3.3V BTL 9-bit latched/registered/pass-thru
universal transceiver with 30Ω termination
PIN CONFIGURATION
CC
V
LOGIC GND
LOGIC GND
LOGIC GND
LOGIC GND
LOGIC GND
LOGIC GND
LOGIC GND
LOGIC GND
A1
A0
52 51 50 49 48 47 46 45 44 43 42 41 40
1
2
A2
3
4
A3
A4
A5
A6
A7
9-Bit latched/registered transceiver
5
6
7
8
9
10
11
12
13
14 15 16 17 18 19 20 21 22 23 24 25 26
A8
SEL1
LCBA
OEA
BIAS V
FBL22031
52-lead PQFP
CC
LCAB
BG V
BG GND
OEB1
OEB0
SEL0
TDO (option)
CC
TMS (option)
TCK (option)
V
B8
CC
V
TDI (option)
B0
BUS GND
39
38
37
36
35
34
33
32
31
30
29
28
27
B7
BUS GND
FBL22031
BUS GND
B1
BUS GND
B2
BUS GND
B3
BUS GND
B4
BUS GND
B5
BUS GND
B6
BUS GND
SG00091
DESCRIPTION
The TTL-level side (A port) has a common I/O. The common I/O,
open collector B port operates at BTL signal levels. The logic
element for data flow in each direction is controlled by two mode
select inputs (SEL0 and SEL1). A “00” configures latches in both
directions. A “10” configures thru mode in both directions. A “01”
configures register mode in both directions. A “11” configures
register mode in the A-to-B direction and latch mode in the B-to-A
direction.
When configured in the buffer mode, the inverse of the input data
appears at the output port. In the register mode, data is stored on
the rising edge of the appropriate clock input (LCAB or LCBA). In the
latch mode, clock pins serve as transparent-Low latch enables.
Regardless of the mode, data is inverted from input to output.
The 3-State A port is enabled by asserting a High level on OEA. The
B port has two output enables, OEB0 and OEB1
is High and OEB1
When either OEB0 is Low or OEB1
is Low is the output enabled.
is High, the B port is inactive
and is pulled to the level of the pullup voltage. New data can be
entered in the register and latched modes or can be retained while
the associated outputs are in 3-State (A port) or inactive (B port).
The B-port drivers are Low-capacitance open collectors with
controlled ramp and are designed to sink 100mA. Precision band
gap references on the B-port insure very good noise margins by
limiting the switching threshold to a narrow region centered at 1.55V .
The B-port interfaces to “Backplane Transceiver Logic” (see the
IEEE 1194.1 BTL standard). BTL features low power consumption
by reducing voltage swing (1V p-p, between 1V and 2V) and
reduced capacitive loading by placing an internal series diode on the
. Only when OEB0
drivers. BTL also provides incident wave switching, a necessity for
high performance backplanes.
Output clamps are provided on the BTL outputs to further reduce
switching noise. The “V
during a Low-to-High transition. The “V
The other clamp, the “trapped reflection” clamp, clamps out ringing
below the BTL 0.5V V
approximately 100ns after a High-to-Low transition.
” clamp reduces inductive ringing effects
OH
level. This clamp remains active for
OL
” clamp is always active.
OH
To support live insertion, OEB0 is held Low during power on/off
cycles to insure glitch- free B port drivers. Proper bias for B port
drivers during live insertion is provided by the BIAS V pin when at a
3.3V level while V
which will reverse-bias the BTL driver series Schottky diode, and
is Low. The BIAS V pin is a low current input
CC
also bias the B port output pins to a voltage between 1.62V and
2.1V. This bias function is in accordance with IEEE BTL Standard
1194.1. If live insertion is not a requirement, the BIAS V pin should
be tied to a V
CC
pin.
The LOGIC GND and BUS GND pins are isolated inside the
package to minimize noise coupling between the BTL and TTL
sides. These pins should be tied to a common ground external to the
package.
Each BTL driver has an associated BUS GND pin that acts as a
signal return path and these BUS GND pins are internally isolated
from each other. In the event of a ground return fault, a “hard” signal
failure occurs instead of a pattern dependent error that may be
infrequent and impossible to troubleshoot.
As with any high power device, thermal considerations are critical. It
is recommended that airflow (300Ifpm) and/or thermal mounting be
used to ensure proper junction temperature.
1998 Sep 04
3
Page 4
Philips SemiconductorsProduct specification
3.3V BTL 9-bit latched/registered/pass-thru
universal transceiver with 30Ω termination
P ACKAGE THERMAL CHARACTERISTICS
PARAMETERCONDITION52-PIN PLASTIC QFP
θjaStill air80°C/W
θja300 Linear feet per minute air flow58°C/W
θjcThermally mounted on one side to heat sink20°C/W
BG GND19GNDBand Gap threshold voltage reference ground
SEL020InputMode select
SEL115InputMode select
LCAB18InputA to B clock/latch enable (transparent latch when Low)
LCBA16InputB to A clock/latch enable (transparent latch when Low)
TMS42InputTest Mode Select (optional, if not implemented then no connect)
TCK44InputTest Clock (optional, if not implemented then no connect)
TDI22InputTest Data In (optional, if not implemented then no connect)
TDO21OutputTest Data Out (optional, if not implemented then shorted to TDI)
40, 38, 36, 34, 32,
30, 28, 26, 24
25, 27, 29, 31, 33,
35, 37, 39, 41
23, 43, 49PowerPositive supply voltage
17PowerBand Gap threshold voltage reference
I/OData inputs/Open Collector outputs, High current drive (BTL)
GNDBus ground (0V)
FBL22031
1998 Sep 04
4
Page 5
Philips SemiconductorsProduct specification
MODE
An to Bn thru mode
An to Bn transparent latch
An to Bn latch and read
An to Bn register
Bn to An thru mode
Bn to An transparent latch
Bn to An latch and read
Bn to An register
Disable Bn outputs
Latch mode (Bn to An)
3.3V BTL 9-bit latched/registered/pass-thru
universal transceiver with 30Ω termination
FUNCTION TABLE
INPUTSOUTPUTS
AnBn*OEB0 OEB1OEALCABLCBASEL0SEL1AnBn
L—HLLXXHLinputH**
H—HLLXXHLinputL
p
Bn outputs latched and read
(preconditioned latch)
p
An outputs latched and read
(preconditioned latch)
H=High voltage level
L=Low voltage level
l=Low voltage level one set-up time prior to the Low-to-High
LCXX transition
h=High voltage level one set-up time prior to the Low-to-High
LCXX transition
X=Don’t care
1998 Sep 04
MODE SELECTEDSEL0SEL1
Thru modeHL
Register mode (An to Bn)XH
Latch mode (An to Bn)LL
Register mode (Bn to An)LH
LL
HH
Z=High-impedance (OFF) state
— =Input not externally driven
↑=Low-to-High transition
H** =Goes to level of pull-up voltage
* =Precaution should be taken to ensure B inputs do not float.
Bn
If they do, they are equal to Low state.
Disable = OEB0 is Low or OEB1
5
is High.
Page 6
Philips SemiconductorsProduct specification
3.3V BTL 9-bit latched/registered/pass-thru
universal transceiver with 30Ω termination
3.3V BTL 9-bit latched/registered/pass-thru
universal transceiver with 30Ω termination
ABSOLUTE MAXIMUM RATINGS
Operation beyond the limits set forth in this table may impair the useful life of the device. Unless otherwise noted these limits are over the
operating free-air temperature range.
SYMBOL
V
V
T
CC
IN
I
IN
OUT
OUT
STG
Supply voltage-0.5 to +4.6V
p
Input current
Voltage applied to output in High output state-0.5 to +7.0V
Current applied to output inAO0 – AO824, –24mA
Low output state/High output stateB0 – B8200
Storage temperature-65 to +150°C
Control pinsVCC = 3.6V; VI = VCC or 100mV±1.0
Control/
AI0 – AI8
AI0 – AI8VCC = 3.6V; VI = V
VCC = 0V or 3.6V; VI = 5.5V10
CC
Note 4VCC = 3.6V; VI = 100mV–5
VCC = MAX, VI = 1.9V100µA
VCC = MAX, VI = 3.5V , note 5100
VCC = MAX, VI = 3.75V, note 5 @ –40°C100
–
I
B to AVCC = MAX, outputs High1832
CCH
I
B to AVCC = MAX, outputs Low2237
CCL
I
A to BVCC = MAX, outputs High1116
CCH
I
A to BVCC = MAX, outputs Low1116
CCL
I
CCZ
will be greater than 100mA but the part will continue to function normally (clamping circuit
IH
CC
=
= 0.
I
VCC = MAX1832
= 1.8V and VIL = 1.3V for the B side.
IH
FBL22031
10mA
LIMITS
V
µA
1
-
mA
1998 Sep 04
8
Page 9
Philips SemiconductorsProduct specification
Waveform 1, 2
ns
Waveform 1, 2
ns
3.3V BTL 9-bit latched/registered/pass-thru
universal transceiver with 30Ω termination
AC ELECTRICAL CHARACTERISTICS
B TO A SPECIFICATIONS
SYMBOLPARAMETER
f
MAX
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PZH
t
PHZ
t
PZL
t
PLZ
t
TLH
t
THL
tSK(o)
tSK(p)
Maximum clock frequencyWaveform 4120150MHz
Propagation delay (thru mode)
Bn to An
Propagation delay (transparent latch)
Bn to An
Propagation delay
LCBA to An (latch)
Propagation delay
LCBA to An (register)
Propagation delay
SEL0 or SEL1 to An (inverting)
Propagation delay
SEL0 or SEL1 to An (non-inverting)
Output enable time from High or Low
OEA to An
Output disable time to High or Low
OEA to An
Output transition time, An Port
10% to 90%, 90% to 10%
Output to output skew for multiple
channels
Pulse skew
t
PHL
– t
1
PLH
2
MAX
TEST
CONDITION
Waveform 1, 2
Waveform 1, 2
Waveform 5, 6
Waveform 5, 6
Test Circuit and
Waveforms
Waveform 30.51.01.5ns
Waveform 20.51.01.5ns
NOTES:
1. t
actual – tPMactual for any data input to output path compared to any other data input to output path where N and M are either LH or HL.
PN
Skew times are valid only under same test conditions (temperature, V
other path or compares t
2. t
(p) is used to quantify duty cycle characteristics. In essence it compares the input signal duty cycle to the corresponding output signal
SK
duty cycle (50MHz input frequency and 50% duty cycle, tested on data paths only).
on a given path to t
PHL
on any other path.
PHL
, loading, etc.). tSK (0) compares t
CC
T
= +25°C,
amb
VCC = 3.3V,
T
amb
VCC = 3.3V±10%,
MINTYPMAXMINMAX
2.3
2.6
3.2
3.5
6.8
5.5
2.1
2.3
2.7
2.5
2.4
2.6
2.6
3.4
2.1
1.2
5.4
5.6
6.5
6.3
10.4
9.8
4.9
5.2
6.5
6.3
6.6
6.2
5.8
5.4
5.4
3.1
8.9
9.1
10.1
9.3
14.4
14.7
8.4
8.3
10.7
10.5
11.3
10.2
9.3
7.5
9.1
5.4
on a given path to t
PLH
FBL22031
= –40 to +85°C,
1.7
2.1
2.4
2.9
5.1
4.3
1.2
1.8
1.8
2.0
1.8
2.1
1.9
2.9
1.6
1.0
0.7
0.5
10.1
10.3
11.6
10.3
16.9
16.8
9.7
9.4
12.8
11.8
13.0
11.6
10.7
9.0
10.1
6.0
3.0
2.0
PLH
UNIT
ns
ns
ns
ns
ns
on any
1998 Sep 04
9
Page 10
Philips SemiconductorsProduct specification
Waveform 1, 2
ns
Waveform 1, 2
ns
3.3V BTL 9-bit latched/registered/pass-thru
universal transceiver with 30Ω termination
AC ELECTRICAL CHARACTERISTICS
A TO B 9 Ω LOAD SPECIFICATIONS
SYMBOLPARAMETER
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
TLH
t
THL
tSK(o)
tSK(p)
Propagation delay (thru latch)
An to Bn
Propagation delay (transparent latch)
An to Bn
Propagation delay
LCAB to Bn (latch)
Propagation delay
LCAB to Bn (register)
Propagation delay
SEL0 or SEL1 to Bn (inverting)
Propagation delay
SEL0 or SEL1 to Bn (non-inverting)
OEBn to BnWaveform 1, 2
Output transition time, Bn Port
(1.3V to 1.8V)
Output to output skew for multiple
channels
Pulse skew
t
PHL
– t
1
PLH
2
MAX
TEST
CONDITION
Waveform 1, 2
Waveform 1, 2
Test Circuit and
Waveforms
Waveform 30.41.02.0ns
Waveform 20.31.01.5ns
NOTES:
actual – tPMactual for any data input to output path compared to any other data input to output path where N and M are either LH or
1. t
PN
HL. Skew times are valid only under same test conditions (temperature, V
any other path or compares t
(p) is used to quantify duty cycle characteristics. In essence it compares the input signal duty cycle to the corresponding output signal
2. t
SK
duty cycle (50MHz input frequency and 50% duty cycle, tested on data paths only).
on a given path to t
PHL
on any other path.
PHL
, loading, etc.). tSK (0) compares t
CC
T
= +25°C,
amb
VCC = 3.3V,
T
amb
VCC = 3.3V±10%,
MINTYPMAXMINMAX
1.2
1.2
1.2
1.3
7.2
7.2
1.2
1.4
1.2
1.6
1.9
1.9
1.2
1.2
3.5
3.1
3.8
4.0
12.0
11.1
4.4
4.3
5.1
4.6
5.6
4.7
4.0
3.7
8.1
6.5
8.6
7.7
17.4
15.5
8.8
7.5
9.8
8.1
9.9
7.9
8.4
6.7
PLH
FBL22031
= –40 to +85°C,
1.0
1.0
1.0
1.0
5.3
5.6
1.0
1.0
1.0
1.1
1.0
1.3
1.0
1.0
1.2
0.4
on a given path to t
9.1
6.9
9.5
8.4
20.5
17.8
10.2
8.4
11.4
9.9
11.2
9.0
9.8
8.0
3.0
1.5
UNIT
ns
ns
ns
ns
PLH
on
1998 Sep 04
10
Page 11
Philips SemiconductorsProduct specification
Waveform 1, 2
ns
Waveform 1, 2
ns
3.3V BTL 9-bit latched/registered/pass-thru
universal transceiver with 30Ω termination
AC ELECTRICAL CHARACTERISTICS
A TO B 16.5 Ω LOAD SPECIFICATIONS
SYMBOLPARAMETER
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
TLH
t
THL
tSK(o)
tSK(p)
Propagation delay (thru latch)
An to Bn
Propagation delay (transparent latch)
An to Bn
Propagation delay
LCAB to Bn (latch)
Propagation delay
LCAB to Bn (register)
Propagation delay
SEL0 or SEL1 to Bn (inverting)
Propagation delay
SEL0 or SEL1 to Bn (non-inverting)
OEBn to BnWaveform 1, 2
Output transition time, Bn Port
(1.3V to 1.8V)
Output to output skew for multiple
channels
Pulse skew
t
PHL
– t
1
PLH
2
MAX
TEST
CONDITION
Waveform 1, 2
Waveform 1, 2
Test Circuit and
Waveforms
Waveform 30.41.02.0ns
Waveform 20.31.01.5ns
NOTES:
actual – tPMactual for any data input to output path compared to any other data input to output path where N and M are either LH or
1. t
PN
HL. Skew times are valid only under same test conditions (temperature, V
any other path or compares t
(p) is used to quantify duty cycle characteristics. In essence it compares the input signal duty cycle to the corresponding output signal
2. t
SK
duty cycle (50MHz input frequency and 50% duty cycle, tested on data paths only).
on a given path to t
PHL
on any other path.
PHL
, loading, etc.). tSK (0) compares t
CC
T
= +25°C,
amb
VCC = 3.3V,
T
amb
VCC = 3.3V±10%,
MINTYPMAXMINMAX
1.2
1.3
1.2
1.6
6.6
6.7
1.2
1.2
1.3
1.7
1.8
1.8
1.3
1.7
4.1
3.5
4.3
4.3
11.8
10.9
4.3
4.1
5.3
4.9
5.6
4.7
4.4
4.0
7.4
5.9
8.0
7.3
17.6
15.7
8.8
7.6
9.7
8.6
9.8
7.9
8.1
6.7
PLH
FBL22031
= –40 to +85°C,
1.0
1.1
1.0
1.2
4.8
5.2
1.0
1.0
1.0
1.3
1.0
1.1
1.0
1.0
1.2
0.4
on a given path to t
8.7
6.4
9.3
8.1
20.6
18.1
10.1
8.5
11.2
9.6
11.3
9.0
9.4
7.8
3.0
1.5
UNIT
ns
ns
ns
ns
PLH
on
1998 Sep 04
11
Page 12
Philips SemiconductorsProduct specification
SYMBOL
PARAMETER
UNIT
3.3V BTL 9-bit latched/registered/pass-thru
universal transceiver with 30Ω termination
AC SETUP REQUIREMENTS (Commercial)
TEST
CONDITION
ts(H)
ts(L)
th(H)
th(L)
ts(H)
t
(L)
s
th(H)
th(L)
tw(H)
tw(L)
AC WAVEFORMS
Setup time
An to LCAB
Hold time
An to LCAB
Setup time
Bn
to LCBA
Hold time
Bn to LCBA
Pulse width, High or Low
LCAB or LCBA
Waveform 4
Waveform 4
Waveform 4
Waveform 4
Waveform 4
LIMITS
T
T
= +25°C, VCC = 3.3V,
amb
amb
VCC = 3.3V±10%,
CL = 50pF (A side) / CD = 30pF (B side)
RL = 500Ω (A side) / RU = 16.5Ω (B side)
MINTYPMIN
1.0
1.0
1.0
1.0
2.0
2.0
0.0
0.0
3.0
3.0
FBL22031
= –40 to +85°C,
1.5
1.0
2.0
1.0
3.0
3.0
0.0
0.0
3.0
3.0
ns
ns
ns
ns
ns
Input
Output
V
M
t
PLH
V
M
t
PHL
V
M
V
M
Waveform 1. Propagation Delay for Data
or Output Enable to Output
An, Bn
An, Bn
V
M
tSK(o)
V
M
Waveform 3. Output to Output Skew
OEA
An
V
M
t
PZH
V
M
t
PHZ
V
M
VOH -0.3V
OV
Waveform 5. 3-State Output Enable Time to High Level
and Output Disable Time from High Level
NOTE: V
= 1.55V for Bn, V
M
The shaded areas indicate when the input is permitted to change for predictable output performance.
= 1.5V for all others.
M
Input
Output
V
M
t
(input)
w
t
PHL
V
M
t
(output)
w
V
M
t
PLH
V
M
Waveform 2. Propagation Delay for Data
or Output Enable to Output
V
An, Bn
LCAB, LCBA
M
t
t
s
h
V
M
t
(H)
w
1/f
MAX
tst
h
t
(L)
w
V
M
Waveform 4. Setup and Hold Times,
Pulse Widths and Maximum Frequency
OEA
V
M
t
PZL
An
V
M
t
PLZ
V
M
VOL +0.3V
Waveform 6. 3-State Output Enable Time to Low Level
and Output Disable Time from Low Level
SG00062
1998 Sep 04
12
Page 13
Philips SemiconductorsProduct specification
3.3V BTL 9-bit latched/registered/pass-thru
universal transceiver with 30Ω termination
TEST CIRCUIT AND WAVEFORMS
V
CC
7.0V
NEGATIVE
PULSE
POSITIVE
PULSE
Family
FB+
A Port
DEFINITIONS:
RL= Load Resistor; see AC CHARACTERISTICS for value.
CL= Load capacitance includes jig and probe capacitance; see AC
CHARACTERISTICS for value.
R
= Termination resistance should be equal to Z
T
CD= Load capacitance includes jig and probe capacitance; see AC
CHARACTERISTICS for value.
RU= Pull up resistor; see AC CHARACTERISTICS for value.
PULSE
GENERATOR
V
IN
R
T
D.U.T.
V
OUT
Test Circuit for 3-State Outputs on A Port
SWITCH POSITION
TESTSWITCH
t
PLZ,
All other
PULSE
GENERATOR
t
PZL
V
IN
Test Circuit for Outputs on B Port
BIAS
V
R
T
closed
open
V
CC
D.U.T.
V
OUT
R
L
R
C
L
L
2.0V (for RU = 9 Ω)
2.1V (for RU = 16.5 Ω)
R
U
C
D
90%
10%
t
W
V
M
10%
(tf)
t
THL
t
(tr)
TLH
90%
V
M
t
W
VM = 1.55V for Bn, VM = 1.5V for all others.
10%
90%
V
M
V
Input Pulse Definitions
INPUT PULSE REQUIREMENTS
Low V
0.0V
1.0VB Port
Rep. RateAmplitudet
1MHz3.0V
1MHz2.0V
t
W
500ns
of pulse generators.
OUT
FBL22031
90%
t
TLH
t
THL
M
10%
TLHtTHL
2.5ns
2.0ns500ns
2.5ns
2.0ns
AMP (V)
LOW V
(tr)
(tf)
AMP (V)
LOW V
SG00063
1998 Sep 04
13
Page 14
Philips SemiconductorsProduct specification
3.3V BTL 9-bit latched/registered/pass-thru
FBL22031
universal transceiver with 30Ω termination
Q30FP52: plastic quad flat package; 52 leads (lead length 1.6 mm); body 10 x 10 x 2.0 mmSOT379-1
1998 Sep 04
14
Page 15
Philips SemiconductorsProduct specification
3.3V BTL 9-bit latched/registered/pass-thru
Futurebus+ transceiver with 30Ω termination
Data sheet status
Data sheet
status
Objective
specification
Preliminary
specification
Product
specification
Product
status
Development
Qualification
Production
Definition
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1]
FBL22031
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print codeDate of release: 06-98
Document order number:9397-750-04398
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