
Note Fig. 4 -20 ~ 100 °C
C
-55 ~ 150 °C
60Hz, Sinusoidal, AC 1 minute, Connection
2500 V
Pins to Heat- sink Plate
18 V 20 V
-0.3 ~ 6.0 V
400 V
rms
©2002 Fairchild Semiconductor Corporation
Rev. C, February 2002
Page 5
V
COM
IN IN
IN
C
CC(L)
(UL) (VL)
(WL)
V
FOD
C
R
NC NC
NC
FPBL15SH60
Case Temperature (TC) Detecting Point
V
S(U)
V
B(U)
V
CC(UH)
IN
(L)
FO
SC
SC
WVUNP
Fig. 4. Tc Measurement Point
(UH)
V
S(V)
V
B(V)
V
CC(VH)
IN
(VH)
COM
V
S(W)
V
B(W)
V
CC(WH)
IN
(WH)
(H)
Ceramic Substate
©2002 Fairchild Semiconductor Corporation
Rev. C, February 2002
Page 6
Absolute Maximum Ratings
Thermal Resistance
Item Symbol Condition Min. Typ. Max. Unit
Junction to Case Thermal
R
th(j-c)Q
Resistance
R
Contact Thermal
R
Resistance
Note
2. For the measurement point of case temperature (Tc), please refer to Fig. 4.
Each IGBT under Inverter Operating Condition (Note 2)
Each FWDi under Inverter Operating Condition
th(j-c)F
(Note 2) Ceramic Substrate (per 1 Module)
th(c-f)
Thermal Grease Applied
Electrical Characteristics
Inverter Part
Collector - Emitter Saturation Voltage
FWDi Forward Voltage V
Switching Times t
Collector - Emitter Leakage Current
(Tj = 25°C, Unless Otherwise Specified)
Item Symbol Condition Min. Typ. Max. Unit
V
CE(SAT)VCC
FM
ON
t
C(ON)
t
OFF
t
C(OFF)
t
rr
I
CES
= VBS = 15V
V
= 0V
IN
VIN = 5V IC = 15A, Tj = 25°C - - 2.3 V
VPN = 300V, VCC = VBS = 15V I
= 15A, Tj = 25°C
C
= 5V 0V, Inductive Load
V
IN
(High-Low Side) (Note 3)
VCE = V
, Tj = 25°C - - 250 µA
CES
- - 2.61 °C/W
- - 3.73 °C/W
- - 0.06 °C/W
= 15A, Tj = 25°C - - 2.8 V
I
C
= 15A, Tj = 125°C - - 2.9 V
I
C
= 15A, Tj = 125°C - - 2.1 V
I
C
-0.39-µs
-0.12-µs
-0.53-µs
-0.16-µs
-0.1-µs
FPBL15SH60
Note
3. tON and t internally. For the detailed information, please see Fig. 5.
include the propagation delay time of th e internal drive IC. t
OFF
C(ON)
and t
are the switching time o f IGBT itself u nder the given gate drivin g condition
C(OFF)
©2002 Fairchild Semiconductor Corporation
Rev. C, February 2002
Page 7
V
V
IN(ON)
IN(ON)
FPBL15SH60
100% I
100% I
C
t
t
rr
rr
V
V
CE
CE
V
V
IN
IN
t
t
ON
ON
10% I
10% I
(a) Turn-on
(a) Turn-on (b) Turn-off
C
I
I
C
C
t
t
C(ON)
C(ON)
90% I
90% I
C
C
10% V
10% V
C
C
CE
CE
Fig 5. Switching Time Definition
V
V
IN(OFF)
IN(OFF)
V
V
IN
IN
t
t
I
I
C
C
OFF
OFF
10% VCE10% I
10% VCE10% I
(b) Turn-off
t
t
C(OFF)
C(OFF)
V
V
CE
CE
C
C
VCE: 100V/div.
VCE: 100V/div.
time : 100ns/div.
time : 100ns/div.
(a) Turn-on
(a) Turn-on
: 5A/div.
: 5A/div.
I
I
C
C
IC: 5A/div.
IC: 5A/div.
time : 100ns/div.
time : 100ns/div.
(b) Turn-off
(b) Turn-off
Fig. 6. Experimental Results of Switching Waveforms
Test Condition: Vdc=300V, Vcc=15V, L=500uH (Inductive Load), T
VCE: 100V/div.
VCE: 100V/div.
=25°°°°C
C
©2002 Fairchild Semiconductor Corporation
Rev. C, February 2002
Page 8
Electrical Characteristics
Control Part
Control Supply Voltage V High-Side Bias Voltage V
Quiescent V Current
Quiescent V Current
Fault Output Voltage V
PWM Input Frequency f Allowable Input Signal
Blanking Time Considering Leg Arm-Short
Short Circuit Trip Level V Sensing Voltage
of IGBT Current Supply Circuit Under-
Voltage Protection
Fault-Out Pulse Width t
ON Threshold Voltage V OFF Threshold Voltage V ON Threshold Voltage V OFF Threshold Voltage V
Note
4. Short-circuit current protection is functioning only at the low-sides. It would be recommended that the value of the external sensing resistor (RSC) should be selected around 56 in order to make the SC trip-level of about 20A. Please refer to Fig. 7 which shows the current sensing characteristics according to sensing resistor RSC.
5. The fault-out pulse width t
(Tj = 25°C, Unless Otherwise Specified)
Item Symbol Condition Min. Typ. Max. Unit
Supply
CC
Supply
BS
Applied between V
CC
Applied between V
BS
V
- V
B(W)
I
QCCLVCC
I
QCCHVCC
I
QBSVBS
FOHVSC
V
FOLVSC
PWMTC
t
dead
SC(ref)TJ
V
SEN
UV
CCDTJ
UV
CCR
UV
BSD
UV
BSR
FODVCC
IN(ON)
IN(OFF)
IN(ON)
IN(OFF)
depends on the capacitance value of C
FOD
= 15V
IN
(UL, VL, WL)
= 15V
IN
(UH, VH, WH)
= 15V
IN
(UH, VH, WH)
= 0V, VFO Circuit: 4.7k to 5V Pull-up 4.5 - - V = 1V, VFO Circuit: 4.7k to 5V Pull-up - - 1.1 V
100°C, TJ 125°C - 15 - kHz
-20°C TC 100°C 1.5 - - us
= 25°, VCC = 15V (Note 4) 0.45 0.51 0.56 V
-20°C TC 100°C, @ RSC = 82 and I
= 15A (Note Fig. 7)
C
125°C Detection Level 11.5 12 12.5 V
= 15V, C(sc) = 1V
= 33nF (Note 5)
C
FOD
High-Side Applied between IN
Low-Side Applied between IN
S(W)
CC(H),VCC(L) B(U)
= 5V
= 5V
= 5V
according to the following approximate equation : C
FOD
- COM 13.5 15 16.5 V
- V
, V
- V
S(U)
V
CC(L)
V
CC(U)
COM V
B(U)
V
B(W)
- COM
, V
(H)
- V
S(U)
- V
B(V)
CC(V)
S(W)
, V
,
S(V)
(L)
, V
-
CC(W)
-V
B(V)
S(V)
13.5 15 16.5 V
--26mA
- - 130 uA
,
- - 420 uA
0.37 0.45 0.56 V
Reset Level 12 12.5 13 V Detection Level 7.3 9.0 10.8 V Reset Level 8.6 10.3 12 V
1.4 1.8 2.0 ms
, IN
,
(UH)
(UL)
, IN
(VH)
(VL)
- COM
IN
(WH)
IN
(WL)
- COM
(H)
(L)
--0.8V
3.0 - - V
,
--0.8V
3.0 - - V
= 18.3 x 10-6 x t
FOD
FOD
[F]
FPBL15SH60
©2002 Fairchild Semiconductor Corporation
Rev. C, February 2002
Page 9
FPBL15SH60
90
80
70
[A]
SC
60
50
40
30
SC Trip Current I
20
10
10 20 30 40 50 60 70 80 90
Sensing Resistor RSC [Ω]
Fig. 7. Relationship between Sensing Resistor and SC Trip Current for Short-Circuit Protection (I
= 82 ×××× Rating Current(15A) / RSC)
SC
©2002 Fairchild Semiconductor Corporation
Rev. C, February 2002
Page 10
Mechanical Characteris ti cs and Ratings
FPBL15SH60
Item Condition
Mounting Torque Mounting Screw: M3
(Note 6 and 7)
Ceramic Flatness (Note Fig. 8) 0 - +100 um Weight -56-g
Recommended 10kg•cm 8 10 12 Kg•cm Recommended 0.98N•m 0.78 0. 98 1.17 N•m
Limits
Min. Typ. Max.
Units
Fig. 8. Flatness Measurement Position of The Ceramic Substrate
Note
6. Do not make over torque or mounting screws. Much mounting torque may cause ceramic cracks and bolts and Al heat-fin destruction.
7. Avoid one side tightening stress. Fig.9 shows the recommended torque order for mounting screws. Uneven mounting can cause the SPM ceramic substrate to
be damaged.
4
4
2222
1
1
3
3
Fig. 9. Mounting Screws Torque Order (1 →→→ 2 →→→→ 3 →→→→ 4)
2222
©2002 Fairchild Semiconductor Corporation
Rev. C, February 2002
Page 11
Recommended Operating Conditions
FPBL15SH60
Item Symbol Condition
Supply Voltage V Control Supply Voltage V
High-Side Bias Voltage V
Blanking Time for Preventing
t
PN CC
BS
dead
Applied between P - N - 300 400 V Applied between V
- COM
V
CC(L)
Applied between V V
- V
B(W)
S(W)
CC(H)
(L)
B(U)
For Each Input Signal 1.5 - - us
Arm-short PWM Input Signal f Input ON Threshold Voltage V Input OFF Threshold Voltage V
PWMTC
IN(ON)
IN(OFF)
100°C, TJ 125°C - 15 - kHz Applied between UIN,VIN, WIN - COM 0 ~ 0.65 V Applied between UIN,VIN, WIN - COM 4 ~ 5.5 V
ICs Internal Structure and Input/Output Conditions
D
BS
UV
DETECT
PULSE FILTER
HVIC
HVIC
HVICHVIC
15V Line
15V Line
15V Line15V Line
5V Line
5V Line
5V Line5V Line
R
C
R
BS
VCC
VCC
VCCVCC
(UH,VH,WH)
(UH,VH,WH)
(UH,VH,WH)(UH,VH,WH)
LEVEL
C
BP15
P
PH
IN
IN
ININ
(UH,VH,WH)
(UH,VH,WH)
(UH,VH,WH)(UH,VH,WH)
COM
COM
COMCOM
SHIFT
PULSE
GENERATOR
- COM
- V
S(U)
R R S Q
, V
(H)
B(V)
,
VS
VS
VSVS
- V
VB
VB
VBVB
(UH,VH,WH)
(UH,VH,WH)
(UH,VH,WH)(UH,VH,WH)
(UH,VH,WH)
(UH,VH,WH)
(UH,VH,WH)(UH,VH,WH)
S(V)
Value
Min. Typ. Max.
13.5 15 16.5 V
,
13.5 15 16.5 V
C
C
BSC
BS
Unit
PPPP
U,V,W
U,V,W
LVIC
LVIC
TIME
DELAY
LVICLVIC
BUFFER
SOFT_OFF CONTROL
SC
DETECTION
OUTPUT
(UL,VL,WL)
R
F
C
SC
R
VCC
VCC
VCCVCC
(L)
(L)
(L)(L)
5V Line
5V Line
5V Line5V Line
R
R
P
PF
IN
IN
ININ
(UL,VL,WL)
(UL,VL,WL)
(UL,VL,WL)(UL,VL,WL)
VVVV
FO
FO
FOFO
C
C
PF
PL
C
FOD
Note
1. One LVIC drives three Sense-IGBTs and can do short-circuit current protection also. Three sense emitters are commonly connected to RSC terminal to detect short-circuit current. Low-side part of the inverter consists of three sense-IGBTs
2. One HVIC drives one normal-IGBT. High-side part of the inverter consists of three normal-IGBTs
3. Each IC has under voltage detection and protection function.
4. The logic input is compatible with standard CMOS or LSTTL outputs.
5. RPCP coupling at each input/output is recommended in order to prevent the gating input/output signals oscillation and it should be as close as possible to each SPM gating input pin.
6. It would be recommended that the bootstrap diode, DBS, has soft and fast recovery characteristics.
CCCC
FOD
FOD
FODFOD
UV
DETECT
BANDGAP
REFERENCE
PULSE
GENERATOR
(HYSTERISIS)
FAULT OUTPUT
DURATION
TIME
DELAY
UV
LATCH_UP
UV
PROTECTION
SC
PROTECTION
SC
LATCH_UP
U,V,WU,V,W
NNNN
SC
Fig. 10.
©2002 Fairchild Semiconductor Corporation
Rev. C, February 2002
Page 12
Time Charts of SPMs Protective Function
Input Signal
FPBL15SH60
Internal IGBT
Gate-Emitter Voltage
Control Supply Voltage
Output Current
Fault Output Signal
P1 : Normal operation - IGBT ON and conducting current P2 : Under voltage detection P3 : IGBT gate interrupt P4 : Fault signal generation P5 : Under voltage reset P6 : Normal operation - IGBT ON and conducting current
Fig. 11. Under-Voltage Protection (Low-side)
Input Signal
UV
detect P1
P3
P2
P4
P5
UV
reset
P6
Internal IGBT
Gate-Emitter Voltage
Control Supply Voltage
V
BS
Output Current
Fault Output Signal
P1 : Normal operation - IGBT ON and conducting current P2 : Under voltage detection P3 : IGBT gate interrupt P4 : No fault signal P5 : Under voltage reset P6 : Normal operation - IGBT ON and conducting current
Fig. 12. Under-Voltage Protection (High-side)
©2002 Fairchild Semiconductor Corporation
UV
detect P1
P4
P3
P2
P5
UV
reset
P6
Rev. C, February 2002
Page 13
Input Signal
FPBL15SH60
P5
Internal IGBT
P6
Gate-Emitter Voltage
SC Detection
P1
P4
Output Current
P7
P2
SC Reference
Sensing Voltage
RC Filter Delay
Fault Output Signal
P1 : Normal operation - IGBT ON and conducting currents P2 : Short-circuit current detection P3 : IGBT gate interrupt / Fault signal generation P4 : IGBT is slowly turned off P5 : IGBT OFF signal P6 : IGBT ON signal - but IGBT cannot be turned on during the fault-output activation P7 : IGBT OFF sta te P8 : Fault-output reset and normal operation start
Voltage (0.5V)
P3
P8
Fig. 13. Short-circuit Current Protection (Low-side Operation only)
4.7k
100
100
CPU
100
1nF
Note
It would be recommended that by-pass capacitors for the gating input signals, IN for the fault output signal, VFO, as close as possible.
©2002 Fairchild Semiconductor Corporation
Fig. 14. Recommended CPU I/O Interface Circuit
5V-Line
FPBL15SH 60
4.7k
(XX)
4.7k
should be placed on the SPM pins and on the both sides of CPU and SPM
,,
IN
(UH)IN(VH)
,,
IN
(UL)IN(VL)
V
FO
1.2nF0.47nF1nF COM
IN
IN
(WH)
(WL)
Rev. C, February 2002
Page 14
1000uF
1000uF
One-leg Diagram of FPBL15SH60
15V-Line
15V-Line
20Ω
20Ω
220uF
220uF
0.1uF
0.1uF
0.1uF
0.1uF
One-leg Diagram of FPBL15SH60
Vcc
VB
Vcc
VB
IN
HO
IN
HO
COM
VS
COM
VS
Vcc
Vcc
IN
OUT
IN
OUT
COM
COM
Fig. 15. Recommended Bootstrap Operation Circuit and Parameters
P
P
Inverter
Inverter Output
Output
N
N
FPBL15SH60
©2002 Fairchild Semiconductor Corporation
Rev. C, February 2002
Page 15
FPBL15SH60
Gating UL
Gating VL
Gating WL
(1) V
(2) COM
(3) IN
(4) IN
(5) IN
(6) V
(7) C
(8) C
(9) R
(10) NC (11) NC
(12) NC
Fault
CC(L)
V
CC
(L)
COM
(L)
(UL)
(VL)
(WL)
FO
FOD
SC
SC
Uout
IN
(UL)
IN
(VL)
Vout
IN
(WL)
V
(FO)
Wout
C
(FOD)
C
(SC)
C
BPF
RSRSRSR
S
5V line
R
RPRPR
P
P
C
C
C
C
PL
PL
PL
PF
C
FOD
C
SC
R
F
R
SC
CPU
(13)
(14) (15) (16) (17) P
WV U N
Gating UH
Gating VH
Gating WH
R
RSR
S
S
RBSD
V
V
CC(UH)
Vcc
VB
IN
IN
HO
COM
VS
VB HO VS
VB HO VS
C
DCS
COM
COM
V
V
V
CC(VH)
Vcc
IN
IN
COM
V
V
V
CC(WH)
Vcc
IN
IN
V
BS
(29)
B(U)
(28) (27)
(UH)
C
C
(30)
BS
BSC
S(U)
(25)
B(V)
(24) (23)
(VH)
(22)
(H)
(26)
S(V)
(20)
B(W)
(19)
(18)
(WH)
(21)
S(W)
RBSD
BS
CBSC
BSC
RBSD
BS
CBSC
BSC
C
SPC15
15V line
5V line
RPR
R
P
P
CPHC
C
PH
PH
C
SP15
M
+-
Vdc
Note
1. RPCPL/RPCPH coupling at each SPM input is recommended in order to prevent input signals’ oscillation and it should be as close as possible to each SPM inp ut pin.
2. By virtue of integrating an application specific type HVIC inside the SPM, direct coupling to CPU terminals without any opto-coupler or transformer isolation is possible.
3. VFO output is open collector type. This signal line should be pulled up to the positive side of the 5V power supply with approximately 4.7k resistance. Please refer to Fig. 14.
4. C
of around 7 times larger than bootstrap capacitor CBS is recommended.
SP15
5. VFO output pulse width should be determined by connecting an external capacitor(C then tFO = 300 µs (typ.)) Please refer to the note 5 for calculation method.
6. Each input signal line should be pulled up to the 5V power supply with approximately 4.7k resistance (other RC coupling circuits at each input may be needed depending on the PWM control scheme used and on the wiring impedance of the system’s printed circuit board). Approximately a 0.22~2nF by-pass capacitor should be used across each power supply connection terminals.
7. To prevent errors of the protection function, the wiring around RSC, RF and CSC should be as short as possible.
8. In the short-circuit protection circui t, plea se select th e RFCSC time constant in the range 3~4 µs. RF should be at least 30 times larger than RSC. (Recommended Example: RSC = 56 Ω, RF = 3.9k and CSC = 1nF)
9. Each capacitor should be mounted as close to the pins of the SPM as possible.
10.To prevent surge destruction, the wiring between the smoothing capacitor and the P&N pins should be as short as possible. The use of a high frequency non­inductive capacitor of around 0.1~0.22 uF between the P&N pins is recommended.
11. Relays are used at almost every syste ms o f electr ical equ ipments of home app liances. In the s e cases, ther e should be suf fi cient distance b etw een the CPU a nd the relays. It is recommended that the distance be 5cm at least
) between C
FOD
(pin7) and COM
FOD
(pin2). (Example : if C
(L)
FOD
= 5.6 nF,
Fig. 16. Application Circuit
©2002 Fairchild Semiconductor Corporation
Rev. C, February 2002
Page 16
Detailed Package Outline Drawings
FPBL15SH60
©2002 Fairchild Semiconductor Corporation
Rev. C, February 2002
Page 17
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACEx™ Bottomless™ CoolFET™ CROSSVOLT™ DenseTrench™ DOME™ EcoSPARK™
2
CMOS™
E EnSigna™ FACT™ FACT Quiet Series™
STAR*POWER is used under license
®
FAST FASTr™ FRFET™ GlobalOptoisolator™ GTO™ HiSeC™ ISOPLANAR™ LittleFET™ MicroFET™ MicroPak™ MICROWIRE™
OPTOLOGIC™ OPTOPLANAR™ PACMAN™ POP™ Power247™ PowerTrench
®
QFET™ QS™ QT Optoelectronics™ Quiet Series™ SLIENT SWITCHER
SMART START™ STAR*POWER™ Stealth™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TruTranslation™ TinyLogic™ UHC™
®
UltraFET
VCX™
®
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
2. A critical component is any com ponent of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative or In
Design
Preliminary First Production This datasheet contains preliminary data, and
No Identification Needed Full Production This datasheet contains final specifications. Fairchild
Obsolete Not In Production This datasheet contains specifications on a product
©2002 Fairchild Semiconductor Corporation Rev. H4
This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.
supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Semiconductor reserves the right to make changes at any time without notice in order to improve design.
that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
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