•74ABTH16827A incorporates bus-hold data inputs which
eliminate the need for external pull-up resistors to hold unused
inputs
•Output capability: +64mA/-32mA
•Latch-up protection exceeds 500mA per Jedec Std 17
•ESD protection exceeds 2000 V per MIL STD 883 Method 3015
and 200 V per Machine Model
QUICK REFERENCE DATA
SYMBOLPARAMETER
C
t
PLH
t
PHL
C
OUT
I
CCZ
I
CCL
IN
Propagation delay
nAx to nYx
Input capacitanceVI = 0V or V
Output capacitanceVO = 0V or VCC; 3-State6pF
pp
DESCRIPTION
The 74ABT16827A high-performance BiCMOS device combines
low static and dynamic power dissipation with high speed and high
output drive.
The 74ABT16827A 20-bit buffers provide high performance bus
interface buffering for wide data/address paths or buses carrying
parity. They have NOR Output Enables (nOE
control flexibility.
Two options are available, 74ABT16827A which does not have the
bus-hold feature and 74ABTH16827A which incorporates the
bus-hold feature.
Outputs disabled; VCC = 5.5V500µA
74ABT16827A
74ABTH16827A
1, nOE2) for maximum
CONDITIONS
T
= 25°C; GND = 0V
amb
CL = 50pF; VCC = 5V
CC
Outputs Low; VCC = 5.5V9mA
TYPICALUNIT
1.7
1.4
4pF
ns
ORDERING INFORMATION
PACKAGESTEMPERATURE RANGE OUTSIDE NORTH AMERICANORTH AMERICADWG NUMBER
56-Pin Plastic SSOP Type III–40°C to +85°C74ABT16827A DLBT16827A DLSOT371-1
56-Pin Plastic TSSOP Type II–40°C to +85°C74ABT16827A DGGBT16827A DGGSOT364-1
56-Pin Plastic SSOP Type III–40°C to +85°C74ABTH16827A DLBH16827A DLSOT371-1
56-Pin Plastic TSSOP Type II–40°C to +85°C74ABTH16827A DGGBH16827A DGGSOT364-1
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.
3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
DC supply voltage–0.5 to +7.0V
DC input diode currentVI < 0–18mA
DC input voltage
I
DC output diode currentVO < 0–50mA
DC output voltage
High-level output voltageVCC = 5.0V; IOH = -3mA; VI = VIL or V
OH
VCC = 4.5V; IOH = -32mA; VI = VIL or V
Low-level output voltageVCC = 4.5V; IOL = 64mA; VI = VIL or V
OL
I
Input leakage currentVCC = 5.5V; VI = GND or 5.5V±0.01±1.0±1.0µA
I
IH
IH
IH
IH
2.52.92.5V
3.03.43.0V
2.02.42.0V
0.420.550.55V
VCC = 5.5V; VI = 5.5V0.0111µA
Input leakage current
I
I
VCC = 5.5V; VI = VCC or GND
VCC = 5.5V; VI = V
CC
VCC = 5.5V; VI = 0
Control
pins
p
±0.01±1±1µA
0.0111µA
–1–3–5µA
VCC = 4.5V; VI = 0.8V3535
I
HOLD
Bus Hold current A inputs
VCC = 4.5V; VI = 2.0V–75–75
VCC = 5.5V; VI = 0 to 5.5V±800
I
OFF
IPU/I
I
OZH
I
OZL
I
CEX
I
CCH
I
CCL
I
CCZ
∆I
NOTES:
1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
Power-off leakage currentVCC = 0.0V; VO = 4.5V; VI = 0V or 5.5V±5.0±100±100µA
Power-up/down 3-State
PD
output current
3
3-State output High currentVCC = 5.5V; VO = 2.7V; VI = VIL or V
3-State output Low currentVCC = 5.5V; VO = 0.5V; VI = VIL or V
Output High leakage
current
I
O
Output current
1
Quiescent supply currentVCC = 5.5V; Outputs Low, VI = GND or V
Additional supply current
CC
per input pin
2
VCC = 2.1V; VO = 0.5V; VI = GND or VCC;
VOE = Don’t care
IH
IH
VCC = 5.5V; VO = 5.5V; VI = GND or V
CC
±5.0±50±50µA
1.01010µA
–1.0–10–10µA
1.05050µA
VCC = 5.5V; VO = 2.5V–50–70–180–50–180mA
VCC = 5.5V; Outputs High, VI = GND or
V
CC
VCC = 5.5V; Outputs 3-State;
VI = GND or V
CC
VCC = 5.5V; one input at 3.4V,
other inputs at VCC or GND
CC
0.511mA
91919mA
0.511mA
0.211mA
2. This is the increase in supply current for each input at 3.4V.
3. This parameter is valid for any VCC between 0V and 2.1V with a transition time of up to 10msec. From VCC = 2.1V to VCC = 5V ± 10% a
transition time of up to 100µsec is permitted.
4. Unused pins at V
5. This is the bus hold overdrive current required to force the input to the opposite logic state.
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1]
74ABT16827A
74ABTH16827A
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print codeDate of release: 05-96
Document order number:9397-750-03504
yyyy mmm dd
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