Product specification
Supersedes data of 1997 Jun 12
IC23 Data Handbook
1998 Feb 25
Page 2
Philips SemiconductorsProduct specification
Quiescent su ly current
16-bit buffer/driver (3-State)
74ABT16241A
74ABTH16241A
FEA TURES
•16-bit bus interface
•3-State buffers
•Output capability: +64mA/-32mA
•TTL input and output switching levels
•Input and output interface capability to systems at 5V supply
•Bus-hold data inputs eliminate the need for external pull-up
resistors to hold unused inputs
•Live insertion/extraction permitted
•Power-up 3-State
•74ABTH16241A incorporates bus hold data inputs which eliminate
the need for external pull up resistors to hold unused inputs
•Latch-up protection exceeds 500mA per JEDEC Std 17
•ESD protection exceeds 2000V per MIL STD 883 Method 3015
and 200V per Machine Model
QUICK REFERENCE DATA
SYMBOLPARAMETER
t
PLH
t
PHL
C
IN
C
OUT
I
CCZ
I
CCL
ORDERING INFORMATION
PACKAGESTEMPERATURE RANGE OUTSIDE NORTH AMERICANORTH AMERICADWG NUMBER
48-Pin Plastic SSOP Type III–40°C to +85°C74ABT16241A DLBT16241A DLSOT370-1
48-Pin Plastic TSSOP Type II–40°C to +85°C74ABT16241A DGGBT16241A DGGSOT362-1
48-Pin Plastic SSOP Type III–40°C to +85°C74ABTH16241A DLBH16241A DLSOT370-1
48-Pin Plastic TSSOP Type II–40°C to +85°C74ABTH16241A DGGBH16241A DGGSOT362-1
Propagation delay
nAx to nYx
CL = 50pF;
VCC =
Input capacitance nOEVI = 0V or 3.0V4pF
Output capacitanceOutputs disabled; VO = 0V or6pF
pp
Outputs disabled; VCC =500µA
Outputs low; VCC = 5.5V8mA
DESCRIPTION
The 74ABT16241A is a high-performance BiCMOS device which
combines low static and dynamic power dissipation with high speed
and high output drive.
This device is a 16-bit buffer that is ideal for driving bus lines. The
device features four Output Enables (1OE, 2OE, 3OE, 4OE), each
controlling four of the 3-State outputs.
Two options are available, 74ABT16241A which does not have the
bus hold feature and 74ABTH16241A which incorporates the bus
hold feature.
CONDITIONS
T
= 25°C
amb
TYPICALUNIT
1.8
1.6
ns
LOGIC SYMBOL
47
46
44
43
1
41
40
38
37
48
1998 Feb 25853-1991 19019
1A0
1A1
1A2
1A3
1OE
2A0
2A1
2A2
2A3
2OE
1Y0
1Y1
1Y2
1Y3
2Y0
2Y1
2Y2
2Y3
3A0
2
36
3A1
3
35
3A2
5
33
3A3
6
32
3OE
25
4A0
8
30
4A1
9
29
4A2
11
27
4A3
12
26
4OE
24
3Y0
3Y1
3Y2
3Y3
4Y0
4Y1
4Y2
4Y3
SA00432
13
14
16
17
19
20
22
23
2
Page 3
Philips SemiconductorsProduct specification
16-bit buffer/driver (3-State)
PIN CONFIGURA TION
1
1OE
2
1Y0
1Y1
3
GND
4
1Y2
5
1Y3
6
V
7
CC
2Y0
8
2Y1
9
GND
10
2Y2
11
2Y3
12
3Y0
13
3Y1
14
GND
15
3Y2
16
3Y4
17
V
18
CC
4Y0
19
4Y1
20
GND
21
4Y2
22
4Y3
23
4OE
24
SA00434
PIN DESCRIPTION
PIN NUMBERSYMBOLNAME AND FUNCTION
47, 46, 44, 43,
41, 40, 38, 37,
36, 35, 33, 32,
30, 29, 27, 26
2, 3, 5, 6,
8, 9, 11, 12,
13, 14, 16, 17,
19, 20, 22, 23
1, 48, 25, 24
4, 10, 15, 21,
28, 34, 39, 45
7, 18, 31, 42V
1A0-1A3
2A0-2A3
3A0-3A3
4A0-4A3
1Y0-1Y3
2Y0-2Y3
3Y0-3Y3
4Y0-4Y3
1OE, 2OE,
3OE, 4OE
GNDGround (0V)
CC
2OE
48
1A0
47
1A1
46
GND
45
1A2
44
1A3
43
V
42
CC
2A0
41
2A1
40
GND
39
2A2
38
2A3
37
3A0
36
3A1
35
GND
34
3A2
33
3A3
32
V
31
CC
30
4A0
4A1
29
GND
28
27
4A2
26
4A3
25
3OE
Data inputs
Data outputs
Output enables
Positive supply voltage
74ABT16241A
74ABTH16241A
LOGIC SYMBOL (IEEE/IEC)
1
1OE
48
2OE
25
3OE
24
4OE
47
1A1
46
1A2
44
1A3
43
1A4
41
2A1
40
2A2
38
2A3
37
2A4
36
3A1
35
3A2
33
3A3
32
3A4
30
4A1
29
4A2
27
4A3
26
4A4
FUNCTION TABLE
InputsOutputs
1OE, 4OE1An, 4An1Yn, 4Yn
LLL
LHH
HXZ
2OE, 3OE2An, 3An2Yn, 3Yn
HLL
HHH
LXZ
H = High voltage level
L = Low voltage level
X = Don’t care
Z = High Impedance “off” state
EN1
EN2
EN3
EN4
1 ∇
1
2 ∇1
3 ∇1
4 ∇1
2
1Y1
3
1Y2
5
1Y3
6
1Y4
8
2Y1
9
2Y2
11
2Y3
12
2Y4
13
3Y1
14
3Y2
16
3Y3
17
3Y4
19
4Y1
20
4Y2
22
4Y3
23
4Y4
SA00433
1998 Feb 25
3
Page 4
Philips SemiconductorsProduct specification
I
DC output current
mA
SYMBOL
PARAMETER
UNIT
16-bit buffer/driver (3-State)
ABSOLUTE MAXIMUM RATINGS
SYMBOL
V
V
CC
I
IK
V
I
OK
OUT
OUT
T
stg
DC supply voltage-0.5 to +7.0V
DC input diode currentVI < 0–18mA
DC input voltage
I
DC output diode currentVO < 0–50mA
DC output voltage
p
Storage temperature range-65 to +150°C
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.
3. The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.
PARAMETERCONDITIONSRATINGUNIT
3
3
RECOMMENDED OPERATING CONDITIONS
V
CC
V
V
V
I
OH
I
OL
∆t/∆vInput transition rise or fall rate; Outputs enabled010ns/V
T
amb
DC supply voltage4.55.5V
Input voltage0V
I
High-level input voltage2.0V
IH
Input voltage0.8V
IL
High-level output current–32mA
Low-level output current32mA
Low-level output current; current duty cycle ≤ 50%; f ≥ 1kHz64
VCC = 5.0V; IOH = –3mA; VI = VIL or V
VCC = 4.5V; IOH = –32mA; VI = VIL or V
Low-level output voltageVCC = 4.5V; IOL = 64mA; VI = VIL or V
OL
I
Input leakage currentVCC = 5.5V; VI = GND or 5.5V±0.01±1.0±1.0µA
I
VCC = 5.5V; VI = VCC or GND
I
I
p
74ABTH16241A
VCC = 5.5V; VI = V
CC
VCC = 5.5V; VI = 0
IH
IH
IH
IH
Control
pins
p
VCC = 4.5V; VI = 0.8V7575
I
HOLD
us Hold current A inputs
74ABTH16241A
VCC = 4.5V; VI = 2.0V–75–75
VCC = 5.5V; VI = 0 to 5.5V±500
I
OFF
IPU/I
I
OZH
I
OZL
I
CEX
I
CCH
I
CCL
I
CCZ
∆I
Power-off leakage currentVCC = 0.0V; VO or VI ≤ 4.5V±5.0±100±100µA
Power-up/down 3-State
PD
output current
3-State output High currentVCC = 5.5V; VO = 2.7V; VI = VIL or V
3-State output Low currentVCC = 5.5V; VO = 0.5V; VI = VIL or V
Output high leakage currentVCC = 5.5V; VO = 5.5V; VI = GND or V
I
O
Output current
1
pp
VCC = 2.0V; VO = 0.5V; VI = GND or VCC;
VOE = V
CC
IH
IH
CC
VCC = 5.5V; VO = 2.5V–50–70–180–50–180mA
VCC = 5.5V; Outputs High, VI = GND or V
VCC = 5.5V; Outputs Low, VI = GND or V
CC
CC
VCC = 5.5V; Outputs 3-State;
Additional supply current per
CC
input pin
2
VI = GND or V
Outputs enabled, one input at 3.4V , other
inputs at VCC or GND; VCC = 5.5V
CC
NOTES:
1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
2. This is the increase in supply current for each input at 3.4V .
3. This is the bus hold overdrive current required to force the input to the opposite logic state.
Waveform 1. Input (nAx) to Output (nYx) Propagation Delays
TEST CIRCUIT AND WAVEFORMS
is less
0V
V
OH
V
M
V
OL
SA00016
74ABT16241A
74ABTH16241A
CC
nOE INPUT
nYx OUTPUT
nYx OUTPUT
V
M
t
PZL
V
M
t
PZH
V
M
Waveform 2. 3-State Output Enable and Disable Times
V
M
0V
t
PLZ
t
PHZ
3.5V
VOL + 0.3V
V
OL
V
OH
VOH – 0.3V
0V
SH00092
V
CC
R
PULSE
GENERATOR
V
IN
R
D.U.T.
T
V
OUT
C
L
L
R
L
Test Circuit for 3-State Outputs
SWITCH POSITION
TESTSWITCH
t
t
PLZ
PZL
closed
7V
All otheropen
DEFINITIONS
RL = Load resistor; see AC CHARACTERISTICS for value.
C
= Load capacitance includes jig and probe capacitance;
L
see AC CHARACTERISTICS for value.
R
= Termination resistance should be equal to Z
T
pulse generators.
OUT
of
t
7.0V
GND
OPEN
90%
NEGATIVE
PULSE
POSITIVE
PULSE
10%
V
M
10%10%
t
THL
t
TLH
90%90%
V
M
W
V
M
(tF)
(tR)t
V
t
W
VM = 1.5V
Input Pulse Definition
INPUT PULSE REQUIREMENTS
FAMILY
AmplitudeRep. Ratet
W
74ABT163.0V1MHz500ns 2.5ns2.5ns
AMP (V)
90%
0V
(tR)
t
TLH
(tF)
THL
AMP (V)
M
10%
0V
t
t
R
F
SH00093
1998 Feb 25
6
Page 7
Philips SemiconductorsProduct specification
16-bit buffer/driver (3-State)
74ABT16241A
74ABTH16241A
SSOP48:plastic shrink small outline package; 48 leads; body width 7.5 mmSOT370-1
1998 Feb 25
7
Page 8
Philips SemiconductorsProduct specification
16-bit buffer/driver (3-State)
74ABT16241A
74ABTH16241A
TSSOP48:plastic thin shrink small outline package; 48 leads; body width 6.1mmSOT362-1
1998 Feb 25
8
Page 9
Philips SemiconductorsProduct specification
16-bit buffer/driver (3-State)
74ABT16241A
74ABTH16241A
NOTES
1998 Feb 25
9
Page 10
Philips SemiconductorsProduct specification
16-bit buffer/driver (3-State)
Data sheet status
Data sheet
status
Objective
specification
Preliminary
specification
Product
specification
Product
status
Development
Qualification
Production
Definition
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
74ABT16241A
74ABTH16241A
[1]
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print codeDate of release: 05-96
Document order number:9397-750-03483
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