PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
C
D
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
Title
SizeDocument NumberRev
SizeDocument NumberRev
SizeDocument NumberRev
Date:Sheetof
Date:Sheetof
Date:Sheetof
Compal Electronics, Inc.
Cover Sheet
Cover Sheet
Cover Sheet
LA-6592P
LA-6592P
LA-6592P
175Thursday, January 13, 2011
175Thursday, January 13, 2011
175Thursday, January 13, 2011
E
1.0
1.0
1.0
A
B
C
D
E
Block Diagram
LVDS CONN
11
PAGE 24
HDMI CONN
PAGE 26
DOCKING PORT
PAGE 40
USB[8,9]
SATA5
DOCK LAN
22
EXPRESS
Card
USB10
33
CPU XDP Port
PCH XDP Port
Thermal
GUARDIAN III
EMC4022
WiFi ON/OFF &
Power ON/OFF SW
44
DC/DC Interface
LED
Compal confidentialModel: PAL51/53
LVDS Switch
PI3LVD400ZFEX
HDMI Repeater
PS121
DAI
SDXC/MMC/MS
PCIE5
1/2 Mini Card
Flash
USB6
PAGE 7
PAGE 14
PAGE 22
PAGE 31
PAGE 44
PAGE 45
A
PAGE 23
PAGE 26
DPC
DPD
VGA
CRT CONN
On IO board
1/2 Mini Card
Smart Card
RFID
PWM FAN
PAGE 35
WLAN
PAGE 33
PAGE 33
PAGE 22
iLVDS
dLVDS
VGA
Card reader
OZ600FJ0LN
PCIE2
Full Mini Card
WWAN/UWB
USB5USB4
TDA8034HN
Fingerprint
CONN
SMSC SIO
ECE5028
DPE
N12M-NS
PAGE 46-51
Video Switch
MAX14885E
PCI Express BUS
PCIE1PCIE3
PAGE 33
PAGE 23
PAGE 41
B
Option
FP_USB
BC BUS
PEG
dVGA
iVGA
PAGE 25
iLVDS
PAGE 35
100MHz
PCIE x1
China TPM1.2
SSX44B
PAGE 34PAGE 36PAGE 36PAGE 36PAGE 37
USH
TPM1.2
BCM5882
PAGE 33,34
USB7
SMSC KBC
MEC5055
PAGE 43PAGE 43
PAGE 42
KB CONNTP CONN
Sandy Bridge
4MB (Socket 988B)
rPGA CPU
988 pins
FDI
Lane x 8
INTEL
COUGAR POINT-M
BGA
SPI
LPC BUS
33MHz
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
Memory BUS (DDR3)
1066/1333MHz
PAGE 6-11
DMI2
Lane x 4
USB
PAGE 14-21
PCI Express BUS
HD Audio I/F
S-ATA 0/1 6GB/s, S-ATA 2/3/4/5 3GB/s
W25X64ZE
64M 4K sector
PAGE 14
W25Q16BVSSIG
16M 4K sector
C
PAGE 14
PCIE4
E-Module
PAGE 29
Touch Screen
SATA
100MHz
SATA
SATA Repeater
MAX4951BE
PAGE 28
HDD
PAGE 28
D
DDRIII-DIMM X2
BANK 0, 1, 2, 3, 4 ,5 ,6 ,7
PAGE 24
BT
PAGE 43
Camera
SATA Repeater
MAX4951BE
PAGE 39
HDA Codec
92HD90B2
MDC
RJ11
on IO board
DELL CONFIDENTIAL/PROPRIETARY
PAGE 12,13
Trough eDP Cable
E-SATA
USB Port
USB Port
USB Port
USB Port
PAGE 39
PAGE 38
PAGE 38
2560
2560
2062
on IO board
Intel Lewisville
PAGE 30
DOCK LAN
INT.Speaker
HeadPhone &
MIC Jack
DAI
To Docking side
PAGE 30
82579LM
PAGE 32
LAN SWITCH
PAGE 32
PI3L720
RJ45
on IO board
Dig.
MIC
Trough eDP Cable
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
Title
SizeDocument NumberRev
SizeDocument NumberRev
SizeDocument NumberRev
Date:Sheetof
Date:Sheetof
Date:Sheetof
Compal Electronics, Inc.
DIS Block Diagram
DIS Block Diagram
DIS Block Diagram
LA-6592P
LA-6592P
LA-6592P
275Thursday, January 13, 2011
275Thursday, January 13, 2011
275Thursday, January 13, 2011
E
1.0
1.0
1.0
5
4
3
2
1
POWER STATES
State
S0 (Full ON) / M0
DD
S3 (Suspend to RAM) / M3LOW HIGH HIGHONONONOFF
S4 (Suspend to DISK) / M3ONONOFF
S5 (SOFT OFF) / M3ONONOFFL
S3 (Suspend to RAM) / M-OFF
S4 (Suspend to DISK) / M-OFFHIGH
S5 (SOFT OFF) / M-OFF
Signal
SLP
S3#
HIGH
LOWHIGH HIGH
OWHIGHLOW
LOW HIGH HIGH LOWONONOFFOFFOFF
LOW LOWLOWONOFFOFFOFFOFF
LOW LOW LOW LOWONOFFOFFOFFOFF
SLP
SLP
S5#
S4#
HIGH HIGH
LOW
LOW
SLP
A#
HIGH
HIGH
ALWAYS
PLANE
ON
M
PLANE
ON
SUS
RUN
PLANE
PLANE
ONONON
OFF
OFF
CLOCKS
OFF
OFF
OFF
PCH
USB PORT#
0
1
2
3
4
5
6
7
JUSB2 (Right side 1)
JUSB3 (Right side 2)
JESA1 (Right Side ESATA)
JESA1 (Ext Left Side )
WLAN
WWAN
JMINI3(Flash)
USH->BIO
DESTINATION
DOCKING8
PM TABLE
CC
power
plane
State
S0
S3
+15V_ALW
+5V_ALW
+3.3V_ALW_PCH
+3.3V_RTC_LDO
ON
+3.3V_SUS
+1.5V_MEM
ONON
ON
+5V_RUN
+3.3V_RUN
+1.8V_RUN
+1.5V_RUN
+0.75V_DDR_VTT
+VCC_CORE
+1.05V_RUN_VTT
+1.05V_RUN
OFFON
+3.3V_M +3.3V_M
+1.05V_M
ON
ON
+1.05V_M
(M-OFF)
ON
OFF
SATA
SATA 0
SATA 1
SATA 2
SATA 3
SATA 4
SATA 5
DESTINATION
HDD
ODD/ E3 Module Bay
NA
NA
ESATA
Dock
USH
9
10Express card
11
12
13LCD Touch
0
1
DOCKING
Bluetooth
Camera
BIO
NA
S5 S4/AC
S5 S4/AC don't exist
BB
AA
ON
OFF
OFFOFF
OFF
OFF
ON
OFF
OFFOFF
need to update Power Status and PM Table
DSC DP/HDMI Port
Port C
Port D
Port E
Connetion
Dock DP port 2
Dock DP port 1
MB HDMI Conn
PCI EXPRESS
Lane 1
Lane 2
Lane 3
Lane 4
Lane 5
Lane 6
Lane 7
Lane 8None
DESTINATION
MINI CARD-1 WWAN
MINI CARD-2 WLAN
Express card
E3 Module Bay (USB3)
1/2vMINI CARD-3 PCIE
MMI
10/100/1G LOM
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Title
Title
SizeDocument NumberRev
SizeDocument NumberRev
SizeDocument NumberRev
Date:Sheetof
Date:Sheetof
Date:Sheetof
Compal Electronics, Inc.
Index and Config.
Index and Config.
Index and Config.
LA-6592P
LA-6592P
LA-6592P
375Thursday, January 13, 2011
375Thursday, January 13, 2011
375Thursday, January 13, 2011
1
1.0
1.0
1.0
5
4
3
2
1
EN_INVPWR
ADAPTER
DD
PGPU_PWR_EN
1.05V_VTTPWRGD
+PWR_SRC
BATTERY
1.05V_0.8V_PWROK
FDC654P
Q21
ISL95870A
(PU15)
ISL95870AH
(PU13)
MAX17411
(PU9)
+BL_PWR_SRC
+GPU_CORE
+VCC_SA
+VCC_GFXCORE
HDDC_EN
+5V_HDD
ALWON
MODC_EN
SI3456BDVSI3456BDV
(Q30)(Q27)
+5V_MOD
CHARGER
+15V_ALW
CC
SN0608098
(PU2)
+5V_ALW
RUN_ON
SI4164DY
+3.3V_ALW
(Q50)
+5V_RUN
MAX17411
(PU9)
RT8209BGQW
(PU3)
RT9026GFP
(PU5)
TPS51311
(PU4)
SN1003055
(PU7)
SN1003055
(PU6)
AUX_EN_WOWL
PCH_ALW_ON
SUS_ON
AUX_ON
RUN_ON
M_ON
SI3456
(Q38)
BB
1.05V_0.8V_PWROK
+VCC_CORE
CPU1.5V_S3_GATE
AO4728
(QC3)
DDR_ON
0.75V_VR_EN
+1.5V_MEM+0.75V_DDR_VTT
RUN_ON
NTGS4141N
(Q59)
RUN_ON
+1.8V_RUN
CPU_VTT_ON
+1.05V_RUN_VTT+1.05V_M
M_ON
RUN_ON
SI4164
(Q63)
+3.3V_WLAN
Pop option
+1.0V_LAN
SI3456
(Q49)
+3.3V_ALW_PCH
S13456
(Q54)
Pop option
+3.3V_M
SI3456
(Q34)(Q55)
+3.3V_LAN+3.3V_SUS
NTMS4920
+3.3V_RUN
SI3456
(Q58)
+3.3V_M
+0.8V_VCCSA
AA
+1.5V_CPU_VDDQ
5
+1.5V_RUN
+1.05V_RUN
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
eDP_COMPIO and I COMPO signals sh ould be shorted n ear
AA
balls and routed with typical im pedance <25 mohms
5
PEG_ICOMPI and R COMPO signals sh ould be shorted a nd routed
with - max lengt h = 500 mils - t ypical impedance = 43 mohms
PEG_ICOMPO signa ls should be rou ted with - max le ngth = 500 mils
- typical impeda nce = 14.5 mohms
4
(1)PEG_RCOMPO (H22) use 4mil connect to PEG_ICOMPI, then use 4mil connect to RC2.
(2)PEG_ICOMPO use 12mil connect to RC2
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
Avoid stub in th e PWRGD path
while placing re sistors RC25 & R C130
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
10: x8, x8 - Device 1 function 1 enabled ; function 2
disabled
01: Reserved - (Device 1 function 1 disabled ; function
2 enabled)
00: x8,x4,x4 - Device 1 functions 1 and 2 enabled
CFG4
CFG6
CFG5
RC54
@RC54
@
1K_0402_5%~D
1K_0402_5%~D
12
RC51
@RC51
@
1K_0402_5%~D
1K_0402_5%~D
12
RC52
@RC52
@
1K_0402_5%~D
1K_0402_5%~D
follow DG0.9 change to 1Kohm 5%
12
12
RC53
@RC53
@
1K_0402_5%~D
1K_0402_5%~D
Sandy Bridge_rPGA_Rev1p0
Sandy Bridge_rPGA_Rev1p0
CFG7
12
RC56
@RC56
@
1K_0402_5%~D
1K_0402_5%~D
PEG DEFER TRAINING
1: (Default) PEG Train immediately
CFG7
following xxRESETB de assertion
AA
0: PEG Wait for BIOS for training
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
Note: Place the PU resistors clo se to CPU
R1555 close to C PU 300 - 1500mil s
H_CPU_SVIDALRT#
VIDSCLK58
Place RC66, RC70near CPU
12
12
12
12
22U_0805_6.3VAM~D
1
1
CC80
CC80
CC81
CC81
2
2
22U_0805_6.3VAM~D
22U_0805_6.3VAM~D
22U_0805_6.3VAM~D
22U_0805_6.3VAM~D
@CC92
@
@CC93
1
2
+1.05V_RUN_VTT
@
1
CC92
CC93
2
12
RC6143_0402_5%~DRC6143_0402_5%~D
12
RC63
RC63
130_0402_1%~D
130_0402_1%~D
VIDSOUT 58
VTT_SENSE 57
VTT_GND57
22U_0805_6.3VAM~D
22U_0805_6.3VAM~D
1
1
CC82
CC82
2
2
330U_D2_2VM_R6M~D
330U_D2_2VM_R6M~D
1
1
CC107
CC107
+
+
+
+
2
2
CAD Note: Place the PU
resistors close to CPU
R1558 close to C PU 300 - 1500mil s
+VCC_CORE
12
RC66
RC66
100_0402_1%~D
100_0402_1%~D
12
RC70
RC70
100_0402_1%~D
100_0402_1%~D
22U_0805_6.3VAM~D
22U_0805_6.3VAM~D
1
CC83
CC83
2
330U_D2_2VM_R6M~D
330U_D2_2VM_R6M~D
1
CC108
CC108
2
VCCSENSE 58
VSSSENSE 58
1
22U_0805_6.3VAM~D
22U_0805_6.3VAM~D
22U_0805_6.3VAM~D
1
CC84
CC84
2
330U_D2_2VM_R6M~D
330U_D2_2VM_R6M~D
CC109
CC109
+
+
@
@
+1.05V_RUN_VTT
12
22U_0805_6.3VAM~D
CC85
CC85
RC60
RC60
75_0402_1%~D
75_0402_1%~D
22U_0805_6.3VAM~D
22U_0805_6.3VAM~D
1
2
22U_0805_6.3VAM~D
22U_0805_6.3VAM~D
1
CC70
CC70
2
VIDALERT_N 58
CC86
CC86
Iccmax current c hanged for PDDG Rev0.7
CPU Power Rail Table
Voltage Rail
VCC
VCCIO
VAXG
VCCPLL
VDDQ
VCCSA
+1.5V_MEM1.5
Description
*
5A to Mem contro ller(+1.5V_CPU_V DDQ)
5-6A to 2 DIMMs/ channel
2-5A to +1.5V_RU N & +0.75V_DDR_V TT
Voltage
0.65-1.3
1.05
0.0-1.1
1.8
1.5
0.65-0.9
+1.05V_RUN_VTT
S0 Iccmax
Current (A)
53
8.5
26
3
5
6
12-16
*
Sandy Bridge_rPGA_Rev1p0
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
SizeDocument NumberRev
SizeDocument NumberRev
SizeDocument NumberRev
Date:Sheetof
Date:Sheetof
Date:Sheetof
Compal Electronics, Inc.
Sandy Bridge (6/6)
Sandy Bridge (6/6)
Sandy Bridge (6/6)
LA-6592P
LA-6592P
LA-6592P
1175Thursday, January 13, 2011
1175Thursday, January 13, 2011
1175Thursday, January 13, 2011
1
1.0
1.0
1.0
5
Note:
Check voltage tolerance of
VREF_DQ at the DIMM socket
DDR_A_DQS#[0..7]8
DDR_A_D[0..63]8
DD
DDR_A_DQS[0..7]8
DDR_A_MA[0..15]8
Layout Note:
Place near JDIMMA
+1.5V_MEM
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1
CD3
CD3
2
CC
+1.5V_MEM
10U_0603_6.3V6M~D
10U_0603_6.3V6M~D
10U_0603_6.3V6M~D
10U_0603_6.3V6M~D
CD7
CD7
1
1
2
2
BB
+0.75V_DDR_VTT
AA
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1
1
2
CD8
CD8
Layout Note:
Place near JDIMMA.203,204
1
2
CD5
CD5
CD4
CD4
2
10U_0603_6.3V6M~D
10U_0603_6.3V6M~D
10U_0603_6.3V6M~D
10U_0603_6.3V6M~D
CD9
CD9
CD10
CD10
1
1
2
2
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1
CD17
CD17
CD18
CD18
2
All VREF traces should
have 10 mil trace width
Populate RD1 for Intel DDR3
VREFDQ multiple methods M1
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Title
Title
SizeDocument NumberRev
SizeDocument NumberRev
SizeDocument NumberRev
Date:Sheetof
Date:Sheetof
Date:Sheetof
Compal Electronics, Inc.
DDRIII-SODIMM SLOT1
DDRIII-SODIMM SLOT1
DDRIII-SODIMM SLOT1
LA-6592P
LA-6592P
LA-6592P
1275Thursday, January 13, 2011
1275Thursday, January 13, 2011
1275Thursday, January 13, 2011
1
1.0
1.0
1.0
5
All VREF traces should
have 10 mil trace width
DDR_B_DQS#[0..7]8
DDR_B_D[0..63]8
DDR_B_DQS[0..7]8
DD
CC
BB
AA
DDR_B_MA[0..15]8
+1.5V_MEM
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1
1
2
+1.5V_MEM
10U_0603_6.3V6M~D
10U_0603_6.3V6M~D
CD29
CD29
1
2
Layout Note:
Place near JDIMMB.203,204
+0.75V_DDR_VTT
1
2
CD26
CD26
CD25
CD25
2
10U_0603_6.3V6M~D
10U_0603_6.3V6M~D
10U_0603_6.3V6M~D
10U_0603_6.3V6M~D
CD30
CD30
CD31
CD31
1
1
1
2
2
2
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1
CD40
CD40
CD39
CD39
2
Layout Note:
Place near JDIMMB
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1
1
CD27
CD27
CD28
CD28
2
2
10U_0603_6.3V6M~D
10U_0603_6.3V6M~D
10U_0603_6.3V6M~D
10U_0603_6.3V6M~D
CD32
CD32
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1
2
10U_0603_6.3V6M~D
10U_0603_6.3V6M~D
CD33
CD33
CD34
CD34
1
2
CD41
CD41
1
1
2
2
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1
CD42
CD42
2
10U_0603_6.3V6M~D
10U_0603_6.3V6M~D
Populate RD4 for Intel DDR3
VREFDQ multiple methods M1
330U_SX_2VY~D
330U_SX_2VY~D
@CD35
@
1
CD36
CD36
CD35
+
+
2
4
+DIMM0_1_VREF_DQ
2.2U_0603_6.3V6K~D
2.2U_0603_6.3V6K~D
1
2
Note:
Check voltage tolerance of
VREF_DQ at the DIMM socket
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Title
Title
SizeDocument NumberRev
SizeDocument NumberRev
SizeDocument NumberRev
Date:Sheetof
Date:Sheetof
Date:Sheetof
Compal Electronics, Inc.
DDRIII-SODIMM SLOT2
DDRIII-SODIMM SLOT2
DDRIII-SODIMM SLOT2
LA-6592P
LA-6592P
LA-6592P
1375Thursday, January 13, 2011
1375Thursday, January 13, 2011
1375Thursday, January 13, 2011
1
1.0
1.0
1.0
5
CMOS settingCMOS_CLR1
Clear CMOSShunt
Open
ME_CLR1
Shunt
Open
DD
+RTC_CELL
INTVRMEN- Integrated SUS
1.1V VRM Enable
High - Enable Internal VRs
*
Low - Enable External VRs
CC
PCH_AZ_CODEC_SDOUT30
PCH_AZ_CODEC_SYNC30
PCH_AZ_CODEC_BITCLK30
BB
Keep CMOS
TPM setting
Clear ME RTC Registers
Keep ME RTC Registers
12
RH38
RH38
330K_0402_5%~D
330K_0402_5%~D
PCH_INTVRMEN
12
RH39
@RH39
@
330K_0402_5%~D
330K_0402_5%~D
1
1
@
@
ME1SHORT PADS~D
ME1SHORT PADS~D
12
CH51U_0402_6.3V6K~DCH51U_0402_6.3V6K~D
PCH_AZ_CODEC_RST#30
CH101
@CH101
@
27P_0402_50V8J~D
27P_0402_50V8J~D
+3.3V_RUN
12
RH295
@RH295
@
8.2K_0402_5%~D
8.2K_0402_5%~D
PCH_SPI_DO
2
2
1
2
PCH_AZ_SYNC is sampled
at the rising edge of RSMRST# pin.
So signal should be PU to the ALWAYS rail.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
Low = Intel ME Crypto Transport Layer
Security (TLS) cipher suite with no
confidentiality
High = Intel ME Crypto TLS cipher suite
with confidentiality
+3.3V_ALW_PCH
RH356
RH356
4.7K_0402_5%~D
4.7K_0402_5%~D
12
CC
Note: PCH has internal pull up 20k ohm on
E3_PAID_TS_DET# (GPIO27)
+3.3V_ALW_PCH
BB
+3.3V_ALW_PCH
RH17010K_0402_5%~DRH1701 0K_0402_5%~D
+3.3V_RUN
RH17110K_0402_5%~D@ RH17110K_0402_5%~D@
RH1731K_0402_5%~D@RH1731K_0402_5%~D@
RH26510K_0402_5%~DRH2651 0K_0402_5%~D
AA
RH26610K_0402_5%~DRH2661 0K_0402_5%~D
RH17910K_0402_5%~DRH1791 0K_0402_5%~D
RH18010K_0402_5%~D@ RH18010K_0402_5%~D@
RH2698.2K_0402_5%~DRH2698.2K_0402_5%~D
RH16310K_0402_5%~DRH1631 0K_0402_5%~D
RH27210K_0402_5%~DRH2721 0K_0402_5%~D
RH2731K_0402_5%~D@RH2731K_0402_5%~D@
SLP_ME_CSW_DE V#
RH353
@ RH353
@
1K_0402_5%~D
1K_0402_5%~D
12
KB_DET#
GPIO36
12
GPIO37
12
EN_ESATA_RPTR#
12
TEMP_ALERT#
12
MEDIA_DET#
12
DGPU_HOLD_RST#
12
GPIO17
IO_LOOP#
LEDB_DET#
GPIO17
12
SIO_EXT_WAKE#
5
12
RH17710K_0402_5%~DRH17710K_0402_5%~D
12
RH171, RH173 should be no pop as reverse strap.
12
12
12
Layout note:
Trace wide 10mil & length 30mil
All NCTF pins should have thick
traces at 45°from the pad.
SIO_EXT_SCI#_R14
SIO_EXT_SCI#42
IO_LOOP#31
LEDB_DET#31
SIO_EXT_WAKE#41
PM_LANPHY_ENABLE32
PCH_GPIO1514
EN_ESATA_RPTR#14
MEDIA_DET#31
PCIE_MCARD1_DET#36
E3_PAID_TS_DET#24
SLP_ME_CSW_DE V#14,41
DGPU_HOLD_RST#46
USB_MCARD1_DET#14,36
FFS_INT228
TEMP_ALERT#14,41
KB_DET#43
+3.3V_RUN
TPM_ID0
GPIO3614
GPIO3714
1@ RH267
1@
12
2@ RH270
2@
12
4
SIO_EXT_SCI#
PCH_GPIO1
IO_LOOP#
LEDB_DET#
SIO_EXT_WAKE#
PCH_GPIO15
EN_ESATA_RPTR#
GPIO17
MEDIA_DET#
E3_PAID_TS_DET#
SLP_ME_CSW_DE V#
DGPU_HOLD_RST#
GPIO36
GPIO37
TPM_ID0
TPM_ID1
FFS_INT2
TEMP_ALERT#
KB_DET#
RH267
10K_0402_5%~D
10K_0402_5%~D
TPM_ID1
RH270
10K_0402_5%~D
10K_0402_5%~D
4
12
RH2590_0402_5%~D@RH2590_0402_5%~D@
VSS_NCTF_1
VSS_NCTF_2
VSS_NCTF_3
VSS_NCTF_4
VSS_NCTF_5
VSS_NCTF_6
VSS_NCTF_7
VSS_NCTF_8
VSS_NCTF_9
VSS_NCTF_10
VSS_NCTF_11
VSS_NCTF_12
VSS_NCTF_13
VSS_NCTF_14
+3.3V_RUN
12
RH268
3@ RH268
3@
20K_0402_5%~D
20K_0402_5%~D
12
RH271
4@ RH271
4@
2.2K_0402_5%~D
2.2K_0402_5%~D
UH4F
UH4F
T7
BMBUSY# / GPIO0
A42
TACH1 / GPIO1
H36
TACH2 / GPIO6
E38
TACH3 / GPIO7
C10
GPIO8
C4
LAN_PHY_PWR_CTRL / GPIO12
G2
GPIO15
U2
SATA4GP / GPIO16
D40
TACH0 / GPIO17
T5
SCLOCK / GPIO22
E8
GPIO24 / MEM_LED
E16
GPIO27
P8
GPIO28
K1
STP_PCI# / GPIO34
K4
GPIO35
V8
SATA2GP / GPIO36
M5
SATA3GP / GPIO37
N2
SLOAD / GPIO38
M3
SDATAOUT0 / GPIO39
V13
SDATAOUT1 / GPIO48
V3
SATA5GP / GPIO49
D6
GPIO57
A4
VSS_NCTF_1
A44
VSS_NCTF_2
A45
VSS_NCTF_3
A46
VSS_NCTF_4
A5
VSS_NCTF_5
A6
VSS_NCTF_6
B3
VSS_NCTF_7
B47
VSS_NCTF_8
BD1
VSS_NCTF_9
BD49
VSS_NCTF_10
BE1
VSS_NCTF_11
BE49
VSS_NCTF_12
BF1
VSS_NCTF_13
BF49
VSS_NCTF_14
CougarPoint_Rev_1p0
CougarPoint_Rev_1p0
No TPM, No China TPM
China TPM
USH2.0
GPIO
GPIO
3
CPU/MISC
CPU/MISC
NCTF
NCTF
3
TACH4 / GPIO68
TACH5 / GPIO69
TACH6 / GPIO70
TACH7 / GPIO71
A20GATE
PECI
RCIN#
PROCPWRGD
THRMTRIP#
INIT3_3V#
DF_TVS
TS_VSS1
TS_VSS2
TS_VSS3
TS_VSS4
NC_1
VSS_NCTF_15
VSS_NCTF_16
VSS_NCTF_17
VSS_NCTF_18
VSS_NCTF_19
VSS_NCTF_20
VSS_NCTF_21
VSS_NCTF_22
VSS_NCTF_23
VSS_NCTF_24
VSS_NCTF_25
VSS_NCTF_26
VSS_NCTF_27
VSS_NCTF_28
VSS_NCTF_29
VSS_NCTF_30
VSS_NCTF_31
VSS_NCTF_32
0
0
11
TPM_ID1TPM_ID0
C40
B41
C41
A40
P4
AU16
P5
AY11
AY10
T14
AY1
AH8
AK11
AH10
AK10
P37
BG2
BG48
BH3
BH47
BJ4
BJ44
BJ45
BJ46
BJ5
BJ6
C2
C48
D1
D49
E1
E49
F1
F49
0
1
CONTACTLESS_DET#
SIO_A20GATE
H_PECI_R
SIO_RCIN#
H_CPUPWRGD
PCH_THRMTRIP#_R
INIT3_3V#
DF_TVS
NC_1
VSS_NCTF_15
VSS_NCTF_16
VSS_NCTF_17
VSS_NCTF_18
VSS_NCTF_19
VSS_NCTF_20
VSS_NCTF_21
VSS_NCTF_22
VSS_NCTF_23
VSS_NCTF_24
VSS_NCTF_25
VSS_NCTF_26
VSS_NCTF_27
VSS_NCTF_28
VSS_NCTF_29
VSS_NCTF_30
VSS_NCTF_31
VSS_NCTF_32
CONTACTLESS_DET# 33
DGPU_PWROK 41,63
PCIE_MCARD3_DET# 36
USB_MCARD2_DET# 36
SIO_A20GATE 42
12
RH1590_0402_5%~D@RH1590_0402_5%~D@
SIO_RCIN# 42
H_CPUPWRGD 7
T106@ T106@
T108@ T108@
Layout note:
Trace wide 10mil & length 30mil
All NCTF pins should have thick
traces at 45°from the pad.
RH2610_0402_5%~D@ RH2610_0402_5%~D@
2
12
RH26256_0402_5%~DRH26256_0402_5%~D
1
CH97
CH97
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
2
2
PECI_EC42
H_PECI7
+1.05V_RUN_VTT
12
1
+3.3V_RUN
CONTACTLESS_DET#
PLACE RH150 CLOS E TO THE BRANCHI NG POINT
( TO CPU and NVR AM CONNECTOR)
12
RH25610K _0402_1%~DRH25610K_0402_1%~D
SIO_A20GATE
SIO_RCIN#
PCH_GPIO1
SIO_EXT_SCI#
RH15810K_0402_5%~DRH15810K_0402_5%~D
RH20310K_0402_5%~DRH20310K_0402_5%~D
RH16410K_0402_5%~DRH16410K_0402_5%~D
12
RH26310K_0402_5%~DRH26310K_0402_5%~D
+VCCDFTERM
RH149 need to cl ose to CPU
12
RH149
RH149
2.2K_0402_5%~D
2.2K_0402_5%~D
DF_TVS_R
RH1500_0402 _5%~DRH1500_0402_5%~D
12
12
12
12
+3.3V_RUN
DF_TVS
DMI & FDI Termination Voltage
DF_TVS
Set to Vss when LOW
Set to Vcc when HIGH
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
Title
izeDocument NumberRev
SizeDocument NumberRev
SizeDocument NumberRev
S
Date:Sheetof
Date:Sheetof
Date:Sheetof
Compal Electronics, Inc.
PCH (5/8)
PCH (5/8)
PCH (5/8)
LA-6592P
LA-6592P
LA-6592P
1875Thursday, January 13, 2011
1875Thursday, January 13, 2011
1875Thursday, January 13, 2011
1
1.0
1.0
1.0
5
4
3
2
1
POWER
+1.05V_RUN
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
10U_0805_4VAM~D
10U_0805_4VAM~D
1
1
DD
+1.05V_RUN
2
CH30
CH30
CH32
CH32
2
+1.05V_RUN
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1
1
CH33
CH33
CH31
CH31
2
2
50 mA
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
CH47
CH47
+VCCAPLLEXP
1
CH40
CH40
2
@
@
10U_0805_4VAM~D
10U_0805_4VAM~D
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1
CH48
CH48
2
+VCCAPLL_FDI
12
RH247
@RH247
@
CC
BB
+1.05V_RUN
+3.3V_RUN
+1.05V_RUN
RH1950.022_0805_1%@RH1950.022_0805_1%@
12
1UH_LB2012T1R0M_20%~D
1UH_LB2012T1R0M_20%~D
10U_0805_4VAM~D
10U_0805_4VAM~D
1
CH44
CH44
2
0.1U_0402_10V7K~D
0.1U_0402_10V7K~D
1
CH51
CH51
2
+VCCAPLL_FDI
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1
1
CH45
CH45
CH46
CH46
2
2
+1.05V_+1.5V_1.8V_RUN
+1.05V_RUN
+1.05V_RUN_VTT
1
2
UH4G
UH4G
AA23
VCCCORE[1]
AC23
VCCCORE[2]
AD21
VCCCORE[3]
AD23
VCCCORE[4]
AF21
VCCCORE[5]
AF23
VCCCORE[6]
AG21
VCCCORE[7]
AG23
VCCCORE[8]
AG24
VCCCORE[9]
AG26
VCCCORE[10]
AG27
VCCCORE[11]
AG29
VCCCORE[12]
AJ23
VCCCORE[13]
AJ26
VCCCORE[14]
AJ27
VCCCORE[15]
AJ29
VCCCORE[16]
AJ31
VCCCORE[17]
AN19
VCCIO[28]
BJ22
VCCAPLLEXP
AN16
VCCIO[15]
AN17
VCCIO[16]
AN21
VCCIO[17]
AN26
VCCIO[18]
AN27
VCCIO[19]
AP21
VCCIO[20]
AP23
VCCIO[21]
AP24
VCCIO[22]
AP26
VCCIO[23]
AT24
VCCIO[24]
AN33
VCCIO[25]
AN34
VCCIO[26]
BH29
VCC3_3[3]
AP16
VCCVRM[2]
BG6
VccAFDIPLL
AP17
VCCIO[27]
AU20
VCCDMI[2]
CougarPoint_Rev_1p0
CougarPoint_Rev_1p0
POWER
VCC CORE
VCC CORE
VCCIO
VCCIO
FDI
FDI
CRTLVDS
CRTLVDS
VCCTX_LVDS[1]
VCCTX_LVDS[2]
VCCTX_LVDS[3]
VCCTX_LVDS[4]
DMI
DMI
VCCDFTERM[1]
VCCDFTERM[2]
VCCDFTERM[3]
VCCDFTERM[4]
DFT / SPIHVCMOS
DFT / SPIHVCMOS
VCCADAC
VSSADAC
VCCALVDS
VSSALVDS
VCC3_3[6]
VCC3_3[7]
VCCVRM[3]
VCCDMI[1]
VCCCLKDMI
VCCSPI
U48
U47
AK36
AK37
AM37
AM38
AP36
AP37
V33
V34
AT16
AT20
AB36
AG16
AG17
AJ16
AJ17
V1
+1.8V_RUN_LVDS
1
2
1
2
+VCCCLKDMI
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1
CH50
CH50
2
+VCCADAC
0.01U_0402_16V7K~D
0.01U_0402_16V7K~D
0.1U_0402_10V7K~D
0.1U_0402_10V7K~D
1
1
CH34
CH34
2
2
0.01U_0402_16V7K~D
0.01U_0402_16V7K~D
0.01U_0402_16V7K~D
0.01U_0402_16V7K~D
CH104
CH104
CH103
CH103
1
2
CH43
CH43
0.1U_0402_10V7K~D
0.1U_0402_10V7K~D
+1.05V_+1.5V_1.8V_RUN
12
CH49
CH49
10U_0603_4VAM~D
10U_0603_4VAM~D
@
@
1
HK1608R10J-T_0603~D
HK1608R10J-T_0603~D
CH106
CH106
2
+VCCDFTERM
1
CH52
CH52
0.1U_0402_10V7K~D
0.1U_0402_10V7K~D
2
1
CH54
CH54
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
2
BLM18PG181SN1_0603~D
BLM18PG181SN1_0603~D
10U_0805_4VAM~D
10U_0805_4VAM~D
1
CH36
CH36
CH35
CH35
2
22U_0805_6.3VAM~D
22U_0805_6.3VAM~D
CH105
CH105
1
2
+3.3V_RUN
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
12
LH9
LH9
RH2760_0805_5%~D@RH2760_0805_5%~D@
LH1
LH1
12
+3.3V_RUN
12
LH8
LH8
HK1608R10J-T_0603~D
HK1608R10J-T_0603~D
+1.05V_RUN_VTT
+1.05V_RUN
12
PJP51
PJP51
12
PAD-OPEN1x1m
PAD-OPEN1x1m
+3.3V_M
+3.3V_RUN
+1.8V_RUN
+3.3V_RUN
+1.8V_RUN
PCH Power Rail Table
Voltage Rail
V_PROC_IO
V5REF
V5REF_Sus
Vcc3_3
VccADAC3
VccADPLLA
VccADPLLB
VccCore
VccDMI
Voltage
1.05
3.3
3.3
1.05
1.05
1.05
1.05
S0 Iccmax
Current (A)
0.001
5
5
0.001
0.001
0.266
0.001
0.08
0.08
1.3
0.042
1.05VccIO2.925
VccASW
VccSPI
VccDSW3_30.003
1.05
3.3
3.3
1.01
0.020
1.80.19VCCDFTERM
3.3VccRTC2 (mA)
3.3VccSus3_3
3.3VccSusHDA
0.119
0.01
VccVRM1.8 / 1. 50.16
1.05VccClkDMI0.02
1.05VccSSC
VccDIFFCLKN0.055
1.05
VccALVDS3.3
0.095
0.001
1.8VccTX_LVDS0.06
+1.5V_RUN
+1.8V_RUN
+1.05V_RUN
AA
RH1970_0603_5%~DRH1970_0603_5%~D
RH1980_0603_5%~D@RH1980_0603_5%~D@
RH1990_0603_5%~D@RH1990_0603_5%~D@
12
12
12
+1.05V_+1.5V_1.8V_RUN
+1.05V_RUN
1
+
CH41
@+CH41
@
330U_D2_2VM_R6M~D
330U_D2_2VM_R6M~D
2
1
+
CH42
@+CH42
@
330U_D2_2VM_R6M~D
330U_D2_2VM_R6M~D
2
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
SizeDocument NumberRev
SizeDocument NumberRev
SizeDocument NumberRev
Date:Sheetof
Date:Sheetof
Date:Sheetof
Compal Electronics, Inc.
PCH (8/8)
PCH (8/8)
PCH (8/8)
LA-6592P
LA-6592P
LA-6592P
2175Thursday, January 13, 2011
2175Thursday, January 13, 2011
2175Thursday, January 13, 2011
1
1.0
1.0
1.0
5
Place under CPU
Place C266 close to the Q12 as possible
C
@
@
DD
100P_0402_50V8J~D
100P_0402_50V8J~D
CC
100P_0402_50V8J~D
100P_0402_50V8J~D
BB
AA
2
C266
C266
1
(1) DP3/DN3 for SODIMM on Q14, place Q14 close to SODIMM and C272 close to Q14
(2) DP5/DN5 for Skin on Q13, place Q13 close to JMINI1 for WWAN and C277 close Q13
1
C272
@C272
@
2
MMBT3904WT1G_SC70-3~D
MMBT3904WT1G_SC70-3~D
+1.05V_RUN_VTT
H_THERMTRIP#7
THERMTRIP_VGA#46
C
E
E
31
MMBT3904WT1G_SC70-3~D
MMBT3904WT1G_SC70-3~D
C
C
2
B
B
E
E
31
Q14
Q14
R398
R398
2.2K_0402_5%~D
2.2K_0402_5%~D
12
PMST3904_SOT323-3~D
PMST3904_SOT323-3~D
+3.3V_RUN_GFX
8.2K_0402_5%~D
@R1111
8.2K_0402_5%~D
@
12
R1111
PMST3904_SOT323-3~D
PMST3904_SOT323-3~D
5
2
B
B
Q12
Q12
2
B
B
Q15
Q15
12
THERMB3
100P_0402_50V8J~D
100P_0402_50V8J~D
+3.3V_M
2.2K_0402_5%~D
2.2K_0402_5%~D
1
@
@
C277
C277
2
12
C
C
E
E
31
R1112
R1112
Q115
Q115
E
E
31
B
B
2
Q13
Q13
C
C
MMBT3904WT1G_SC70-3~D
MMBT3904WT1G_SC70-3~D
R395
R395
8.2K_0402_5%~D
8.2K_0402_5%~D
THERMATRIP2#
1
2
+3.3V_M
12
C
C
2
B
B
E
E
31
REM_DIODE1_P_4022
REM_DIODE1_N_4022
REM_DIODE3_P_4022
REM_DIODE3_N_4022
C278
C278
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
R405
R405
8.2K_0402_5%~D
8.2K_0402_5%~D
THERMATRIP3#
1
C280
C280
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
2
4
+FAN1_VOUT
+5V_RUN
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
10U_0805_10V4Z~D
10U_0805_10V4Z~D
C275
C275
C276
C276
1
1
+3.3V_RUN
2
2
10U_0805_6.3V6M~D
10U_0805_6.3V6M~D
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
C305
C305
C1171
C1171
1
1
2
2
+3.3V_M
12
C2702200P_0402_50V7K~DC2702200P_0402_50V7K~D
C2712200P_0402_50V7K~DC2712200P_0402_50V7K~D
MAX8731_IINP60
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
3
RB751S40T1_SOD523-2~DD2RB751S40T1_SOD523-2~D
22U_0805_6.3VAM~D
22U_0805_6.3VAM~D
D2
C219
C219
1
2
21
12
R38910K_040 2_5%~DR38910K_0402_5%~D
12
+3.3V_M
PCH_PWRGD#42
1
C282
C282
2
FAN1_DET#
FAN1_TACH_FB
VDD_PWRGD
REM_DIODE1_N_4022
REM_DIODE1_P_4022
REM_DIODE3_P_4022
REM_DIODE3_N_4022
VSET_4022
12
R3911K_0402_5%~DR3911K_0402_5%~D
+RTC_CELL
12
R406
R406
953_0402_1%~D
953_0402_1%~D
MOLEX_53398-0471~D
MOLEX_53398-0471~D
VGA_THERMDN
VGA_THERMDP
12
R3874.7K_0402_5%~DR3874.7K_0402_5%~D
FAN1_TACH_FB
FAN1_DET#
12
R117810K_0402_5%~DR117810K_0402_5%~D
3V_PWROK#
VSET_4022
VCP2
PWM
1
2
3
4
JFAN1
CONN@JFA N1
CONN@
1
2
5
3
G1
6
4
G2
U9
U9
2
VDDH
3
VDDH
6
VDDL
13
VDD_PWRGD
23
DN1/THERM
24
DP1/VREF_T
26
DN2/DP4
27
DP2/DN4
30
DP3/DN5
29
DN3/DP5
31
VCP
25
VIN
28
VSET
10
TACH/GPIO1
11
GPIO2
15
GPIO3/PWM/THERMTRIP_SIO
12
3V_PWROK#
16
RTC_PWR3V
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
EMC4022-1-EZK-TR_QFN32_5X5~D
EMC4022-1-EZK-TR_QFN32_5X5~D
1
C274
C274
2
THERMTRIP2#
THERMTRIP3#
POWER_SW#
ACAVAIL_CLR
ATF_INT#/BC_IRQ#
SMCLK/BC_CLK
SMDATA/BC_DATA
ADDR_MODE/XEN
POWER_SW#
2
17
18
FAN_OUT
FAN_OUT
VDD
TEST1
TEST2
VSS
19
20
21
9
5
4
8
7
1
32
14
22
33
U10
U10
SYS_SHDN#
TC7SH08FU_SSOP5~D
TC7SH08FU_SSOP5~D
THERMATRIP2#
THERMATRIP3#
POWER_SW#
BC_INT#_EMC4022
+VCC_4022
+ADDR_XEN
+RTC_CELL
5
P
B
4
O
A
G
3
+FAN1_VOUT
12
12
R403
R403
10K_0402_5%~D
10K_0402_5%~D
SMSC request
C281
C281
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
12
1
2
VGA_THERMDP47
VGA_THERMDN47
BC_INT#_EMC4022
FAN1_TACH_FB
FAN1_DET#
12
R39047K_0402_1%~D@ R39047K_0402_1%~D@
ACAV_IN42,60,62
BC_INT#_EMC4022 42
BC_CLK_EMC4022 42
BC_DAT_EMC4022 42
+VCC_4022
R3934.7K_0402_5%~DR3934.7K_0402_5%~D
1
C1104
C1104
470P_0402_50V7K~D
470P_0402_50V7K~D
2
R38510K_040 2_5%~DR38510K_0402_5%~D
R42610K_040 2_5%~DR42610K_0402_5%~D
R40210K_040 2_5%~DR40210K_0402_5%~D
THERM_STP# 53
22_0402_5%~D
22_0402_5%~D
C273
C273
DOCK_PWR_SW # 42
POWER_SW_IN# 42
1
VGA_THERMDP
VGA_THERMDN
12
12
12
+RTC_CELL
R388
R388
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
1
C1179
C1179
2
DSC only
+3.3V_M
12
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1
2
+3.3V_M
Rest=953, Tp=88degree
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
3
FP_USBD+33
FP_USBD-33
L8
@L8
@
DLW21SN121SQ2L_4P~D
DLW21SN121SQ2L_4P~D
1
1
4
4
12
R4090_0402_5%~DR4 090_0402_5%~D
12
R4100_0402_5%~DR4 100_0402_5%~D
2
3
R1135
@R1135
@
0_0603_5%
FP_USB_D+
2
FP_USB_D-
3
+3.3V_RUN
+3.3V_ALW
0_0603_5%
12
R1136
@R1136
@
0_0603_5%~D
0_0603_5%~D
12
+3.3V_FP
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
Title
izeDocument NumberR ev
SizeDocument NumberRev
SizeDocument NumberRev
S
Date:Sheetof
Date:Sheetof
2
Date:Sheetof
Compal Electronics, Inc.
LVDS SW/FP Conn.
LVDS SW/FP Conn.
LVDS SW/FP Conn.
LA-6592P
LA-6592P
LA-6592P
2375Tuesday, January 18, 2011
2375Tuesday, January 18, 2011
2375Tuesday, January 18, 2011
1
1.0
1.0
1.0
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