Datasheet 2SK2955 Datasheet (HIT)

Page 1
2SK2955
Silicon N Channel MOS FET High Speed Power Switching
Features
Low on-resistance
RDS =0.010 typ.
High speed switching
4V gate drive device can be driven from 5V source
Outline
ADE-208-564B (Z)
3rd. Edition
Jun 1998
TO–3P
G
D
1. Gate
1
2
3
S
2. Drain (Flange)
3. Source
Page 2
2SK2955
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V Gate to source voltage V Drain current I Drain peak current I Body-drain diode reverse drain current I Avalanche current I Avalanche energy E Channel dissipation Pch
DSS
GSS
D
D(pulse)
DR
Note3
Note3
AR
Note1
Note2
Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C
Note: 1. PW 10µs, duty cycle 1 %
2. Value at Tc = 25°C
3. Value at Tch = 25°C, Rg 50
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown voltage V Gate to source breakdown voltage V Gate to source leak current I Zero gate voltege drain current I Gate to source cutoff voltage V Static drain to source on state R resistance R
(BR)DSS
(BR)GSS
GSS
DSS
GS(off)
DS(on)
DS(on)
Forward transfer admittance |yfs|2440—S ID = 20A, VDS = 10V Input capacitance Ciss 2200 pF VDS = 10V Output capacitance Coss 1050 pF VGS = 0 Reverse transfer capacitance Crss 320 pF f = 1MHz Turn-on delay time t Rise time t Turn-off delay time t Fall time t Body–drain diode forward voltage V Body–drain diode reverse
t
d(on)
r
d(off)
f
DF
rr
recovery time Note: 4. Pulse test
60——V I ±20——V I ——±10 µAVGS = ±16V, VDS = 0 ——10µAVDS = 60 V, VGS = 0
1.5 2.5 V ID = 1mA, VDS = 10V — 0.010 0.013 ID = 20A, VGS = 10V — 0.015 0.025 ID = 20A, VGS = 4V
25 ns ID = 20A, VGS = 10V — 200 ns RL = 1.5 320 ns — 240 ns — 0.95 V IF = 45A, VGS = 0 — 60 ns IF = 45A, VGS = 0
60 V ±20 V 45 A 180 A 45 A 45 A 173 mJ 100 W
= 10mA, VGS = 0
D
= ±100µA, VDS = 0
G
diF/ dt =50A/µs
Note4
Note4
Note4
2
Page 3
Main Characteristics
2SK2955
200
150
100
Channel Dissipation Pch (W)
Power vs. Temperature Derating
50
50
40
0
10 V
50 100 150 200
Case Temperature Tc (°C)
Typical Output Characteristics
6 V
5 V 4 V
Pulse Test
Maximum Safe Operation Area
1000
300 100
D
30 10
Operation in
3
this area is
Drain Current I (A)
0.3
0.1
50
40
limited by R
1
Ta = 25 °C
0.1 0.3 1 Drain to Source Voltage V (V)
Typical Transfer Characteristics
V = 10 V
DS
Pulse Test
10 µs
100 µs
PW = 10 ms (1shot)
DC Operation (Ta = 25°C)
DS(on)
3
10
1 ms
30
DS
100
D
30
20
Drain Current I (A)
10
0
246810
Drain to Source Voltage V (V)
3.5 V
3 V
V = 2.5 V
GS
DS
D
30
20
Drain Current I (A)
10
0
Gate to Source Voltage V (V)
Tc = 75°C
12345
25°C
–25°C
GS
3
Page 4
2SK2955
Drain to Source Saturation Voltage vs.
Gate to Source Voltage
0.5 Pulse Test
0.4
DS(on)
V (V)
0.3
I = 20 A
0.2
0.1
D
10 A
Drain to Source Saturation Voltage
0
48
12
16 20
Gate to Source Voltage V (V)
Static Drain to Source on State Resistance
vs. Temperature
40
W
Pulse Test
32
DS(on)
R (m )
24
V = 4 V
GS
I = 20 A
D
10 A 5 A
16
5, 10, 20 A
8
10 V
0
Static Drain to Source on State Resistance
–40 0 40 80 120 160
Case Temperature Tc (°C)
5 A
GS
Static Drain to Source on State Resistance
vs. Drain Current
100
Pulse Test
W
50
20
DS(on)
R (m )
10
V = 4 V
GS
10 V
5
2
Drain to Source On State Resistance
1
1 5 20 10021050
Drain Current I (A)
D
Forward Transfer Admittance vs.
Drain Current
500
fs
Pulse Test
V = 10 V
DS
200 100
50
Tc = –25 °C
20 10
25 °C
5 2
75 °C
1
Forward Transfer Admittance |y | (S)
0.5
0.1 0.3 1 3 10 30 100 Drain Current I (A)
D
4
Page 5
2SK2955
Body–Drain Diode Reverse
Recovery Time
100
50
20
di / dt = 50 A / µs
Reverse Recovery Time trr (ns)
10
V = 0, Ta = 25 °C
GS
0.1 0.3 1 3 10 30 100 Reverse Drain Current I (A)
Dynamic Input Characteristics
100
I = 45 A
D
80
DS
60
V
DS
V
GS
V = 10 V
DD
40
20
Drain to Source Voltage V (V)
0
V = 50 V
DD
25 V 10 V
40 80 120 160 200
Gate Charge Qg (nc)
DR
25 V 50 V
Typical Capacitance vs.
10000
5000
2000
1000
500
Capacitance C (pF)
200
100
50
Drain to Source Voltage
V = 0
GS
f = 1 MHz
01020304050
Drain to Source Voltage V (V)
Switching Characteristics
20
16
GS
1000
500
200
12
100
8
4
50
Switching Time t (ns)
20
Gate to Source Voltage V (V)
0
10
0.1 0.2 1 2 10 20 100
0.5 5 50 Drain Current I (A)
Ciss
Coss
Crss
DS
t
d(off)
t
f
t
r
t
d(on)
V = 10 V, V = 30 V
GS
DD
PW = 10 µs, duty < 1 %
D
5
Page 6
2SK2955
Reverse Drain Current vs.
Source to Drain Voltage
50
40
DR
30
10 V
5 V
V = 0, –5 V
GS
20
10
Reverse Drain Current I (A)
0
0.4 0.8 1.2 1.6 2.0
Source to Drain Voltage V (V)
Avalanche Test Circuit Avalanche Waveform
V
DS
Monitor
Rg
Vin 15 V
50W
Pulse Test
SD
L
I
AP
Monitor
D. U. T
Maximum Avalanche Energy vs.
Channel Temperature Derating
200
AR
160
120
80
40
0
Repetitive Avalanche Energy E (mJ)
25 50 75 100 125 150
Channel Temperature Tch (°C)
1
E = • L • I •
AR
2
I
AP
V
DD
I
D
V
DD
0
AP
2
I = 45 A
AP
V = 25 V
DD
duty < 0.1 % Rg > 50
W
V
DSS
V – V
DSS DD
V
DS
V
(BR)DSS
6
Page 7
2SK2955
3
Normalized Transient Thermal Impedance vs. Pulse Width
s (t)
1
g
D = 1
0.5
0.3
0.2
0.1
0.1
0.05
0.03
Normalized Transient Thermal Impedance
0.02
0.01
1shot pulse
0.01 10 µ
100 µ 1 m 10 m 100 m 1 10
Pulse Width PW (S)
Tc = 25°C
q g q
ch – c(t) = s (t) • ch – c
q
ch – c = 1.25 °C/W, Tc = 25 °C
P
DM
PW
T
D =
PW
T
Switching Time Test Circuit Waveform
Vin Monitor
Vout Monitor
D.U.T.
R
Vin 10 V
50W
L
V
DD
= 30 V
Vin Vout
10%
10%
90%
td(on)
tr
90%
td(off)
90%
10%
t
f
7
Page 8
2SK2955
Package Dimensions
16.0 max
0.5 typ
f
3.2 ± 0.2
1.0 typ
Unit: mm
5.0 max
1.5 typ
5.0 ± 0.3
1.6 typ
1.4 max
2.0 typ
1.0 ± 0.2
3.6 typ
5.45 ± 0.2 5.45 ± 0.2
0.9 typ
1.0 typ
2.0 typ
20.1 max18.0 ± 0.5
14.9 ± 0.2
0.3 typ
2.8 typ
0.6 ± 0.2
Hitachi Code
EIAJ
JEDEC
TO–3P SC–65
8
Page 9
Cautions
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2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
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Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
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