•Three separate pairs of driver enables in a 1 bit, 3 bit, 3 bit
arrangement
•Drives heavily loaded backplanes with equivalent load
impedances down to 10Ω.
•High drive 100mA BTL open collector drivers on B-port
•Allows incident wave switching in heavily loaded backplane buses
•Reduced BTL voltage swing produces less noise and reduces
power consumption
•Built-in precision band-gap reference provides accurate receiver
thresholds and improved noise immunity
•Compatible with IEEE Futurebus+ or proprietary BTL backplanes
•Controlled output ramp and multiple GND pins minimize ground
bounce
•Each BTL driver has a dedicated Bus GND for a signal return
•Glitch-free power up/power down operation
•Low I
current
CC
•Tight output skew
•Supports live insertion
•Pins for the optional JTAG boundary scan function are provided
•High density packaging in plastic Quad Flatpack
•5V compatible I/O on A-port
•The A port includes a series resistor of 30Ω making external
terminating resistors unnecessary
DESCRIPTION
The FBL22041 is a 7-bit bidirectional BTL transceiver and is
intended to provide the electrical interface to a high performance
wired-OR bus. The FBL22041 is an inverting transceiver.
The B-port drivers are Low-capacitance open collectors with
controlled ramp and are designed to sink 100mA. Precision band
gap references on the B-port insure very good noise margins by
limiting the switching threshold to a narrow region centered at 1.55V .
The FBL22041 is designed with a 30Ω series resistance in both the
HIGH and LOW states of the output.
The FBL22041 is pin and function compatible with FB2041 but
operates at a 3.3V supply voltage, greatly reducing power
consumption.
The B-port interfaces to “Backplane Transceiver Logic” (See the
IEEE 1194.1 BTL standard). BTL features low power consumption
by reducing voltage swing (1Vp-p, between 1V and 2V) and reduced
capacitive loading by placing an internal series diode on the drivers.
BTL also provides incident wave switching, a necessity for high
performance backplanes.
There are three separate pairs of driver enables in a 1 bit, 3 bit, 3 bit
arrangement. The TTL/BTL output drivers for bit 0 are enabled with
OEA1/OEB1
OEA2/OEB2
OEA3/OEB3
, output drivers for bits 1–2–3 are enabled with
and output drivers for bits 4–5–6 are enabled with
.
CC
BIAS V
OEA1
AI6
BG GND
OEB0
OEA2
V
OEB1
TCK (option)
CC
V
TDI (option)
TDO (option)
TMS (option)
BUS GND
B0
OEB2
OEA3
OEB3
39
38
37
36
35
34
33
32
31
30
29
28
27
BUS GND
B1
BUS GND
B2
BUS GND
B3
BUS GND
B4
BUS GND
B5
BUS GND
B6
N/C
SG00084
The A-port operates at TTL levels with separate I/O. The 3-state
A-port drivers are enabled when OEAn goes High after an extra 6ns
delay which is built in to provide a break-before-make function.
When OEAn goes Low, A-port drivers become High impedance
without any extra delay. During power on/of f cycles, the A-port
drivers are held in a High impedance state when V
CC
The B-port has an output enable, OEB0, which affects all seven
drivers. When OEB0 is High and OEBn
be enabled. When OEB0 is Low or if OEBn
is Low the output driver will
is High, the B-port
drivers will be inactive and at the level of the backplane signal.
b0 – b640, 38, 36, 34, 32, 30, 28i/oData inputs/Open Collector outputs, High current drive (BTL)
OEB046InputEnables the Bn outputs when High
OEB145InputEnables the B0 output when Low
OEB225InputEnables the B1 – B3 outputs when Low
OEB326InputEnables the B4 – B6 outputs when Low
OEA147InputEnables the A0 outputs when High
OEA220InputEnables the A1 – A3 outputs when High
OEA324InputEnables the A4 – A6 outputs when High
bus gnd41, 39, 37, 35, 33, 31, 29GNDBus ground (0V)
LOGIC gnd1, 5, 7, 11, 13, 15GNDLogic ground (0V)
LOGIC/bus V
BG V
BIAS V48PowerPositive supply voltage
BG GND19GNDBAND GAP GROUND (0V)
CC
CC
TMS42InputTest Mode Select (no-connect)
Tck44InputTest Clock (no-connect)
Tdi22InputT est Data In (shorted to TDO)
H=High voltage level
L=Low voltage level
X=Don’t care
Z=High-impedance (OFF) state
— =Input not externally driven
H** =Goes to level of pull-up voltage
B* =Precaution should be taken to ensure B inputs do not float.
If they do, they are equal to Low state.
Z=High-impedance (OFF) state
— =Input not externally driven
H** =Goes to level of pull-up voltage
B* =Precaution should be taken to ensure B inputs do not float.
Operation beyond the limits set forth in this table may impair the useful life of the device. Unless otherwise noted these limits are over the
operating free-air temperature range.
SYMBOL
V
V
T
CC
I
IN
OUT
OUT
STG
IN
Supply voltage-0.5 to +4.6V
p
Input currentVIN 0-50
Voltage applied to output in High output state-0.5 to +7.0V
Current applied to output inAO0 – AO648, –24mA
Low output state/High output stateB0 – B6200
Storage temperature-65 to +150°C
Bus voltage during prebiasB0 – B8 = 0V, Bias V = 3.3V1.622.1V
Fall current during prebiasB0 – B8 = 2V, Bias V = 1.3 to 2.5V1µA
Rise current during prebiasB0 – B8 = 1V, Bias V = 3 to 3.6V-1µA
Peak bus current during
insertion
p
Input glitch rejectionVCC = 3.3V1.01.35ns
Voltage dif ference between the Bias voltage
and VCC after the PCB is plugged in.
––0.5V
VCC = 0 V, Bias V = 3.6V1.2mA
VCC = 3.3V, Bias V = 3.6V10µA
VCC = 0 to 3.3V, B0 – B8 = 0 to 2.0V,
Bias V = 2.7 to 3.6V, OEB0 = 0.8V, tr = 2ns
V
= 0 to 3.3V, OEB0 = 0.8V100
CC
V
= 0 to 1.2V, OEB0 = 0 to 5V100
CC
10mA
µ
DC ELECTRICAL CHARACTERISTICS
Over recommended operating free-air temperature range unless otherwise noted.
LIMITS
MINTYP2MAX
I
I
OFF
V
V
V
I
OZH
I
OZL
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operation conditions for the applicable type.
2. All typical values are at V
3. Due to test equipment limitations, actual test conditions are V
4. Unused pins are at V
5. For B port input voltage between 3 and 5 volt; I
is active).
High level output current B0 – B6VCC = MAX, VIL = MAX, VOH = 1.9V100µA
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1]
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print codeDate of release: 05-96
Document order number:9397-750-04279
yyyy mmm dd
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