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Excelics EMA303D
TENTATIVE DATA SHEET
16 - 26 GHz Medium Power MMIC
FEATURES
•• 16 -26 GHz BANDWIDTH
•• +22 dBm OUTPUT POWER @1dB Gain Compression
•• 25 dB TYPICAL SMALL SIGNAL GAIN
•• DUAL BIAS SUPPLY
•• 0.3 MICRON RECESSED “MUSHROOM” GATE
•• Si3N4 PASSIVATION
•• ADVANCED EPITAXIAL HETEROJUNCTION
PROFILE PROVIDES EXTRA HIGH POWER
EFFICIENCY, AND HIGH RELIABILITY
ELECTRICAL CHARACTERISTICS1 (Ta = 25 OC)
SYMBOL PARAMETERS/TEST CONDITIONS MIN TYP MAX UNIT
F
Operating Frequency Range 16 26 GHz
P
1dB
Ouput Power at 1dB Gain Compression @ Vdd=8V 22 dBm
Gss
Small Signal Gain 25 dB
∆∆Gss
Small Signal Gain Flatness
± 1.5
dB
NF
Noise Figure @ f=18GHz, Vdd=3.5V, Id=140mA 4 dB
VSWR in
Input VSWR 3.0:1
VSWR out
Output VSWR 2.0:1
Idd
Power Supply Current 140 mA
Vdd
Power Supply Voltage 6 8 V
MAXIMUM RATINGS AT 25OC
SYMBOLS PARAMETERS ABSOLUTE1 CONTINUOUS2
Vds
Drain-Source Voltage 12V 8V
Vgs
Gate-Source Voltage -8V -3V
Ids
Drain Current Idss 215mA
Igf
Forward Gate Current 50 mA 8.5mA
Pin
Input Power 15dBm @3dB Compression
Tch
Channel Temperature 175oC 150oC
Tstg
Storage Temperature -65/175oC -65/150oC
Pt
Total Power Dissipation 1 W 0.85 W
Note: 1. Exceeding any of the above ratings may result in permanent damage.
2. Exceeding any of the above ratings may reduce MTTF below design goals.
Excelics Semiconductor, Inc., 2908 Scott Blvd., Santa Clara, CA 95054
Phone: (408) 970-8664 Fax: (408) 970-8998 Web Site: www.excelics.com
Chip Size 1060 x 2500 microns
Chip Thickness: 75 ± 13 microns
All Dimensions In Microns
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EMA303D
TENTATIVE DATA SHEET
16 - 26 GHz Medium Power MMIC
S-PARAMETERS ( On wafer Sij measurements )
6V, 1/2 Idss
FREQ --- S11 --- --- S21 --- --- S12 --- --- S22 --(GHz) MAG ANG MAG ANG MAG ANG MAG ANG
11.0 0.46 165.5 2.26 62.4 0.0007 113.9 0.92 131.9
11.5 0.49 163.4 2.88 51.1 0.0007 113.0 0.92 127.8
12.0 0.51 159.7 3.61 34.5 0.0011 93.0 0.88 122.4
12.5 0.53 154.7 4.55 16.1 0.0011 95.3 0.87 117.2
13.0 0.54 148.9 5.62 -2.3 0.0007 90.5 0.88 111.6
13.5 0.54 142.4 6.86 -21.6 0.0005 75.3 0.89 105.0
14.0 0.53 136.3 8.26 -41.7 0.0004 107.5 0.91 96.8
14.5 0.51 130.9 9.72 -61.3 0.0002 138.1 0.95 89.7
15.0 0.50 125.8 11.62 -83.4 0.0005 112.6 0.94 77.0
15.5 0.48 121.0 13.59 -108.0 0.0008 102.4 0.88 61.0
16.0 0.46 116.3 15.19 -133.7 0.0008 104.4 0.76 43.3
16.5 0.44 111.5 16.35 -158.8 0.0010 102.7 0.61 24.6
17.0 0.42 106.4 17.30 176.7 0.0011 112.3 0.44 3.6
17.5 0.41 100.4 17.91 152.2 0.0011 116.9 0.27 -20.5
18.0 0.39 93.3 18.09 128.2 0.0010 86.1 0.12 -50.2
18.5 0.36 83.9 18.21 105.4 0.0007 65.2 0.03 -110.2
19.0 0.31 72.8 18.21 82.9 0.0005 7.2 0.04 164.3
19.5 0.25 61.7 18.07 60.2 0.0006 -17.8 0.05 152.3
20.0 0.18 51.4 17.87 38.4 0.0006 -5.7 0.07 152.6
20.5 0.10 43.0 17.76 16.2 0.0002 73.6 0.08 154.9
21.0 0.03 71.6 17.25 -5.4 0.0003 -157.9 0.09 149.2
21.5 0.06 159.1 16.73 -26.3 0.0006 167.5 0.08 151.5
22.0 0.13 158.3 16.54 -46.0 0.0010 163.9 0.06 160.8
22.5 0.19 148.8 16.62 -66.8 0.0013 163.6 0.07 -161.2
23.0 0.25 136.2 16.82 -88.2 0.0012 163.1 0.09 -142.1
23.5 0.29 121.5 16.79 -111.0 0.0012 131.5 0.14 -141.7
24.0 0.32 105.3 16.58 -134.5 0.0010 134.8 0.19 -144.1
24.5 0.33 88.8 16.07 -158.3 0.0007 130.4 0.22 -148.2
25.0 0.33 71.5 15.44 177.1 0.0008 110.6 0.27 -152.4
25.5 0.31 55.4 14.50 152.7 0.0007 124.6 0.31 -157.3
26.0 0.28 40.0 13.40 128.1 0.0004 92.4 0.34 -162.3
26.5 0.24 26.9 12.21 103.4 0.0005 94.3 0.38 -167.0
27.0 0.21 16.2 10.98 78.8 0.0006 118.2 0.41 -171.9
27.5 0.18 10.7 9.73 54.0 0.0007 104.2 0.44 -176.7
28.0 0.16 10.4 8.51 29.2 0.0011 82.6 0.45 178.5
28.5 0.17 11.3 7.29 4.4 0.0012 88.0 0.47 174.5
29.0 0.20 9.3 6.11 -20.1 0.0016 57.2 0.47 170.8
29.5 0.24 2.1 5.06 -43.9 0.0019 49.0 0.48 167.9
30.0 0.29 -7.9 4.13 -66.6 0.0010 28.0 0.49 165.4
30.5 0.33 -18.8 3.35 -88.2 0.0008 -15.6 0.50 162.9
31.0 0.37 -29.7 2.70 -108.5 0.0004 -64.6 0.52 160.2
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EMA303D
TENTATIVE DATA SHEET
16 - 26 GHz Medium Power MMIC
ASSEMBLY DRAWING
50 ohm line on Alumina
RF INPUT
50pF
50pF
V
dd
50 ohm line on Alumina
V
GG
RF OUTPUT
0.1 uF
0.1 uF
The length of RF wires should be as short as possible. Use at least two wires between RF pad and 50 ohm line and
separate the wires to minimize the mutual inductance.
CHIP OUTLINE
Chip Size 1060 x 2500 microns
Chip Thickness: 75 ± 13 microns
PAD Dimensions: 1. DC 100 x 100 microns
2. RF 80 x 68 microns
All Dimensions In Microns
0
0
1060
2500
2350
680
55 0
750
V
GG
1
V
D
1
V
D
3
RF IN
RF OUT
1150
2065
GND
GND
for DC check
1500
V D2
V
GG
1
V
GG
1
700
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EMA303D
TENTATIVE DATA SHEET
16 - 26 GHz Medium Power MMIC
TYPICAL PERFORMANCE DATA
Input / Output Return Loss
Vdd=6V 1/2 Idss
-40
-30
-20
-10
0
10 15 20 25 30
frequency [GHz]
Return Loss [dB]
S11
Small Siganal Gain
Vdd=6V 1/2 Idss
10
15
20
25
30
10.0 15.0 20.0 25.0 30.0
frequency [GHz]
Gain [dB]
P1dB
15
17
19
21
23
25
15 20 25 30
frequency [GHz]
P1dB [dB]
8V
6V
5v
NF & Gain
f=18G Vdd=3.5V
0
5
10
15
20
25
30
50 100 150 200
Drain current [mA]
Gain & NF [dB]
gain
NF
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