Datasheet 2SK2938-S, 2SK2938-L Datasheet (HIT)

Page 1
2SK2938(L),2SK2938(S)
Silicon N Channel MOS FET High Speed Power Switching
ADE-208-561B (Z)
3rd. Edition
Jun 1998
Features
RDS =0.026 typ.
High speed switching
4V gate drive device can be driven from 5V source
Outline
1. Gate
2. Drain
3. Source
4. Drain
1
2
3
4
1
2
3
4
LDPAK
G
D
S
Page 2
2SK2938(L),2SK2938(S)
2
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V
DSS
60 V
Gate to source voltage V
GSS
±20 V
Drain current I
D
25 A
Drain peak current I
D(pulse)
Note1
100 A
Body-drain diode reverse drain current I
DR
25 A
Avalanche current I
AP
Note3
20 A
Avalanche energy E
AR
Note3
34 mJ
Channel dissipation Pch
Note2
50 W Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C
Note: 1. PW 10µs, duty cycle 1 %
2. Value at Tc = 25°C
3. Value at Tch = 25°C, Rg 50
Page 3
2SK2938(L),2SK2938(S)
3
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown voltage V
(BR)DSS
60——V I
D
= 10mA, VGS = 0
Gate to source breakdown voltage V
(BR)GSS
±20——V I
G
= ±100µA, VDS = 0
Gate to source leak current I
GSS
——±10 µAVGS = ±16V, VDS = 0
Zero gate voltege drain current I
DSS
——10µAVDS = 60 V, VGS = 0
Gate to source cutoff voltage V
GS(off)
1.5 2.5 V ID = 1mA, VDS = 10V
Static drain to source on state R
DS(on)
0.026 0.034 ID = 15A, VGS = 10V
Note4
resistance R
DS(on)
0.045 0.07 ID = 15A, VGS = 4V
Note4
Forward transfer admittance |yfs|1117—S I
D
= 15A, VDS = 10V
Note4
Input capacitance Ciss 740 pF VDS = 10V Output capacitance Coss 380 pF VGS = 0 Reverse transfer capacitance Crss 140 pF f = 1MHz Turn-on delay time t
d(on)
10 ns ID = 15A, VGS = 10V
Rise time t
r
160 ns RL = 2
Turn-off delay time t
d(off)
100 ns
Fall time t
f
150 ns
Body–drain diode forward voltage V
DF
0.95 V IF = 25A, VGS = 0
Body–drain diode reverse recovery time
t
rr
40 ns IF = 25A, VGS = 0
diF/ dt =50A/µs
Note: 4. Pulse test
Page 4
2SK2938(L),2SK2938(S)
4
Main Characteristics
Channel Dissipation Pch (W)
Case Temperature Tc (°C)
Power vs. Temperature Derating
Drain to Source Voltage V (V)
DS
Drain Current I (A)
D
Drain to Source Voltage V (V)
DS
Drain Current I (A)
D
Typical Output Characteristics
Gate to Source Voltage V (V)
GS
Drain Current I (A)
D
Typical Transfer Characteristics
80
60
40
20
0
50 100 150 200
50
40
30
20
10
0
246810
3.5 V
4 V
5 V
V = 3 V
GS
6 V
4.5 V
10 V
20
16
12
8
4
0
12345
Tc = 75°C
25°C
–25°C
V = 10 V Pulse Test
DS
Maximum Safe Operation Area
200 100
50
10
20
5
1
2
0.5
0.2
0.1 0.3 1 3 10 30 100
Ta = 25 °C
1 ms
PW = 10 ms (1shot)
DC Operation (Tc = 25°C)
10 µs
100 µs
Operation in this area is limited by R
DS(on)
Pulse Test
Page 5
2SK2938(L),2SK2938(S)
5
Gate to Source Voltage V (V)
GS
Drain to Source Saturation Voltage vs.
Gate to Source Voltage
V (V)
DS(on)
Drain to Source Saturation Voltage
Drain Current I (A)
D
Static Drain to Source on State Resistance
vs. Drain Current
Case Temperature Tc (°C)
Static Drain to Source on State Resistance
vs. Temperature
Drain Current I (A)
D
Forward Transfer Admittance |y | (S)
fs
Forward Transfer Admittance vs.
Drain Current
Drain to Source On State Resistance
R ( )
W
DS(on)
Static Drain to Source on State Resistance
R ( )
W
DS(on)
1.0
0.8
0.6
0.4
0.2
0
48
12
16 20
I = 15 A
D
5 A
10 A
0.1 1 100.2 5
0.5
0.02
0.05
0.01
20.5 5020
0.2
0.1
V = 4 V
GS
10 V
Pulse Test
0.10
0.08
0.06
0.04
0.02
–40 0 40 80 120 160
0
V = 4 V
GS
10 V
2, 5 A
10 A
2, 5, 10 A
Pulse Test
0.1 0.3 1 3 10 30 100
50
20
5
10
1
2
0.5
25 °C
Tc = –25 °C
75 °C
V = 10 V Pulse Test
DS
Pulse Test
Page 6
2SK2938(L),2SK2938(S)
6
Reverse Drain Current I (A)
DR
Reverse Recovery Time trr (ns)
Body–Drain Diode Reverse
Recovery Time
Capacitance C (pF)
Drain to Source Voltage V (V)
DS
Typical Capacitance vs. Drain to Source Voltage
Gate Charge Qg (nc)
Drain to Source Voltage V (V)
DS
Gate to Source Voltage V (V)
GS
Dynamic Input Characteristics
Drain Current I (A)
D
Switching Time t (ns)
Switching Characteristics
0.1 0.3 1 3 10 30 100
1000
500
50
100
20 10
200
di / dt = 50 A / µs V = 0, Ta = 25 °C
GS
01020304050
2000
5000
1000
100
200
500
10
20
50
V = 0 f = 1 MHz
GS
Ciss
Coss
Crss
100
80
60
40
20
0
20
16
12
8
4
8 16243240
0
I = 25 A
D
V
GS
V
DS
V = 50 V
25 V 10 V
DD
V = 50 V
25 V 10 V
DD
1000
300
30
100
3
10
1
0.1 0.3 1 3 10 30 100
V = 10 V, V = 3 0 V PW = 5 µs, duty < 1 %
GS
DD
t
f
r
t
d(on)
t
d(off)
t
Page 7
2SK2938(L),2SK2938(S)
7
Channel Temperature Tch (°C)
Repetitive Avalanche Energy E (mJ)
AR
Maximum Avalanche Energy vs.
Channel Temperature Derating
Source to Drain Voltage V (V)
SD
Reverse Drain Current I (A)
DR
Reverse Drain Current vs.
Source to Drain Voltage
D. U. T
Rg
I Monitor
AP
V Monitor
DS
V
DD
50W
Vin 15 V
0
I
D
V
DS
I
AP
V
(BR)DSS
L
V
DD
E = • L • I •
2
1
V
V – V
AR
AP
DSS
DSS DD
2
Avalanche Test Circuit Avalanche Waveform
20
16
12
8
4
0
0.4 0.8 1.2 1.6 2.0
V = 0, –5 V
GS
10 V
5 V
Pulse Test
40
32
24
16
8
25 50 75 100 125 150
0
I = 20 A V = 25 V duty < 0.1 % Rg > 50
AP
DD
W
Page 8
2SK2938(L),2SK2938(S)
8
Vin Monitor
D.U.T.
Vin 10 V
R
L
V = 30 V
DD
tr
td(on)
Vin
90%
90%
10%
10%
Vout
td(off)
Vout Monitor
50W
90%
10%
t
f
3
1
0.3
0.1
0.03
0.01 10 µ
100 µ 1 m 10 m
100 m 1 10
DM
P
PW
T
D =
PW
T
ch – c(t) = s (t) • ch – c ch – c = 2.5 °C/W, Tc = 25 °C
q g q q
Tc = 25°C
D = 1
0.5
0.2
0.1
0.05
0.02
0.01
1shot pulse
Switching Time Test Circuit
Waveform
Pulse Width PW (S)
Normalized Transient Thermal Impedance vs. Pulse Width
Normalized Transient Thermao Impedance
s (t)
g
Page 9
2SK2938(L),2SK2938(S)
9
Package Dimentions
Unit: mm
10.2 ± 0.3 (1.4)
8.6 ± 0.3
1.27 ± 0.2
1.2 ± 0.2
2.54 ± 0.5
11.3 ± 0.5
(1.5)
0.86
+0.2 –0.1
3.0
+0.3
–0.5
0.76 ± 0.1
10.0
+0.3
–0.5
2.54 ± 0.5
4.44 ± 0.2
1.3 ± 0.2
2.59 ± 0.2
0.4 ± 0.1
11.0 ± 0.5
10.2 ± 0.3 (1.4)
8.6 ± 0.3
1.27 ± 0.2
2.54 ± 0.5
(1.5)
0.86
+0.2 –0.1
10.0
+0.3
–0.5
2.54 ± 0.5
4.44 ± 0.2
1.3 ± 0.2
2.59 ± 0.2
0.4 ± 0.1
1.2 ± 0.2
(1.5)
0.1
+0.2 –0.1
L type S type
Hitachi Code
EIAJ
JEDEC
LDPAK
— —
Page 10
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