Datasheet FBL22031BB Datasheet (Philips)

Page 1
INTEGRATED CIRCUITS
FBL22031
9-bit BTL 3.3V latched/registered/pass-thru Futurebus+ transceiver with 30Ω termination
Product specification 1998 Sep 04 IC23 data handbook
Philips Semiconductors
Page 2
mA
3.3V BTL 9-bit latched/registered/pass-thru universal transceiver with 30Ω termination

FEA TURES

•Latched, registered or straight through in either A to B or B to A
path
•Drives heavily loaded backplanes with equivalent load
impedances down to 10Ω.
•High drive 100mA BTL open collector drivers on B-port
•Allows incident wave switching in heavily loaded backplane buses
•Reduced BTL voltage swing produces less noise and reduces
power consumption
•Built-in precision band-gap reference provides accurate receiver
thresholds and improved noise immunity
•Compatible with IEEE Futurebus+ or proprietary BTL backplanes
•Each BTL driver has a dedicated Bus GND for a signal return
•Controlled output ramp and multiple GND pins minimize ground
bounce
•Glitch-free power up/power down operation
•Low I
current
CC
•Tight output skew
•Supports live insertion
•Pins for the optional JTAG boundary scan function are provided
•High density packaging in plastic Quad Flatpack
•5V compatible I/O on A-port
•Same pinout and function as the FBL2033 except for 30Ω sereis
•The A output includes a a series resistor of 30Ω making external

DESCRIPTION

The FBL22031 is a 9-bit latched/registered transceiver featuring a latched, registered or pass-thru mode in either the A-to-B or B-to-A direction.
The FBL22031 is designed with a 30Ω series resistor in both the HIGH and LOW states of the output.
The FBL22031 is intended to provide the electrical interface to a high performance wired-OR bus.
FBL22031
termination
terminating resistors unnecessary

QUICK REFERENCE DATA

SYMBOL PARAMETER TYPICAL UNIT
t
PLH
t
PHL
t
PLH
t
PHL
C I
I
O
OL
CC
Propagation delay An to Bn
Propagation delay Bn to An
Output capacitance (B0 – Bn only) 6 pF Output current (B0 – Bn only) 100 mA
AIn to Bn (outputs Low or High) 11
Supply current
Bn to AOn (outputs Low) 22 Bn to AOn (outputs High) 18
2.7 ns
4.4
4.2

ORDERING INFORMATION

PACKAGE VCC = 3.3V±10%; T
52-pin Plastic Quad Flat Pack (PQFP) FBL22031BB SOT379-1
= –40°C to +85°C
amb
ns
DWG
No.
1998 Sep 04 853-21 19 19967
2
Page 3
Philips Semiconductors Product specification
3.3V BTL 9-bit latched/registered/pass-thru universal transceiver with 30Ω termination

PIN CONFIGURATION

CC
V
LOGIC GND
LOGIC GND
LOGIC GND
LOGIC GND
LOGIC GND
LOGIC GND
LOGIC GND
LOGIC GND
A1
A0
52 51 50 49 48 47 46 45 44 43 42 41 40
1 2
A2
3 4
A3
A4
A5
A6
A7
9-Bit latched/registered transceiver
5 6
7 8
9 10 11
12 13
14 15 16 17 18 19 20 21 22 23 24 25 26
A8
SEL1
LCBA
OEA
BIAS V
FBL22031
52-lead PQFP
CC
LCAB
BG V
BG GND
OEB1
OEB0
SEL0
TDO (option)
CC
TMS (option)
TCK (option)
V
B8
CC
V
TDI (option)
B0
BUS GND
39 38 37 36 35
34 33 32 31 30 29 28 27
B7
BUS GND
FBL22031
BUS GND B1 BUS GND B2 BUS GND B3 BUS GND B4 BUS GND B5 BUS GND B6 BUS GND
SG00091

DESCRIPTION

The TTL-level side (A port) has a common I/O. The common I/O, open collector B port operates at BTL signal levels. The logic element for data flow in each direction is controlled by two mode select inputs (SEL0 and SEL1). A “00” configures latches in both directions. A “10” configures thru mode in both directions. A “01” configures register mode in both directions. A “11” configures register mode in the A-to-B direction and latch mode in the B-to-A direction.
When configured in the buffer mode, the inverse of the input data appears at the output port. In the register mode, data is stored on the rising edge of the appropriate clock input (LCAB or LCBA). In the latch mode, clock pins serve as transparent-Low latch enables. Regardless of the mode, data is inverted from input to output.
The 3-State A port is enabled by asserting a High level on OEA. The B port has two output enables, OEB0 and OEB1 is High and OEB1
When either OEB0 is Low or OEB1
is Low is the output enabled.
is High, the B port is inactive and is pulled to the level of the pullup voltage. New data can be entered in the register and latched modes or can be retained while the associated outputs are in 3-State (A port) or inactive (B port).
The B-port drivers are Low-capacitance open collectors with controlled ramp and are designed to sink 100mA. Precision band gap references on the B-port insure very good noise margins by limiting the switching threshold to a narrow region centered at 1.55V .
The B-port interfaces to “Backplane Transceiver Logic” (see the IEEE 1194.1 BTL standard). BTL features low power consumption by reducing voltage swing (1V p-p, between 1V and 2V) and reduced capacitive loading by placing an internal series diode on the
. Only when OEB0
drivers. BTL also provides incident wave switching, a necessity for high performance backplanes.
Output clamps are provided on the BTL outputs to further reduce switching noise. The “V during a Low-to-High transition. The “V The other clamp, the “trapped reflection” clamp, clamps out ringing below the BTL 0.5V V approximately 100ns after a High-to-Low transition.
” clamp reduces inductive ringing effects
OH
level. This clamp remains active for
OL
” clamp is always active.
OH
To support live insertion, OEB0 is held Low during power on/off cycles to insure glitch- free B port drivers. Proper bias for B port drivers during live insertion is provided by the BIAS V pin when at a
3.3V level while V which will reverse-bias the BTL driver series Schottky diode, and
is Low. The BIAS V pin is a low current input
CC
also bias the B port output pins to a voltage between 1.62V and
2.1V. This bias function is in accordance with IEEE BTL Standard
1194.1. If live insertion is not a requirement, the BIAS V pin should be tied to a V
CC
pin.
The LOGIC GND and BUS GND pins are isolated inside the package to minimize noise coupling between the BTL and TTL sides. These pins should be tied to a common ground external to the package.
Each BTL driver has an associated BUS GND pin that acts as a signal return path and these BUS GND pins are internally isolated from each other. In the event of a ground return fault, a “hard” signal failure occurs instead of a pattern dependent error that may be infrequent and impossible to troubleshoot.
As with any high power device, thermal considerations are critical. It is recommended that airflow (300Ifpm) and/or thermal mounting be used to ensure proper junction temperature.
1998 Sep 04
3
Page 4
Philips Semiconductors Product specification
3.3V BTL 9-bit latched/registered/pass-thru universal transceiver with 30Ω termination

P ACKAGE THERMAL CHARACTERISTICS

PARAMETER CONDITION 52-PIN PLASTIC QFP
θja Still air 80°C/W θja 300 Linear feet per minute air flow 58°C/W θjc Thermally mounted on one side to heat sink 20°C/W

PIN DESCRIPTION

SYMBOL PIN NUMBER TYPE NAME AND FUNCTION
A0 – A8 50, 52, 2, 4, 6, 8, 10, 12, 14 I/O BiCMOS data inputs/3-State outputs (TTL) B0 – B8
OEB0 46 Input Enables the B outputs when High OEB1 45 Input Enables the B outputs when Low
OEA 47 Input Enables the A outputs when High
BUS GND
LOGIC GND 51, 1, 3, 5, 7, 9, 11, 13 GND Logic ground (0V)
V
CC
BIAS V 48 Power Live insertion pre-bias pin
BG V
CC
BG GND 19 GND Band Gap threshold voltage reference ground
SEL0 20 Input Mode select
SEL1 15 Input Mode select LCAB 18 Input A to B clock/latch enable (transparent latch when Low) LCBA 16 Input B to A clock/latch enable (transparent latch when Low)
TMS 42 Input Test Mode Select (optional, if not implemented then no connect)
TCK 44 Input Test Clock (optional, if not implemented then no connect)
TDI 22 Input Test Data In (optional, if not implemented then no connect)
TDO 21 Output Test Data Out (optional, if not implemented then shorted to TDI)
40, 38, 36, 34, 32,
30, 28, 26, 24
25, 27, 29, 31, 33,
35, 37, 39, 41
23, 43, 49 Power Positive supply voltage
17 Power Band Gap threshold voltage reference
I/O Data inputs/Open Collector outputs, High current drive (BTL)
GND Bus ground (0V)
FBL22031
1998 Sep 04
4
Page 5
Philips Semiconductors Product specification
MODE
An to Bn thru mode
An to Bn transparent latch
An to Bn latch and read
An to Bn register
Bn to An thru mode
Bn to An transparent latch
Bn to An latch and read
Bn to An register
Disable Bn outputs
Latch mode (Bn to An)
3.3V BTL 9-bit latched/registered/pass-thru universal transceiver with 30Ω termination

FUNCTION TABLE

INPUTS OUTPUTS
An Bn* OEB0 OEB1 OEA LCAB LCBA SEL0 SEL1 An Bn
L — H L L X X H L input H**
H — H L L X X H L input L
p
Bn outputs latched and read (preconditioned latch)
p
An outputs latched and read (preconditioned latch)
p
Disable An outputs X X X X L X X X X Z X
L — H L L L X L L input H**
H — H L L L X L L input L
l — H L L ↑ X L L input H**
h — H L L ↑ X L L input L
X — H L X H X L L X
l — H L L ↑ X X H input H**
h — H L L ↑ X X H input L — L Disable H X X H L H input — H Disable H X X H L L input — L Disable H X L L L H input — H Disable H X L L L L input — L Disable H X L H H H input — H Disable H X L H H L input — l Disable H X ↑ L L H input — h Disable H X ↑ L L L input — l Disable H X ↑ H H H input — h Disable H X ↑ H H L input
— X X X H X H L L
— X X X H X H H H — l Disable H X ↑ L H H input
— h Disable H X ↑ L H L input
X X L X X X X X X X H** X X X H X X X X X X H**
FBL22031
latched
data
latched
data
latched
data
X
X

FUNCTION SELECT TABLE

NOTES:
H = High voltage level L = Low voltage level l = Low voltage level one set-up time prior to the Low-to-High LCXX transition h = High voltage level one set-up time prior to the Low-to-High LCXX transition X = Don’t care
1998 Sep 04
MODE SELECTED SEL0 SEL1
Thru mode H L Register mode (An to Bn) X H Latch mode (An to Bn) L L Register mode (Bn to An) L H
L L
H H
Z = High-impedance (OFF) state — = Input not externally driven ↑ = Low-to-High transition H** = Goes to level of pull-up voltage
* = Precaution should be taken to ensure B inputs do not float.
Bn If they do, they are equal to Low state. Disable = OEB0 is Low or OEB1
5
is High.
Page 6
Philips Semiconductors Product specification
3.3V BTL 9-bit latched/registered/pass-thru universal transceiver with 30Ω termination

LOGIC DIAGRAM

46
OEB0
45
OEB1
47
OEA
DQ E DQ
14
A8
12
A7
Clk
MUX
A ⇐ B
DQ E
DQ Clk
MUX
A ⇒ B
MUX
A ⇒ B
DQ
QD
E
DQ
Clk
FBL22031
24
B8
26
B7
28
TTL
LCAB
SEL0 SEL1
LCBA
10
8
6
4
2
52
A1
50
A0
18
20 15
16
DQ E
DQ Clk
DQ E DQ Clk
Decode
OutIn
MUX
A ⇐ B
MUX
A ⇐ B
MUX
A ⇐ B
DQ
E
DQ
Clk
MUX
A ⇒ B
DQ
E
DQ
Clk
MUX
A ⇒ B
DQ
E
DQ
Clk
30
32
BTL
34
36
38
B1
40
B0
1998 Sep 04
TMS TCK
TDI
TDO
42
(JTAG Boundary Scan pins)
44 22 21
LOGIC GND = 1, 3, 5, 7, 9, 11, 13, 51 BUS GND = 25, 27, 29, 31, 33, 35, 37, 39, 41 BIAS V = 48
V
CC
BG V BG GND = 19
CC
= 23, 43, 49 =17
SG00061
6
Page 7
Philips Semiconductors Product specification
V
In ut voltage
I
V
High-level in ut voltage
V
Low-level in ut voltage
I
Low-level out ut current
3.3V BTL 9-bit latched/registered/pass-thru universal transceiver with 30Ω termination

ABSOLUTE MAXIMUM RATINGS

Operation beyond the limits set forth in this table may impair the useful life of the device. Unless otherwise noted these limits are over the operating free-air temperature range.
SYMBOL
V
V
T
CC
IN
I
IN
OUT
OUT
STG
Supply voltage -0.5 to +4.6 V
p
Input current Voltage applied to output in High output state -0.5 to +7.0 V
Current applied to output in AO0 – AO8 24, –24 mA Low output state/High output state B0 – B8 200 Storage temperature -65 to +150 °C

RECOMMENDED OPERATING CONDITIONS

SYMBOL
V
CC
IH
IL
I
IK
I
OH
OL
C
OB
T
amb
Supply voltage 3.0 3.3 3.6 V
p
p
Input clamp current -18 mA High-level output current AO0 – AO8 -12 mA
p
Output capacitance on B port 6 7 pF Operating free-air temperature range 0 +70 °C
PARAMETER
PARAMETER RATING UNIT
AI0 – AI6, OEB0, OEBn, OEAn -0.5 to +7.0 V
B0 – B8 -0.5 to +3.5 VIN 0
COMMERCIAL LIMITS
VCC = 3.3V±10%;
T
= –40 to +85°C
amb
MIN TYP MAX
Except B0–B8 2.0 V B0 – B8 1.62 1.55 Except B0–B8 0.8 V B0 – B8 1.47
AO0 – AO8 +12 mA B0 – B8 100
FBL22031
-50
UNIT
1998 Sep 04
7
Page 8
Philips Semiconductors Product specification
SYMBOL
PARAMETER
UNIT
I
(
BIASV
)
IOLOFF
Power u current
µA
1
SYMBOL
PARAMETER
TEST CONDITIONS
1
UNIT
I
Power-off out ut current
B0
B8
µA
V
g
AO0
AO8
3 3
AO0
AO8
3
V
I
g
µ
mA
IILLow-level in ut current
B0
B8
V
MAX, V
75V
100
µA
3.3V BTL 9-bit latched/registered/pass-thru universal transceiver with 30Ω termination

LIVE INSERTION SPECIFICA TIONS

LIMITS
MIN TYP MAX
V
BIASV
BIASV
V
I I
IBnPEAK
Bias pin voltage Bias pin (I
DC current Bus voltage during prebias B0 – B8 = 0V, Bias V = 3.3V 1.62 2.1 V
Bn
Fall current during prebias B0 – B8 = 2V, Bias V = 1.3 to 2.5V 1 µA
LM
Rise current during prebias B0 – B8 = 1V, Bias V = 3 to 3.6V -1 µA
HM
BIASV
) input
Peak bus current during insertion
p
t
Input glitch rejection VCC = 3.3V 1.0 1.35 ns
GR

DC ELECTRICAL CHARACTERISTICS

Over recommended operating free-air temperature range unless otherwise noted.
I
OFF
V
V
I
OZH
I
OZL
I
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operation conditions for the applicable type.
2. All typical values are at V
3. Due to test equipment limitations, actual test conditions are V
4. Unused pins are at V
5. For B port input voltage between 3 and 5 volt; I is active).
High level output current B0 – B8 VCC = MAX, VIL = MAX, VOH = 1.9V 100 µA
OH
p
High-level output
OH
voltage
Low-level output voltage
OL
Input clamp voltage VCC = MIN, II = I
IK
I
Input leakage current
I
I
High-level input current B0 – B8
IH
p
Off-state output current AO0 – AO8 VCC = MAX, VO =3V 5 µA Off-state output current AO0 – AO8 VCC = MAX, VO = 0.5V -5 µA
Supply current (total)
CC
= 3.3V, TA = 25°C.
CC
or GND.
CC
Voltage dif ference between the Bias voltage and VCC after the PCB is plugged in.
– – 0.5 V
VCC = 0 V, Bias V = 3.6V 1.2 mA VCC = 3.3V, Bias V = 3.6V 10 µA
VCC = 0 to 3.3V, B0 – B8 = 0 to 2.0V, Bias V = 2.7 to 3.6V, OEB0 = 0.8V, tr = 2ns
V
= 0 to 3.3V, OEB0 = 0.8V 100
CC
V
= 0 to 1.2V, OEB0 = 0 to 5V 100
CC
MIN TYP2MAX
–
–
VCC = 0V, VIL = MAX, VOH = 1.9V 100 VCC = 0V, VIL = MAX, VOH = 1.9V @ 85°C 300
V
VCC = MIN to MAX, IOH = –100µA
CC
–0.2 VCC = MIN; IOH = –4mA 2.4 V VCC = MIN; IOH = –12mA 2.0 V
–
VCC = MIN; IOL = 4mA 0.4 V VCC = MIN; IOL = 12mA 0.8 V
B0 – B8 VCC = MIN, IOL = 4mA 0.5
VCC = MIN, IOL = 100mA 0.75 1.0 1.20
= –18mA –0.85 -1.2 V
IK
Control pins VCC = 3.6V; VI = VCC or 100mV ±1.0 Control/
AI0 – AI8 AI0 – AI8 VCC = 3.6V; VI = V
VCC = 0V or 3.6V; VI = 5.5V 10
CC
Note 4 VCC = 3.6V; VI = 100mV –5
VCC = MAX, VI = 1.9V 100 µA VCC = MAX, VI = 3.5V , note 5 100 VCC = MAX, VI = 3.75V, note 5 @ –40°C 100
–
I
B to A VCC = MAX, outputs High 18 32
CCH
I
B to A VCC = MAX, outputs Low 22 37
CCL
I
A to B VCC = MAX, outputs High 11 16
CCH
I
A to B VCC = MAX, outputs Low 11 16
CCL
I
CCZ
will be greater than 100mA but the part will continue to function normally (clamping circuit
IH
CC
=
= 0.
I
VCC = MAX 18 32
= 1.8V and VIL = 1.3V for the B side.
IH
FBL22031
10 mA
LIMITS
V
µA
1
-
mA
1998 Sep 04
8
Page 9
Philips Semiconductors Product specification
Waveform 1, 2
ns
Waveform 1, 2
ns
3.3V BTL 9-bit latched/registered/pass-thru universal transceiver with 30Ω termination

AC ELECTRICAL CHARACTERISTICS

B TO A SPECIFICATIONS
SYMBOL PARAMETER
f
MAX
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PZH
t
PHZ
t
PZL
t
PLZ
t
TLH
t
THL
tSK(o)
tSK(p)
Maximum clock frequency Waveform 4 120 150 MHz Propagation delay (thru mode)
Bn to An Propagation delay (transparent latch)
Bn to An Propagation delay
LCBA to An (latch) Propagation delay
LCBA to An (register) Propagation delay
SEL0 or SEL1 to An (inverting) Propagation delay
SEL0 or SEL1 to An (non-inverting) Output enable time from High or Low
OEA to An Output disable time to High or Low
OEA to An Output transition time, An Port
10% to 90%, 90% to 10% Output to output skew for multiple
channels Pulse skew
t
PHL
– t
1
PLH
2
MAX
TEST
CONDITION
Waveform 1, 2
Waveform 1, 2
Waveform 5, 6
Waveform 5, 6
Test Circuit and
Waveforms
Waveform 3 0.5 1.0 1.5 ns
Waveform 2 0.5 1.0 1.5 ns
NOTES:
1.  t
actual – tPMactualfor any data input to output path compared to any other data input to output path where N and M are either LH or HL.
PN
Skew times are valid only under same test conditions (temperature, V other path or compares t
2. t
(p) is used to quantify duty cycle characteristics. In essence it compares the input signal duty cycle to the corresponding output signal
SK
duty cycle (50MHz input frequency and 50% duty cycle, tested on data paths only).
on a given path to t
PHL
on any other path.
PHL
, loading, etc.). tSK (0) compares t
CC
T
= +25°C,
amb
VCC = 3.3V,
T
amb
VCC = 3.3V±10%,
MIN TYP MAX MIN MAX
2.3
2.6
3.2
3.5
6.8
5.5
2.1
2.3
2.7
2.5
2.4
2.6
2.6
3.4
2.1
1.2
5.4
5.6
6.5
6.3
10.4
9.8
4.9
5.2
6.5
6.3
6.6
6.2
5.8
5.4
5.4
3.1
8.9
9.1
10.1
9.3
14.4
14.7
8.4
8.3
10.7
10.5
11.3
10.2
9.3
7.5
9.1
5.4
on a given path to t
PLH
FBL22031
= –40 to +85°C,
1.7
2.1
2.4
2.9
5.1
4.3
1.2
1.8
1.8
2.0
1.8
2.1
1.9
2.9
1.6
1.0
0.7
0.5
10.1
10.3
11.6
10.3
16.9
16.8
9.7
9.4
12.8
11.8
13.0
11.6
10.7
9.0
10.1
6.0
3.0
2.0
PLH
UNIT
ns
ns
ns
ns
ns
on any
1998 Sep 04
9
Page 10
Philips Semiconductors Product specification
Waveform 1, 2
ns
Waveform 1, 2
ns
3.3V BTL 9-bit latched/registered/pass-thru universal transceiver with 30Ω termination
AC ELECTRICAL CHARACTERISTICS
A TO B 9 Ω LOAD SPECIFICATIONS
SYMBOL PARAMETER
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
TLH
t
THL
tSK(o)
tSK(p)
Propagation delay (thru latch) An to Bn
Propagation delay (transparent latch) An to Bn
Propagation delay LCAB to Bn (latch)
Propagation delay LCAB to Bn (register)
Propagation delay SEL0 or SEL1 to Bn (inverting)
Propagation delay SEL0 or SEL1 to Bn (non-inverting)
OEBn to Bn Waveform 1, 2 Output transition time, Bn Port
(1.3V to 1.8V) Output to output skew for multiple
channels Pulse skew
t
PHL
– t
1
PLH
2
MAX
TEST
CONDITION
Waveform 1, 2
Waveform 1, 2
Test Circuit and
Waveforms
Waveform 3 0.4 1.0 2.0 ns
Waveform 2 0.3 1.0 1.5 ns
NOTES:
actual – tPMactual for any data input to output path compared to any other data input to output path where N and M are either LH or
1.  t
PN
HL. Skew times are valid only under same test conditions (temperature, V any other path or compares t
(p) is used to quantify duty cycle characteristics. In essence it compares the input signal duty cycle to the corresponding output signal
2. t
SK
duty cycle (50MHz input frequency and 50% duty cycle, tested on data paths only).
on a given path to t
PHL
on any other path.
PHL
, loading, etc.). tSK (0) compares t
CC
T
= +25°C,
amb
VCC = 3.3V,
T
amb
VCC = 3.3V±10%,
MIN TYP MAX MIN MAX
1.2
1.2
1.2
1.3
7.2
7.2
1.2
1.4
1.2
1.6
1.9
1.9
1.2
1.2
3.5
3.1
3.8
4.0
12.0
11.1
4.4
4.3
5.1
4.6
5.6
4.7
4.0
3.7
8.1
6.5
8.6
7.7
17.4
15.5
8.8
7.5
9.8
8.1
9.9
7.9
8.4
6.7
PLH
FBL22031
= –40 to +85°C,
1.0
1.0
1.0
1.0
5.3
5.6
1.0
1.0
1.0
1.1
1.0
1.3
1.0
1.0
1.2
0.4
on a given path to t
9.1
6.9
9.5
8.4
20.5
17.8
10.2
8.4
11.4
9.9
11.2
9.0
9.8
8.0
3.0
1.5
UNIT
ns
ns
ns
ns
PLH
on
1998 Sep 04
10
Page 11
Philips Semiconductors Product specification
Waveform 1, 2
ns
Waveform 1, 2
ns
3.3V BTL 9-bit latched/registered/pass-thru universal transceiver with 30Ω termination
AC ELECTRICAL CHARACTERISTICS
A TO B 16.5 Ω LOAD SPECIFICATIONS
SYMBOL PARAMETER
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
TLH
t
THL
tSK(o)
tSK(p)
Propagation delay (thru latch) An to Bn
Propagation delay (transparent latch) An to Bn
Propagation delay LCAB to Bn (latch)
Propagation delay LCAB to Bn (register)
Propagation delay SEL0 or SEL1 to Bn (inverting)
Propagation delay SEL0 or SEL1 to Bn (non-inverting)
OEBn to Bn Waveform 1, 2 Output transition time, Bn Port
(1.3V to 1.8V) Output to output skew for multiple
channels Pulse skew
t
PHL
– t
1
PLH
2
MAX
TEST
CONDITION
Waveform 1, 2
Waveform 1, 2
Test Circuit and
Waveforms
Waveform 3 0.4 1.0 2.0 ns
Waveform 2 0.3 1.0 1.5 ns
NOTES:
actual – tPMactual for any data input to output path compared to any other data input to output path where N and M are either LH or
1.  t
PN
HL. Skew times are valid only under same test conditions (temperature, V any other path or compares t
(p) is used to quantify duty cycle characteristics. In essence it compares the input signal duty cycle to the corresponding output signal
2. t
SK
duty cycle (50MHz input frequency and 50% duty cycle, tested on data paths only).
on a given path to t
PHL
on any other path.
PHL
, loading, etc.). tSK (0) compares t
CC
T
= +25°C,
amb
VCC = 3.3V,
T
amb
VCC = 3.3V±10%,
MIN TYP MAX MIN MAX
1.2
1.3
1.2
1.6
6.6
6.7
1.2
1.2
1.3
1.7
1.8
1.8
1.3
1.7
4.1
3.5
4.3
4.3
11.8
10.9
4.3
4.1
5.3
4.9
5.6
4.7
4.4
4.0
7.4
5.9
8.0
7.3
17.6
15.7
8.8
7.6
9.7
8.6
9.8
7.9
8.1
6.7
PLH
FBL22031
= –40 to +85°C,
1.0
1.1
1.0
1.2
4.8
5.2
1.0
1.0
1.0
1.3
1.0
1.1
1.0
1.0
1.2
0.4
on a given path to t
8.7
6.4
9.3
8.1
20.6
18.1
10.1
8.5
11.2
9.6
11.3
9.0
9.4
7.8
3.0
1.5
UNIT
ns
ns
ns
ns
PLH
on
1998 Sep 04
11
Page 12
Philips Semiconductors Product specification
SYMBOL
PARAMETER
UNIT
3.3V BTL 9-bit latched/registered/pass-thru universal transceiver with 30Ω termination
AC SETUP REQUIREMENTS (Commercial)
TEST
CONDITION
ts(H)
ts(L)
th(H)
th(L)
ts(H)
t
(L)
s
th(H)
th(L)
tw(H) tw(L)

AC WAVEFORMS

Setup time An to LCAB
Hold time An to LCAB
Setup time Bn
to LCBA
Hold time Bn to LCBA
Pulse width, High or Low LCAB or LCBA
Waveform 4
Waveform 4
Waveform 4
Waveform 4
Waveform 4
LIMITS
T
T
= +25°C, VCC = 3.3V,
amb
amb
VCC = 3.3V±10%,
CL = 50pF (A side) / CD = 30pF (B side)
RL = 500Ω (A side) / RU = 16.5Ω (B side)
MIN TYP MIN
1.0
1.0
1.0
1.0
2.0
2.0
0.0
0.0
3.0
3.0
FBL22031
= –40 to +85°C,
1.5
1.0
2.0
1.0
3.0
3.0
0.0
0.0
3.0
3.0
ns
ns
ns
ns
ns
Input
Output
V
M
t
PLH
V
M
t
PHL
V
M
V
M
Waveform 1. Propagation Delay for Data
or Output Enable to Output
An, Bn
An, Bn
V
M
tSK(o)
V
M
Waveform 3. Output to Output Skew
OEA
An
V
M
t
PZH
V
M
t
PHZ
V
M
VOH -0.3V
OV
Waveform 5. 3-State Output Enable Time to High Level
and Output Disable Time from High Level
NOTE: V
= 1.55V for Bn, V
M
The shaded areas indicate when the input is permitted to change for predictable output performance.
= 1.5V for all others.
M
Input
Output
V
M
t
(input)
w
t
PHL
V
M
t
(output)
w
V
M
t
PLH
V
M
Waveform 2. Propagation Delay for Data
or Output Enable to Output
V
An, Bn
LCAB, LCBA
M
t
t
s
h
V
M
t
(H)
w
1/f
MAX
tst
h
t
(L)
w
V
M
Waveform 4. Setup and Hold Times,
Pulse Widths and Maximum Frequency
OEA
V
M
t
PZL
An
V
M
t
PLZ
V
M
VOL +0.3V
Waveform 6. 3-State Output Enable Time to Low Level
and Output Disable Time from Low Level
SG00062
1998 Sep 04
12
Page 13
Philips Semiconductors Product specification
3.3V BTL 9-bit latched/registered/pass-thru universal transceiver with 30Ω termination

TEST CIRCUIT AND WAVEFORMS

V
CC
7.0V NEGATIVE PULSE
POSITIVE PULSE
Family
FB+
A Port
DEFINITIONS:
RL= Load Resistor; see AC CHARACTERISTICS for value. CL= Load capacitance includes jig and probe capacitance; see AC
CHARACTERISTICS for value.
R
= Termination resistance should be equal to Z
T
CD= Load capacitance includes jig and probe capacitance; see AC
CHARACTERISTICS for value.
RU= Pull up resistor; see AC CHARACTERISTICS for value.
PULSE
GENERATOR
V
IN
R
T
D.U.T.
V
OUT
Test Circuit for 3-State Outputs on A Port
SWITCH POSITION
TEST SWITCH
t
PLZ,
All other
PULSE
GENERATOR
t
PZL
V
IN
Test Circuit for Outputs on B Port
BIAS
V
R
T
closed
open
V
CC
D.U.T.
V
OUT
R
L
R
C
L
L
2.0V (for RU = 9 Ω)
2.1V (for RU = 16.5 Ω)
R
U
C
D
90%
10%
t
W
V
M
10%
(tf)
t
THL
t
(tr)
TLH
90%
V
M
t
W
VM = 1.55V for Bn, VM = 1.5V for all others.
10%
90%
V
M
V
Input Pulse Definitions
INPUT PULSE REQUIREMENTS
Low V
0.0V
1.0VB Port
Rep. RateAmplitude t
1MHz3.0V 1MHz2.0V
t
W
500ns
of pulse generators.
OUT
FBL22031
90%
t
TLH
t
THL
M
10%
TLHtTHL
2.5ns
2.0ns500ns
2.5ns
2.0ns
AMP (V)
LOW V
(tr)
(tf)
AMP (V)
LOW V
SG00063
1998 Sep 04
13
Page 14
Philips Semiconductors Product specification
3.3V BTL 9-bit latched/registered/pass-thru
FBL22031
universal transceiver with 30Ω termination

Q30FP52: plastic quad flat package; 52 leads (lead length 1.6 mm); body 10 x 10 x 2.0 mm SOT379-1

1998 Sep 04
14
Page 15
Philips Semiconductors Product specification
3.3V BTL 9-bit latched/registered/pass-thru Futurebus+ transceiver with 30Ω termination

Data sheet status

Data sheet status
Objective specification
Preliminary specification
Product specification
Product status
Development
Qualification
Production
Definition
This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make chages at any time without notice in order to improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
[1]
FBL22031
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print code Date of release: 06-98 Document order number: 9397-750-04398
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