Boosted Class D Amplifier with Speaker-Protection Monitoring
and Flash LED Drivers
Mono Class D Speaker Amplifier
• Two-level Class G operation:
• Boosted: 5 V nominal
• Bypassed: battery voltage is supplied directly
• 2.5-mA quiescent current, monitors powered down
• 1.7 W into 8 (@ 10% THD+N)
• 102-dB signal-to-noise ratio (SNR, A-weighted)
• Idle channel noise 25 Vrms (A-weighted)
• 90% efficiency
Audio Input and Gain
• One differential analog input
• Speaker gain:
• 9, 12, 15, and 18 dB and mute
• Pop suppression, zero-crossing detect transitions
Flash LED Drivers
• Integrated dual LED drivers using the following:
• Boost supply output voltage
• Dual matched current regulators, 750 mA max each
• Programmable setting for Flash Mode current:
50–750 mA, in 50-mA steps
• Programmable setting for Flash-Inhibit Mode current:
50–350 mA, in 50-mA steps
• Programmable setting for Movie Mode current:
150, 120, 100, 80, 60, 40, 20 mA
• Programmable flash timer setting:
50–500 ms, in 25-ms steps
• Dedicated pin for flash trigger (FLEN)
• Dedicated pin for flash inhibit (FLINH)
• Thermally managed through boost-voltage regulation
(Features continue on page 2)
http://www.cirrus.com
Copyright Cirrus Logic, Inc. 2014
(All Rights Reserved)
JUL ‘14
DS963F4
CS35L32
Monitors and Protection
•Protection:
• Latched overtemperature shutdown
• Latched amplifier output short circuit shutdown
• LED short or open detection and LED driver shutdown
• Flash inhibit LED current reduction
• Low battery flash LED current reduction
• VP undervoltage lockout (UVLO) shutdown
• Programmable boost inductor current limiting
• Audio and LED shutdown upon stopped MCLK, with
autorecovery
• Interrupt driven error reporting
• Speaker current and voltage monitoring:
• 16-bit resolution
• 60-dB dynamic range (unweighted) for voltage
• 56-dB dynamic range (unweighted) for current
• Bused over I
• Battery voltage monitoring:
• 7-bit resolution
• Bused over I
• System reset
2
S bus
2
S and I2C bus
I2C Control Settings and Registers
• Low-power standby
• LED and audio power budgeting programmable settings
• Boost inductor current limit programmable setting
• Speaker programmable settings:
• Pop suppression through zero-crossing transitions
• Gain and mute
• Battery voltage monitor register, 8 bits
• LED driver programmable settings:
• Flash current register
• Flash inhibit current register
• Movie Mode current register
• Flash timer register
• Error status bit, including the following:
• Stopped MCLK error
• Low battery detection with programmable thresholds
• VP UVLO error
• Overtemperature warning
• Overtemperature error
• Boost converter overvoltage error
• Boost inductor current-limiting error
• Amplifier short-circuit error
• Shorted or open LED error
I2S Reporting
• Monitoring:
• Speaker voltage monitor
• Speaker current monitor
• Battery voltage monitor
• Error reporting:
• VP UVLO shutdown error
• Overtemperature warning
• Overtemperature error
• Boost converter overvoltage error
• Boost inductor current limiting error
• Amplifier short-circuit error
• Speaker voltage monitor overflow error
• Speaker current monitor overflow error
• Battery voltage monitor overflow error
• Status reporting:
• Power-down done
• LED flash event
• LED Movie Mode event
• Flash timer on
Package
• 30-ball WLCSP
Applications
• Smart phones
•Tablets
General Description
The CS35L32 is a low-quiescent power-integrated audio IC, with a mono full-bridge Class D speaker amplifier operating
with a self-boosted Class G supply. Audio input is received differentially. Pop-and-click reduction is achieved with zerocrossing transitions at turn-on, turn-off and upon gain changes. Communication with the host processor is done using an
2C
I
interface. In addition, an I2S bus is used to send monitor and status data.
When two CS35L32 devices are available on the same board, each is identified by its I
or upon deasserting RESET
The speaker amplifier, using closed-loop modulation, achieves low levels of distortion. Class D amplifier efficiency
allows operation at higher speaker power levels without generating excessive heat and without wasting power. Automatic
Class G operation using a boosted supply to the speaker allows for even higher powers and higher crest factor. With a
boosted speaker supply, operation at a fixed 5 V is achieved independently of line supplied battery voltage. The user can
disable Class G operation.
2DS963F4
, each CS35L32 reads the AD0 pin logic level and configures its I2C device address.
2
C chip address. Upon power-up
CS35L32
The battery voltage, speaker voltage, and speaker current signals are monitored, digitized using converters, and
serialized over an I
externally to the CS35L32. Outgoing data is sent over I
monitor data is accessible through I
2
S bus. The speaker monitoring signals are part of a speaker-protection algorithm that is managed
2
C.
2
S with the CS35L32 in Slave or Master Mode. Battery voltage
An integrated dual LED driver operates up to two LEDs in Flash Mode or Movie Mode. A flash event is triggered by an
external signal. A flash-inhibit event is triggered by an external signal, and causes a reduction in flash current. A timer is
provided for flash and flash inhibit events. Movie Mode operation has no timer and starts and ends via an I
Flash and Movie Mode current levels, as well as the flash timer are I
2
C programmable.
2
C command.
Total power consumption when powering LEDs in Flash Mode or Movie Mode, and powering audio simultaneously, is
managed by the user’s choices in programming the current limit and in power budgeting. The primary goal is to manage
audio and LED loads so the boost converter is not current limited and so the CS35L32 does not shut down due to
overheating.
A latched shutdown of the audio amplifier occurs in the event of an output short pin to ground, pin to supply, or pin to pin.
A latched shutdown of the CS35L32 also occurs on overtemperature. An LED driver shutdown occurs in the event of a
shorted or open LED. The CS35L32 shuts down in the event of a battery (VP) undervoltage and autorecovers when the
battery voltage recovers. The CS35L32 shuts down in the event of a stopped MCLK and autorecovers when MCLK
recovers.
The CS35L32 responds to detection of a low battery in the presence of a flash event by reducing flash current and
autorecovers when the battery voltage recovers.
The CS35L32 is reset by asserting RESET
. CS35L32 power up and power down are managed through the RESET pin.
The CS35L32 is available in a 30-ball WLCSP package in the temperature range –10 to +70°C.
low-power mode, outputs are set to Hi-Z, and
I²C register values are set to defaults. Outputs
are Hi-Z except those with weak pull-ups or
pull-downs as mentioned.
1 Pin Descriptions
Internal
Connection
——Hysteresis
DriverReceiver
CS35L32
State at
Reset
Low
on CMOS
input
FLEND4VAI Flash Enable. Input signal commanding a
FLINHC4VAI Flash Inhibit. Input signal determining
FLOUT1B6SPKR
SUPPLY
FLOUT2/AD0A6SPKR
SUPPLY
VBSTE1—O Boost Converter Output. Output of boosted
SPKRSUPPLYE2—I Speaker Supply. Full-bridge Class D speaker
SWC1, D1VBSTI Boost Converter Switch Node. Connects the
IREF+D5VAI Current Reference Resistor. Connection for
flash event into both LEDs. It is asserted high.
whether the LEDs are in Flash Mode (logic
low) or Flash-Inhibit Mode (logic high, LED
current reduced).
O LED Driver 1. Output driving LED 1 by sinking
current from the LED cathode
I/O LED Driver 2/Address Zero. Output driving
LED 2 by sinking current from the LED
cathode. AD0 programs the chip address
when RESET
tying the pin to ground clears the chip address
LSB. Otherwise, the LSB is set.
supply. This pin cannot be used to drive any
external loads other than the on chip Class D
Amplifier and Flash LEDs.
amplifier power supply.
inductor to the rectifying switch.
an external resistor to be used for generating
the CS35L32’s internal main current reference.
See Fig. 2-1 for required resistor value.
is deasserted. If no LED is used,
Weak pulldown
(~1 M
Weak pulldown
(~1 M
Weak pull-up
(~1 M
Weak pull-up
(~1 M
————
——
————
————
—Hysteresis
on CMOS
input
—Hysteresis
on CMOS
input
——SPKR
——SPKR
Pulled
down
Pulled
down
SUPPLY
SUPPLY
IN+E4SPKR
IN–E3SPKR
SPKOUT+
SPKOUT–/VSENSE–D2D3
ISENSE+
ISENSE–/VSENSE+E6E5
FILT+D6VAO Positive Voltage Reference. Positive
VAC6—I Analog Input Power. Power supply for
VPB1—I Boost Converter Input Power. Power supply
GNDAC5—Analog Ground. Ground reference for the
GNDPC2, C3—Power Ground. Ground reference for boost
GNDPLEDB5—LED Power Ground. Ground reference for
SUPPLY
SUPPLY
SPKR
SUPPLY
SPKR
SUPPLY
I Input 1 Differential Positive Line. Positive
analog input
I Input 1 Differential Negative Line. Negative
analog input
O Speaker Differential Audio Output. Internal
Class D speaker amplifier output. SPKOUT–
serves as voltage monitor negative sense pin
(VSENSE–).
I Current Sense Inputs. Sense voltage across
an external resistor in series with SPKOUT+.
ISENSE– serves as voltage monitor positive
sense pin (VSENSE+).
reference for internal circuits
internal analog section
or battery voltage powering boost converter
internal analog section of the IC
converter and Class D amplifier’s output stage
LED current return. Should be tied to ground
plane.
————
————
———Hi-Z
————
————
————
————
————
————
————
6DS963F4
2Typical Connection Diagram
Batter y
1 H
C
OUT
0.1
0.1 F
**
L
BST
44.2 k
R
BST_SNS
8
C
OUT
**
Applications
Processor
0.1 F
10 F
C
BST
*
*
RPRPRP_
I
PMU
10 F
*
0.1 F
VA
*
4.7 F
*
Line Input 1
CS35L32
ISENSE–/
VSENSE +
SPKOUT+
ISENSE+
IREF+
SPKOUT–/
VSENSE–
VBST
GNDP
FLOUT1
FLOUT2 / AD0
GNDPLED
SPKRSUPPLY
SDOUT
LRCK
SCLK
MCLK
FLEN
FLINH
SCL
SDA
INT
RESET
VA
FILT+
GNDA
IN+
IN–
VPSW
*
*
3.0–5.25 V
1.71–1.89 V
10 F
Notes:
• All external passive component values are nominal values.
Key for capacitor types required:
* Use low ESR, X7R/X5R capacitors.
** Use low ESR, X7R capacitors.
If no type symbol is shown next to a capacitor, any type may be used.
• As required, add protection circuitry to ensure compliance with the absolute maximum ratings in Tab le 3 -2 .
1. C
BST
is a ceramic capacitor and derates at DC voltages higher than 0 V. In this application, the capacitor should not derate to a value lower
than 4 F across the specified boost output voltage in Tab le 3 -4 . Capacitor tolerance and the temperature coefficient should also be taken
into account to guarantee the 4-F value.
2. Minimum pull-up resistor values are selected in accordance with the Table 3-8 V
OL
specification. Maximum pull-up resistances are selected
based on load capacitance and relevant switching specs (Table 3-13).
3. Select each capacitor to be 0.22 F for an 18-Hz passband @ 12-dB amplifier gain, for a 3-dB roll-off. The equation for calculating the
capacitance for a given passband is C = 1/( * f * R
INDIF
), where C is in F, R
INDIF
is the differential input resistance in and f is in Hz (see
the differential input resistance specification in Tab l e 3- 3). Signals IN+ and IN– are subject to the recommended ranges in Table 3-1.
4. R
BST_SNS
is inherently tied to the accuracy of the BST_IPK current limit. A resistor with a 0.1% tolerance is required for this component to
meet the specified IMAX(B) max and min values in Table 3-4.
5. The required tolerance on the 0.1- ISENSE resistor is 1%. The required temperature coefficient is ±200 ppm/°C.
6. C
OUT
capacitors are optional EMI suppressors used with CS35L32 edge-rate control, depending on application requirements. Because
switching losses increase linearly with increases to these capacitances, it is recommended that C
GNDA = GNDP = 0 V, all voltages with respect to ground. Device functional operation is guaranteed within these limits. Functionality is not guaranteed
or implied outside of these limits. Operation outside of these limits may adversely affect device reliability.
Parameters Test Conditions Symbol Min MaxUnits
DC power supplyAnalog (and digital I/O and core)—VA1.711.89V
Battery—VP3.05.25V
External voltage applied to analog inputs powered by VA (IREF+, FILT+)
External voltage applied to analog inputs powered by SPKRSUPPLY (IN+,
IN–, ISENSE+, ISENSE–,VSENSE+, VSENSE–)
External voltage applied to digital inputs—V
Ambient temperature —TA–10+70°C
1.The maximum overvoltage/undervoltage is limited by the input current.
Table 3-2. Absolute Maximum Ratings
GNDA = GNDP = 0 V; all voltages with respect to ground. Operation at or beyond these limits may permanently damage the device.
Parameters Test Conditions SymbolMinMaxUnits
DC power supply Analog—VA–0.32.22V
Input current
1
Ambient operating temperature (local to device, power applied)—T
Junction operating temperature (power applied)—T
Storage temperature—T
1.Any pin except supplies. Transient currents of up to ±100 mA on the analog input pins do not cause SCR latch up.
Table 3-3. DC Characteristics
Test conditions, except where noted otherwise: VA = 1.8 V, VP = 3.6 V, VBST = 5.0 V, GNDA = GNDP = 0 V, TA = +25°C.
ParametersSymbol Test ConditionsMin Typical Max Units
Boost FET ON resistanceR
Boost FET ON resistance temp coefficient—I
Rectifying FET ON resistanceR
Rectifying FET ON resistance temp coefficientI
Overvoltage detection thresholdV
Threshold Class G On, IN+ to IN–V
Threshold Class G Off, IN+ to IN–V
f
SW(B)
DS(ON)B
DS(ON)R
OVTH
IN1THON
IN1THOF
I
OUT(B)
OUT(B)
I
OUT(B)
OUT(B)
Boost enabled—5.55.7V
VBST = VP = 3.6 V—0.60—V
VP = 3.6 V, VBST = 5 V—0.33—V
Minimum Class G boost ON hold-off time—VP = 3.6 V, VBST = 5 V—800
Operating efficiency
1.MCLKDIV2 (see p. 37) should be configured so MCLK
2.Minimum Class G boost ON hold-off time is determined from when the low audio detection is latched until when the boost is turned off. The latching
mechanism occurs in 800-ms intervals. If the audio level is detected as low between two sequential latches, the hold-off time is extended by the
difference between when the detection occurs and the subsequent latch pulse. This may extend the hold-off time up to 1.6 s in extreme cases.
3.Efficiency specified here assumes the boost converter drives an external resistive load via the VBST pin, instead of the onboard Class D amplifier.
Table 3-5. LED Drive Characteristics
Test conditions, except where noted otherwise: VA = 1.8 V, VP = 3.6 V, VBST = 5.0 V, GNDA = GNDP = GNDPLED = 0 V, TA = +25°C.
3
B
is 6 or 6.1440 MHz (see Table 4-14) for boost-converter operation at 2 or 2.05 MHz.
—
LED current accuracy–10—+10%
LED current matching—10—%
Flash timer (t
) MCLK
flash
MCLK
= 6 MHz 2; TIMER = 1 0010–1 1111
INT
TIMER = 0 0001
TIMER = 0 0000
= 6.144 MHz; TIMER = 1 0010–1 1111
INT
TIMER = 0 0001
TIMER = 0 0000
—
—
—
—
—
—
500
75
50
488.3
73.2
48.8
—
—
—
—
—
—
LED flash timer accuracy0—+1ms
LED flash inhibit time (FLINH high to LED current 3% settling)—40—s
1.Flash or Movie Mode current is delivered from the boost converter’s output, which provides a voltage higher than the LED voltage. Depending on the
LED voltage requirement and on VP supply voltage, the boost converter is internally controlled to boost or be in bypass (rectifying FET fully on).
2.The flash time setting is generated from MCLK
. MCLKDIV2 (see p. 37) should be configured so MCLK
Test conditions, except where noted otherwise: VA = 1.8 V, VP = 3.6 V, VBST = 5.0 V, 1-kHz input, amp gain = 12 dB, GNDA = GNDP = 0 V, TA = +25°C,
measurement bandwidth is 20 Hz to 20 kHz, Fs = 48 kHz, MCLK
ParametersSymbol Test Conditions Min Typical Max Units
Continuous average power delivered to load
1
Po8- load, THD 10%
THD+NTHD+N8- load, 1.0 W —0.02—%
Input voltage @ 1% THD+NV
ICLIP
Signal to noise ratioSNRReferenced to output voltage @1% THD+N, A-weighted —102 —dB
Idle channel noiseICNVBST = VP, A-weighted —25— Vrms
Common-mode rejection ratioCMRRV
Frequency responseFR20 Hz to 20 kHz, No input DC blocking caps –0.100.1dB
Efficiency
2
A
Class D amplifier gain—AMP_GAIN = 000 (mute)
N-FET ON resistanceR
P-FET ON resistanceR
Output DC offset voltageV
Time from shutdown to audio outt
DS ON,N
DS ON,P
OFFSET
SDRESET
1.Power delivered to the speaker from the 0.1- load side terminal (refer to Fig. 2-1).
2.Efficiency collected using a 5-V external supply, as shown
in the drawing. For this test, the VBST pin should not be
connected to the SPKRSUPPLY pin.
Test conditions, except where noted otherwise: VA = 1.8 V, VP = 3.6 V, VBST = 5.0 V, amp gain = 12 dB, 0.1- sense resistor, GNDA = GNDP = 0 V,
T
= +25°C. Measurement bandwidth is 20 Hz to 20 kHz, Fs = 48 kHz, Input Signal = 1 kHz, MCLK
A
and Section 7.7.
Parameters MinTypicalMaxUnits
General ADC characteristicsPower-up time: t
VSENSE± monitoring
characteristics (VMON)
Dynamic range (unweighted), VSENSE± = ±5.0 V (10 V
Total harmonic distortion + noise, –3.8 dBFS
Full-scale signal input voltage 6.59•VA 6.94•VA 7.29•VA V
Common-mode rejection ratio (217 Hz @ 500 mVPP)
ISENSE± monitoring
characteristics (IMON)
Dynamic range (unweighted), ISENSE± = ±0.625 A (1.25 A
Total harmonic distortion, –29.5 dBFS
Full-scale signal input voltage 1.56•VA 1.64•VA 1.72•VA V
VMON-to-IMON isolation
VP monitoring characteristicsData width—8—Bits
Voltage resolution (See the equation in Section 4.8.4.)—35.3—mV
(FF code) signal input voltage (VP) 2.89•VA 3.05•VA 3.20•VAV
VPMON = 1011 0011
VPMON = 1011 0100
VPMON = 1111 1111
VPMON = 0000 0000
1.Typical value is specified with PDN_AMP and PDN_xMON bits initially set. Maximum power-up time is affected by the actual MCLK
2.Parameters given in dB are referred to the applicable typical full-scale voltages. Applies to all THD+N and resolution values in the table
3.VSENSE± THD is measured with the Class D amplifier as the audio source connected to an 8- + 33H speaker load, supplied by a 6.3-VPP, 1-kHz
sine wave, operating under the typical performance test conditions to produce a large, unclipped audio signal. This setup produces a –3.8-dBFS
VMON output. Larger Class D amplifier amplitudes begin to exhibit clipping behavior, increasing distortion of the signal supplied to VSENSE±
4.CMRR test setup for VSENSE±:
= 6 MHz, MCLK
INT
PUP(ADC)
is explained in Section 4.13.1
INT
—8.5
[1]
Data width—16—Bits
)—60— dB
PP
3
—–60—dB
4
—60—dB
Group delay
5
—7.6/Fs— s
Data width—16—Bits
)—56— dB
PP
6
—–45—dB
7
—56—dB
Group delay
8
—7.6/Fs— s
…
—
—
…
—
—
2.8
2.835
…
5.482
5.518
—
—
…
—
—
frequency.
INT
ms
2
2
PP
2
2
2
PP
2
V
V
…
V
V
5.VMON group delay is measured from the time a signal is presented on the VSENSE± and pins until the MSB of the digitized signal exits the serial
port. Fs is the LRCK rate.
6.For reference, injecting a 125-mVpp fully differential sine wave into the ISENSE± pins (equivalent to a ±0.625 A current with a 0.1- ISENSE resistor)
produces an IMON output of –29.5 dBFS (since typical full-scale is 1.64*VA, in V
amplifier as the audio source, which is connected to an 8- + 33-H speaker load, supplied by a 7.0-V
). ISENSE± monitoring THD is measured using the Class D
PP
, 1-kHz sine wave, operating under the
PP
typical performance test conditions to produce a large, unclipped audio signal. This setup produces a –29.5-dBFS amplitude IMON output. Larger
Class D amplifier amplitudes begin to exhibit clipping behavior, increasing the distortion of the signal supplied to ISENSE±.
7.VMON-to-IMON isolation is the error in the current sense due to VMON, expressed relative to full-scale sense current in decibels.
8.IMON group delay is measured from when a signal is presented on the ISENSE± pins until the MSB of the digitized signal exits the serial port. Fs is
the LRCK rate.
Table 3-8. Digital Interface Specifications and Characteristics
Test conditions, except where noted otherwise: VA = 1.8 V, VP = 3.6 V, VBST = 5.0 V, GNDA = GNDP = 0 V, TA = +25°C.
ParametersSymbolTest ConditionsMin MaxUnits
Input leakage current (per pin)
1,2
MCLK, SCLK, SDOUT
SCL, SDA,
Input capacitanceI
VA logic I/OsHigh-level output voltageV
Low-level output voltageV
High-level input voltageV
Low-level input voltageV
1.Specification includes current through internal pull up/down resistors, where applicable (as defined in Section 1).
2.Leakage current is measured with VA = 1.80 V, VP = 3.60 V, VBST = 3.60 V, and RESET
3.For the ADSP output SDOUT and potential outputs SCLK and LRCK (if M/S = 1), if ADSP_DRIVE = 0 see Section 7.13, IOH and I
+100 A. If ADSP_DRIVE = 1, I
OH
and I
OL
FLOUT2/AD0
FLEN, FLINH, LRCK
, RESET
INT
I
IN
IN
OH
OL
IH
IL
All outputs, IOL = 67/100 A
IOH = –67/–100 A
, SDA, IOL = 3 mA——
INT
—
—
—
—
—
—
—
—
±7.5
±4.5
±4.5
±0.1
A
A
A
A
——10pF
3
VA– 0.2—V
3
0.20
0.4
V
V
—0.70•VA—V
——0.30•VAV
asserted. Each pin is tested while driven high and low.
are –100 and
OL
are –67 and +67 A. For other, non-ADSP_DRIVE-affected outputs, IOH and IOLare –100 and +100 A.
DS963F411
CS35L32
V
MIN
GND
Internal supplies stable
V
OPERATING
t
RH(PWR-RH)tIRS
Control po rt active
t
RS(RL-PWR)
RESET
t
PWR-RUD
t
PWR-RUD
t
PWR-
RUD
t
PWR-RUD
1
st
Suppl y
Up
Last
Suppl y
Up
1
st
Supply
Down
Last
Supply
Down
3 Characteristics and Specifications
Table 3-9. PSRR Characteristics
Test conditions, except where noted otherwise: VA = 1.8 V, VP = 3.6 V, VBST = VP, amp gain = 12 dB, GNDA = GNDP = 0 V, TA = +25°C.
ParametersConditions
Speaker amplifier
VBST = VPVASPKOUT±100217
Noise
Injected Into
PSRR
VPSPKOUT±100217
VPMON PSRR VBST = VPVASDOUT100217
1
VSENSE± PSRR
VBST = VPVASDOUT100217
ISENSE± PSRRVBST = VPVASDOUT100217
1.The speaker voltage monitor has a lower PSRR because its input path has an attenuation of 16.6 dB. The PSRR specification is referred to the input
signal and, as such, includes the loss of 16.6 dB.
Table 3-10. Power Consumption
Test conditions, except where noted otherwise: VA = 1.8 V, VP = 3.6 V, VBST = VP, GNDA = GNDP = 0 V, TA = +25°C.
Use Configuration
Powered up
PDN_BST = 00)
(
RESET asserted, MCLK, SCLK, LRCK inactive
IN+ IN– shorted to ground, LEDs off, monitors powered down
IN+ IN– shorted to ground, LEDs off, monitors powered down
IN+ IN– shorted to ground, LEDs off, monitors powered up
IN+ IN– shorted to ground, LEDs off, monitors powered up
Boost Mode
bypass
PDN_BST = 01)
(
.
RESET
asserted, MCLK, SCLK, LRCK inactive
IN+ IN– shorted to ground, LEDs off, monitors powered down
IN+ IN– shorted to ground, LEDs off, monitors powered down
IN+ IN– shorted to ground, LEDs off, monitors powered up
IN+ IN– shorted to ground, LEDs off, monitors powered up
1.Refer to Section 7.6 for configuring monitor power down
Test conditions, except where noted otherwise: VA = 1.8 V, VP = 3.6 V, VBST = 5.0 V, TA = +25°C, GNDA = GNDP = 0 V. Fig. 2-1 shows typical
connections; GNDA = GNDP = 0 V. Section 9 describes some parameters in detail; input timings are measured at V
are measured at V
Power supplies
2
Reset
Master clocksMCLK frequency
1.Power and reset sequencing
and VOH thresholds (see Table 3-8).
OL
ParametersSymbol
2
Power supply ramp up/downt
RESET low (logic 0) pulse width
RESET
RESET
RESET
MCLK duty cycleD
hold time after power supplies ramp up
setup time before power supplies ramp down
rising edge to control-port active
Noise
Measured On
4
Noise
Amplitude (mV)
1
1
C
OUT
1
1
C
1
1
C
OUT
1
1
C
Noise
Frequency (Hz)
1k
20k
1k
20k
1k
20k
1k
20k
1k
20k
MinTypicalMaxUnits
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
75
75
70
70
70
55
36
36
33
60
60
50
60
60
60
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Typical Current
i
VP
i
VA
11A
No C
3270390A
OUT
= 470 pF (See Fig. 2-1) 4275390A
No C
= 470 pF See Fig. 2-1) 43601435A
OUT
33601435A
OUT
11A
No C
1983390A
OUT
= 470 pF (See Fig. 2-1) 3093390A
No C
= 470 pF See Fig. 2-1) 31851435A
OUT
PWR-RUD
t
RLPW
t
RH(PWR-RH)
t
RS(RL-PWR)
t
IRS
f
MCLK
MCLK
20741435A
OUT
and VIH thresholds; output timings
IL
1
Min MaxUnits
—100ms
1—ms
1—ms
1—ms
[3]
—ns
—12.3MHz
4555%
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
Units
2.VP supply may be applied or removed independently of RESET and the other power rails. See Section 4.1 for additional details.
3.The RESET rising-edge-to-control-port-active timing, t
4.Maximum frequency for highest supported nominal rate is indicated. The supported nominal serial port sample rates are found in Section 4.11.2.
, is specified in Table 3-13.
irs
12DS963F4
CS35L32
//
LRCK
SCLK
SDOUT
T
P
Note:
= “S” or “M”
t
S(LK-SK)
t
H(SK-LK)
t
DataValidStrt
t
DataValidEnd
DataValidWind
3 Characteristics and Specifications
Table 3-12. Switching Specifications: ADSP in I2S Mode
Test conditions, except where noted otherwise: VA = 1.8 V, VP = 3.6 V, VBST = 5.0 V, TA = +25°C, Inputs: Logic 0 = GNDA = GNDP = 0 V, Logic 1 =
VA; C
at V
Slave ModeInput sample rate (LRCK)
Master Mode OUTPUT sample rate (LRCK)
1.ADSP timing in I2S Mode
= 30 pF. Section 9 describes some parameters in detail; input timings are measured at VIL and VIH thresholds; output timings are measured
LOAD
and VOH thresholds (see Table 3-8).
OL
ParametersSymbol
2
1
Min MaxUnits
Fs—49kHz
LRCK duty cycle—4555%
SCLK frequency1/t
Ps
—64•FsHz
SCLK duty cycle—4555%
LRCK setup time before SCLK rising edget
LRCK hold time after SCLK rising edget
SDOUT time from SCLK to data valid start
SDOUT time from SCLK to data valid end
RATIO = 1
LRCK setup time before SCLK rising edget
LRCK hold time after SCLK rising edget
SDOUT time from SCLK to data valid start
SDOUT time from SCLK to data valid end
3
3
[5]
SM(LK–SK)
HM(SK–LK)
t
DataValidStrt
t
DataValidEnd
PM
—
—
—64•FsHz
45
33
55
67
35—ns
20—ns
—300ns
155—ns
kHz
%
%
2.Clock rates should be stable when the CS35L32 is powered up.
3.Minimum data valid window, as shown in signal diagram, is (SCLKperiod – 300 + 155) ns. For SCLK = 64*Fs =64*48 = 3072 kHz, this is 180 ns.
4.In Master Mode, the output sample rate follows MCLK rate divided down per Table 4-14 and Section 7.7. Any deviation in internal MCLK from the
nominal supported rates is directly imparted to the output sample rate by the same factor (e.g., +100-ppm offset in the frequency of MCLK becomes
a +100-ppm offset in LRCK).
5.If RATIO = 1, the MCLK(INT)-to-LRCK ratio is 125. The device periodically extends SCLK high time to compensate for a fractional MCLK/SCLK ratio
DS963F413
CS35L32
t
BUF
t
LOW
StopStart
Start
Stop
Repeated
SDA
SCL
t
IRS
RESET
t
HDDI,
t
HDDO
t
SUD
t
SUST
t
RC
t
HDST
t
HIGH
t
HDST
t
FC
t
SUSP
3 Characteristics and Specifications
Table 3-13. Switching Specifications: I²C Control Port
Test conditions, except where noted otherwise: VA = 1.8 V, VP = 3.6 V, VBST = 5.0 V, TA = +25°C, Inputs: Logic 0 = GNDA = GNDP = 0 V, Logic 1 =
VA; SDA load capacitance equal to maximum value of C
parameters in detail. All specifications are valid for the signals at the pins of the CS35L32 with the specified load capacitance; input timings are measured
at V
and VIH thresholds; output timings are measured at VOL and VOH thresholds (see Table 3-8).
IL
ParameterSymbol
RESET
rising edge to start
SCL clock frequencyf
Start condition hold time (before first clock pulse)t
Clock low timet
Clock high timet
Setup time for repeated start conditiont
SDA input hold time from SCL falling
3
SDA output hold time from SCL fallingt
SDA setup time to SCL risingt
Rise time of SCL and SDAt
Fall time of SCL and SDAt
Setup time for stop conditiont
Bus free time between transmissionst
SDA bus capacitanceC
1.The minimum R
and R
P
values (resistors shown in Fig. 2-1) are determined using the maximum level of VA, the minimum sink current strength of
P_I
their respective output, and the maximum low-level output voltage V
by how fast their associated signals must transition (e.g., the lower the value of R
capacitance). See the I²C switching specifications in Table 3-13 and the I²C bus specification referenced in Section 13.
2.I²C control-port timing.
specified below; minimum SDA pull-up resistance, R
B
t
IRS
SCL
HDST
LOW
HIGH
SUST
t
HDDI
HDDO
SUD
RC
FC
SUSP
BUF
B
(specified in Table 3-8). The maximum RP and R
OL
, the faster the I2C bus is able to operate for a given bus load
P
.1 Section 9 describes some
P(min)
2
MinMaxUnits
500—ns
—400kHz
0.6—µs
1.3—µs
0.6—µs
0.6—µs
00.9µs
0.20.9µs
100—ns
—300ns
—300ns
0.6—µs
1.3—µs
—400pF
values may be determined
P_I
3.Data must be held long enough to bridge the transition time, tF, of SCL.
14DS963F4
4Functional Description
Class D Power Stage
SPKR SU PPLY
VP
GNDPLED
Current Mode Synchronous
Boost Controller
VCOM
Range
Scaling
Class D F r ont End
Short C ircuit Prot ection
∆Σ Class D M odulator
V
REF
Gener ation
Bandgap
Voltage
Gener ation
FILT+
VREF
ISENSE+
ISENSE–/
VSENSE+
SCLKLRCK
Soft Ramp
Level Shifters
I²C Control Port
SDASCLSCLKLRCKSDOUT
MCLK
IN–
–
+
9,12,15 , or
18 dB + Mute
IN+
Flash LED Current Driver
Control,
Sensing,
and Fault
Protection
FLOUT1 FLOUT2/AD0FLEN FLINH
SPKOUT+
SPKOUT–/
VSENSE–
I2C Class G Override
Watchdog
Error
GNDP
VSENSE–
VSENSE+
ISENSE–
ISENSE+
SPKR
SUPPLY
ADC
Serial Audio /Data Por t
Serial Port
Clock Generation
VA
RESETINT
VMON ADC
Front End
LP
IMON ADC
Front End
LP
Low Battery Management
Class G
VBST
Current
Sense
IREF+SW
Power
Budgeting
Temperature
Sensor
Overtemp
Protec tion
ADC
ADC
See Section 4.9 “LED Driver.”
See Section 4.4.
See
Section 4.11
“Audio/Data
Serial Port
(ADSP).”
See Section 4.8,
“Signal Monitoring.”
See
Section 4.10,
“Power
Budgeting.”
See
Section 4.7.
See Section 4.3.
See Section 4.6 “Boost Converter.”
See Section 4.11.
See Section 4.14.
See Section 4.2.
See Section 4.13,
“Device Clocking.”
CS35L32
4 Functional Description
4.1Power Supplies
The VA and VP supplies are required for proper operation of the CS35L32. Before either supply is powered down, RESET
must be asserted. RESET
Timing requirement for RESET
generated internally (as described in Section 7.12) and connected to the high-power output stage of the Class D amplifier
through two balls: VBST and SPKRSUPPLY. By so doing, the speaker amplifier benefits from the proximity of the external
decoupling capacitor that is connected to the boosted supply.
4.2Interrupts
Events that require special attention, such as when a threshold is exceeded or an error occurs, are reported through the
assertion of the interrupt output pin, INT
individually masked by setting corresponding bits in the interrupt mask registers. Table 4-1 lists interrupt status and mask
registers. The configuration of mask bits determines which events cause the immediate assertion of INT
•When an unmasked interrupt status event is detected, the status bit is set and INT
•When a masked interrupt status event is detected, the interrupt status bit is set, but INT
Once INT
are sticky and read-to-clear: Once set, they remain set until the register is read and the associated interrupt condition is
not present. If a condition is still present and the status bit is read, although INT
is asserted, it remains asserted until all unmasked status bits that are set have been read. Interrupt status bits
must be held in the asserted state until all supplies are up and within the recommended range.
during supply power up and power down is described in Table 3-11. The VBST supply is
Figure 4-1. CS35L32 Block Diagram
. These events are captured within the interrupt status registers. Events can be
is deasserted, the status bit remains set.
is asserted.
:
is not affected.
DS963F415
CS35L32
Hybrid Class D A udio Am plifier
(PDN_AMP = 0)
Hybrid Class D Modulator
-Class D
Modulator
9–18 dB
Short
Circuit
Protec tion
SPKOUT+
SPKOUT–
Hybrid Class D
Power Stage
VBST
IN+
IN–
AMP_GAIN p. 39
GAIN_CHG_ZC p. 39
AUDIOGAIN_MNG p. 38
V
IN1THOF
4
15
------ K
VBST
Gain
-----------------
=
V
IN1THON
2
3
---
K
VBST
Gain
-----------------
=
4.3 Speaker Amplifier
To clear any status bits set due to the initiation of a path or block, all interrupt status bits should be read after reset and
before normal operation begins. Otherwise, unmasking these previously set status bits causes INT
Table 4-1. Interrupt Status Registers and Corresponding Mask Registers
Status Registers Mask Registers
Interrupt Status 1 (Audio) (Section 7.19)
Interrupt Status 2 (Monitors) (Section 7.20)
Interrupt Status 3 (LEDs and Boost Converter) (Section 7.21)
The CS35L32 features a high-efficiency mono Class D audio amplifier, shown in Fig. 4-2, with an advanced closed-loop
architecture that achieves low levels of output distortion. Automatic Class G operation, using a boosted supply to the
amplifier, allows louder speaker performance with high crest factor.
to assert.
Figure 4-2. Speaker Amplifier Block Diagram
4.3.1Class G Operation with LEDs Off
The boost converter output is the supply to the speaker amplifier. Audio operation can be programmed to have one of the
following supply modes (See Section 7.12 for programming details.):
•Class G where the boost converter is in Bypass Mode for audio input signals below a threshold V
5-V Boost Mode for audio signal inputs above a threshold V
IN1THOFF
. These thresholds are specified in Table 3-4
IN1THON
for the given conditions. The corresponding equations are shown below.
•Class G disabled, boost converter is in Bypass Mode, and VBST = VP. In this mode, thresholds are ignored.
•Class G disabled, boost converter is in Boost Mode, and VBST = 5 V. In this mode, thresholds are ignored.
The Class G equations for the audio input signal thresholds are as follows:
VBST is the boost converter output voltage (whether in Bypass or Boost Mode), and gain is audio gain expressed as a
unitless real ratio (nonlogarithmic). K = 1 if MCLK is 6 or 12 MHz; K = 1.024 if MCLK is 6.144 or 12.288 MHz. MCLK
should be configured as described in Section 4.13.1 and Section 7.7.
and
16DS963F4
and in
INT
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