Datasheet 2SK3054 Datasheet (NEC)

DATA SHEET
MOS FIELD EFFECT TRANSISTOR
N-CHANNEL MOS FIELD EFFECT TRANSISTOR
FOR SWITCHING
DESCRIPTION
The 2SK3054 is a switching device which can be driven directly by a 2.5-V power source. The 2SK3054 has excellent switching characteristics, and is suitable for use as a high-speed switching device in digital circuits.
FEATURES
Can be driven by a 2.5-V power source
Low gate cut-off voltage
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Drain to Source Voltage (VGS= 0 V) V
DS
Gate to Source Voltage (V Drain Current (DC) I Drain Current (pulse) Total Power Dissipation P Channel Temperature T Storage Temperature T
Note
PW 10 ms, Duty cycle 50 %
= 0 V) V
Note
DSS
GSS
D(DC)
D(pulse)
I
ch
stg
T
–55 to +150 °C
50 V
±7V ±0.1 A ±0.2 A
150 mW 150 °C
ORDERING INFORMATION
PART NUMBER PACKAGE
2SK3054 SC-70
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. D14209EJ2V0DS00 (2nd edition) Date Published March 2000 NS CP(K) Printed in Japan
The mark
★★★★
shows major revised points.
©
1999
ELECTRICAL CHARACTERISTICS (TA = 25 °C)
CHARACTERISTICS SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
2SK3054
Drain Cut-off Current I Gate Leakage Current I Gate to Source Cut-off Voltage V
DSS
VDS = 50 V, VGS = 0 V 1
GSS
VGS = ±7 V, VDS = 0 V
GS(off)VDS
5
±
= 3 V, ID = 1 µA 0.9 1.2 1.5 V
Forward Transfer Admittance | yfs |VDS = 3 V, ID = 10 mA 20 38 mS Drain to Source On-state Resi stance R
Input Capacitance C Output Capacitance C Reverse Transfer Capacitance C Turn-on Delay Time t Rise Time t Turn-off Delay Time t Fall Time t
DS(on)1VGS
DS(on)2VGS
R
iss
oss
rss
d(on)
r
d(off)
f
= 2.5 V, ID = 10 mA 22 40 = 4.0 V, ID = 10 mA 14 20
VDS = 3 V 8 pF VGS = 0 V 7 pF f = 1 MHz 3 pF VDD = 3 V 15 ns ID = 20 mA 100 ns
GS(on)
V
= 3 V 30 ns
RG = 10 Ω, RL = 150
35 ns
TEST CIRCUIT SWITCHING TIME
D.U.T.
V
GS
GS
10 %
0
D
I
10 %
0
t
d(on)
90 %
t
on
V
t
r
GS(on)
I
D
t
d(off)
t
off
90 %
90 %
10 %
t
f
PG.
GS
V
RG = 10
0
τ
τ = 1 s
µ
Duty Cycle 1 %
L
R
V
R
G
Wave Form
V
DD
I
D
Wave Form
A
µ
A
µ
Ω Ω
2
Data Sheet D14209EJ2V0DS00
TYPICAL CHARACTERISTICS (TA = 25 °C)
DRAIN CURRENT vs. DRAIN TO SOURCE VOLTAGE
V
DS
- Drain to Source Voltage - V
I
D
- Drain Current - mA
0
1.0
1.5
2.0
40
0.5
Pulsed
V
GS
= 4.5 V
80
100
60
20
V
GS
= 4.0 V
V
GS
= 2.5 V
FORWARD TRANSFER ADMITTANCE vs. DRAIN CURRENT
I
D
- Drain Current - mA
| y
fs
| - Forward Transfer Admittance - mS
V
DS
= 5 V
f = 1 kHz
10
10
100
200
100 200
1
2SK3054
DERATING FACTOR OF FORWARD BIAS SAFE OPERATING AREA
100
80
300
250
TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE
200
60
150
40
20
dT - Percentage of Rated Power - %
0
20 40 60 80 100 120 140 160
T
A
- Ambient Temperature - ˚C
100
- Total Power Dissipation - mW
50
T
P
0
30 60 90 120 150 180
T
A
- Ambient Temperature - ˚C
FORWARD TRANSFER CHARACTERISTICS
Pulsed
100
10
T
A
1
= 150 ˚C
75 ˚C
25 ˚C
- Drain Current - mA
D
I
0.1
25 ˚C
GATE TO SOURCE CUT-OFF VOLTAGE vs. CHANNEL TEMPERATURE
2.0
1.5
1.0
- Gate to Source Cut-off Voltage - V
GS(off)
V
0.5 0 50 100 150
T
ch
- Channel Temperature - ˚C
VDS = 3 V
D
= 1 µA
I
Data Sheet D14209EJ2V0DS00
0.01
V
DS
= 3 V
0
2
1
V
GS
34567
-
Gate to Source Voltage - V
3
2SK3054
DRAIN TO SOURCE ON-STATE RESISTANCE vs. GATE TO SOURCE VOLTAGE
V
GS
- Gate to Source Voltage - V
R
DS(on)
- Drain to Source On-state Resistance -
01 3 5 7 9
6
10
10
Pulsed
30
20
8
42
ID = 100 mA
ID = 10 mA
DRAIN TO SOURCE ON-STATE RESISTANCE vs. DRAIN CURRENT
I
D
- Drain Current - mA
Pulsed
10.1
10
100
10 100
1
R
DS(on)
- Drain to Source On-state Resistance -
V
GS
= 4.0 V
V
GS
= 2.5 V
DRAIN TO SOURCE ON-STATE RESISTANCE vs. CHANNEL TEMPERATURE
T
ch
- Channel Temperature - ˚C
R
DS(on)
- Drain to Source On-state Resistance -
50
0
10
100 150
I
D
= 5 mA
15
20
25
V
GS
= 2.5 V
DRAIN TO SOURCE ON-STATE RESISTANCE vs. CHANNEL TEMPERATURE
T
ch
- Channel Temperature - ˚C
R
DS(on)
- Drain to Source On-state Resistance -
50
0
100 150
I
D
= 5 mA
15
20
30
25
V
GS
= 4.0 V
CAPACITANCE vs. DRAIN TO SOURCE VOLTAGE
100
10
- Capacitance - pF
rss
, C
oss
, C
iss
C
1
1
V
DS
- Drain to Source Voltage - V
4
GS
= 0 V
V f = 1 MHz
C
iss
C
oss
C
rss
10 100
Data Sheet D14209EJ2V0DS00
SWITCHING CHARACTERISTICS
1 000
100
t
d(off)
- Switching Time - ns
f
, t
10
d(off)
, t
r
, t
d(on)
t
1
1
t
r
t
f
t
d(on)
10 100
I
D
- Drain Current - mA
V V R
DD
= 3 V
GS
= 3 V
GS
= 10
1000
SOURCE TO DRAIN DIODE FORWARD VOLTAGE
Pulsed VGS = 0 V
100
10
1
- Diode Forward Current - mA
0.1
SD
I
0.5
0.6 0.7 0.8 0.9 1.0
SD
- Source to Drain Voltage - V
V
2SK3054
Data Sheet D14209EJ2V0DS00
5
PACKAGE DRAWING (Unit: mm)
SC-70
2.1±0.1
1.25±0.1
2SK3054
2.0±0.2
0.9±0.1
Remark
+0.1
0.3
2
0
0.65
0.65
1
3
+0.1
0
0.3
Electrode Connection
1. Source
2. Gate
3. Drain
EQUIVALENT CIRCUIT
Drain
Body Diode
0.3
Marking
0 to 0.1
+0.1
0.05
0.15
Gate
Gate Protection Diode
Source
Marking : G25
The diode connected between the gate and source of the transistor serves as a protector against ESD. When this device actually used, an additional protection circuit is externally required if a voltage exceeding the rated voltage may be applied to this device.
6
Data Sheet D14209EJ2V0DS00
[MEMO]
2SK3054
Data Sheet D14209EJ2V0DS00
7
2SK3054
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M7 98. 8
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