Datasheet 74ABTH16374BDL, 74ABTH16374BDGG, 74ABT16374BDL, 74ABT16374BDGG Datasheet (Philips)

Page 1
INTEGRATED CIRCUITS
74ABT16374B 74ABTH16374B
16-bit D-type flip-flop; positive-edge trigger (3-State)
Product specification Supersedes data of 1995 Sep 28 IC23 Data Handbook
 
1998 Feb 27
Page 2
Philips Semiconductors Product specification
Quiescent su ly current
16-bit D-type flip-flop; positive-edge trigger (3-State)
FEA TURES
Two 8-bit positive edge triggered registers
Live insertion/extraction permitted
Power-up 3-State
Power-up reset
Multiple V
and GND pins minimize switching noise
CC
3-State output buffers
74ABTH16373B incorporates bus-hold data inputs which
eliminate the need for external pull-up resistors to hold unused inputs
Bus-hold data inputs eliminate the need for external pull-up
resistors to hold unused inputs
Output capability: +64mA/–32mA
Latch-up protection exceeds 500mA per JEDEC Std 17
ESD protection exceeds 2000V per MIL STD 883 Method 3015
and 200V per Machine Model
DESCRIPTION
The 74ABT16374B high-performance BiCMOS device combines low static and dynamic power dissipation with high speed and high output drive.
The 74ABT16374B has two 8-bit, edge triggered registers, with each register coupled to eight 3-State output buffers. The two sections of each register are controlled independently by the clock (nCP) and Output Enable (nOE
Each register is fully edge triggered. The state of each D input, one set-up time before the Low-to-High clock transition, is transferred to the corresponding flip-flop’s Q output.
The 3-State output buffers are designed to drive heavily loaded 3-State buses, MOS memories, or MOS microprocessors. Each active-Low Output Enable (nOE its register independent of the clock operation.
When nOE register. When nOE is High, the outputs for that register are in the High-impedance “OFF” state, which means they will neither drive nor load the bus.
Two options are available, 74ABT16374B which does not have the bus-hold feature and 74ABTH16374B which incorporates the bus-hold feature.
) control gates.
is Low, the stored data appears at the outputs for that
74ABT16374B
74ABTH16374B
) controls all eight 3-State buffers for
QUICK REFERENCE DATA
SYMBOL PARAMETER
C
t
PLH
t
PHL
C
OUT
I
CCZ
I
CCL
Propagation delay nCP to nQx
Input capacitance VI = 0V or V
IN
Output capacitance VO = 0V or VCC; 3-State 7 pF
pp
CL = 50pF; VCC = 5V
Outputs disabled; VCC = 5.5V 500 µA Outputs Low; VCC = 5.5V 8 mA
CONDITIONS
T
= 25°C; GND = 0V
amb
CC
TYPICAL UNIT
2.6
2.2 4 pF
ORDERING INFORMATION
PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER
48-Pin Plastic SSOP Type III –40°C to +85°C 74ABT16374B DL BT16374B DL SOT370-1 48-Pin Plastic TSSOP Type II –40°C to +85°C 74ABT16374B DGG BT16374B DGG SOT362-1 48-Pin Plastic SSOP Type III –40°C to +85°C 74ABTH16374B DL BH16374B DL SOT370-1 48-Pin Plastic TSSOP Type II –40°C to +85°C 74ABTH16374B DGG BH16374B DGG SOT362-1
ns
PIN DESCRIPTION
PIN NUMBER SYMBOL FUNCTION
47, 46, 44, 43, 41, 40, 38, 37 36, 35, 33, 32, 30, 29, 27, 26
2, 3, 5, 6, 8, 9, 11, 12
13, 14, 16, 17, 19, 20, 22, 23
4, 10, 15, 21, 28, 34, 39, 45 GND Ground (0V)
1998 Feb 27 853-1752 19027
1D0 – 1D7 2D0 – 2D7
1Q0 – 1Q7 2Q0 – 2Q7
1, 24 1OE, 2OE
48, 25 1CP, 2CP
7, 18, 31, 42 V
CC
Data inputs
Data outputs
Output enable inputs (active-Low)
Clock pulse inputs (active rising edge)
Positive supply voltage
LOGIC SYMBOL
48
25 24
2
1
47 46 44 43
1D0 1D1 1D2 1D3
1CP 1OE
1Q0 1Q1 1Q2651Q3
32
36 35 33 32
2D02D21 2D2 2D3
2CP 2OE
2Q0 2Q1 2Q2 2Q3
1413 1716
41 40 38 37
1D4 1D5 1D6 1D7
1Q4 1Q5 1Q6
30 29 27 26
2D4 2D5 2D6 2D7
2Q4 2Q5 2Q6 2Q7
98
2019 2322
SH00078
1Q7
1211
Page 3
Philips Semiconductors Product specification
16-bit D-type flip-flop; positive-edge trigger (3-State)
LOGIC SYMBOL (IEEE/IEC)
1OE
1CP
2OE
2CP
1D0 1D1 1D2 1D3 1D4 1D5 1D6 1D7 2D0
2D1 2D2 2D3 2D4 2D5 2D6 2D7
1 48 24 25
47 46 44 43 41 40 38 37 36 35 33 32 30 29 27
1EN
2EN
1D
2D
C1
C2
1
2
2 3 5 6 8
9 11 12 13 14 16 17 19 20 22 2326
SH00077
1Q0 1Q1 1Q2 1Q3 1Q4 1Q5 1Q6 1Q7 2Q0
2Q1 2Q2 2Q3 2Q4 2Q5 2Q6 2Q7
PIN CONFIGURATION
1
1OE
2
1Q0
1Q1
3
GND
4
1Q2
5 6
1Q3
7
V
CC
8
1Q4 1Q5
9
GND
10
1Q6
11
1Q7
12
2Q0
13
2Q1
14
GND
15 16
2Q2 2Q3
17 18
V
CC
2Q4
19 20
2Q5
21
GND
22
2Q6
23
2Q7
24
2OE
74ABT16374B
74ABTH16374B
48
1CP
47
1D0 1D1
46
GND
45
1D2
44 43
1D3
42
V
CC
41
1D4 1D5
40
GND
39
1D6
38
1D7
37
2D0
36
2D1
35
GND
34 33
2D2 2D3
32 31
V
CC
2D4
30 29
2D5
28
GND
27
2D6
26
2D7
25
2CP
SA00326
LOGIC DIAGRAM
nD0
nCP
nOE
D
CP Q
nQ0
nD1
nD2
D
CP Q
nQ1 nQ2 nQ3 nQ4 nQ5 nQ6 nQ7
D
CP Q
nD3
D
CP Q
nD4
D
CP Q
nD5
D
CP Q
nD6
D
CP Q
nD7
D
CP Q
SA00327
1998 Feb 27
3
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Philips Semiconductors Product specification
OPERATING MODE
I
DC output current
mA
SYMBOL
PARAMETER
UNIT
16-bit D-type flip-flop; positive-edge trigger (3-State)
74ABT16374B
74ABTH16374B
FUNCTION TABLE
INPUTS
nOE nCP nDx
L L
L X NC NC Hold
H H
H = High voltage level h = High voltage level one set-up time prior to the High-to-Low E transition L = Low voltage level l = Low voltage level one set-up time prior to the High-to-Low E transition NC= No change X = Don’t care Z = High impedance “off” state = Low-to-High clock transition
= Not a Low-to-High clock transition
↑ ↑
↑ ↑
l
h
X
nDx
ABSOLUTE MAXIMUM RATINGS
SYMBOL
V
CC
I
IK
V
I
OK
V
OUT
OUT
T
stg
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability .
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.
3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
DC supply voltage –0.5 to +7.0 V DC input diode current VI < 0 –18 mA DC input voltage
I
DC output diode current VO < 0 –50 mA DC output voltage
Storage temperature range –65 to 150 °C
PARAMETER CONDITIONS RATING UNIT
3
3
p
INTERNAL REGISTER
L H
NC
nDx
1, 2
OUTPUTS
nQ0 – nQ7
L
H
Z Z
output in Off or High state –0.5 to +5.5 V
output in Low state 128
output in High state –64
Load and read register
Disable outputs
–1.2 to +7.0 V
RECOMMENDED OPERATING CONDITIONS
1998 Feb 27
LIMITS
MIN MAX
V
CC
V
V
V
I
OH
I
OL
t/v Input transition rise or fall rate 0 10 ns/V
T
amb
DC supply voltage 4.5 5.5 V Input voltage 0 V
I
High-level input voltage 2.0 V
IH
Low-level Input voltage 0.8 V
IL
High-level output current –32 mA Low-level output current 64 mA
Operating free-air temperature range –40 +85 °C
4
CC
V
Page 5
Philips Semiconductors Product specification
I
t
I
g
V
V
V
GND
0.01±1±1µA
I
74ABT16374B
CC I CC
µ
In ut leakage current
Data pins
5
6
74ABTH16374B
16-bit D-type flip-flop; positive-edge trigger (3-State)
DC ELECTRICAL CHARACTERISTICS
SYMBOL PARAMETER TEST CONDITIONS T
MIN TYP MAX MIN MAX
V
V
OH
V
OL
V
RST
I
Input clamp voltage VCC = 4.5V; IIK = –18mA –0.9 –1.2 –1.2 V
IK
VCC = 4.5V; IOH = –3mA; VI = VIL or V
High-level output voltage VCC = 5.0V; IOH = –3mA; VI = VIL or V
VCC = 4.5V; IOH = –32mA; VI = VIL or V Low-level output voltage VCC = 4.5V; IOL = 64mA; VI = VIL or V Power-up output voltage
I
nput leakage curren
3
VCC = 5.5V; IO = 1mA; VI = GND or V
;
= 5.5V;
CC
=
I
CC
VCC = 5.5V; VI = VCC or
I
p
74ABTH16374B VCC = 5.5V; VI = V
GND
CC
VCC = 5.5V; VI = 0
or
IH IH
IH
IH
CC
Control pins ±0.01 ±1 ±1
p
VCC = 4.5V; VI = 0.8V 50 50
I
HOLD
Bus Hold current inputs 74ABTH16374B
VCC = 4.5V; VI = 2.0V –75 –75
VCC = 5.5V; VI = 0 to 5.5V ±800
I
OFF
I
PU/PD
I
OZH
I
OZL
I
CEX
I
I
CCH
I
CCL
I
CCZ
I
I
O
CC
CC
Power-off leakage current VCC = 0.0V; VO or VI 4.5V ±5.0 ±100 ±100 µA Power-up/down 3-State
output current
4
3-State output High current VCC = 5.5V; VO = 2.7V; VI = VIL or V 3-State output Low current VCC = 5.5V; VO = 0.5V; VI = VIL or V Output High leakage current VCC = 5.5V; VO = 5.5V; VI = GND or V Output current
1
Quiescent supply current VCC = 5.5V; Outputs Low, VI = GND or V
VCC = 2.1V; VO = 0.5V;
VI = GND or VCC; VOE = GND
IH IH
CC
VCC = 5.5V; VO = 2.5V –50 –70 –180 –50 –180 mA
VCC = 5.5V; Outputs High, VI = GND or V
CC CC
VCC = 5.5V; Outputs 3-State;
Additional supply current per input pin
2
74ABT16374B Additional supply current
per input pin
2
74ABTH16374B
VI = GND or V
VCC = 5.5V; one input at 3.4V, other inputs at
V
or GND
CC
VCC = 5.5V; one input at 3.4V, other inputs at
VCC or GND
CC
NOTES:
1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
2. This is the increase in supply current for each input at 3.4V.
3. For valid test results, data must not be loaded into the flip-flops (or latches) after applying the power.
4. This parameter is valid for any V transition time of up to 100µsec is permitted.
5. Unused pins at V
6. This is the bus hold overdrive current required to force the input to the opposite logic state.
or GND.
CC
between 0V and 2.1V with a transition time of up to 10msec. From VCC = 2.1V to VCC = 5V ± 10% a
CC
= +25°C
amb
2.5 2.9 2.5
3.0 3.4 3.0
2.0 2.4 2.0
0.42 0.55 0.55 V
0.13 0.55 0.55 V
0.01 1 1 –1 –3 –5
±5.0 ±50 ±50 µA
0.5 10 10 µA
–0.5 –10 –10 µA
5.0 50 50 µA
0.5 2 2 mA 8 19 19 mA
0.5 2 2 mA
5 100 100 µA
0.5 1.5 1.5 mA
74ABTH16374B
LIMITS
74ABT16374B
T
= –40°C
amb
to +85°C
UNIT
V
µA
µA
1998 Feb 27
5
Page 6
Philips Semiconductors Product specification
16-bit D-type flip-flop; positive-edge trigger (3-State)
AC CHARACTERISTICS
GND = 0V, tR = tF = 2.5ns, CL = 50pF, RL = 500
SYMBOL PARAMETER WAVEFORM
f
MAX
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
AC SETUP REQUIREMENTS
GND = 0V, tR = tF = 2.5ns, CL = 50pF, RL = 500
SYMBOL PARAMETER WAVEFORM
ts(H) t
(L)
s
th(H) th(L)
tw(H) tw(L)
Maximum clock frequency 1 180 260 MHz Propagation delay
nCP to nQx Output enable time
to High and Low level Output disable time
from High and Low level
Setup time, High or Low nDx to nCP
Hold time, High or Low nDx to nCP
nCP pulse width High or Low
1 3
4 3
4
2
2
1
74ABT16374B
74ABTH16374B
LIMITS
T
= +25°C
amb
VCC = +5.0V
MIN TYP MAX MIN MAX
1.7
1.4
1.3
1.3
1.9
1.7
2.6
2.2
2.4
2.3
3.1
2.6
T
= +25°C
amb
VCC = +5.0V
4.0
3.4
3.7
3.4
4.6
4.0
MIN TYP MIN
1.0
1.0
1.0
1.0
2.8
2.8
0.3
0.1
–0.1 –0.3
1.2
1.5
LIMITS
T
= –40 to +85°C
amb
VCC = +5.0V ±0.5V
1.7
1.4
1.3
1.3
1.9
1.7
T
= –40 to +85°C
amb
VCC = +5.0V ±0.5V
1.0
1.0
1.0
1.0
2.8
2.8
4.7
3.9
4.7
4.6
5.5
4.4
UNIT
ns
ns
ns
UNIT
ns
ns
ns
AC WAVEFORMS
VM = 1.5V, VIN = GND to 3.0V
1/f
MAX
nCP
nQx
Waveform 1. Propagation Delay, Clock Input to Output, Clock
Pulse Width, and Maximum Clock Frequency
VM VM VM
tw(H) tw(L)
t
PHL
VM VM
t
PLH
SA00328
nDx
nCP
NOTE: The shaded areas indicate when the input is permitted to
change for predictable output performance.
V
V
M
M
t
(H) th(H) ts(L) th(L)
s
V
M
V
MVM
Waveform 2. Data Setup and Hold Times
V
M
SA00329
1998 Feb 27
6
Page 7
Philips Semiconductors Product specification
16-bit D-type flip-flop; positive-edge trigger (3-State)
OE
V
M
t
PZH
nQx
Waveform 3. 3-State Output Enable Time to High Level and
Output Disable Time from High Level
TEST CIRCUIT AND WAVEFORM
V
PULSE
GENERATOR
IN
R
T
Test Circuit for 3-State Outputs
SWITCH POSITION
TEST SWITCH
t
PLZ
t
PZL
All other open
closed closed
V
V
M
V
D.U.T.
CC
M
t
PHZ
V
OUT
V
OH
VOH –0.3V
0V
SH00079
7.0V
R
L
C
L
R
L
74ABT16374B
74ABTH16374B
OE
nQx
Waveform 4. 3-State Output Enable Time to Low Level and
Output Disable Time from Low Level
90%
NEGATIVE PULSE
POSITIVE PULSE
10%
V
M
t
PZL
V
M
10% 10%
(tF)
t
THL
t
(tR)t
TLH
90% 90%
V
M
V
M
t
PLZ
V
M
t
W
V
M
V
M
t
W
90%
10%
VOL + 0.3V V
t
TLH
THL
OL
SH00080
0V
(tR)
(tF)
0V
VM = 1.5V
Input Pulse Definition
AMP (V)
AMP (V)
DEFINITIONS
RL = Load resistor; see AC CHARACTERISTICS for value. C
= Load capacitance includes jig and probe capacitance;
L
see AC CHARACTERISTICS for value.
RT = Termination resistance should be equal to Z
pulse generators.
1998 Feb 27
OUT
of
FAMILY
INPUT PULSE REQUIREMENTS
Amplitude Rep. Rate t
t
W
t
R
F
74ABT/H16 3.0V 1MHz 500ns 2.5ns 2.5ns
SA00018
7
Page 8
Philips Semiconductors Product specification
Dual octal D-type flip-flop; positive-edge trigger (3-State)
SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm SOT370-1
74ABT16374B
74ABTH16374B
1998 Feb 27
8
Page 9
Philips Semiconductors Product specification
Dual octal D-type flip-flop; positive-edge trigger (3-State)
TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1mm SOT362-1
74ABT16374B
74ABTH16374B
1998 Feb 27
9
Page 10
Philips Semiconductors Product specification
16-bit D-type flip-flop; positive-edge trigger (3-State)
Data sheet status
Data sheet status
Objective specification
Preliminary specification
Product specification
Product status
Development
Qualification
Production
Definition
This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make chages at any time without notice in order to improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
[1]
74ABT16374B
74ABTH16374B
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print code Date of release: 05-96 Document order number: 9397-750-03492
 
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