CTLST CAT25C64U20I-TE13, CAT25C64U20I-1.8TE13, CAT25C64U20A-TE13, CAT25C64U20A-1.8TE13, CAT25C32U14I-1.8TE13 Datasheet

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CAT25C32/64
32K/64K-Bit SPI Serial CMOS E2PROM FEATURES
10 MHz SPI Compatible
1.8 to 6.0 Volt Operation
Hardware and Software Protection
Low Power CMOS Technology
SPI Modes (0,0 &1,1)
Commercial, Industrial and Automotive
Temperature Ranges
1,000,000 Program/Erase Cycles
100 Year Data Retention
Self-Timed Write Cycle
8-Pin DIP/SOIC, 16-Pin SOIC, 14-Pin TSSOPand
20-Pin TSSOP
64-Byte Page Write Buffer
Block Write Protection
– Protect 1/4, 1/2 or all of E2PROM Array
PIN CONFIGURATION
PIN FUNCTIONS
Pin Name Function
SO Serial Data Output SCK Serial Clock
WP Write Protect V
CC
+1.8V to +6.0V Power Supply
V
SS
Ground CS Chip Select SI Serial Data Input HOLD Suspends Serial Input
NC No Connect
BLOCK DIAGRAM
© 1999 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice
Advanced Information
DESCRIPTION
The CAT25C32/64 is a 32K/64K-Bit SPI Serial CMOS E2PROM internally organized as 4Kx8/8Kx8 bits. Catalyst’s advanced CMOS Technology substantially reduces device power requirements. The CAT25C32/ 64 features a 64-byte page write buffer. The device operates via the SPI bus serial interface and is enabled though a Chip Select (CS). In addition to the Chip Select, the clock input (SCK), data in (SI) and data out (SO) are
required to access the device. The HOLD pin may be used to suspend any serial communication without resetting the serial sequence. The CAT25C32/64 is designed with software and hardware write protection features including Block write protection. The device is available in 8-pin DIP, 8-pin SOIC, 14-pin TSSOP and 20-pin TSSOP packages.
Doc No. 25087-00 8/99 SPI-1
DIP Package (P)
TSSOP Package (U20)SOIC Package (S)
SENSE AMPS
SHIFT REGISTERS
SPI
CONTROL
LOGIC
WORD ADDRESS
BUFFERS
I/O
CONTROL
E2PROM
ARRAY
COLUMN
DECODERS
XDEC
HIGH VOL T A GE/
TIMING CONTROL
SO
STATUS
REGISTER
BLOCK
PROTECT
LOGIC
CONTROL LOGIC
DATA IN
STORAGE
SI
CS
WP
HOLD
SCK
SO
WP
CS
V
CC HOLD SCK
SI
1 2 3 4
8 7 6 5
V
SS
V
SS
SO
WP
V
CC
HOLD SCK SI
1 2 3 4
8 7 6 5
CS
NC
NC
CS
WP
HOLD
HOLD
VCC
NC NC
NC
NC
NC NC
SO
NC
NC
SO
V
SS
SCK SI
1 2 3 4
5 6 7 8
9 10 11
12
13
14
15
16
17
18
19
20
TSSOP Package (U14)
CS
WP
HOLD
VCC NC
NC
NC NC
SO
NC
NC
V
SS
SCK SI
1 2 3 4
5 6 7
8
9
10
11
12
13
14
2
CAT25C32/64
Doc. No. 25087-00 8/99 SPI-1
Advanced Information
D.C. OPERATING CHARACTERISTICS
VCC = +1.8V to +6.0V, unless otherwise specified.
Limits
Symbol Parameter Min. Typ. Max. Units Test Conditions
I
CC1
Power Supply Current 10 mA VCC = 5V @ 10MHz (Operating Write) SO=open; CS=Vss
I
CC2
Power Supply Current 2 mA VCC = 5.0V (Operating Read) F
CLK
= 10MHz
I
SB
Power Supply Current 0 µA CS = V
CC
(Standby) VIN = VSS or V
CC
I
LI
Input Leakage Current 2 µA
I
LO
Output Leakage Current 3 µAV
OUT
= 0V to VCC,
CS = 0V
V
IL
(3)
Input Low Voltage -1 VCC x 0.3 V
V
IH
(3)
Input High Voltage VCC x 0.7 V
CC
+ 0.5 V
V
OL1
Output Low Voltage 0.4 V
V
OH1
Output High Voltage VCC - 0.8 V
V
OL2
Output Low Voltage 0.2 V 1.8V≤VCC<2.7V
V
OH2
Output High Voltage VCC-0.2 V IOL = 150µA
IOH = -100µA
ABSOLUTE MAXIMUM RATINGS*
Temperature Under Bias ................. –55°C to +125°C
Storage Temperature....................... –65°C to +150°C
Voltage on any Pin with
Respect to V
SS
1)
................... –2.0V to +VCC +2.0V
VCC with Respect to V
SS
................................
–2.0V to +7.0V
Package Power Dissipation
Capability (Ta = 25°C)................................... 1.0W
Lead Soldering Temperature (10 secs)............ 300°C
Output Short Circuit Current
(2)
........................ 100 mA
*COMMENT
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions outside of those listed in the operational sections of this specifica­tion is not implied. Exposure to any absolute maximum rating for extended periods may affect device perfor­mance and reliability.
RELIABILITY CHARACTERISTICS
Symbol Parameter Min. Max. Units Reference Test Method
N
END
(3)
Endurance 1,000,000 Cycles/Byte MIL-STD-883, Test Method 1033
T
DR
(3)
Data Retention 100 Years MIL-STD-883, Test Method 1008
V
ZAP
(3)
ESD Susceptibility 2000 Volts MIL-STD-883, Test Method 3015
I
LTH
(3)(4)
Latch-Up 100 mA JEDEC Standard 17
Note: (1) The minimum DC input voltage is –0.5V. During transitions, inputs may undershoot to –2.0V for periods of less than 20 ns. Maximum DC
voltage on output pins is VCC +0.5V, which may overshoot to VCC +2.0V for periods of less than 20 ns. (2) Output shorted for no more than one second. No more than one output shorted at a time. (3) This parameter is tested initially and after a design or process change that affects the parameter. (4) Latch-up protection is provided for stresses up to 100 mA on address and data pins from –1V to VCC +1V.
4.5VVCC<5.5V IOL = 3.0mA IOH = -1.6mA
3
CAT25C32/64
Doc No. 25087 -00 8/99 SPI-1
Advanced Information
Limits
Vcc= VCC =V
CC
=
1.8V-6.0V 2.5V-6.0V 4.5V-5.5V Test
SYMBOL PARAMETER Min. Max. Min. Max. Min. Max. UNITS Conditions
t
SU
Data Setup Time 50 50 20 ns
t
H
Data Hold Time 50 50 20 ns
t
WH
SCK High Time 250 125 40 ns
t
WL
SCK Low Time 250 125 40 ns
f
SCK
Clock Frequency DC 1 DC 3 DC 10 MHz
t
LZ
HOLD to Output Low Z 50 50 50 ns
t
RI
(1)
Input Rise Time 2 2 2 µs
t
FI
(1)
Input Fall Time 2 2 2 µs
t
HD
HOLD Setup Time 100 100 40 ns
t
CD
HOLD Hold Time 100 100 40 ns
t
WC
Write Cycle Time 10 10 5 ms
t
V
Output Valid from Clock Low 250 250 80 ns
t
HO
Output Hold Time 0 0 0 ns
t
DIS
Output Disable Time 250 250 75 ns
t
HZ
HOLD to Output High Z 150 100 50 ns
t
CS
CS High Time 500 250 200 ns
t
CSS
CS Setup Time 500 250 100 ns
t
CSH
CS Hold Time 500 250 100 ns
NOTE:
(1) This parameter is tested initially and after a design or process change that affects the parameter.
A.C. CHARACTERISTICS
Figure 1. Sychronous Data Timing
CL = 50pF
Note: Dashed Line= mode (1, 1) — — — —
VALID IN
V
IH
V
IL
t
CSS
V
IH
V
IL
V
IH
V
IL
V
OH
V
OL
HI-Z
t
SU
t
H
t
WH
t
WL
t
V
t
CS
t
CSH
t
HO
t
DIS
HI-Z
CS
SCK
SI
SO
t
RI
t
FI
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