z Digital Gain and Offset Corrections
z Test DAC Bit-stream Generator
Digital Sine Wave Output
z Time Break Controller, General Purpose I/O
z Secondary SPI™ Port, Boundary Scan JTAG
z Microcontroller or EEPROM Configuration
z Small-footprint, 64-pin TQFP Package
z Low Power Consumption
9 mW per Channel at 500 SPS
z Flexible Power Supplies
I/O Interface: 3.3 V or 5.0 V
Digital Logic Core: 3.0 V, 3.3 V or 5.0 V
I
Description
The CS5376A is a multi-function digital filter utilizing a
low-power signal processing architecture to achieve efficient filtering for up to four ∆Σ modulators. By
combining the CS5376A with CS3301A/02A differential
amplifiers, CS5371A/72A ∆Σ modulators, and the
CS4373A ∆Σ test DAC a synchronous, high-resolution,
self-testing, multi-channel me as ur em e nt s yst em can be
designed quickly and easily.
Digital filter coefficients for the CS5376A FIR and IIR filters are included on-chip for a simple setup, or they can
be programmed for custom applications. Selectable digital filter decimation ratios produce output word rates
from 4000 SPS to 1 SPS, resulting in measurement
bandwidths ranging from 1600 Hz down to 400 mHz
when using the on-chip coefficient sets.
The CS5376A includes integrated peripherals to simplify
system design: offset and gain corrections, a test DAC
bit stream generator, a time-break controller, 12 general-purpose I/O pins, a secondary SPI port, and a
boundary scan JTAG port.
SPI1CTRL00 - 02R/W8, 8, 8SPI 1 Control
SPI1CMD03 - 05R/W8, 8, 8SPI 1 Command
SPI1DAT106 - 08R/W8, 8, 8SPI 1 Data 1
SPI1DAT209 - 0BR/W8, 8, 8SPI 1 Data 2
Digital Filter Registers
NameAddr.Type# BitsDescription
CONFIG00R/W24Hardware Configuration
RESERVED01-0DR/W24Reserved
GPCFG00ER/W24GPIO[7:0] Direction, Pull-up Enable, and Data
GPCFG10FR/W24GPIO[11:8] Direction, Pull-up Enable, and Data
SPI2CTRL10R/W24SPI 2 Control
SPI2CMD11R/W16SPI 2 Command
SPI2DAT12R/W24SPI 2 Data
RESERVED13-1FR/W24Reserved
FILTCFG20R/W24Digital Filter Configuration
GAIN121R/W24Gain Correction Channel 1
GAIN222R/W24Gain Correction Channel 2
GAIN323R/W24Gain Correction Channel 3
GAIN424R/W24Gain Correction Channel 4
OFFSET125R/W24Offset Correction Channel 1
OFFSET226R/W24Offset Correction Channel 2
OFFSET327R/W24Offset Correction Channel 3
OFFSET428R/W24Offset Correction Channel 4
TIMEBRK29R/W24Time Break Delay
TBSCFG2AR/W24Test Bit Stream Configuration
TBSGAIN2BR/W24Test Bit Stream Gain
SYSTEM12CR/W24User Defined System Register 1
SYSTEM22DR/W24User Defined System Register 2
VERSION2ER/W24Hardware Version ID
SELFTEST2FR/W24Self-Test Result Code
CS5376A
T able 3. SPI 1 and Digital Filter Registers
DS612F412
CS5376A
2. CHARACTERISTICS AND SPECIFICATIONS
•Min / Max characteristics and specifications are guaranteed over the Specified Operating Conditions.
•Typical performance characteristics and specifications are derived from measurements taken at nominal supply voltages and TA = 25°C.
•GND, GND1, GND2 = 0 V, all voltages with respect to 0 V.
SPECIFIED OPERATING CONDITIONS
ParameterSymbol Min NomMaxUnit
Logic Core Power SupplyVD2.853.05.25V
Microcontroller Interface Power SupplyVDD13.1353.35.25V
Modulator Interface Power SupplyVDD23.1353.35.25V
Ambient Operating TemperatureIndustrial (-IQ)T
A
-40-85°C
ABSOLUTE MAXIMUM RATINGS
ParameterSymbolMinMaxUnits
DC Power SuppliesLogic Core
Microcontroller Interface
Modulator Interface
Input Current, Any Pin Except Supplies(Note 1)I
Input Current, Power Supplies(Note 1)I
Output Current(Note 1)I
Power DissipationP
Digital Input VoltagesV
Ambient Operating Temperature (Power Applied)T
Storage Temperature RangeT
1. Transient currents up to 100 mA will not cause SCR latch-up.
VDD1
VDD2
VD
IN
IN
OUT
DN
IND
A
STG
-0.3
-0.3
-0.3
-±10mA
-±50mA
-±25mA
-500mW
-0.5VDD+0.5V
-4085°C
-65150°C
6.0
6.0
6.0
V
V
V
DS612F413
THERMAL CHARACTERISTICS
V
ParameterSymbol Min TypMaxUnit
Allowable Junction TemperatureT
Junction to Ambient Thermal ImpedanceΘ
Ambient Operating Temperature (Power Applied)T
Low-Level Output Drive VoltageI
Rise Times, Digital Inputst
Fall Times, Digital Inputst
Rise Times, Digital Outputst
Fall Times, Digital Outputst
Input Leakage Current(Note 2)I
3-State Leakage CurrentI
Digital Input CapacitanceC
Digital Output Pin CapacitanceC
= -40 µAV
out
= +40 µAV
out
J
JA
A
IH
IL
OH
OL
RISE
FALL
RISE
FALL
IN
OZ
IN
OUT
CS5376A
--135°C
-65°C / W
-40-+85°C
0.6 * VDD-VDDV
0.0-0.8V
VDD - 0.3-VDDV
0.0-0.3V
--100ns
--100ns
--100ns
--100ns
-± 1± 10µA
--± 10µA
-9-pF
-9-pF
Notes: 2. Max leakage for pins with pull-up resistors (TRST, TMS, TDI, SSI, GPIO, MOSI, SCK1) is ±250 µA.
t
risein
t
fa llin
2.6 V
0.9 * VDD
0.1 * VDD
0.7 V
t
rise out
t
fallo ut
0.9 * VDD
4.6
0.1 * VDD
0.4 V
POWER CONSUMPTION
ParameterSymbol Min TypMaxUnit
Operational Power Consumption
1.024 MHz Digital Filter ClockPWR
2.048 MHz Digital Filter ClockPWR
4.096 MHz Digital Filter ClockPWR
8.192 MHz Digital Filter ClockPWR
16.384 MHz Digital Filter ClockPWR
Standby Power Consumption
32 kHz Digital Filter Clock, Filter StoppedPWR
1
2
4
8
16
S
-21-mW
-26-mW
-37-mW
-57-mW
-85-mW
-40-µW
DS612F414
SWITCHING CHARACTERISTICS
SPI 1 Interface Timing (External Master)
SSI
CS5376A
MOSI
SCK1
SCLK
MSBMSB - 1
t
1
t
2
t
t
3
t
5
4
Figure 4. MOSI Write Timing in SPI Slave Mode
SSI
MISO
SCK1
SCLK
MSBMSB - 1LSB
t
t
9
t
7
8
Figure 5. MISO Read Timing in SPI Slave Mode
ParameterSymbol Min TypMaxUnit
MOSI Write Timing
SSI
Enable to Valid Latch Clockt
Data Set-up Time Prior to SCK1 Risingt
Data Hold Time After SCK1 Risingt
SCK1 High Timet
SCK1 Low Timet
SCK1 Falling Prior to SSI
Disablet
MISO Read Timing
SCK1 Falling to New Data Bitt
SCK1 High Timet
SCK1 Low Timet
SSI
Rising to MISO Hi-Zt
10
LSB
t
6
t
10
1
2
3
4
5
6
7
8
9
60--ns
60--ns
120--ns
120--ns
120--ns
60--ns
--60ns
120--ns
120--ns
--150ns
DS612F415
SWITCHING CHARACTERISTICS
Serial Data Port (SD Port)
SDRDY
SDCLK
t
3
SDDAT
t4t
SDTKI
SDTKO
t
1
t
2
5
CS5376A
t
t
6
7
t
t
9
8
Figure 6. SD Port Read Timing
ParameterSymbol Min TypMaxUnit
SDTKI to SDRDY Falling Edget
SDTKI High Time Widtht
SDRDY
Falling Edge to SDCLK Falling Edget
Data Setup Time Prior to SDCLK Risingt
Data Hold Time After SDCLK Risingt
SDCLK High Timet
SDCLK Low Timet
SDCLK Rising to SDRDY
Data Hold Time After SDRDY
SDRDY
High to SDTKO Rising Edget
Risingt
Risingt
SDTKO High Timet
10
t10t
11
1
2
3
4
5
6
7
8
9
60--ns
60-1000ns
50--ns
60--ns
60--ns
120--ns
120--ns
60--ns
--150ns
--60ns
11
90--ns
DS612F416
SWITCHING CHARACTERISTICS
CLK, SYNC, MCLK, MSYNC, and MDATAx
SYNC
MCLK
CS5376A
MSYNC
t
msd
MDATAx
Note: SYNC input latched on MCLK rising edge. MSYNC output triggered by MCLK falling edge.
TBS Data Bit Rate-256-kbps
TBS Data Rising to TBS Clock Rising Setup Timet
TBS Clock Rising to TBS Data Falling Hold Time(Note 6)t
4
5
60--ns
60--ns
5. TBSCLK phase can be delayed in 1/8 increments. The timing diagram shows no TBSCLK delay.
6. TBSDATA can be delayed from 0 to 63 full bit period s. The tim ing diag ram sho ws no T BSDATA delay.
DS612F418
CS5376A
Geophone
or
Hydrophone
Sensor
Geophone
or
Hydrophone
Sensor
Geophone
or
Hydrophone
Sensor
Geophone
or
Hydrophone
Sensor
CS3301A
AMP
AMP
AMP
AMP
CS3302A
CS3301A
CS3302A
CS3301A
CS3302A
CS3301A
CS3302A
Switch
Switch
MUX
MUX
CS5371A
CS5372A
∆Σ
Modulator
CS5371A
CS5372A
∆Σ
Modulator
CS5376A
Digital F ilter
CS4373A
DAC
M
U
X
M
U
X
M
U
X
M
U
X
Figure 9. Multi-Channel System Block Diagram
Test
System T e lemetry
µController
or
Configuration
EEPROM
Communication
Interface
3. SYSTEM DESIGN WITH CS5376A
Figure 9 illustrates a simplified block diagram of
the CS5376A in a multi-channel measurement system.
Up to four differential sensors are connected
through CS3301A/02A differential amplifiers to
the CS5371A/72A ∆Σ modulators, where analog to
digital conversion occurs. Each modulators 1-bit
output connects to a CS5376A MDATA input,
where the oversampled ∆Σ data is decimated and
filtered to 24-bit output samples at a programmed
output rate. These output samples are buffered in
an 8-deep data FIFO and passed to the system telemetry on command.
System self tests are performed by connecting the
CS5376A test bit stream (TBS) generator to the
CS4373A test DAC. Analog tests drive differential
signals from the CS4373A test DAC into the multiplexed inputs of the CS3301A/02A amplifiers or
directly to the sensors through external analog
switches. Digital loopback tests internally connect
the TBS digital output directly to the CS5376A
modulator inputs.
3.1 Power Supplies
The multi-channel system shown in Figure 9 typically operates from a ±2.5 V analog power supply
and a 3.3 V digital power supply. The CS5376A
logic core can be powered from 3 V to minimize
power consumption, if required.
3.2 Reset Control
System reset is required only for the CS5376A device, and is a standard active low signal that can be
generated by a power supply monitor or microcontroller. Other system devices default to a powerdown state when the CS5376A is reset.
DS612F419
CS5376A
3.3 Clock Generation
A single 32.768 MHz low-jitter clock input, which
can be generated from a VCXO based PLL, is required to drive the CS5376A device. Clock inputs
for other system devices are driven by clock outputs from the CS5376A.
3.4 Synchronization
Digital filter phase and analog sample timing of the
four ∆Σ modulators connected to the CS5376A are
synchronized by a rising edge on the SYNC pin. If
a synchronization signal is received identically by
all CS5376A devices in a measurement network,
synchronous sampling across the network is guaranteed.
3.5 System Configuration
Through the SPI 1 serial port, filter coefficients and
digital filter register settings can either be programmed by a microcontroller or automatically
loaded from an external EEPROM after reset. System configuration is only required for the
CS5376A device, as other devices are configured
via the CS5376A General Purpose I/O pins.
Two registers in the digital filter, SYSTEM1 and
SYSTEM2 (0x2C, 0x2D), are provided for user defined system information. These are general purpose registers that will hold any 24-bit data values
written to them.
3.6 Digital Filter Operation
After analog to digital conversion occurs in the
modulators, the oversampled 1-bit ∆Σ data is read
into the CS5376A through the MDATA pins. The
digital filter then processes data through the enabled filter stages, decimating it to 24-bit words at
a programmed output word rate. The final 24-bit
samples are concatenated with 8-bit status words
and placed into an output FIFO.
3.7 Data Collection
Data is collected from the CS5376A through the
Serial Data port (SD port). Automatically or upon
request, depending how the SDTKI pin is connected, the SD port initiates serial transactions to transfer 32-bit data from the output FIFO to the system
telemetry. The output FIFO has eight data locations
to permit latency in data collection.
3.8 Integrated peripherals
Test Bit Stream (TBS)
A digital signal generator built into the CS5376A
produces a 1-bit ∆Σ sine wave. This digital test bit
stream can be connected to the CS4373A test DAC
to create high quality analog test signals or it can be
internally looped back to the CS5376A MDATA
inputs to test the digital filter and data collection
circuitry.
Time Break
Timing information is recorded during data collection by strobing the TIMEB pin. A dedicated flag
in the sample status bits, TB, is set high to indicate
over which measurement the timing event occurred.
General Purpose I/O (GPIO)
Twelve general purpose pins are available on the
CS5376A for system control. Each pin can be set as
input or output, high or low, with an internal pullup enabled or disabled. The CS3301A/02A,
CS5371A/72A and CS4373A devices in Figure 9
are configured by simple pin settings controlled
through the CS5376A GPIO pins.
Serial Peripheral Interface 2 (SPI 2)
A secondary master mode serial port to communicate with external serial peripherals.
The CS5376A has three sets of power supply inputs. Two sets supply power to the I/O pins of the
device (VDD1, VDD2), and the third supplies
power to the logic core (VD). The I/O pin power
supplies determine the maximum input and output
voltages when interfacing to peripherals, and the
logic core power supply largely determines the
power consumption of the CS5376A.
4.1 Pin Descriptions
VDD1, GND1 - Pins 54,53
Sets the interface voltage to a microcontroller and
system telemetry. Can be driven with voltages from
3.3 V to 5 V.
VDD1 powers pins 1-5 and 41-64:
TRST, TMS, TCK, TDI, TDO
GND
GND2
MFLAG1
SI4
VDD2
SO
SI3
SI2
SI1
SCK2
GPIO0:CS0
GPIO6 - GPIO11:EECS
SSO
, SCK1, SSI, MISO, MOSI, SINT,
RESET
SDDAT, SDRDY
, BOOT, TIMEB, CLK, SYNC
, SDCLK, SDTKO, SDTKI
VDD2, GND2 - Pins 11, 25, 24, 38
Sets the interface voltage to the modulators, test
DAC, and serial peripherals. Can be driven with
voltages from 3.3 V to 5 V.
Sets the operational voltage of the CS5376A logic
core. Can be driven with voltages from 3 V to 5 V.
A 3 V supply minimizes total power consumption.
4.2 Bypass Capacitors
Each power supply pin should be bypassed with
parallel 1 µF and 0.01 µF caps, or by a single
0.1 µF cap, placed as close as possible to the
CS5376A. Bypass capacitors should be ceramic
(X7R, C0G), tantalum, or other good quality dielectric type.
4.3 Power Consumption
Power consumption of the CS5376A depends primarily on the power supply voltage of the logic
core (VD) and the programmed digital filter clock
rate. Digital filter clock rates are selected based on
the required output word rate as explained in “Digital Filter Initialization” on page 41.
22DS612F4
CS5376A
RESET
Figure 11. Reset Control Block Diagram
Self-Tests
SELFTEST
Register
5. RESET CONTROL
The CS5376A reset signal is active low. When released, a series of self-tests are performed and the
device either actively boots from an external EEPROM or enters an idle state waiting for microcontroller configuration.
5.1 Pin Descriptions
RESET - Pin 55
Reset input, active low.
BOOT - Pin 56
Boot mode select, latched following a RESET rising edge.
After RESET is released but before booting, a series of digital filter self-tests are run. Results are
Self-Test
Type
Program ROM0x00000A0x00000F
Data ROM0x0000A00x0000F0
Program RAM0x000A000x000F00
Data RAM0x00A0000x00F000
Execution Unit0x0A00000x0F0000
Pass
Code
Fail
Code
BOOT
Pin
1
EEPROM
Boot
0
µController
Boot
combined into the SELFTEST register (0x2F),
with 0x0AAAAA indicating all passed. Self-tests
require 60 ms to complete, after which configuration commands are serviced.
5.3 Boot Configurations
The logic state of the BOOT pin after reset determines if the CS5376A actively reads configuration
information from EEPROM or enters an idle state
waiting for a microcontroller to write configuration
commands.
EEPROM Boot
When the BOOT pin is high after reset, the
CS5376A actively reads data from an external serial EEPROM and then begins operation in the specified configuration. Configuration commands and
data are encoded in the EEPROM as specified in
the ‘Configuration By EEPROM’ section of this
data sheet, starting on page 26.
Microcontroller Boot
When the BOOT pin is low after reset, the
CS5376A enters an idle state waiting for a microcontroller to write configuration commands and
initialize filter operation. Configuration commands
and data are written as specified in the ‘Configuration By Microcontroller’ section of this data sheet,
starting on page 32.
DS612F423
CS5376A
Clock DividerCLK
MCLK
Generator
DSPCFG Register
Figure 12. Clock Generation Block Diagram
6. CLOCK GENERATION
The CS5376A requires a 32.768 MHz master clock
input, which is used to generate internal digital filter clocks and external modulator clocks.
6.1 Pin Description
CLK - Pin 58
Clock input, nominal frequency 32.768 MHz.
Internal
and
Clocks
MCLK
Output
ensure recovered clocks have identical phase, system PLL designs should use a phase/frequency detector architecture.
6.3 Master Clock Jitter and Skew
Care must be taken to minimize jitter and skew in
the received master clock as both parameters affect
measurement performance.
6.2 Synchronous Clocking
To guarantee synchronous measurements throughout a sensor network, the CS5376A master clock
should be distributed to arrive at all nodes in phase.
The 32.768 MHz master clock can either be directly distributed through the system telemetry, or reconstructed locally using a VCXO based PLL. To
Jitter in the master clock causes jitter in the generated modulator clocks, resulting in sample timing
errors and increased noise.
Skew in the master clock from node to node creates
a sample timing offset, resulting in systematic measurement errors in the reconstructed signal.
24DS612F4
CS5376A
0
SYNC
1
MSEN
MSYNC
Generator
Figure 13. Synchronization Block Diagram
7. SYNCHRONIZATION
The CS5376A has a dedicated SYNC input that
aligns the internal digital filter phase and generates
an external signal for synchronizing modulator analog sampling. By providing simultaneous rising
edges to the SYNC pins of multiple CS5376A devices, synchronous sampling across a network can
be guaranteed.
7.1 Pin Description
SYNC - Pin 59
Synchronization input, rising edge triggered.
7.2 MSYNC Generation
Digital
Filter
MSYNC
Output
0
1
TSYNC
Tes t Bit
Stream
phase. Filter convolutions restart, and the next output word is available one full sample period later.
Repetitive synchronization is supported when
SYNC events occur at exactly the selected output
word rate. In this case, re-synchronization occurs at
the start of a convolution cycle when the digital filter state machine is already reset.
7.4 Modulator Synchronization
The external MSYNC signal phase aligns modulator analog sampling when connected to the
CS5371A/72A MSYNC input. This ensures synchronous analog sampling relative to MCLK.
The SYNC signal rising edge is used to generate a
retimed synchronization signal, MSYNC. The
MSYNC signal reinitializes internal digital filter
phase and is driven onto the MSYNC output pin to
Repetitive synchronization of the modulators is
supported when SYNC events occur at exactly the
selected output word rate. In this case, synchronization will occur at the start of analog sampling.
phase align modulator analog sampling.
The MSEN bit in the digital filter CONFIG register
(0x00) enables MSYNC generation. See “Modulator Interface” on page 39 for more information
about MSYNC.
7.5 Test Bit Stream Synchronization
When the test bit stream generator is enabled, an
MSYNC signal can reset the internal data pointer.
This restarts the test bit stream from the first data
point to establish a known output signal phase.
7.3 Digital Filter Synchronization
The internal MSYNC signal resets the digital filter
state machine to establish a known digital filter
The TSYNC bit in the digital filter TBSCFG register (0x2A) enables synchronization of the test bit
stream by MSYNC. When TSYNC is disabled, the
test bit stream phase is not affected by MSYNC.
DS612F425
GPIO11:EECS
CS5376AAT25640
Figure 14. EEPROM Configuration Block Diagram
8. CONFIGURATION BY EEPROM
SCK1
MISO
MOSI
CS5376A
VD
387
46
48
50
51
WP VCC HOLD
1
CS
6
SCK
2
SO
5
SI
4
GND
After reset, the CS5376A reads the state of the
BOOT pin to determine a source for configuration
commands. If BOOT is high, the CS5376A initiates serial transactions through the SPI 1 port to
read configuration information from an external
EEPROM.
8.1 Pin Descriptions
Pins required for EEPROM boot are listed here,
other SPI 1 pins are inactive.
GPIO11:EECS - Pin 46
EEPROM chip select output, active low.
SCK1 - Pin 48
Serial clock output, nominally 1.024 MHz.
MOSI - Pin 51
Serial data output pin. Valid on rising edge of
SCK1, transition on falling edge.
MISO - Pin 50
Serial data input pin. Valid on rising edge of SCK1,
transition on falling edge.
8.2 EEPROM Hardware Interface
When booting from EEPROM the CS5376A SPI 1
port actively performs serial transactions, as shown
in Figure 15, to read configuration commands and
data. 8-bit SPI opcodes and 16-bit addresses are
combined to read back 8-bit configuration commands and 24-bit configuration data.
System design should include a connection to the
configuration EEPROM for in-circuit reprogramming. The CS5376A SPI 1 pins go high impedance
when inactive to support external connections to
the serial bus.
8.3 EEPROM Organization
The boot EEPROM holds the 8-bit commands and
24-bit data required to initialize the CS5376A into
an operational state. Configuration information
starts at memory location 0x10, with addresses
0x00 to 0x0F free for use as manufacturing header
information.
The first serial transaction reads a 1-byte command
from memory location 0x10 and then, depending
on the command type, reads multiple 3-byte data
words to complete the command. Command and
data reads continue until the ‘Filter Start’ command
is recognized.
The maximum number of bytes that can be written
for a single configuration is approximately
26DS612F4
CS5376A
InstructionOpcodeAddressDefinition
Read0x03ADDR[15:0]Read data beginning at the address given in ADDR.
SPI 1 Read from EEPROM
SSI
MOSI
MISO
EECS
Cycle
SCK1
MOSI
READ
CMD
0x03ADDR
2 BYTE
ADDR
ADDR
DATA1DATA3DATA2
1 BYTE / 3 BYTE
DATA
18276543
MSBLSB
612345
MISO
EECS
MSBLSB612345
Figure 15. SPI 1 EEPROM Read Transactions
X
DS612F427
Write DF Register - 0x01
CS5376A
0000h
Mfg Header
0010h
EEPROM
Manufacturing
Information
8-bit Command
N x 24-bit Data
EEPROM
Command and
8-bit Command
Data Values
N x 24-bit Data
. . .
1FFFh
Figure 16. 8 Kbyte EEPROM Memory Organization
5 KByte (40 Kbit), which includes command overhead:
Memory RequirementBytes
Digital Filter Registers (22)154
FIR Coefficients (255+255)1537
IIR Coefficients (3+5)25
Test Bit Stream Data (1024)3076
This EEPROM command writes a data value to the
specified digital filter register. Digital filter registers control hardware peripherals and filtering
functions. See “Digital Filter Registers” on page 86
for the bit definitions of the digital filter registers.
Sample Command:
Write digital filter register 0x00 with data value
0x070431. Then write 0x20 with data 0x000240.
01 00 00 00 07 04 31
01 00 00 20 00 02 40
Write FIR Coefficients - 0x02
This EEPROM command writes custom coefficients for the FIR1 and FIR2 filters. The first two
data words set the number of FIR1 and FIR2 coefficients to be written. The remaining data words are
the concatenated FIR1 and FIR2 coefficients.
A maximum of 255 coefficients can be written for
each FIR filter, though the available digital filter
computation cycles will limit their practical size.
See “FIR Filter” on page 47 for more information
about FIR filter coefficients.
SPI mode 0 (0,0) compatible, 16-bit addresses, 8bit data, larger than 5 KByte (40 KBit). ATMEL
AT25640, AT25128, or similar serial EEPROMs
are recommended.
This EEPROM command writes custom coefficients for the two stage IIR filter. The IIR architecture and number of coefficients is fixed, so eight
data words containing coefficient values always
8.4 EEPROM Configuration
Commands
immediately follow the command byte. The IIR coefficient write order is: a11, b10, b11, a21, a22,
b20, b21, and b22. See “IIR Filter” on page 55 for
03
84 BC 9D 7D A1 B1 82 5E 4F 83 69 4F
3C AD 5F 3E 51 04 83 5D F8 3E 51 04
Write ROM Coefficients - 0x04
This EEPROM command selects the on-chip coefficients for the FIR1, FIR2, IIR 1st order, and IIR
2nd order filters for use by the digital filter. One
data word is required to select which internal coefficient sets to use. See “Filter Coefficient Selection” on page 41 for information about selecting
on-chip FIR and IIR coefficient sets.
Sample Command:
Select IIR1 and IIR2 3 Hz @ 500 SPS low-cut coefficients, with FIR1 and FIR2 linear phase highcut coefficients. Data word 0x002200.
04 00 22 00
Write TBS Data - 0x05
This EEPROM command writes a custom data set
for the test bit stream (TBS) generator. This command, along with the ability to program the test bit
stream generator interpolation and clock rate, can
create custom frequency test signals.
The first data word sets the number of TBS data to
be written and the remaining data words are the
TBS data values. See “Test Bit Stream Generator”
on page 64 for information about using custom test
bit stream data sets.
NameCMD
8-bit
NOP00-No Operation
WRITE DF REGISTER01REG
WRITE FIR COEFFICIENTS02NUM FIR1
WRITE IIR COEFFICIENTS03a11
WRITE ROM COEFFICIENTS04COEF SELUse On-Chip Coefficients
WRITE TBS DATA05NUM TBS
WRITE ROM TBS06-Use On-Chip TBS Data
FILTER START07-Start Digital Filter Operation
DATA
24-bit
DATA
NUM FIR2
(FIR COEF)
b10
b11
a21
a22
b20
b21
b22
(TBS DATA)
Description
Write Digital Filter Register
Write Custom FIR Coefficients
Write Custom IIR Coefficients
Write Custom Test Bit Stream Data
(DATA) indicates multiple words of this type are to be written.
Table 5. EEPROM Boot Configuration Commands
DS612F429
CS5376A
Sample Command:
Write test bit stream data 0x000000, 0x0007DA,
0x000FB5, 0x00178F.
05 00 00 04
00 00 00 00 07 DA 00 0F B5 00 17 8F
Write TBS ROM Data - 0x06
This EEPROM command selects the on-chip test
bit stream (TBS) data for use by the TBS generator.
No data words are required for this EEPROM command. See “Test Bit Stream Generator” on page 64
for more information about the on-chip test bit
stream data set.
Sample Command:
06
Filter Start - 0x07
This EEPROM command initializes and starts the
digital filter. Measurement data becomes available
one full sample period after this command is received. No data words are required for this EEPROM command.
Sample Command:
07
8.5 Example EEPROM Configuration
Table 6 shows an example EEPROM file for a minimal CS5376A configuration.
30DS612F4
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